Air guide device of high-performance server

Abstract

The utility model provides an air guide device of a high-performance server, which comprises a case, one end of the case is provided with an air inlet cavity, the case is fixedly connected with a vertical plate at the air inlet cavity, a transverse plate is fixedly connected between the vertical plate and the case, one side of the air inlet cavity is provided with an air inlet hole, an air inlet fan is arranged in the air inlet cavity, and the transverse plate is fixedly connected with the vertical plate. And the vertical plate is fixedly connected with an air guide sleeve. The air inlet fan has the advantages that the air inlet fan is started, external air enters the air inlet cavity through the air inlet holes, and airflow further enters the air guide sleeve and then flows out of the air outlet. And the flowing-out gas acts on the electronic components in the case to dissipate heat of the electronic components. Part of airflow enters the air guide pipe through the air outlet head, and the air guide pipe can guide the airflow, so that the airflow can directly act on heating parts of the electronic components, and the heat dissipation effect of the electronic components is ensured. And the air guide device is used for accurately dissipating heat of each electronic element, so that quick heat dissipation and long-term use of the server are facilitated.

Description

Technical Field

[0001] The utility model relates to the technical field of server heat dissipation, in particular to an air guide device for a high-performance server. Background Art

[0002] The server provides computing or application services for other clients (such as PCs, smart phones, ATM terminals and even large devices such as train systems) in the network. It has high-speed CPU computing power, long-term reliable operation, strong external data throughput and better expansion performance. It is one of the most important equipment in the computer room. The safe and stable operation of the server is the basis for data transmission.

[0003] In order to ensure that the electronic components in the server are at a suitable operating temperature, an air guide device is often provided to dissipate heat. Existing air guide devices often use fans to directly dissipate heat in the chassis. However, the heating positions and heights of the electronic components are different, and the fan-driven air flow may not necessarily affect the heating position of the electronic components. Higher electronic components will also block the airflow and affect the heat dissipation of the electronic components behind. For this reason, an air guide device for a high-performance server is proposed for improvement. Utility Model Content

[0004] The purpose of the present invention is to solve at least one of the above technical deficiencies.

[0005] Therefore, one purpose of the present invention is to provide an air guide device for a high-performance server to solve the problems mentioned in the background technology and overcome the deficiencies in the prior art.

[0006] In order to achieve the above-mentioned purpose, an embodiment of the utility model on one side provides an air guide device for a high-performance server, comprising a chassis, an air inlet cavity is arranged at one end of the chassis, a vertical plate is fixedly connected to the chassis at the air inlet cavity, a horizontal plate is fixedly connected between the vertical plate and the chassis, an air inlet hole is opened on one side of the air inlet cavity, an inlet fan is arranged in the air inlet cavity, an air guide sleeve is fixedly connected to the vertical plate, a threading hole is opened on the vertical plate, an air outlet is opened at the air guide sleeve of the vertical plate, a plurality of air outlet heads are fixedly connected to the vertical plate, an air guide duct is threadedly connected to the air outlet head, and an air outlet hole is opened on the air guide duct;

[0007] The other end of the chassis is provided with an exhaust fan, and the other end of the chassis is provided with a plurality of connection holes.

[0008] Preferably, any of the above solutions is that the air inlet cavity is arranged at the front end of the chassis, and the horizontal plate is arranged at the lower part of the vertical plate.

[0009] Preferably, any of the above schemes has a plurality of air inlet holes which are evenly arranged at the front end of the chassis.

[0010] The above technical solution is adopted: the chassis provides installation space for server-related electronic components, and an air inlet cavity is set at one end of the chassis to allow external air to enter from one end of the chassis. The vertical plate and the horizontal plate divide the internal space of the chassis, wherein the internal space of the air inlet cavity provides installation space for air inlet components. The space below the horizontal plate provides installation space for power supply-related components, and the space above provides installation space for components such as the motherboard. An air inlet hole is opened on one side of the air inlet cavity to facilitate external air to enter the air inlet cavity. The air inlet hole can also block external impurities to prevent external impurities from entering the chassis.

[0011] Preferably, any of the above schemes has a plurality of inlet fans which are evenly arranged in the air inlet cavity, and the air guide sleeve has a conical structure.

[0012] Preferably, any of the above schemes is that the threading hole is provided in the middle of the vertical plate, and the air outlet is provided on the inner side of the vertical plate.

[0013] The above technical solution is adopted: the inlet fan can drive the gas flow, allowing the external gas to enter the air inlet cavity through the air inlet hole, and push the gas to further flow into the air guide sleeve. Several inlet fans are evenly arranged in the air inlet cavity, which can drive the airflow to flow in various places in the air inlet cavity. The air guide sleeve adopts a conical structure, which can guide the airflow and facilitate the airflow to flow into the chassis. The threading holes can be used for the connection between the electronic components on both sides of the vertical plate. The air outlet can allow the gas in the air guide sleeve to flow out into the chassis. The air outlet is opened on the inner side of the vertical plate, and the airflow flows out from the air outlet, which can blow close to the electronic components in the chassis to improve the heat dissipation efficiency.

[0014] Preferably, any of the above schemes is that the air outlet is arranged through the vertical plate, and a thread is provided on the outer side of the air outlet.

[0015] Preferably, any of the above schemes is that the air duct adopts an L-shaped structure, and there are a plurality of air outlet holes which are evenly arranged along the air duct.

[0016] The above technical solution is adopted: the air outlet head can provide gas circulation, and a thread is provided on the outer side thereof to facilitate its connection with the air duct. The air duct can guide the airflow so that the airflow can directly act on the heating part of the electronic components to ensure the heat dissipation effect of each electronic component. The air duct adopts an L-shaped structure to facilitate it to guide the airflow to the heating part of the electronic components. An air outlet hole is provided on the air duct, and several air outlet holes are evenly arranged along the air duct, so that the air can be discharged from multiple places of the air duct and promote further flow of gas. The exhaust fan drives the gas in the chassis to flow to the outside to accelerate the discharge of heat.

[0017] Compared with the prior art, the advantages and beneficial effects of the utility model are:

[0018] 1. The air guide device of the high-performance server is provided with an air inlet cavity, a vertical plate, an air inlet fan, an air guide sleeve, an air outlet, an air outlet head, an air guide duct, an air outlet hole and other structures. When performing heat dissipation work, the air inlet fan is started, and the outside gas enters the air inlet cavity through the air inlet hole, and the air flow further enters the air guide sleeve, and then flows out from the air outlet. The outflowing gas acts on the electronic components in the chassis to dissipate the heat of the electronic components. Part of the air flow enters the air guide duct through the air outlet head, and the air guide duct can guide the air flow so that the air flow can directly act on the heating part of the electronic components to ensure the heat dissipation effect of each electronic component. The air guide device accurately dissipates the heat of each electronic component, which is conducive to the rapid heat dissipation and long-term use of the server.

[0019] 2. The air guide device of the high-performance server is provided with a plurality of inlet fans, which are evenly arranged in the air inlet cavity, and can drive the airflow to flow in various places in the air inlet cavity. The air outlet is opened on the inner side of the vertical plate, and the airflow flows out from the air outlet, and can blow close to the electronic components in the chassis to improve the heat dissipation efficiency. The air guide duct adopts an L-shaped structure, which is convenient for it to guide the airflow to the heating part of the electronic components. The air outlet holes are opened on the air guide duct, and the plurality of air outlet holes are evenly arranged along the air guide duct, so that the air can be discharged from multiple places of the air guide duct, and the further flow of gas can be promoted.

[0020] Additional aspects and advantages of the present invention will be given in part in the following description and in part will become apparent from the following description or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0022] Figure 1 This is a schematic diagram of the structure of the utility model from a first perspective;

[0023] Figure 2 This is a schematic diagram of the structure of the utility model from a second viewing angle;

[0024] Figure 3 This is a schematic diagram of the structure of the utility model from a third viewing angle;

[0025] Figure 4 This is a schematic structural diagram of the fourth viewing angle of the present utility model.

[0026] In the figure: 1-chassis, 2-air inlet cavity, 3-vertical plate, 4-horizontal plate, 5-air inlet hole, 6-inlet fan, 7-air guide sleeve, 8-threading hole, 9-air outlet, 10-air outlet head, 11-air guide duct, 12-air outlet hole, 13-exhaust fan, 14-connection hole. DETAILED DESCRIPTION

[0027] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0028] In the present invention, unless otherwise clearly specified and limited, the terms "install", "connect", "connect", "fix" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0029] like Figures 1 to 4 As shown, the utility model comprises a chassis 1, an air inlet cavity 2 is arranged at one end of the chassis 1, a vertical plate 3 is fixedly connected to the air inlet cavity 2 of the chassis 1, a horizontal plate 4 is fixedly connected between the vertical plate 3 and the chassis 1, an air inlet hole 5 is opened on one side of the air inlet cavity 2, an inlet fan 6 is arranged in the air inlet cavity 2, an air guide sleeve 7 is fixedly connected to the vertical plate 3, a threading hole 8 is opened on the vertical plate 3, an air outlet 9 is opened at the air guide sleeve 7 of the vertical plate 3, a plurality of air outlet heads 10 are fixedly connected to the vertical plate 3, an air guide duct 11 is threadedly connected to the air outlet head 10, and an air outlet hole 12 is opened on the air guide duct 11;

[0030] An exhaust fan 13 is disposed at the other end of the chassis 1 , and a plurality of connection holes 14 are opened at the other end of the chassis 1 .

[0031] Embodiment 1: The air inlet chamber 2 is arranged at the front end of the chassis 1, and the horizontal plate 4 is arranged at the lower part of the vertical plate 3. There are several air inlet holes 5 that are evenly arranged at the front end of the chassis 1. The chassis 1 provides installation space for server-related electronic components, and the air inlet chamber 2 is arranged at one end of the chassis 1 to allow external air to enter from one end of the chassis 1. The vertical plate 3 and the horizontal plate 4 divide the internal space of the chassis 1, wherein the internal space of the air inlet chamber 2 provides installation space for air inlet components. The space below the horizontal plate 4 provides installation space for power supply-related components, and the upper space provides installation space for components such as the motherboard. An air inlet hole 5 is opened on one side of the air inlet chamber 2 to facilitate external air to enter the air inlet chamber 2. The air inlet hole 5 can also block external impurities to prevent external impurities from entering the chassis 1.

[0032] Embodiment 2: There are several inlet fans 6 and they are evenly arranged in the air inlet cavity 2, and the air guide sleeve 7 adopts a conical structure. The threading hole 8 is opened in the middle of the vertical plate 3, and the air outlet 9 is opened on the inner side of the vertical plate 3. The inlet fan 6 can drive the gas flow, allowing the external gas to enter the air inlet cavity 2 through the air inlet hole 5, and push the gas to further flow into the air guide sleeve 7. Several inlet fans 6 are evenly arranged in the air inlet cavity 2, which can drive the airflow to flow in various places in the air inlet cavity 2. The air guide sleeve 7 adopts a conical structure, which can guide the airflow and facilitate the airflow to flow into the chassis 1. The threading hole 8 can be used for the connection between the electronic components on both sides of the vertical plate 3 to pass through. The air outlet 9 can allow the gas in the air guide sleeve 7 to flow out into the chassis 1. The air outlet 9 is opened on the inner side of the vertical plate 3, and the airflow flows out from the air outlet 9, which can be blown close to the electronic components in the chassis 1 to improve the heat dissipation efficiency.

[0033] Embodiment 3: The air outlet 10 is arranged through the vertical plate 3, and a thread is provided on the outer side of the air outlet 10. The air duct 11 adopts an L-shaped structure, and there are several air outlet holes 12 evenly arranged along the air duct 11. The air outlet 10 can provide gas circulation, and a thread is provided on the outer side thereof to facilitate its connection with the air duct 11. The air duct 11 can guide the airflow so that the airflow can directly act on the heating part of the electronic components to ensure the heat dissipation effect of each electronic component. The air duct 11 adopts an L-shaped structure, which is convenient for it to guide the airflow to the heating part of the electronic components. Air outlet holes 12 are provided on the air duct 11, and several air outlet holes 12 are evenly arranged along the air duct 11, so that air can be discharged from multiple places of the air duct 11, thereby promoting further flow of gas. The exhaust fan 13 drives the gas in the chassis 1 to flow to the outside to accelerate the discharge of heat.

[0034] The working principle of the utility model is as follows:

[0035] S1, start the air inlet fan 6 and the exhaust fan 13, the external air enters the air inlet cavity 2 through the air inlet hole 5, the airflow further enters the air guide sleeve 7, and then flows out from the air outlet 9. The outflowing air acts on the electronic components in the chassis 1 to dissipate heat for the electronic components;

[0036] S2, the outflowing gas acts on the electronic components in the chassis 1 to dissipate heat for the electronic components. Part of the airflow passes through the air outlet 10 and enters the air duct 11. The air duct 11 can guide the airflow so that the airflow can directly act on the heating part of the electronic components to ensure the heat dissipation effect of each electronic component;

[0037] S3. The exhaust fan 13 drives the gas in the chassis 1 to flow to the outside, accelerating the discharge of heat.

[0038] Compared with the prior art, the present invention has the following beneficial effects:

[0039] 1. The air guide device of the high-performance server is provided with an air inlet chamber 2, a vertical plate 3, an air inlet fan 6, an air guide sleeve 7, an air outlet 9, an air outlet head 10, an air guide duct 11, an air outlet hole 12 and other structures. When heat dissipation is performed, the air inlet fan 6 is started, and the outside air enters the air inlet chamber 2 through the air inlet hole 5. The airflow further enters the air guide sleeve 7 and then flows out from the air outlet 9. The outflowing gas acts on the electronic components in the chassis 1 to dissipate heat for the electronic components. Part of the airflow enters the air guide duct 11 through the air outlet head 10. The air guide duct 11 can guide the airflow so that the airflow can directly act on the heating part of the electronic components to ensure the heat dissipation effect of each electronic component. The air guide device accurately dissipates heat for each electronic component, which is beneficial to the rapid heat dissipation and long-term use of the server.

[0040] 2. The air guide device of the high-performance server is provided with a plurality of inlet fans 6, which are evenly arranged in the air inlet chamber 2, and can drive the airflow to flow in various places in the air inlet chamber 2. The air outlet 9 is provided on the inner side of the vertical plate 3, and the airflow flows out from the air outlet 9, and can blow close to the electronic components in the chassis 1 to improve the heat dissipation efficiency. The air guide 11 adopts an L-shaped structure, which is convenient for it to guide the airflow to the heating part of the electronic components. The air outlet holes 12 are provided on the air guide 11, and the plurality of air outlet holes 12 are evenly arranged along the air guide 11, so that the air can be discharged from multiple places of the air guide 11, and the further flow of gas can be promoted.

Claims

1. An air guide device for a high-performance server, comprising a chassis (1); characterized in that: An air inlet cavity (2) is provided at one end of the chassis (1); a vertical plate (3) is fixedly connected to the air inlet cavity (2) of the chassis (1); a horizontal plate (4) is fixedly connected between the vertical plate (3) and the chassis (1); an air inlet hole (5) is provided on one side of the air inlet cavity (2); an air inlet fan (6) is provided in the air inlet cavity (2); an air guide sleeve (7) is fixedly connected to the vertical plate (3); a threading hole (8) is provided on the vertical plate (3); an air outlet (9) is provided on the air guide sleeve (7) of the vertical plate (3); a plurality of air outlet heads (10) are fixedly connected to the vertical plate (3); an air guide pipe (11) is threadedly connected to the air outlet head (10); and an air outlet hole (12) is provided on the air guide pipe (11); An exhaust fan (13) is provided at the other end of the chassis (1), and a plurality of connection holes (14) are opened at the other end of the chassis (1).

2. The air guide device for a high-performance server according to claim 1, characterized in that: The air inlet chamber (2) is arranged at the front end of the chassis (1), and the horizontal plate (4) is arranged at the lower part of the vertical plate (3).

3. The air guide device for a high-performance server according to claim 2, characterized in that: There are a plurality of air inlet holes (5) which are evenly arranged at the front end of the chassis (1).

4. The air guide device for a high-performance server according to claim 3, characterized in that: There are a plurality of air inlet fans (6) which are evenly arranged in the air inlet cavity (2), and the air guide sleeve (7) has a conical structure.

5. The air guide device for a high-performance server according to claim 4, characterized in that: The threading hole (8) is provided in the middle of the vertical plate (3), and the air outlet (9) is provided on the inner side of the vertical plate (3).

6. The air guide device for a high-performance server according to claim 5, characterized in that: The air outlet head (10) is arranged to penetrate the vertical plate (3), and a thread is provided on the outer side of the air outlet head (10).

7. The air guide device for a high-performance server according to claim 6, characterized in that: The air guide pipe (11) adopts an L-shaped structure, and there are a plurality of air outlet holes (12) which are evenly arranged along the air guide pipe (11).

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