Liquid cooling device of server modularization system based on boron chip

Abstract

The utility model provides a liquid cooling device of a server modularization system based on a boron chip, which comprises a box body, a dustproof net is arranged in the box body, and a heat dissipation piece is arranged on one side of the box body. According to the liquid cooling device of the server modularization system based on the greenhouse chip provided by the utility model, the water pump is matched with the input pipe and the output pipe, so that cooling liquid in the water tank is conveyed into the shunting pipe and then is conveyed into the plurality of heat dissipation pipes through the shunting pipe; the cooling liquid in the water tank is circulated and the interior of the tank body is cooled by connecting a water inlet pipe through a shunt pipe connected with the other ends of the plurality of heat dissipation pipes, and meanwhile, the interior of the tank body is subjected to multi-layer heat dissipation through the plurality of heat dissipation pipes, so that the heat dissipation effect is improved, and the heat dissipation efficiency is improved. And the heat dissipation pieces are matched with the heat dissipation holes to conduct circulating heat dissipation on air in the box body, so that the heat dissipation effect is improved, and meanwhile heat dissipation can be conducted on the water tank.

Description

Technical Field

[0001] The utility model relates to the field of servers, and in particular to a liquid cooling device for a modular server system based on a Kunpeng chip. Background Art

[0002] A server is a type of computer that runs faster, has a higher load, and is more expensive than an ordinary computer. A server provides computing or application services to other clients on the network. A server has high-speed CPU computing power, long-term reliable operation, powerful I / O external data throughput capabilities, and better scalability.

[0003] Today's servers with Kunpeng chips are used for high-speed CPU computing power, long-term reliable operation, and powerful I / O external data throughput capabilities. However, multiple groups of servers are usually placed inside a larger room and cooled uniformly through central air conditioning. However, due to the large space inside the room, the heat dissipation effect is poor, resulting in high server temperatures and reduced operating efficiency.

[0004] Therefore, it is necessary to provide a liquid cooling device for a server modular system based on the Kunpeng chip to solve the above technical problems. Utility Model Content

[0005] The utility model provides a liquid cooling device for a modular server system based on the Kunpeng chip, which solves the problem of poor heat dissipation effect of existing servers.

[0006] In order to solve the above technical problems, the utility model provides a liquid cooling device for a server modular system based on Kunpeng chip, comprising:

[0007] A box body, wherein a dustproof net is arranged inside the box body, a heat sink is arranged on one side of the box body, a box door is rotatably connected inside the box body, and a plurality of heat dissipation holes are opened inside the box body;

[0008] A water tank, the water tank is arranged on one side of the box body, a baffle is fixedly connected to the inside of the water tank, an input pipe is fixedly installed inside the baffle, one end of the input pipe is fixedly connected to a water pump, an output pipe is fixedly installed at the output end of the water pump, and a water inlet pipe is arranged inside the water tank;

[0009] A shunt pipe is arranged at one end of the output pipe, and a heat dissipation pipe is arranged on the surface of the shunt pipe.

[0010] Preferably, one end of the input pipe is fixedly installed inside the baffle, and the other end is fixedly installed at the input end of the water pump.

[0011] Preferably, one end of the output pipe is fixedly mounted on the output end of the water pump, and the other end is fixedly mounted on the surface of the diversion pipe.

[0012] Preferably, a heat conducting rod is fixedly connected to the interior of the water tank, and a plurality of heat sinks are fixedly connected to the bottom of the water tank.

[0013] Preferably, a moving groove is provided inside the box body, and a moving rod is fixedly connected inside the moving groove.

[0014] Preferably, a moving block is slidably connected to the surface of the moving rod, and a return spring is sleeved on one end of the moving block and located on the surface of the moving rod.

[0015] Preferably, a cleaning brush is fixedly connected to one side of the moving block, and a connecting rope is fixedly connected to the surface of the cleaning brush.

[0016] Compared with the related art, the liquid cooling device of the server modular system based on Kunpeng chip provided by the utility model has the following beneficial effects:

[0017] The utility model provides a liquid cooling device for a modular server system based on Kunpeng chips. Through a water pump, an input pipe and an output pipe, the coolant inside a water tank is transported into the interior of a shunt pipe, and then transported into multiple heat dissipation pipes through the shunt pipe. The shunt pipe connected to the other ends of the multiple heat dissipation pipes is connected to the water inlet pipe to transport the coolant back to the interior of the water tank, so that the coolant inside the water tank is circulated to dissipate the heat inside the box. At the same time, multiple heat dissipation pipes are used to dissipate the heat inside the box in a multi-layer manner to increase the heat dissipation effect. The heat dissipation element cooperates with the heat dissipation holes to circulate the air inside the box to dissipate the heat, thereby increasing the heat dissipation effect while also dissipating the heat from the water tank. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 A schematic structural diagram of a first embodiment of a liquid cooling device for a modular server system based on a Kunpeng chip provided by the utility model;

[0019] Figure 2 for Figure 1 The schematic diagram of the overall structure of the device shown;

[0020] Figure 3 for Figure 1 The structural schematic diagram of the shunt tube shown;

[0021] Figure 4 for Figure 1 A schematic cross-sectional structural diagram of the overall device shown;

[0022] Figure 5 for Figure 1 A schematic cross-sectional view of the water tank shown;

[0023] Figure 6 A schematic structural diagram of a second embodiment of a liquid cooling device for a modular server system based on a Kunpeng chip provided by the utility model;

[0024] Figure 7 for Figure 6 Schematic diagram of the structure of the cleaning brush shown.

[0025] Numbers in the figure: 1. box body, 2. dustproof net, 3. water tank, 31. baffle, 32. input pipe, 33. water pump, 34. output pipe, 4. diverter pipe, 41. heat dissipation pipe, 5. water inlet pipe, 6. heat dissipation part, 7. heat sink, 8. heat conducting rod, 9. heat dissipation hole, 10. box door, 11. movable groove, 111. movable rod, 112. movable block, 113. reset spring, 12. cleaning brush, 13. connecting rope. DETAILED DESCRIPTION

[0026] The utility model is further described below in conjunction with the accompanying drawings and implementation modes.

[0027] First embodiment

[0028] Please refer to Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5 ,in, Figure 1 A schematic structural diagram of a first embodiment of a liquid cooling device for a modular server system based on a Kunpeng chip provided by the utility model; Figure 2 for Figure 1 The schematic diagram of the overall structure of the device shown; Figure 3 for Figure 1 The structural schematic diagram of the shunt tube shown; Figure 4 for Figure 1 A schematic cross-sectional structural diagram of the overall device shown; Figure 5 for Figure 1 A liquid cooling device for a server modular system based on a Kunpeng chip, comprising:

[0029] A box body 1, wherein a dust screen 2 is disposed inside the box body 1, a heat sink 6 is disposed on one side of the box body 1, a box door 10 is rotatably connected inside the box body 1, and a plurality of heat dissipation holes 9 are opened inside the box body 1;

[0030] A water tank 3, which is arranged at one side of the box body 1, a baffle 31 is fixedly connected to the inside of the water tank 3, an input pipe 32 is fixedly installed inside the baffle 31, one end of the input pipe 32 is fixedly connected to a water pump 33, an output pipe 34 is fixedly installed at the output end of the water pump 33, and a water inlet pipe 5 is arranged inside the water tank 3;

[0031] The shunt pipe 4 is arranged at one end of the output pipe 34 , and a heat dissipation pipe 41 is arranged on the surface of the shunt pipe 4 .

[0032] The heat sink 6 may be a fan for circulating the air inside the box 1 to dissipate heat.

[0033] The interior of the box body 1 is divided into multiple layers by partitions, which is used to perform layered heat dissipation on the interior of the box body 1, thereby increasing the heat dissipation effect.

[0034] Meanwhile, a plurality of partitions are fixedly provided with heat dissipation pipes 41 and are provided with a plurality of heat dissipation holes 9 inside.

[0035] One end of the input pipe 32 is fixedly installed inside the baffle 31 , and the other end is fixedly installed at the input end of the water pump 33 .

[0036] One end of the output pipe 34 is fixedly mounted on the output end of the water pump 33 , and the other end is fixedly mounted on the surface of the diverter pipe 4 .

[0037] Two shunt pipes 4 are fixedly connected to one side of the box body 1, and the surfaces of the two shunt pipes 4 are respectively fixedly installed on the two ends of the multiple heat dissipation tubes 41. One shunt pipe 4 is connected to one end of the output pipe 34, and the other shunt pipe 4 is connected to the water inlet pipe 5, so that the coolant is transported to the inside of one shunt pipe 4 through the output pipe 34 and enters the inside of the multiple heat dissipation tubes 41. Then, the coolant is transported back to the inside of the water tank 3 through the other shunt pipe 4 connected to the other end of the multiple heat dissipation tubes 41 in cooperation with the water inlet pipe 5.

[0038] A heat conducting rod 8 is fixedly connected to the interior of the water tank 3 , and a plurality of heat sinks 7 are fixedly connected to the bottom of the water tank 3 .

[0039] A plurality of heat-conducting rods 8 are fixedly installed inside the water tank 3 for pouring out the heat inside the coolant stored inside the water tank 3 and dissipating heat when air is blown to the plurality of heat sinks 7 through the heat sink 6 .

[0040] The working principle of the liquid cooling device of the server modular system based on Kunpeng chip provided by the utility model is as follows:

[0041] When in use, the input end of the water pump 33 is started to transport the coolant inside the water tank 3 into the inside of the output pipe 34 through the input pipe 32, and then transported into the inside of the diverter pipe 4 through the output pipe 34, and then transported into multiple heat dissipation pipes 41 through the diverter pipe 4. The diverter pipe 4 connected to the other end of the multiple heat dissipation pipes 41 is connected to the water inlet pipe 5 and transported back to the inside of the water tank 3, so that the coolant inside the water tank 3 is circulated and the inside of the box body 1 is cooled.

[0042] At the same time, the heat sink 6 is started to suck the internal air of the box 1 outward, and the external air is filtered through the dustproof net 2 and then passes through the heat dissipation holes 9 to dissipate heat to each layer inside the box 1. At the same time, the wind blown out by the heat sink 6 will dissipate heat to the water tank 3.

[0043] Compared with the related art, the liquid cooling device of the server modular system based on Kunpeng chip provided by the utility model has the following beneficial effects:

[0044] The utility model provides a liquid cooling device for a modular server system based on Kunpeng chip, which transports the coolant inside the water tank 3 into the inside of the shunt pipe 4 through a water pump 33 in cooperation with an input pipe 32 and an output pipe 34, and then transports the coolant through the shunt pipe 4 into multiple heat dissipation pipes 41, and then the shunt pipe 4 connected at the other end of the multiple heat dissipation pipes 41 is connected to the water inlet pipe 5 to transport the coolant back to the inside of the water tank 3, so that the coolant inside the water tank 3 is circulated, and the inside of the box body 1 is dissipated. At the same time, the inside of the box body 1 is dissipated in a multi-layer manner through multiple heat dissipation pipes 41 to increase the heat dissipation effect, and the air inside the box body 1 is circulated and dissipated through the heat dissipation member 6 in cooperation with the heat dissipation hole 9, thereby increasing the heat dissipation effect while also dissipating the water tank 3.

[0045] Second embodiment

[0046] Please refer to Figure 6 and Figure 7 Based on the first embodiment of the present application, a liquid cooling device for a server modular system based on a Kunpeng chip is provided. The second embodiment of the present application proposes another liquid cooling device for a server modular system based on a Kunpeng chip. The second embodiment is only a preferred method of the first embodiment, and the implementation of the second embodiment will not affect the independent implementation of the first embodiment.

[0047] Specifically, the second embodiment of the present application provides a liquid cooling device for a server modular system based on the Kunpeng chip, which is different in that a liquid cooling device for a server modular system based on the Kunpeng chip has a movable groove 11 provided inside the box body 1, and a movable rod 111 is fixedly connected to the inside of the movable groove 11.

[0048] Two moving grooves 11 are provided inside the box body 1 , and moving rods 111 are fixedly connected inside the two moving grooves 11 . Moving blocks 112 are slidably connected to the surfaces of the two moving rods 111 , and return springs 113 are sleeved on the surfaces of the two moving rods 111 .

[0049] A moving block 112 is slidably connected to the surface of the moving rod 111 , and a return spring 113 is sleeved on one end of the moving block 112 and located on the surface of the moving rod 111 .

[0050] A cleaning brush 12 is fixedly connected to one side of the moving block 112 , and a connecting rope 13 is fixedly connected to the surface of the cleaning brush 12 .

[0051] Two ends of the cleaning brush 12 are fixedly connected to one side of the two moving blocks 112 respectively.

[0052] One end of the connecting rope 13 is fixedly connected to one side of the cleaning brush 12 and the other end is fixedly connected to one end of the top of the box door 10 .

[0053] The working principle of the liquid cooling device of the server modular system based on Kunpeng chip provided by the utility model is as follows:

[0054] When in use, the box door 10 is opened by rotating it to one side, driving one end of the connecting rope 13 connected to the cleaning brush 12 to move to one side. When the cleaning brush 12 moves to one side, it drives the two moving blocks 112 to move to one side on the surface of the two moving rods 111 respectively, while squeezing the two return springs 113, so that the cleaning brush 12 cleans the dustproof net 2.

[0055] When the door 10 is closed, the two return springs 113 push the two moving blocks 112 to move and return to one side on the surfaces of the two moving rods 111 , thereby driving the cleaning brush 12 to return to its original position.

[0056] Compared with the related art, the liquid cooling device of the server modular system based on Kunpeng chip provided by the utility model has the following beneficial effects:

[0057] The utility model provides a liquid cooling device for a modular server system based on the Kunpeng chip. When the box door 10 is rotated to one side to open it, the connecting rope 13 connected to the cleaning brush 12 connected to two moving blocks 112 are driven to move to one side, so that the cleaning brush 12 cleans the dustproof net 2, thereby preventing the dustproof net 2 from being blocked.

[0058] The above description is only an embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the specification and drawings of the present invention, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A liquid cooling device for a server modular system based on Kunpeng chip, characterized in that: include: A box body, wherein a dustproof net is arranged inside the box body, a heat sink is arranged on one side of the box body, a box door is rotatably connected inside the box body, and a plurality of heat dissipation holes are opened inside the box body; A water tank, the water tank is arranged on one side of the box body, a baffle is fixedly connected to the inside of the water tank, an input pipe is fixedly installed inside the baffle, one end of the input pipe is fixedly connected to a water pump, an output pipe is fixedly installed at the output end of the water pump, and a water inlet pipe is arranged inside the water tank; A shunt pipe is arranged at one end of the output pipe, and a heat dissipation pipe is arranged on the surface of the shunt pipe.

2. According to claim 1, a liquid cooling device for a server modular system based on a Kunpeng chip is characterized in that: One end of the input pipe is fixedly installed inside the baffle, and the other end is fixedly installed at the input end of the water pump.

3. According to claim 1, a liquid cooling device for a server modular system based on a Kunpeng chip is characterized in that: One end of the output pipe is fixedly installed on the output end of the water pump, and the other end is fixedly installed on the surface of the diversion pipe.

4. According to claim 1, a liquid cooling device for a server modular system based on a Kunpeng chip is characterized in that: A heat-conducting rod is fixedly connected to the interior of the water tank, and a plurality of heat sinks are fixedly connected to the bottom of the water tank.

5. According to claim 1, a liquid cooling device for a server modular system based on a Kunpeng chip is characterized in that: A moving groove is provided inside the box body, and a moving rod is fixedly connected inside the moving groove.

6. According to claim 5, a liquid cooling device for a server modular system based on a Kunpeng chip is characterized in that: A moving block is slidably connected to the surface of the moving rod, and a return spring is sleeved on one end of the moving block and located on the surface of the moving rod.

7. The liquid cooling device of the server modular system based on Kunpeng chip according to claim 6 is characterized in that: A cleaning brush is fixedly connected to one side of the moving block, and a connecting rope is fixedly connected to the surface of the cleaning brush.

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