Chemical plating device

Abstract

The utility model discloses a chemical plating device, which relates to the technical field of solution coating and comprises a chemical plating tank, a heating mechanism and a filtering mechanism, the chemical plating tank is used for containing chemical plating solution and workpieces to be processed, and the heating mechanism is used for heating the chemical plating solution in the chemical plating tank; the filtering mechanism comprises a filter and a booster pump which are sequentially communicated, a first filtering opening and a second filtering opening are formed in the chemical plating tank, the first filtering opening is communicated with an inlet of the filter, the second filtering opening is communicated with an outlet of the booster pump, and a winding filter element is arranged in the filter; and the winding filter element is used for filtering impurities and precipitates in the chemical plating solution in the chemical plating tank. According to the chemical plating solution filtering device, the chemical plating solution can be filtered while the chemical plating reaction is carried out, so that impurities and precipitates in the chemical plating solution are effectively reduced, and the quality of a plating layer is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of solution coating, in particular to a chemical coating device. Background Art

[0002] In the field of solution coating, such as chemical nickel plating, it is a common surface treatment method used to improve the corrosion resistance, hardness and appearance of metal workpieces. In the process of chemical nickel plating, filter residue is a common problem, which may affect the quality and stability of the chemical plating solution, thereby affecting the quality and performance of the coating. Therefore, it is very necessary to reduce the filter residue and realize automatic filtering of the filter residue.

[0003] In the prior art, such as the Chinese patent document with announcement number CN203270081U, a plating liquid filtering mechanism is disclosed, including a plating tank, the plating tank is provided with a drain port and a liquid inlet, a filter is connected between the drain port and the liquid inlet through a pipeline, and a circulating pump is provided on the pipeline between the filter and the drain port.

[0004] Although the above-mentioned electroplating liquid filtering mechanism can filter the electroplating liquid regularly through the filter, the filter is used to filter impurities generated during the metal electroplating process, such as dust falling into the electroplating tank, burrs falling from the hanger, and anode mud generated by the anode and other large-volume impurities, but cannot effectively capture and remove tiny particles and filter residues in the chemical plating solution. The presence of impurities and sediments in the chemical plating solution will reduce the quality of the coating. Utility Model Content

[0005] The purpose of the utility model is to provide a chemical plating device to solve the problems existing in the above-mentioned prior art. It can filter the chemical plating solution while the chemical plating reaction is in progress, effectively reducing impurities and sediments in the chemical plating solution and improving the quality of the coating.

[0006] To achieve the above purpose, the utility model provides the following solutions:

[0007] The utility model provides a chemical plating device, comprising a chemical plating tank, a heating mechanism and a filtering mechanism, wherein the chemical plating tank is used to contain chemical plating solution and a workpiece to be processed, and the heating mechanism is used to heat the chemical plating solution in the chemical plating tank; the filtering mechanism comprises a filter and a booster pump which are connected in sequence, and the chemical plating tank is provided with a first filter port and a second filter port, the first filter port is connected with an inlet of the filter, and the second filter port is connected with an outlet of the booster pump, and a winding filter element is provided in the filter, and the winding filter element is used to filter impurities and sediments in the chemical plating solution in the chemical plating tank.

[0008] Preferably, the filtering mechanism also includes a screen plate, which is arranged in the chemical plating tank at an angle from top to bottom, and the edge of the screen plate is in contact with the inner wall of the chemical plating tank; the first filter port is located below the screen plate, and the second filter port is located above the screen plate.

[0009] Preferably, the heating mechanism comprises an electric heating tube, and the electric heating tube is arranged in the chemical plating tank.

[0010] Preferably, the electric heating tube is a quartz glass tube with a wound ceramic resistance wire built in, and the electric heating tube is covered with a protective sheath made of polytetrafluoroethylene.

[0011] Preferably, the chemical plating tank is a square tank; at least four electric heating tubes are provided, and the four electric heating tubes are respectively located near four edges of the chemical plating tank extending in the height direction.

[0012] Preferably, the heating mechanism also includes a temperature sensor and a temperature controller, the electric heating tube and the temperature sensor are electrically connected to the temperature controller, the temperature sensor is used to detect the temperature of the chemical plating solution in the chemical plating tank, and the temperature controller is used to adjust the heating temperature of the electric heating tube.

[0013] Preferably, the chemical plating device further comprises a stirring mechanism, and the stirring mechanism is used to stir the chemical plating solution in the chemical plating tank.

[0014] Preferably, the stirring mechanism includes an air compressor, a compressed air pipe and an aerator which are connected in sequence, and the aerator is arranged in the chemical plating tank. The air compressor can pass compressed air into the aerator through the compressed air pipe, so that the aerator can aerate and stir the chemical plating solution in the chemical plating tank.

[0015] Compared with the prior art, the utility model has achieved the following technical effects:

[0016] The utility model provides a chemical plating device, comprising a chemical plating tank, a heating mechanism and a filtering mechanism, wherein the filtering mechanism comprises a filter and a booster pump which are connected in sequence, a winding filter element is arranged in the filter, and when in use, the chemical plating solution in the chemical plating tank is heated by the heating mechanism to plate the workpiece to be processed, and the booster pump is used to make the chemical plating solution in the chemical plating tank flow into the filter through a first filter port in a unidirectional manner for filtration, and the filtered chemical plating solution flows back into the chemical plating tank through a second filter port, thereby achieving filtration of the chemical plating solution while the chemical plating reaction is in progress, effectively reducing impurities and sediments in the chemical plating solution and improving the quality of the coating. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0018] Figure 1 This is a schematic diagram of the chemical plating device provided in Example 1 of the utility model.

[0019] In the figure: 1-chemical plating tank, 2-filter, 3-boosting pump, 4-screen plate, 5-electric heating tube, 6-temperature controller, 7-air compressor, 8-compressed air pipe, 9-aerator. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0021] The utility model aims to provide a chemical plating device to solve the problems existing in the prior art. It can filter the chemical plating solution while the chemical plating reaction is in progress, effectively reducing impurities and sediments in the chemical plating solution and improving the quality of the coating.

[0022] In order to make the above-mentioned purposes, features and advantages of the present invention more obvious and easy to understand, the present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0023] Embodiment 1

[0024] like Figure 1As shown, this embodiment provides a chemical plating device, including a chemical plating tank 1, a heating mechanism and a filtering mechanism. The chemical plating tank 1 is used to contain a chemical plating solution and a workpiece to be processed. The material of the chemical plating tank 1 can be PP, PE, stainless steel or heat-resistant glass. The material of the chemical plating tank 1 in this embodiment is PP; the heating mechanism is used to heat the chemical plating solution in the chemical plating tank 1; the filtering mechanism includes a filter 2 and a booster pump 3 connected in sequence, and the chemical plating tank 1 is provided with a first filter port and a second filter port, the first filter port is connected to the inlet of the filter 2, and the second filter port is connected to the booster pump 3. The outlet of the filter 2 is connected, and a wound filter element is arranged in the filter 2, which is used to filter impurities and precipitates in the chemical plating solution in the chemical plating tank 1; when in use, the chemical plating solution in the chemical plating tank 1 is made to flow into the filter 2 through the first filter port in a unidirectional manner through the booster pump 3 for filtration. The wound filter element in the filter 2 has strong adsorption capacity and can automatically filter impurities and precipitates in the chemical plating solution. The filtered chemical plating solution flows back into the chemical plating tank 1 through the second filter port, thereby realizing filtering of the chemical plating solution while the chemical plating reaction is taking place, effectively reducing impurities and precipitates in the chemical plating solution and improving the quality of the coating.

[0025] It should be noted that the power of the boost pump 3 is preferably 3MPa-5MPa, and the power of the boost pump 3 in this embodiment is 4MPa; the boost pump 3 can not only transport the filtered chemical plating solution back to the chemical plating tank 1, but also increase the pressure in the chemical plating tank 1, effectively lowering the boiling point of the chemical plating solution, reducing the generation of filter residue in the chemical plating tank 1, thereby improving the efficiency of chemical plating.

[0026] In this embodiment, the filtering mechanism also includes a mesh plate 4, which is arranged in a slanted manner from top to bottom in the chemical plating tank 1, and the edge of the mesh plate 4 is in contact with the inner wall of the chemical plating tank 1; the first filter port is located below the mesh plate 4, and the second filter port is located above the mesh plate 4; specifically, the mesh plate 4 is designed at the bottom of the chemical plating tank 1, and the mesh diameter of the mesh plate 4 is preferably 1mm-3mm, which is conducive to filtering the residue precipitate produced during the chemical reaction.

[0027] In this embodiment, the heating mechanism comprises an electric heating tube 5 , and the electric heating tube 5 is disposed in the chemical plating tank 1 .

[0028] Furthermore, the electric heating tube 5 is a quartz glass tube with a wound ceramic resistance wire built in, and a protective sleeve made of polytetrafluoroethylene is provided on the electric heating tube 5; specifically, the heating power of the electric heating tube 5 is preferably 0.5W-2W / cm 2 To prevent local overheating, the heating power of the electric heating tube 5 in this embodiment is 2W / cm 2; The protective cover in this embodiment is preferably a metal-free screw-fastening cover made of polytetrafluoroethylene (PTFE) to prevent the electric heating tube 5 from directly contacting the chemical plating tank 1 at high temperature and causing damage to the chemical plating tank 1. In addition, the PTFE material is resistant to high temperatures and acid and alkali, and can prevent decomposition in high-temperature acid and alkali environments to avoid affecting the composition of the chemical plating solution.

[0029] In this embodiment, the chemical plating tank 1 is a square tank; at least four electric heating tubes 5 are provided, and the four electric heating tubes 5 are respectively located near the four edges extending along the height direction of the chemical plating tank 1.

[0030] In this embodiment, the heating mechanism also includes a temperature sensor and a temperature controller 6. The electric heating tube 5 and the temperature sensor are both electrically connected to the temperature controller 6. The temperature sensor is used to detect the temperature of the chemical plating solution in the chemical plating tank 1. The temperature controller 6 is used to adjust the heating temperature of the electric heating tube 5, thereby maintaining the temperature of the chemical plating solution within a set range.

[0031] In this embodiment, the chemical plating device further includes a stirring mechanism, and the stirring mechanism is used to stir the chemical plating solution in the chemical plating tank 1 .

[0032] Furthermore, the stirring mechanism includes an air compressor 7, a compressed air pipe 8 and an aerator 9 which are connected in sequence. The aerator 9 is arranged in the chemical plating tank 1. The air compressor 7 can pass compressed air into the aerator 9 through the compressed air pipe 8, so that the aerator 9 can aerate and stir the chemical plating liquid in the chemical plating tank 1, so that the chemical plating liquid before and after filtration is evenly mixed, and promotes uniform film formation on the inner wall, deep holes and other parts of the workpiece to be processed; specifically, the pressure of the air compressor 7 in this embodiment is adjustable, and the aerator 9 is preferably a microporous aeration disk made of PPH material.

[0033] The steps of using the chemical plating device provided in this embodiment to coat a workpiece are as follows:

[0034] The first step is to preset the stirring speed, heating temperature, and heating time process parameters according to the formulation standard of the workpiece coating; specifically, in this embodiment, a 20-micron chemical plating layer is designed and prepared, and the preset heating temperature is 86°C and the heating time is 2h.

[0035] The second step is to add chemical plating solution into the chemical plating tank 1. The electric heating tube 5 and the air compressor 7 are started to stir the chemical plating solution evenly and heat it to a preset temperature.

[0036] The third step is to open the filter 2 and the booster pump 3.

[0037] In the fourth step, the sample (i.e. the workpiece to be processed) is subjected to a degreasing and rust removal pretreatment process and placed in the chemical plating solution in the chemical plating tank 1 .

[0038] In the fifth step, the chemical plating solution continuously flows from the chemical plating tank 1 to the filter 2 under the action of the booster pump 3, and the wound filter element in the filter 2 automatically adsorbs the filter residue and sediment in the chemical plating solution.

[0039] Step 6: After the preset chemical plating time is reached, take out the sample and clean the chemical plating solution physically remaining on its surface. Use a measuring tool to measure the coating thickness of the sample.

[0040] If the coating thickness does not reach the preset standard, the chemical plating steps are repeated according to the methods of the fourth step, the fifth step, and the sixth step until the coating thickness reaches the preset standard.

[0041] If the coating thickness meets the standard, proceed to step 7.

[0042] Step 7: turn off the electric heating tube 5, the air compressor 7, and the booster pump 3 in sequence.

[0043] Embodiment 2

[0044] The difference between this embodiment and the first embodiment is that the material of the chemical plating tank 1 is stainless steel; the power of the booster pump 3 is 3MPa; the heating power of the electric heating tube 5 is 1W / cm 2 .

[0045] Comparative Example 1

[0046] The difference between this comparative example and the second embodiment is that the material of the metal-free screw fastening sleeve is polyvinyl chloride (PVC); and the power of the booster pump 3 is 2 MPa.

[0047] The coating thickness and roughness of the samples of the above-mentioned embodiments 1 and 2 and comparative example 1 were tested, and the results are as follows:

[0048] Sample Name Coating thickness / μm Application time / h Roughness / μm Embodiment 1 22 2 0.17 Embodiment 2 20 2 0.19 Comparative Example 1 3 2.5 0.4

[0049] According to the above results, the materials used in Examples 1 and 2 are suitable for working in high temperature and acidic environments, while in Comparative Example 1, the metal-free screw fastening sleeve provided outside the electric heating tube 5 is made of PVC material, which makes chemical plating impossible. PVC material has small molecules dissolved in a high temperature and acidic environment, which will adhere to the surface of the sample and inhibit the progress of chemical plating.

[0050] This device has the following advantages:

[0051] First, an inclined screen plate 4 is provided in the chemical plating tank 1 of the device, which effectively promotes the filter residue produced during the chemical plating reaction to be deposited at the bottom of the chemical plating tank 1, thereby maintaining the stability and uniformity of the chemical plating solution and ensuring the quality of the coating.

[0052] Second, the electric heating tube 5 uses a wound ceramic resistance wire, and the outer wall is quartz glass, which has a significant heating effect. The PTFE material has a metal-free screw fastening sleeve to prevent the electric heating tube 5 from damaging the chemical plating tank 1 at high temperatures. In addition, the PTFE material is resistant to high temperatures, acids and alkalis, and prevents decomposition in high-temperature acid-base environments, avoiding affecting the chemical plating solution components.

[0053] Third, the chemical plating solution flows from the chemical plating tank 1 to the filter 2 in one direction under the action of the booster pump 3, and flows evenly to the inner wall and deep holes of the workpiece to be processed in the chemical plating tank 1. Not only can the chemical plating solution be fully in contact with the surface of the workpiece to be processed, but the chemical plating solution can also circulate to drive the filter residue produced in the reaction to flow to the filter 2, effectively ensuring the continuous and stable operation of the chemical plating solution and ensuring that the chemical plating layer is uniform and free of impurities.

[0054] Fourth, the device has a simple structure and strong flexibility. It is suitable for large and small industrial production and research and development of chemical plating operations and has good applicability.

[0055] In summary, the device has the functions of automatic filtration, temperature detection, pressurization to reduce boiling point, etc., which can significantly improve the efficiency and quality of the chemical plating process and is suitable for chemical plating applications in various industrial fields.

[0056] The present invention uses specific examples to illustrate the principle and implementation of the present invention. The above examples are only used to help understand the method and core idea of ​​the present invention. At the same time, for those skilled in the art, according to the idea of ​​the present invention, there will be changes in the specific implementation and application scope. In summary, the content of this specification should not be understood as limiting the present invention.

Claims

1. A chemical plating device, characterized in that: It includes a chemical plating tank, a heating mechanism and a filtering mechanism. The chemical plating tank is used to contain chemical plating solution and workpieces to be processed. The heating mechanism is used to heat the chemical plating solution in the chemical plating tank. The filtering mechanism includes a filter and a booster pump which are connected in sequence. The chemical plating tank is provided with a first filter port and a second filter port. The first filter port is connected to the inlet of the filter, and the second filter port is connected to the outlet of the booster pump. A winding filter element is provided in the filter, and the winding filter element is used to filter impurities and sediments in the chemical plating solution in the chemical plating tank.

2. The chemical plating device according to claim 1, characterized in that: The filtering mechanism also includes a mesh plate, which is tilted from top to bottom in the chemical plating tank, and the edge of the mesh plate is in contact with the inner wall of the chemical plating tank; the first filter port is located below the mesh plate, and the second filter port is located above the mesh plate.

3. The chemical plating device according to claim 1, characterized in that: The heating mechanism comprises an electric heating tube, and the electric heating tube is arranged in the chemical plating tank.

4. The chemical plating device according to claim 3, characterized in that: The electric heating tube is a quartz glass tube with a wound ceramic resistance wire built in, and a protective sleeve made of polytetrafluoroethylene is provided on the electric heating tube.

5. The chemical plating device according to claim 3, characterized in that: The chemical plating tank is a square tank; at least four electric heating tubes are provided, and the four electric heating tubes are respectively located near four edges of the chemical plating tank extending in the height direction.

6. The chemical plating device according to claim 3, characterized in that: The heating mechanism also includes a temperature sensor and a temperature controller. The electric heating tube and the temperature sensor are both electrically connected to the temperature controller. The temperature sensor is used to detect the temperature of the chemical plating solution in the chemical plating tank, and the temperature controller is used to adjust the heating temperature of the electric heating tube.

7. The chemical plating device according to claim 1, characterized in that: The chemical plating device further comprises a stirring mechanism, and the stirring mechanism is used for stirring the chemical plating solution in the chemical plating tank.

8. The chemical plating device according to claim 7, characterized in that: The stirring mechanism includes an air compressor, a compressed air pipe and an aerator which are connected in sequence. The aerator is arranged in the chemical plating tank. The air compressor can pass compressed air into the aerator through the compressed air pipe so that the aerator can aerate and stir the chemical plating solution in the chemical plating tank.

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