Adjustable drying equipment for wafer cleaning

Abstract

The utility model discloses an adjustable drying device for wafer cleaning, which comprises a drying cabinet body, a bearing plate, a wafer disc and a wafer piece, the bearing plate is installed inside the drying cabinet body, the wafer disc is placed on the bearing plate, the wafer piece is placed inside the wafer disc, an overturning assembly is arranged between the bearing plate and the wafer disc, and the wafer piece is placed inside the wafer disc. The overturning assembly comprises a mounting plate, an overturning air cylinder, an overturning shaft and a fixing barrel, the mounting plate is mounted in the center of the surface of the bearing plate, and the overturning air cylinder is mounted on the surface of one end of the mounting plate; the supporting plate is provided with a design for adjusting the position of the wafer, the overturning air cylinder changes the angle of the wafer disc and the wafer piece and reduces moisture on the surface of the wafer piece, the lifting electric push rod operates, the fixed circular plate and the supporting plate move upwards, the supporting plate lifts the wafer piece in the wafer disc, the wafer piece is in a suspended state, the height position of the wafer piece can be changed, and the wafer piece can be placed in the wafer disc. The contact surface area of the outer surface of the wafer and external gas is greatly increased, and the wafer can be dried easily.

Description

Technical Field

[0001] The utility model belongs to the technical field of drying equipment, and in particular relates to adjustable drying equipment for wafer cleaning. Background Art

[0002] Wafer nitrogen drying cabinet is a conventional drying equipment used after wafer cleaning. It is one of the important equipment in the wafer semiconductor manufacturing process. Its function is to remove moisture from the surface of the wafer to ensure the quality and efficiency of production. The principle of wafer nitrogen drying cabinet is nitrogen drying. Nitrogen drying is a low-temperature drying method. It is suitable for situations where the wafer temperature is sensitive, such as silicon oxide wafers. In a nitrogen environment, the moisture on the surface of the wafer will be evaporated and taken away;

[0003] When the wafer nitrogen drying cabinet is used to dry wafers, the wafers are placed on the supporting plate inside the drying cabinet, and the nitrogen takes away the moisture on the surface of the wafers. Although there are air holes on the supporting plate, there is still an overlapping part between the wafer and the supporting plate, and the moisture in the overlapping part of the wafer cannot be dried. The supporting plate does not have the function of adjusting the position of the wafer, and the overlapping part cannot be dried. When the wafer nitrogen drying cabinet dries the wafer, there is a problem that there is no design on the supporting plate to adjust the position of the wafer. For this reason, the present application proposes an adjustable drying device for wafer cleaning. Utility Model Content

[0004] The utility model aims to provide an adjustable wafer cleaning drying device to solve the problem that there is no design for adjusting the position of the wafer on the supporting plate in the wafer nitrogen drying cabinet proposed in the background technology.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: an adjustable drying equipment for wafer cleaning, comprising a drying cabinet, a supporting plate, a wafer disc and a wafer part, the supporting plate is installed inside the drying cabinet, the wafer disc is placed on the supporting plate, and the wafer part is placed inside the wafer disc, a flip assembly is provided between the supporting plate and the wafer disc, the flip assembly comprises a mounting plate, a flip cylinder, a flip shaft and a fixed cylinder, the mounting plate is installed at the center position of the supporting plate surface, the flip cylinder is installed on the surface of one end of the mounting plate, the flip shaft is installed between the opposite surfaces of the mounting plate, the flip shaft passes through the fixed cylinder, the bottom surface of the wafer disc is provided with symmetrically distributed limit plates, the inner surface of the wafer disc is provided with blocking glue columns and bosses, the bosses are installed at the center position in the wafer disc, a lifting electric push rod is provided at the bottom of the supporting plate near the side position, a fixed circular plate is provided on the top of the lifting electric push rod, and symmetrically distributed support plates are provided on the fixed circular plate.

[0006] Preferably, both ends of the mounting plate are right-angle structures, the turning axis and the center of the fixed cylinder are on the same axis, and a rectangular groove is provided on the outer surface of the fixed cylinder.

[0007] Preferably, the limit plate is an "L"-shaped structure, the limit plate and the card slot are gap-matched, the bottom surface of the opposing wafer disk is parallel to the inner surface of the mounting plate, and the fixing cylinder is tangent to the wafer disk and the mounting plate.

[0008] Preferably, the boss is a frustum structure that is narrow at the top and wide at the bottom, a vent hole is provided on the surface of the boss, a cavity is formed between the boss and the inner surface of the wafer disk, the vent hole is connected to the cavity, and the blocking glue column is a cone structure.

[0009] Preferably, a "U"-shaped water storage tank is provided on the inner surface of the wafer disc, the water storage tank near the middle of the edge of the wafer disc is the high position a, the water storage tank near the corner of the wafer disc is the low position b, and the distance between the high position a and the low position b is 5 mm.

[0010] Preferably, the top surfaces of the fixed circular plate and the support plate are flush with the bottom surface of the wafer disc.

[0011] Preferably, a rectangular slide groove is provided at a position close to the center of the side of the wafer disc, and one end of the support plate is located in the slide groove.

[0012] Compared with the prior art, the beneficial effects of the utility model are:

[0013] In the utility model, the support plate is designed to adjust the position of the wafer, the turning cylinder changes the angle of the wafer disc and the wafer part, reduces the moisture on the surface of the wafer part, the lifting electric push rod runs, the fixed circular plate and the support plate move up, the support plate lifts the wafer part in the wafer disc, makes the wafer part in a suspended state, can change the height position of the wafer part, greatly increases the surface area of ​​the outer surface of the wafer part in contact with the external gas, and is conducive to drying the wafer part. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram of the structure of the utility model;

[0015] Figure 2 It is a schematic diagram of the top view of the supporting plate of the utility model;

[0016] Figure 3 For the utility model Figure 2 Schematic diagram of the structure in the AA direction;

[0017] Figure 4 It is a schematic cross-sectional structure diagram of the wafer disc of the utility model;

[0018] In the figure: 1. Drying cabinet; 2. Support plate; 3. Turning assembly; 4. Wafer plate; 5. Lifting electric push rod; 6. Fixed circular plate; 7. Wafer piece; 31. Mounting plate; 32. Turning cylinder; 33. Turning axis; 34. Fixed cylinder; 41. Blocking rubber column; 42. Limiting plate; 43. Boss; 44. Water tank; 61. Support plate; 431. Air vent. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0020] Example

[0021] See also Figures 1 to 4The utility model provides a technical solution: an adjustable drying device for wafer cleaning, comprising a drying cabinet 1, a supporting plate 2, a wafer disc 4 and a wafer piece 7. The drying cabinet 1 utilizes conventional technical means of nitrogen drying, which will not be described in detail in this application; the supporting plate 2 is installed inside the drying cabinet 1, the wafer disc 4 is placed on the supporting plate 2, the wafer piece 7 is placed inside the wafer disc 4, a flip assembly 3 is provided between the supporting plate 2 and the wafer disc 4, the flip assembly 3 comprises a mounting plate 31, a flip cylinder 32, a flip shaft 33 and a fixing cylinder 34, the mounting plate 31 is installed at the center of the surface of the supporting plate 2, and the flip cylinder 32 is installed on the surface of one end of the mounting plate 31 The mounting plate 31 and the flip cylinder 32 are combined by a conventional method, the flip shaft 33 is installed between the opposite surfaces of the mounting plate 31, the end of the flip shaft 33 is connected to the flip cylinder 32, and the flip cylinder 32 is operated to rotate the flip shaft 33 by a certain angle, which can change the angle between the flip shaft 33 and the fixed cylinder 34, the flip shaft 33 passes through the fixed cylinder 34, the flip shaft 33 and the fixed cylinder 34 are combined by a conventional method, the flip shaft 33 and the fixed cylinder 34 rotate in the same direction, and the bottom surface of the wafer disk 4 is provided with symmetrically distributed limit plates 42, the limit plates 42 and the wafer disk 4 are combined by a conventional method, the limit plates 42 and the fixed cylinder 34 are engaged and connected, and the limit plates 4 2 is limited by the fixed cylinder 34, and the wafer disc 4 and the limiting plate 42 rotate in the same direction with the fixed cylinder 34, which can change the angle of the wafer disc 4, so that the wafer disc 4 and the wafer part 7 are in an inclined state, so that the water on the surface of the wafer part 7 flows down into the inside of the wafer disc 4 under the action of gravity, and the moisture contained in the surface of the wafer part 7 is reduced. The inner surface of the wafer disc 4 is provided with a blocking glue column 41 and a boss 43, and the boss 43 is installed at the center position of the wafer disc 4. The boss 43, the blocking glue column 41 and the wafer disc 4 are combined by a conventional method. The boss 43 supports the center position of the wafer part 7, and the blocking glue column 41 limits the wafer part 7 to prevent the wafer part 7 from shaking when the wafer disc 4 rotates. A lifting electric push rod 5 is provided at the bottom near the side, and the lifting electric push rod 5 is connected to the supporting plate 2 by a conventional method, such as screwing connection, and a fixed circular plate 6 is provided on the top of the lifting electric push rod 5, and the fixed circular plate 6 is connected to the lifting electric push rod 5 by a conventional method, and symmetrically distributed supporting plates 61 are provided on the fixed circular plate 6, and the fixed circular plate 6 and the supporting plates 61 are an injection-molded integral structure. When the lifting electric push rod 5 runs and becomes an extended state, the fixed circular plate 6 and the supporting plates 61 move vertically upward, and the supporting plates 61 lift the wafer parts 7 in the wafer disk 4, so that the wafer parts 7 are in a suspended state, so as to avoid interference with the overlapping part between the wafer parts 7 and the wafer disk 4, thereby affecting the drying effect.

[0022] In this embodiment, both ends of the mounting plate 31 are right-angle structures, the flip axis 33 and the center of the fixed cylinder 34 are on the same axis, the outer surface of the fixed cylinder 34 is provided with a rectangular slot, the limit plate 42 is an "L"-shaped structure, the limit plate 42 is matched with the slot clearance, the limit plate 42 is connected with the fixed cylinder 34 by snapping, the limit plate 42 is limited by the fixed cylinder 34, the wafer disk 4 and the limit plate 42 rotate in the same direction with the fixed cylinder 34, and the angle of the wafer disk 4 can be changed. The bottom surface of the opposing wafer disk 4 is parallel to the inner surface of the mounting plate 31, the fixed cylinder 34 is tangent to the wafer disk 4 and the mounting plate 31, and the mounting plate 31 does not affect the rotation of the fixed cylinder 34.

[0023] In this embodiment, the boss 43 is a conical structure which is narrow at the top and wide at the bottom. An air hole 431 is provided on the surface of the boss 43. A cavity is formed between the boss 43 and the inner surface of the wafer disk 4. The air hole 431 is connected to the cavity. The air hole 431 can pass gas to reduce the overlapping area between the boss 43 and the wafer part 7. The blocking glue column 41 is a conical structure. The blocking glue column 41 limits the wafer part 7 to prevent the wafer part 7 from shaking when the wafer disk 4 rotates.

[0024] In this embodiment, a water storage tank 44 with a "U"-shaped structure is provided on the inner surface of the wafer disk 4. The water storage tank 44 near the middle position of the side of the wafer disk 4 is a high position a, and the water storage tank 44 near the corner position of the wafer disk 4 is a low position b. The distance between the high position a and the low position b is 5 mm. When the wafer disk 4 and the wafer part 7 are tilted, the moisture on the surface of the wafer part 7 falls on the inner surface of the wafer disk 4, and the water gathers inside the water storage tank 44. The water in the water storage tank 44 flows from the high position a to the low position b to prevent water from falling on the surface of the supporting plate 2.

[0025] In this embodiment, the top surfaces of the fixed circular plate 6 and the support plate 61 are flush with the bottom surface of the wafer disc 4. The support plate 61 supports the wafer 7. A rectangular slide groove is provided on the side of the wafer disc 4 near the center. One end of the support plate 61 is located in the slide groove. The lifting electric push rod 5 extends the side length, and the fixed circular plate 6 and the support plate 61 move upward. The support plate 61 lifts the wafer 7, which is beneficial to drying the wafer 7.

[0026] The working principle and use process of this utility model:

[0027] When drying the wafer 7, the wafer 7 is placed inside the wafer tray 4, and the blocking glue column 41 limits the wafer 7 to prevent the wafer 7 from shaking when the wafer tray 4 rotates;

[0028] The boss 43 supports the wafer 7 to reduce the overlapping area between the wafer 7 and the wafer plate 4. The air holes 431 allow gas to pass through, which is beneficial for drying the surface of the wafer 7 facing the wafer plate 4.

[0029] The limiting plate 42 is engaged with the fixed cylinder 34, and the limiting plate 42 is limited by the fixed cylinder 34. The flip cylinder 32 rotates, the flip shaft 33 and the fixed cylinder 34 rotate, and the wafer disc 4 and the limiting plate 42 rotate in the same direction as the fixed cylinder 34, which can change the angle of the wafer disc 4, so that the wafer disc 4 and the wafer part 7 are in an inclined state, so that the water on the surface of the wafer part 7 flows down into the inside of the wafer disc 4 under the action of gravity, thereby reducing the moisture content on the surface of the wafer part 7;

[0030] The water on the surface of the wafer 7 falls on the inner surface of the wafer plate 4, and the water gathers inside the water storage tank 44. The water in the water storage tank 44 flows from the high position a to the low position b, so as to prevent the water from falling on the surface of the supporting plate 2;

[0031] The flip cylinder 32 rotates, the flip shaft 33 and the fixed cylinder 34 rotate, and the wafer plate 4 rotates, and the wafer plate 4 rotates to a horizontal state;

[0032] The lifting electric push rod 5 runs and becomes an extended state, the fixed circular plate 6 and the support plate 61 move vertically upward, and the support plate 61 lifts the wafer 7 in the wafer tray 4, so that the wafer 7 is in a suspended state, avoiding interference with the overlapping part between the wafer 7 and the wafer tray 4, which affects the drying effect;

[0033] To sum up: the supporting plate 2 is designed to adjust the position of the wafer, the turning cylinder 32 changes the angle of the wafer disc 4 and the wafer part 7, reduces the moisture on the surface of the wafer part 7, the lifting electric push rod 5 runs, the fixed circular plate 6 and the support plate 61 move up, the support plate 61 lifts the wafer part 7 in the wafer disc 4, and makes the wafer part 7 in a suspended state, which can change the height position of the wafer part 7, greatly increase the surface area of ​​the outer surface of the wafer part 7 in contact with the external gas, and is conducive to drying the wafer part 7.

[0034] Although the embodiments of the present invention have been shown and described (see the above detailed description for details), it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An adjustable drying device for wafer cleaning, comprising a drying cabinet (1), a supporting plate (2), a wafer tray (4) and a wafer piece (7), wherein the supporting plate (2) is installed inside the drying cabinet (1), the wafer tray (4) is placed on the supporting plate (2), and the wafer piece (7) is placed inside the wafer tray (4), characterized in that: A flip assembly (3) is provided between the supporting plate (2) and the wafer disc (4), and the flip assembly (3) comprises a mounting plate (31), a flip cylinder (32), a flip shaft (33) and a fixing cylinder (34). The mounting plate (31) is mounted at the center position of the surface of the supporting plate (2), the flip cylinder (32) is mounted on the surface of one end of the mounting plate (31), the flip shaft (33) is mounted between the opposite surfaces of the mounting plate (31), and the flip shaft (33) passes through the fixing cylinder (34). The bottom surface of the wafer disc (4) is provided with symmetrically distributed limit plates (42), the inner surface of the wafer disc (4) is provided with a blocking rubber column (41) and a boss (43), and the boss (43) is installed at the center position inside the wafer disc (4). A lifting electric push rod (5) is provided at the bottom of the supporting plate (2) near the side position, and a fixing circular plate (6) is provided on the top of the lifting electric push rod (5). A symmetrically distributed support plate (61) is provided on the fixing circular plate (6).

2. The adjustable wafer cleaning drying device according to claim 1, characterized in that: Both ends of the mounting plate (31) are right-angle structures, the turning shaft (33) and the center of the fixed cylinder (34) are on the same axis, and the outer surface of the fixed cylinder (34) is provided with a rectangular slot.

3. The adjustable wafer cleaning drying device according to claim 2, characterized in that: The limiting plate (42) is an "L"-shaped structure, the limiting plate (42) is clearance-matched with the card slot, the bottom surface of the opposing wafer disc (4) is parallel to the inner surface of the mounting plate (31), and the fixing cylinder (34) is tangent to the wafer disc (4) and the mounting plate (31).

4. The adjustable wafer cleaning drying device according to claim 1, characterized in that: The boss (43) is a cone structure that is narrow at the top and wide at the bottom. An air hole (431) is provided on the surface of the boss (43). A cavity is formed between the boss (43) and the inner surface of the wafer disk (4). The air hole (431) is connected to the cavity. The blocking glue column (41) is a cone structure.

5. The adjustable wafer cleaning drying device according to claim 1, characterized in that: A water storage groove (44) with a "U"-shaped structure is provided on the inner surface of the wafer disc (4), the water storage groove (44) near the middle position of the side of the wafer disc (4) is a high position a, and the water storage groove (44) near the corner position of the wafer disc (4) is a low position b, and the distance between the high position a and the low position b is 5 mm.

6. The adjustable wafer cleaning drying device according to claim 1, characterized in that: The top surfaces of the fixed circular plate (6) and the support plate (61) are flush with the bottom surface of the wafer disc (4).

7. The adjustable wafer cleaning drying device according to claim 1, characterized in that: A rectangular slide groove is provided on the side of the wafer disk (4) near the center, and one end of the support plate (61) is located in the slide groove.

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