LTCC filter testing device

Abstract

The utility model discloses an LTCC filter testing device, the testing device comprises a PCB for testing, a probe fixing device and a probe for testing, the probe for testing is fixedly arranged in the probe fixing device, and the probe for testing is located on the upper surface of the PCB for testing. During testing, the probe can be well matched with the heights of different pin electrodes of the LTCC filter, and the problems that the different pin electrodes of the LTCC filter are prone to inclination, poor in testing precision and conductive adhesive loss in the electrical performance testing process due to the plating thickness difference generated in the electroplating process are solved.

Description

Technical Field

[0001] The utility model discloses a testing device, in particular to a LTCC filter testing device. Background Art

[0002] LTCC (Low Temperature Co-fired Ceramic) filter is a high-frequency filter manufactured using low-temperature co-fired ceramic technology. This technology allows the ceramic substrate and the internal metal conductive layer to be sintered at a relatively low temperature (usually between 850°C and 900°C) to form a complex three-dimensional structure, which makes LTCC filters particularly suitable for applications that require miniaturization, high performance and multi-layer integrated circuits (ICs), such as in mobile communications, satellite communications, radar systems and other radio frequency (RF) and microwave applications.

[0003] After sintering, the electrode pins of the LTCC filter need to be electroplated for subsequent welding. However, the current LTCC filter products have uneven electrode pins after electroplating. Especially for multi-terminal products, the coplanarity of the electrode pins is poor. During the electrical performance test, the product is easily skewed, resulting in poor test stability and inaccurate test results. Summary of the invention

[0004] In view of the problem in the prior art mentioned above that the poor coplanarity of the electrode pins of the LTCC filter easily leads to poor test stability and inaccurate test results, the utility model provides a new LTCC filter testing device, which can connect the filter electrode pins and the test PCB board through probes, thereby solving the problems of easy tilting, poor test accuracy and conductive adhesive loss during the electrical performance test caused by the difference in plating thickness generated during the electroplating process of different pin electrodes of the LTCC filter.

[0005] The utility model solves the technical problem by adopting a technical solution: an LTCC filter testing device, the testing device comprising a testing PCB board, a probe fixing device and a testing probe, the testing probe is fixed in the probe fixing device, and the testing probe is located on the upper surface of the testing PCB board.

[0006] The technical solution adopted by the utility model to solve its technical problems further includes:

[0007] A microstrip line is provided on the PCB board.

[0008] The conductor layer thickness of the microstrip line on the PCB board is 0.02 mm; the conductor layer width of the microstrip line on the PCB board is 0.025 mm; the conductor layer of the microstrip line on the PCB board is covered on the surface of the microstrip line by immersion gold.

[0009] The substrate of the PCB board is a glass fiber board with a thickness of 1.0±0.05mm; the dielectric constant of the substrate of the PCB board is 4.4±0.2.

[0010] The outer edge thickness of the probe fixture is 4.45 mm, and the inner edge thickness of the probe fixture is 2.95 mm.

[0011] The probe fixing device is connected to the PCB board 1 via four positioning screws.

[0012] Four positioning cylinders are installed on the probe fixing device.

[0013] The total height of the probe is 3.3 mm, and the upper and lower telescopic heights of the probe are both 0.3 mm.

[0014] The beneficial effect of the utility model is that during testing, the probe can be well matched with the height of different pin electrodes of the LTCC filter, thereby solving the problem of easy tilting, poor test accuracy and conductive adhesive loss during electrical performance testing caused by different plating thicknesses during the electroplating process of different pin electrodes of the LTCC filter.

[0015] The utility model will be further described below in conjunction with the accompanying drawings and specific implementation methods. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of the top view of the structure of the LTCC filter testing device of the utility model.

[0017] Figure 2 This is a front view structural diagram of the LTCC filter testing device of the utility model.

[0018] Figure 3 This is a schematic diagram of the top view structure of the PCB board in the utility model.

[0019] Figure 4 This is a schematic diagram of the probe structure in the utility model.

[0020] Figure 5 It is a schematic diagram of the structure of the probe fixing device in the utility model.

[0021] In the figure, 1- PCB board, 2- probe fixture, 3- probe, 4- screw, 5- positioning cylinder. DETAILED DESCRIPTION

[0022] This embodiment is a preferred implementation mode of the utility model. Other embodiments whose principles and basic structures are the same or similar to those of this embodiment are within the protection scope of the utility model.

[0023] Please refer to the attached Figure 1 To Attachment Figure 5 The utility model protects a LTCC filter testing device, which mainly includes a testing PCB board 1, a probe fixing device 2 and a testing probe 3. The testing probe 3 is fixedly arranged in the probe fixing device 2, and the testing probe 3 is located on the upper surface of the testing PCB board 1; the LTCC filter is electrically connected to the PCB board 1 through the probe 3, and the probe 3 is retractable, which can avoid the unevenness of the LTCC filter electrode.

[0024] In this embodiment, a microstrip line is provided on the PCB board 1 for line conduction and signal transmission. The microstrip line design is specifically designed according to the internal circuit structure of the LTCC filter to be tested and the arrangement of the electrode pins. In this embodiment, the conductor layer thickness of the microstrip line on the PCB board 1 is 0.02 mm; the conductor layer line width of the microstrip line on the PCB board 1 is 0.025 mm; the conductor layer of the microstrip line on the PCB board 1 is covered on the surface of the microstrip line by immersion gold.

[0025] In this embodiment, the substrate of the PCB board 1 is a glass fiber board (ie, FR4) with a thickness of 1.0±0.05 mm; the dielectric constant of the substrate of the PCB board 1 is 4.4±0.2.

[0026] In this embodiment, the probe fixture 2 is made of 22*22mm square plastic, the outer edge thickness of the probe fixture 2 is 4.45mm, and the inner edge thickness of the probe fixture 2 is 2.95mm. In this embodiment, the inner edge of the probe fixture 2 is the location where the probe 3 is installed. The probe fixture 2 is connected to the PCB board 1 through four positioning screws 4, and the connection between the probe 3 and the PCB board 1 is ensured by the four positioning screws 4. In this embodiment, four positioning cylinders 5 are installed on the probe fixture 2, and the test position of the probe 3 and the test PCB board 1 is positioned by the four positioning cylinders 5.

[0027] In this embodiment, the total height of the selected probe 3 is 3.3 mm, and the upper and lower retractable heights of the probe 3 are both 0.3 mm. Preferably, the probe 3 is embedded in the probe fixture 2, and the upper side of the probe 3 protrudes 0.3 mm from the upper surface of the probe fixture 2, and is a retractable probe; the lower side of the probe 3 protrudes 0.15 mm from the lower surface of the probe fixture 2, and is a retractable probe.

[0028] The specific manufacturing process of PCB board 1 is as follows: according to the product impedance design of LTCC filter, the corresponding PCB board 1 is manufactured, and the PCB board with the same height as the microstrip line is manufactured. By measuring the height difference of each pin of the filter, the probe height that can be retracted is reversely calculated, and the probe 3 with an upper and lower retractable height of 0.3mm is obtained after calculation; the probe fixture 2 that fixes the probe 3 needs to be a 22*22mm square hollow plastic that can fix and clamp the probe 3 in the middle, leaving only the retractable probe head exposed; the outer edge thickness of the probe fixture 2 is 4.45mm, and the inner edge probe position thickness is 2.95mm.

[0029] The LTCC filter is electrically connected to the PCB board 1 through the probe 3. The probe 3 is retractable and can avoid the unevenness of the LTCC filter electrodes. During the test, the probe 3 can well match the height of the electrodes of different pins of the LTCC filter, and the LTCC filter does not tilt, which solves the problem of easy tilting, poor test accuracy and conductive glue loss during the electrical performance test caused by the difference in plating thickness of different pin electrodes of the LTCC filter during the electroplating process.

[0030] Those skilled in the art will recognize that many variations of the above description are possible, so the embodiments and drawings are only used to describe one or more specific implementations. Although exemplary embodiments that are considered to be exemplary of the present invention have been described and described, those skilled in the art will understand that various changes and substitutions can be made thereto. In addition, many modifications can be made to adapt specific situations to the teachings of the present invention without departing from the central concept of the present invention described herein. Therefore, the present invention is not limited to the specific embodiments disclosed herein, but the present invention may also include all embodiments and their equivalents that fall within the scope of the present invention.

Claims

1. A LTCC filter testing device, characterized in that: The testing device comprises a testing PCB board (1), a probe fixing device (2) and a testing probe (3); the testing probe (3) is fixedly arranged in the probe fixing device (2), and the testing probe (3) is located on the upper surface of the testing PCB board (1).

2. The LTCC filter testing device according to claim 1, characterized in that: A microstrip line is provided on the PCB board (1).

3. The LTCC filter testing device according to claim 2, characterized in that: The thickness of the conductor layer of the microstrip line on the PCB board (1) is 0.02 mm; the line width of the conductor layer of the microstrip line on the PCB board (1) is 0.025 mm; and the conductor layer of the microstrip line on the PCB board (1) is covered on the surface of the microstrip line by means of immersion gold.

4. The LTCC filter testing device according to claim 1, characterized in that: The substrate of the PCB board (1) is a glass fiber board with a thickness of 1.0±0.05 mm; the dielectric constant of the substrate of the PCB board (1) is 4.4±0.

2.

5. The LTCC filter testing device according to claim 1, characterized in that: The outer edge thickness of the probe fixing device (2) is 4.45 mm, and the inner edge thickness of the probe fixing device (2) is 2.95 mm.

6. The LTCC filter testing device according to claim 1, characterized in that: The probe fixing device (2) is connected to the PCB board 1 via four positioning screws (4).

7. The LTCC filter testing device according to claim 1, characterized in that: Four positioning cylinders (5) are installed on the probe fixing device (2).

8. The LTCC filter testing device according to claim 1, characterized in that: The total height of the probe (3) is 3.3 mm, and the upper and lower telescopic heights of the probe (3) are both 0.3 mm.

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