Laser diode chip test equipment with suction cleaning function

Abstract

The utility model discloses a laser diode chip testing device with air suction cleaning, which relates to the technical field of laser diodes and comprises a bottom plate, a box body is mounted on the outer wall of the top of the bottom plate, an air suction assembly is arranged at one end of the outer wall of the top of the box body, and a fixing assembly is arranged in the middle of the outer wall of the top of the bottom plate. The air suction assembly is matched with the fixing assembly. During cleaning, dust attached to the chip is scattered and flies around, at the moment, an exhaust pump is started to exhaust air in an air suction box, the air suction box generates suction force due to negative pressure, the dust drifting in the box body is sucked through a collecting groove, the dust enters the air suction box through a collecting pipe and an air suction pipe, and dust impurities are adsorbed through an adsorption net cage. And compared with a traditional blowing cleaning mechanism, dust generated after cleaning cannot drift away in the device, and the situation that dust in air is attached to the chip again to affect chip testing can be effectively prevented.

Description

Technical Field

[0001] The utility model relates to the technical field of laser diodes, in particular to a laser diode chip testing device with air suction cleaning function. Background Art

[0002] Laser diode is essentially a semiconductor diode. According to whether the PN junction material is the same, laser diode can be divided into homojunction, single heterojunction (SH), double heterojunction (DH) and quantum well (QW) laser diode. Quantum well laser diode has the advantages of low threshold current and high output power, and is the mainstream product in the current market. Compared with lasers, laser diodes have the advantages of high efficiency, small size and long life. Laser diode chips are important components of laser diodes. The quality of the chip is directly related to the quality of the laser diode. Therefore, the quality of the laser diode chip needs to be tested after it is produced.

[0003] Since dust and impurities may be attached to the outer wall of the chip, it will affect the accuracy of chip detection. Therefore, the chip needs to be dust-removed before detection. However, the existing laser diode chip testing equipment mainly uses air blowing to blow away the dust and impurities on the surface of the chip when removing dust from the chip. However, the dust removed by this dust removal method still floats in the air and may attach to the chip again, thereby affecting the accuracy of the chip test. Utility Model Content

[0004] The purpose of the present application is to provide a laser diode chip testing device with air intake cleaning to solve the problems raised in the above background technology.

[0005] To achieve the above-mentioned purpose, the present application provides the following technical solutions: a laser diode chip testing device with air suction cleaning, comprising a bottom plate, a box body is installed on the top outer wall of the bottom plate, an air suction component is arranged at one end of the top outer wall of the box body, a fixing component is arranged in the middle position of the top outer wall of the bottom plate, the air suction component is adapted to the fixing component, a box door is hingedly connected to the outer wall of the box body, an observation window adapted thereto is arranged on the outer wall of the box door, a cleaning component is inserted into the inner wall of the box door, the cleaning component is located above the fixing component, and the The cleaning component is adapted to the fixed component, and the air intake component includes a mounting groove opened on the outer wall of one side of the box body, and a mounting bracket is slidably installed on the inner wall of the mounting groove, and the mounting bracket is an "L"-shaped structure. The mounting bracket is adapted to the box body, and an air intake box is welded to the outer wall at the top of the mounting bracket, and an air intake pipe that passes through the mounting bracket is arranged on the top of the outer wall of one side of the air intake box, and a collecting pipe is installed at the end of the air intake pipe, and the outer wall of the collecting pipe is provided with collecting grooves distributed at equal distances, and the end of the air intake pipe, the collecting pipe, and the collecting groove are all located inside the box body.

[0006] Preferably, an adsorption mesh box is slidably inserted into the inner wall of the air suction box, a slot compatible with the adsorption mesh box is opened on the outer wall of the air suction box, an exhaust pipe is arranged at the bottom of the outer wall of the air suction box away from the air suction pipe, and an exhaust pump is installed on the outer wall of the exhaust pipe.

[0007] Preferably, the cleaning component includes a control frame inserted into the inner wall of the box door, an electric telescopic rod is installed on the bottom outer wall of the control frame by bolts, a control panel is installed on the end of the electric telescopic rod by bolts, a control groove is opened inside the control panel, a gear plate is rotatably installed on the inner wall of the control groove, the gear plates are meshed with each other, a cleaning disc is installed on the bottom outer wall of the gear disc, and the cleaning disc is provided with cleaning soft bristles.

[0008] Preferably, a servo motor is mounted on one end of the top outer wall of the control panel via bolts, and an output shaft of the servo motor is connected to one of the gear plates.

[0009] Preferably, the fixing assembly includes a support plate welded to the top of the base plate, a fixing plate is slidably mounted on the top of the support plate, an anti-slip pad is arranged on the top of the fixing plate, the anti-slip pad is adapted to the fixing plate, the thickness of the anti-slip pad is less than the thickness of the fixing plate, and sealing pads are arranged on the top outer wall of the support plate and the bottom outer wall of the fixing plate.

[0010] Preferably, an adsorption groove is provided inside the support plate, and the anti-slip pad, the fixing plate and the support plate are all provided with adsorption holes, the adsorption holes lead into the adsorption groove, an exhaust pipe penetrating the bottom plate is provided at the bottom of the adsorption groove, and an exhaust pump is installed on the exhaust pipe.

[0011] Preferably, a test component is provided on the inner wall at the top of the box, the test component is adapted to the fixed component, a display is installed on the outer wall at the top of the box, the test component is installed with a PLC controller via a wire, the PLC controller is connected to the display via a wire, a control panel is installed on the top of the outer wall of the box, and the control panel is connected to electrical components via a wire.

[0012] In summary, the technical effects and advantages of the utility model are:

[0013] 1. In the utility model, the laser diode chip to be tested is placed on the fixing component for fixing. After the fixing is completed, the cleaning component cleans the chip fixed on the fixing component. During cleaning, the dust attached to the chip is scattered and floats. At this time, the exhaust pump is started to discharge the air in the suction box. The suction box generates suction due to the negative pressure, and absorbs the dust floating inside the box through the collection groove. The dust enters the suction box through the collection pipe and the suction pipe, and the adsorption net box adsorbs the dust impurities, thereby realizing the cleaning of the chip. Compared with the traditional air blowing cleaning mechanism, the dust after cleaning will not float inside the device, which can effectively prevent the dust in the air from adhering to the chip again and affecting the chip test;

[0014] 2. In the utility model, when the chip is fixed, the fixing plate is pulled out, and the chips to be tested are placed on the adsorption holes in sequence, and then the fixing plate is pushed back onto the supporting plate, and then the vacuum pump on the vacuum pipe is started to extract the air in the adsorption groove. Therefore, the adsorption groove generates suction to adsorb the chip on the fixing plate through the adsorption hole, so that the chip is kept stable while being tested, which is convenient for cleaning and testing of the chip.

[0015] 3. In the utility model, when cleaning the chip, the control frame is connected to the box door, and the electric telescopic rod drives the control panel to descend, so that the cleaning soft hair at the bottom of the cleaning plate contacts the chip. At this time, the servo motor drives one of the gear plates to rotate. Since the gear plates are meshed with each other, the rotation of one gear plate can drive all the gear plates to rotate the cleaning plate to clean the chip, preventing dust and impurities on the chip from affecting the test accuracy. After the chip is cleaned, the test component detects the chip placed on the fixed plate, and the display displays the test results of the test component, which is convenient for screening the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without paying any creative work.

[0017] Figure 1 This is a schematic diagram of the main appearance structure in the embodiment of the present application;

[0018] Figure 2 It is a schematic diagram of the main cross-sectional structure in the embodiment of the present application;

[0019] Figure 3 is a schematic diagram of the cross-sectional structure of a cleaning component in an embodiment of the present application;

[0020] Figure 4 This is a schematic diagram of the appearance structure of the cleaning component in the embodiment of the present application;

[0021] Figure 5 It is a schematic diagram of the structure of the fixing component in the embodiment of the present application.

[0022] In the figure: 1. bottom plate; 2. box body; 3. mounting frame; 4. suction box; 5. suction pipe; 6. collecting pipe; 7. collecting tank; 8. adsorption net box; 9. control frame; 10. electric telescopic rod; 11. control board; 12. gear plate; 13. cleaning plate; 14. servo motor; 15. support plate; 16. fixing plate; 17. anti-skid pad; 18. adsorption hole; 19. suction pipe; 20. test component; 21. display; 22. box door; 23. observation window; 24. control panel. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0024] Example 1

[0025] refer to Figure 1-5 The laser diode chip testing equipment with air suction cleaning shown in the figure comprises a bottom plate 1, a box body 2 is installed on the top outer wall of the bottom plate 1, an air suction component is arranged at one end of the top outer wall of the box body 2, a fixing component is arranged at the middle position of the top outer wall of the bottom plate 1, the air suction component is adapted to the fixing component, a box door 22 is hingedly connected to the outer wall of the box body 2, an observation window 23 adapted thereto is arranged on the outer wall of the box door 22, a cleaning component is plugged into the inner wall of the box door 22, the cleaning component is located above the fixing component, the cleaning component is adapted to the fixing component, the air suction component comprises an installation groove opened on the outer wall of one side of the box body 2, an installation component is slidably installed on the inner wall of the installation groove The mounting frame 3 is an "L"-shaped structure, the mounting frame 3 is compatible with the box body 2, an air suction box 4 is welded to the outer wall of the top of the mounting frame 3, an air suction pipe 5 penetrating the mounting frame 3 is arranged on the top of the outer wall of one side of the air suction box 4, a collecting pipe 6 is installed at the end of the air suction pipe 5, and the outer wall of the collecting pipe 6 is provided with collecting troughs 7 distributed at equal distances, the end of the air suction pipe 5, the collecting pipe 6 and the collecting troughs 7 are all located inside the box body 2, an adsorption mesh box 8 is slidably inserted into the inner wall of the air suction box 4, a slot compatible with the adsorption mesh box 8 is opened on the outer wall of the air suction box 4, an exhaust pipe is arranged on the bottom of the outer wall of the air suction box 4 away from the air suction pipe 5, and an exhaust pump is installed on the outer wall of the exhaust pipe.

[0026] By means of the above structure: when working, open the box door 22, place the laser diode chip to be tested on the fixed component for fixing, after fixing, connect the cleaning component to the box door 22, and clean the chip fixed on the fixed component through the cleaning component. During cleaning, the dust attached to the chip will fly around. At this time, the exhaust pump starts to discharge the air in the suction box 4. The suction box 4 generates suction due to the negative pressure, and absorbs the dust floating inside the box body 2 through the collection groove 7. The dust enters the suction box 4 through the collection pipe 6 and the suction pipe 5, and the adsorption net box 8 adsorbs the dust impurities, thereby realizing the cleaning of the chip. Compared with the traditional air blowing cleaning mechanism, the dust after cleaning will not float inside the device, which can effectively prevent the dust in the air from adhering to the chip again and affecting the chip test.

[0027] like Figure 3 As shown, the cleaning component includes a control frame 9 inserted into the inner wall of the box door 22, an electric telescopic rod 10 is installed on the bottom outer wall of the control frame 9 by bolts, a control board 11 is installed on the end of the electric telescopic rod 10 by bolts, a control slot is opened inside the control board 11, a gear plate 12 is rotatably installed on the inner wall of the control slot, the gear plates 12 are meshed with each other, a cleaning plate 13 is installed on the bottom outer wall of the gear plate 12, and the cleaning plate 13 is provided with cleaning soft bristles, a servo motor 14 is installed on one end of the top outer wall of the control board 11 by bolts, and the output shaft of the servo motor 14 is connected to one of the gear plates 12. When cleaning the chip, the control frame 9 is connected to the box door 22, and the electric telescopic rod 10 drives the control board 11 to descend, so that the cleaning soft bristles at the bottom of the cleaning plate 13 contact the chip. At this time, the servo motor 14 drives one of the gear plates 12 to rotate. Since the gear plates 12 are meshed with each other, the rotation of one gear plate 12 can drive all the gear plates 12, so that the cleaning plate 13 rotates to clean the chip, thereby preventing dust and impurities on the chip from affecting the test accuracy.

[0028] Example 2

[0029] like Figure 2As shown, the fixing assembly includes a support plate 15 welded to the top of the bottom plate 1, a fixing plate 16 is slidably installed on the top of the support plate 15, an anti-skid pad 17 is arranged on the top of the fixing plate 16, the anti-skid pad 17 is adapted to the fixing plate 16, the thickness of the anti-skid pad 17 is less than the thickness of the fixing plate 16, a sealing pad is arranged on the top outer wall of the support plate 15 and the bottom outer wall of the fixing plate 16, an adsorption groove is arranged inside the support plate 15, and adsorption holes 18 are arranged on the anti-skid pad 17, the fixing plate 16 and the support plate 15, and the adsorption holes 18 are connected to the adsorption groove. A vacuum pipe 19 penetrating the bottom plate 1 is provided at the bottom of the adsorption groove, and a vacuum pump is installed on the vacuum pipe 19. When the chip is fixed, the fixing plate 16 is pulled out, and the chips to be tested are placed on the adsorption holes 18 in sequence, and then the fixing plate 16 is pushed back onto the support plate 15. Then the vacuum pump on the vacuum pipe 19 is started to extract the air in the adsorption groove. Therefore, the adsorption groove generates suction to adsorb the chip on the fixing plate 16 through the adsorption hole 18, so that the chip is kept stable while being tested, which is convenient for cleaning and testing of the chip.

[0030] like Figure 1 As shown, a test component 20 is provided on the inner wall at the top of the box body 2, and the test component 20 is adapted to the fixed component. A display 21 is installed on the outer wall at the top of the box body 2. The test component 20 is installed with a PLC controller through a wire, and the PLC controller is connected to the display 21 through a wire. A control panel 24 is installed on the top of the outer wall of the box body 2, and the control panel 24 is connected to the electrical components through a wire. After the chip is cleaned, the test component 20 detects the chip placed on the fixed plate 16, and the display 21 displays the test result of the test component, which is convenient for screening the chip.

[0031] How this utility works:

[0032] During operation, the box door 22 is opened, and the laser diode chip to be tested is placed on the fixing component for fixing. After the fixing is completed, the cleaning component is connected to the box door 22, and the chip fixed on the fixing component is cleaned through the cleaning component. During cleaning, the dust attached to the chip is scattered and floats. At this time, the exhaust pump is started to discharge the air in the suction box 4. The suction box 4 generates suction due to the negative pressure, and absorbs the dust floating inside the box body 2 through the collection groove 7. The dust enters the suction box 4 through the collection pipe 6 and the suction pipe 5, and the adsorption net box 8 adsorbs the dust impurities, thereby realizing the cleaning of the chip. Compared with the traditional air blowing cleaning mechanism, the dust after cleaning will not float inside the device, which can effectively prevent the dust in the air from being attached to the chip again and affecting the chip test.

[0033] When the chip is fixed, the fixing plate 16 is pulled out, and the chips to be tested are placed on the adsorption holes 18 in sequence, and then the fixing plate 16 is pushed back onto the support plate 15, and then the air pump on the air extraction pipe 19 is started to extract the air in the adsorption tank. Therefore, the adsorption tank generates suction to adsorb the chip on the fixing plate 16 through the adsorption holes 18, and the chip is kept stable while being tested, which is convenient for cleaning and testing of the chip;

[0034] When cleaning the chip, the control frame 9 is connected to the box door 22, and the electric telescopic rod 10 drives the control board 11 to descend, so that the cleaning soft hair at the bottom of the cleaning plate 13 contacts the chip. At this time, the servo motor 14 drives one of the gear plates 12 to rotate. Since the gear plates 12 are meshed with each other, the rotation of one gear plate 12 can drive all the gear plates 12, so that the cleaning plate 13 rotates to clean the chip, preventing dust and impurities on the chip from affecting the test accuracy;

[0035] After the chip is cleaned, the testing component 20 detects the chip placed on the fixing plate 16, and the display 21 displays the test result of the testing component to facilitate the screening of the chip.

[0036] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A laser diode chip testing device with air suction cleaning, comprising a base plate (1), characterized in that: The top outer wall of the bottom plate (1) is provided with a box body (2), one end of the top outer wall of the box body (2) is provided with an air suction component, a fixing component is provided at the middle position of the top outer wall of the bottom plate (1), the air suction component is matched with the fixing component, a box door (22) is hingedly connected to the outer wall of the box body (2), the outer wall of the box door (22) is provided with an observation window (23) matched with it, a cleaning component is inserted into the inner wall of the box door (22), the cleaning component is located above the fixing component, the cleaning component is matched with the fixing component, the air suction component includes a cover opened on one side of the outer wall of the box body (2) The mounting groove has a mounting frame (3) slidably mounted on the inner wall of the mounting groove, the mounting frame (3) is an "L"-shaped structure, the mounting frame (3) is compatible with the box body (2), an air suction box (4) is welded to the top outer wall of the mounting frame (3), an air suction pipe (5) penetrating the mounting frame (3) is arranged at the top of the outer wall of one side of the air suction box (4), a collecting pipe (6) is installed at the end of the air suction pipe (5), and the outer wall of the collecting pipe (6) is provided with collecting grooves (7) distributed at equal distances, and the end of the air suction pipe (5), the collecting pipe (6) and the collecting groove (7) are all located inside the box body (2).

2. The laser diode chip testing equipment with air intake cleaning according to claim 1, characterized in that: The inner wall of the suction box (4) is slidably connected with an adsorption net box (8), and the outer wall of the suction box (4) is provided with a slot adapted to the adsorption net box (8). An exhaust pipe is arranged at the bottom of the outer wall of the suction box (4) away from the suction pipe (5), and an exhaust pump is installed on the outer wall of the exhaust pipe.

3. The laser diode chip testing equipment with air intake cleaning according to claim 1, characterized in that: The cleaning assembly comprises a control frame (9) plugged into the inner wall of the box door (22); an electric telescopic rod (10) is installed on the outer wall of the bottom of the control frame (9) by means of bolts; a control panel (11) is installed on the end of the electric telescopic rod (10) by means of bolts; a control groove is provided inside the control panel (11); a gear plate (12) is rotatably installed on the inner wall of the control groove; the gear plates (12) are meshed with each other; a cleaning plate (13) is installed on the outer wall of the bottom of the gear plate (12); and the cleaning plate (13) is provided with cleaning soft bristles.

4. The laser diode chip testing equipment with air intake cleaning according to claim 3, characterized in that: A servo motor (14) is mounted on one end of the top outer wall of the control panel (11) via bolts, and an output shaft of the servo motor (14) is connected to one of the gear plates (12).

5. The laser diode chip testing equipment with air intake cleaning according to claim 1, characterized in that: The fixing assembly comprises a support plate (15) welded to the top of the base plate (1); a fixing plate (16) is slidably mounted on the top of the support plate (15); an anti-skid pad (17) is arranged on the top of the fixing plate (16); the anti-skid pad (17) is matched with the fixing plate (16); the thickness of the anti-skid pad (17) is less than the thickness of the fixing plate (16); and sealing pads are arranged on the top outer wall of the support plate (15) and the bottom outer wall of the fixing plate (16).

6. The laser diode chip testing equipment with air intake cleaning according to claim 5, characterized in that: The support plate (15) is provided with an adsorption groove inside, and the anti-slip pad (17), the fixing plate (16) and the support plate (15) are all provided with adsorption holes (18), the adsorption holes (18) lead into the adsorption groove, and the bottom of the adsorption groove is provided with an air extraction pipe (19) penetrating the bottom plate (1), and the air extraction pipe (19) is installed with an air extraction pump.

7. The laser diode chip testing equipment with air intake cleaning according to claim 1, characterized in that: A test component (20) is arranged on the inner wall at the top of the box (2), the test component (20) is adapted to the fixed component, a display (21) is installed on the outer wall at the top of the box (2), a PLC controller is installed on the test component (20) via a wire, the PLC controller is connected to the display (21) via a wire, and a control panel (24) is installed on the top of the outer wall of the box (2), the control panel (24) is connected to the electrical components via a wire.

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