Middle frame and electronic equipment

Abstract

The utility model discloses a middle frame and electronic equipment, relates to the technical field of electronic products, and can ensure that the electronic equipment has better heat dissipation performance while increasing the battery capacity and reducing the thickness of the electronic equipment. Wherein the middle frame comprises a middle plate main body and a heat dissipation structure, the middle plate main body comprises a first top surface and a first bottom surface which are back to back in a first direction, a through hole is formed in the middle plate main body, and the through hole penetrates through the first bottom surface and a second surface; the heat dissipation structure is arranged in the through hole, the heat dissipation structure comprises a second top surface and a second bottom surface which are back to back, the second bottom surface and the first bottom surface face the same direction, the second bottom surface comprises a first area and a second area, and the second area is sunken towards the second top surface relative to the first area; wherein the first area is in heat conduction connection with a heating device, and the second area is used for fixing a battery.

Description

Technical Field

[0001] The present application relates to the technical field of electronic products, and in particular to a middle frame and an electronic device. Background Art

[0002] Electronic devices such as mobile phones and tablets are constantly developing in the direction of being thinner and lighter with longer battery life. The thickness of electronic devices is designed to be thinner and thinner, and the volume of batteries is designed to be larger and larger. However, with the improvement of the performance of electronic devices, the power density of heating devices (such as chips) is also gradually increasing, and the heating problem of electronic devices is becoming more and more prominent. How to solve the contradiction between the heat dissipation efficiency of heating devices and the thickness of electronic devices and the large-capacity design of batteries is one of the technical problems that need to be solved urgently. Utility Model Content

[0003] The present application provides a middle frame and an electronic device, which can increase the battery capacity and reduce the thickness of the electronic device while ensuring that the electronic device has good heat dissipation performance.

[0004] In order to achieve the above objectives, this application adopts the following technical solutions:

[0005] In the first aspect, the present application provides a middle frame, which includes a middle plate body and a heat dissipation structure, the middle plate body includes a first top surface and a first bottom surface opposite to each other in a first direction, and a through hole is provided on the middle plate body, and the through hole penetrates the first bottom surface and the first top surface; the heat dissipation structure is arranged in the through hole, and the heat dissipation structure includes a second top surface and a second bottom surface opposite to each other, the orientation of the second bottom surface is the same as that of the first bottom surface, the second bottom surface includes a first area and a second area, and the second area is recessed relative to the first area toward the second top surface; wherein the first area is used for thermal conduction connection with the heating device, and the second area is used for fixing the battery.

[0006] In this way, by setting the first area and the second area on the heat dissipation structure, the heat on the heating device can be quickly transferred to the second area (also known as the cold area) corresponding to the battery in the heat dissipation structure through the first area corresponding to the heating device in the heat dissipation structure (also known as the heat source area), which is conducive to reducing the thermal resistance between the heat source area and the cold area, and can improve the heat dissipation efficiency of the heating device. At the same time, since the second area is concave toward the second top surface relative to the first area, it is not only conducive to reducing the thickness of the part corresponding to the second area in the heat dissipation structure, but also can reduce the superposition thickness of the heat dissipation structure and the battery, so that the battery capacity can be increased under the premise of a certain volume and thickness of the electronic device, and the thin and light design of the electronic device and the large capacity design of the battery can be realized; it is also conducive to reducing the distance between the heating device and the heat dissipation structure, so as to shorten the heat conduction path between the heating device and the heat dissipation structure, and can improve the heat exchange efficiency between the heating device and the heat dissipation structure, and thus can improve the heat dissipation efficiency of the heating device.

[0007] In a possible implementation of the first aspect, there are multiple first regions, and the distances between at least two of the multiple first regions and the second top surface are different. In this way, the heat dissipation structure can be connected to the multiple heat-generating devices respectively by thermal conduction through the multiple first regions, which can meet the heat dissipation requirements of heat-generating devices at different heights and adapt to the stacking environment of the heat-generating devices.

[0008] In a possible implementation of the first aspect, the second area is recessed relative to the first bottom surface toward the first top surface. In this way, the thickness of the portion of the heat dissipation structure corresponding to the second area can be further reduced, and at least a portion of the battery compartment can be defined between the heat dissipation structure and the middle plate body, thereby facilitating further expansion of the battery assembly space and facilitating further reduction of the stacked thickness of the middle plate and the battery, thereby further increasing the battery capacity while reducing the thickness of the electronic device.

[0009] In a possible implementation of the first aspect, the heat dissipation structure includes a first heat dissipation portion and a second heat dissipation portion arranged in a second direction, the second direction is perpendicular to the first direction, the first area is formed in the first heat dissipation portion, and the second area is formed in the second heat dissipation portion; at least a portion of the second heat dissipation portion and at least a portion of the first heat dissipation portion are formed as an integral structural member. That is, at least a portion of the second heat dissipation portion is integrally formed with at least a portion of the first heat dissipation portion. In this way, the contact thermal resistance between the first heat dissipation portion and the second heat dissipation portion can be further reduced, so that the heat absorbed by the first heat dissipation portion can be quickly transferred to the second heat dissipation portion, so that the heat on the heating device can be quickly diffused to the second area through the first area of ​​the heat dissipation structure, which can further improve the heat dissipation efficiency of the heating device.

[0010] In a possible implementation of the first aspect, the first heat dissipation portion includes a first shell and a first cooling medium, a first cooling cavity is formed in the first shell, and the first cooling medium is arranged in the first cooling cavity. In this way, the heat on the heating device can be transferred to the first cooling medium through the first shell, and the heat generated by the heating device can be absorbed by the first cooling medium. Since the fluidity of the first cooling medium is usually good, it is beneficial to improve the heat exchange efficiency between the first cooling medium and the heating device, thereby improving the heat dissipation efficiency of the heating device. In addition, by arranging the first cooling cavity in the first heat dissipation portion, it is beneficial to increase the depth of the first cooling cavity, thereby increasing the volume of the first cooling cavity, ensuring that the first heat dissipation portion has good heat dissipation performance, and further increasing the heat exchange efficiency between the heating device and the heat dissipation structure, and also helping to reduce the thickness of the second heat dissipation portion, which is beneficial to further expand the assembly space of the battery, thereby increasing the volume of the battery and realizing a large-capacity design of the battery. In addition, it is also beneficial to reduce the processing difficulty of the heat dissipation structure, thereby reducing the cost of the heat dissipation structure.

[0011] In a possible implementation manner of the first aspect, the first cooling medium is water, ethylene glycol solution, propylene glycol solution, fluorinated liquid or liquid metal.

[0012] In a possible implementation manner of the first aspect, a thermal conductivity coefficient of the first cooling medium is greater than a thermal conductivity coefficient of the first shell.

[0013] In a possible implementation of the first aspect, the first heat dissipation portion includes a first capillary structure, the first capillary structure is disposed in a first cooling cavity, and the first cooling cavity is a vacuum cavity. That is, the first heat dissipation portion includes a heat spreader. In this way, the heat absorbed by the first heat dissipation portion can be evenly distributed to the entire first heat dissipation portion, so that the heat absorbed by the first heat dissipation portion can be quickly dissipated to the second heat dissipation portion, thereby improving the heat dissipation performance of the middle frame and the electronic device.

[0014] In a possible implementation of the first aspect, the first housing includes a first cover body and a second cover body arranged in a first direction, a first cooling cavity is defined between the first cover body and the second cover body, and the first area is formed on a surface of the second cover body away from the first cover body; at least a portion of the second heat dissipation portion is formed as an integral structural member with the first cover body. That is, at least a portion of the second heat dissipation portion is integrally formed with the first cover body. A specific structure of a heat dissipation structure is provided.

[0015] In a possible implementation of the first aspect, the first heat dissipation portion includes a carrier plate, the first shell and the carrier plate are stacked in a first direction, and the first area is formed on the surface of the first shell facing away from the carrier plate; at least a portion of the second heat dissipation portion is formed as an integral structure with the carrier plate. That is, at least a portion of the second heat dissipation portion is formed integrally with the carrier plate. In this way, after the first heat dissipation portion absorbs the heat of the heating device, it can be quickly transferred to the carrier plate, and then quickly diffused from the carrier plate to the second heat dissipation portion. As a result, the thermal resistance between the first area and the second area can be reduced, so that the heat on the heating device can be quickly diffused to the cold area through the heat source area of ​​the heat dissipation structure.

[0016] In a possible implementation of the first aspect, the second heat dissipation portion is a metal plate. In this way, the second heat dissipation portion can be reduced in thickness while ensuring that the second heat dissipation portion has a high structural strength, thereby facilitating an increase in the capacity of the battery, and realizing a large-capacity battery design while reducing the thickness of the electronic device.

[0017] In a possible implementation of the first aspect, the second heat dissipation portion includes a second housing and a second cooling medium, a second cooling cavity is formed in the second housing, and the second cooling medium is disposed in the second cooling cavity. In this way, the heat exchange efficiency between the battery and the second heat dissipation portion can be improved, thereby further improving the heat dissipation efficiency of the heating device.

[0018] In a possible implementation of the first aspect, the heat dissipation structure includes a third heat dissipation portion and a fourth heat dissipation portion arranged in a first direction, the fourth heat dissipation portion protrudes from a side surface of the third heat dissipation portion, the first area is formed on a surface of the fourth heat dissipation portion facing away from the third heat dissipation portion, and the second area is formed on the third heat dissipation portion; the third heat dissipation portion includes a third shell and a third cooling medium, a third cooling cavity is formed in the third shell, and the third cooling medium is arranged in the third cooling cavity.

[0019] Since the third heat dissipation part and the fourth heat dissipation part are arranged in the first direction, it is beneficial to increase the heat conduction area between the third heat dissipation part and the fourth heat dissipation part, and therefore, it is beneficial to reduce the contact thermal resistance between the third heat dissipation part and the fourth heat dissipation part. In this way, the heat on the heating device can be quickly transferred to the third heat dissipation part through the fourth heat dissipation part, which can reduce the thermal resistance between the first area and the second area, so that the heat on the heating device can be quickly diffused from the heat source area of ​​the heat dissipation structure to the cold area, thereby improving the heat dissipation efficiency of the heating device. At the same time, by setting a third cooling cavity in the third heat dissipation part, it is beneficial to improve the heat exchange efficiency between the battery and the third heat dissipation part, thereby further improving the heat dissipation efficiency of the heating device.

[0020] In a possible implementation manner of the first aspect, the fourth heat dissipation unit is a metal block, a heat spreader, or a heat pipe. A specific structure of the fourth heat dissipation unit is provided.

[0021] In a possible implementation of the first aspect, the third housing includes a third cover and a fourth cover arranged in the first direction, a third cooling cavity is defined between the third cover and the fourth cover, the fourth heat dissipation portion is located on a side of the third cover away from the fourth cover, and at least a portion of the fourth heat dissipation portion is formed as an integral structural member with the third cover. That is, at least a portion of the fourth heat dissipation portion is integrally formed with the third cover.

[0022] In a possible implementation of the first aspect, an orthographic projection of the third cooling cavity on the reference plane overlaps an orthographic projection of the fourth heat dissipation portion on the reference plane. The reference plane is perpendicular to the first direction. This is conducive to improving the heat exchange efficiency between the fourth heat dissipation portion and the third heat dissipation portion, thereby improving the heat dissipation performance of the heat dissipation structure and improving the heat dissipation efficiency of the heat-generating device.

[0023] In a possible implementation of the first aspect, the heat dissipation structure includes a fifth shell and a fifth cooling medium, a fifth cooling cavity is formed in the fifth shell, and the fifth cooling medium is arranged in the fifth cooling cavity; the fifth shell includes a first wall plate and a second wall plate opposite to each other in a first direction, the first wall plate includes a main body and a protrusion, the protrusion is connected to the main body, and the protrusion is arched relative to the main body in a direction away from the second wall plate, the first area is formed on the surface of the protrusion away from the second wall plate, and the second area is formed on the surface of the main body away from the second wall plate. Provide another specific structure of the heat dissipation structure. In this way, the thermal resistance between the first area and the second area can also be reduced, so that the heat on the heating device can be quickly diffused from the heat source area of ​​the heat dissipation structure to the cooling, and the light and thin design of the electronic device can be achieved while increasing the battery capacity.

[0024] In a possible implementation of the first aspect, the main body and the raised portion are an integral structural member, that is, the main body and the raised portion are integrally formed.

[0025] In a possible implementation of the first aspect, the heat dissipation structure includes a fifth capillary structure, the fifth capillary structure is disposed in a fifth cooling cavity, and the fifth cooling cavity is a vacuum cavity. That is, the heat dissipation structure is a heat spreader of unequal thickness. In this way, the thermal resistance between the first area and the second area can be further reduced, so that the heat on the heating device can be quickly diffused from the heat source area of ​​the heat dissipation structure to the cooling area, and the light and thin design of the electronic device can be achieved while increasing the battery capacity.

[0026] In a possible implementation of the first aspect, the heat dissipation structure includes a first metal member, the middle plate body includes a second metal member, and the strength of the first metal member is greater than the strength of the second metal member. In this way, the structural strength of the heat dissipation structure can be improved, which is conducive to improving the overall structural strength of the middle plate and the middle frame, thereby improving the fracture resistance and impact resistance of the middle plate and the middle frame, and further improving the safety performance of the battery.

[0027] In a possible implementation manner of the first aspect, the first metal part is a stainless steel part, a titanium alloy part, a high-modulus aluminum part, a copper part, or a copper alloy part.

[0028] In a possible implementation manner of the first aspect, the first metal part is a composite part formed by laminating two metal plates of different materials.

[0029] In a possible implementation manner of the first aspect, the second metal part is an aluminum alloy part or a magnesium-aluminum alloy part.

[0030] In a possible implementation of the first aspect, the spacing between the first region and the second top surface is greater than or equal to 0.1 mm and less than or equal to 0.25 mm. This is conducive to increasing the thickness of the first heat dissipation portion, ensuring that the first heat dissipation portion has good heat dissipation performance, and further conducive to increasing the heat exchange efficiency between the heating device and the heat dissipation structure, and improving the heat dissipation performance of the middle frame and the electronic device.

[0031] In a possible implementation of the first aspect, the spacing between the second region and the second top surface is greater than or equal to 0.2 mm and less than or equal to 0.4 mm. In this way, the thickness of the second heat dissipation portion can be reduced while ensuring that the second heat dissipation portion has a high structural strength, which is conducive to further expanding the assembly space of the battery, thereby further increasing the volume of the battery, and realizing a large-capacity design of the battery while reducing the thickness of the electronic device.

[0032] In a possible implementation of the first aspect, the middle frame further includes a frame and a back cover, the frame is fixedly connected to the outer edge of the middle plate body; the back cover is fixedly connected to the frame, and the back cover is spaced apart from the middle plate body in the first direction. A specific structure of the middle frame is provided.

[0033] In a second aspect, the present application provides an electronic device, including a middle frame, a heating device and a battery, wherein the middle frame is the middle frame in any of the above technical solutions; the heating device is thermally connected to the first area; and the battery is fixedly connected to the second area.

[0034] In a possible implementation of the second aspect, the battery includes a fixed end face facing the second region, and the orthographic projection of the fixed end face on the first bottom surface is located within the orthographic projection of the first region on the first bottom surface. In this way, on the one hand, it is beneficial to increase the heat conduction area between the battery and the heat dissipation structure, thereby facilitating the improvement of the heat exchange efficiency between the battery and the heat dissipation structure, and facilitating the improvement of the heat dissipation efficiency of the heating device and the battery, and on the other hand, it is also beneficial to improve the connection reliability between the battery and the heat dissipation structure, and can improve the stability of the assembly position of the battery.

[0035] Among them, the technical effects brought about by any implementation method in the second aspect can refer to the technical effects brought about by different implementation methods in the first aspect, and will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 A three-dimensional diagram of an electronic device in an unfolded state provided by some embodiments of the present application;

[0037] Figure 2 for Figure 1 A schematic diagram of an electronic device shown in a folded state;

[0038] Figure 3 for Figure 1The electronic device shown is a top view with the screen hidden;

[0039] Figure 4 for Figure 1 A schematic diagram of a partial structure of the electronic device shown;

[0040] Figure 5 for Figure 4 A cross-sectional view of the electronic device shown along line AA;

[0041] Figure 6 Cross-sectional views of electronic devices provided for other embodiments of the present application;

[0042] Figure 7 A cross-sectional view of an electronic device provided in some other embodiments of the present application;

[0043] Figure 8 for Figure 6 A top view of the heat dissipation structure shown;

[0044] Fig. 9 for Figure 8 A cross-sectional view of the heat dissipation structure shown at line BB;

[0045] Fig.10 for Figure 7 An exploded view of a middle frame in the electronic device shown;

[0046] Fig.11 A cross-sectional view of a heat dissipation structure provided in some other embodiments of the present application;

[0047] Fig.12 A cross-sectional view of a heat dissipation structure provided in some other embodiments of the present application;

[0048] Fig.13 A cross-sectional view of a heat dissipation structure provided in some other embodiments of the present application;

[0049] Fig.14 A cross-sectional view of a heat dissipation structure provided in some other embodiments of the present application;

[0050] Fig.15 A cross-sectional view of a heat dissipation structure provided in some other embodiments of the present application;

[0051] Fig.16 A cross-sectional view of a heat dissipation structure provided in some other embodiments of the present application;

[0052] Fig.17 A cross-sectional view of a heat dissipation structure provided in some other embodiments of the present application;

[0053] Fig.18 A cross-sectional view of a heat dissipation structure provided in some other embodiments of the present application;

[0054] Fig.19 A cross-sectional view of a heat dissipation structure provided in some further embodiments of the present application.

[0055] Reference numerals:

[0056] Electronic equipment 1000;

[0057] Screen 100; first display portion 100a; second display portion 100b; third display portion 100c;

[0058] Shell assembly 200; first shell 200a; second shell 200b; shaft mechanism 200c;

[0059] Middle frame 201; frame 10; middle plate 20; middle plate body 21; first top surface 21a; first bottom surface 21b; support plate 22;

[0060] Heat dissipation structure 23; second top surface m1; second bottom surface m2; first area m21; second area m22;

[0061] First heat dissipation part 231; first housing 2311; first cover 2311a; second cover 2311b; first cooling medium 2312; first capillary structure 2313; first capillary part 2313a; second capillary part 2313b; first cooling cavity Q1; supporting plate 2314; supporting column 2315;

[0062] The second heat dissipation part 232; the second housing 2321; the first sub-housing 2321a; the second sub-housing 2321b; the second cooling medium 2322; the second capillary structure 2323; the second cooling cavity Q2;

[0063] The third heat dissipation part 233; the third housing 2331; the third cover 2331a; the fourth cover 2331b; the third capillary structure 2333; the third cooling cavity Q3; the fourth heat dissipation part 234;

[0064] Fifth housing 235; fifth cover 2351; first wall plate 2351a; main body 2351a1; raised portion 2351a2; sixth cover 2352; second wall plate 2352a; fifth cooling chamber Q5; fifth capillary structure 236;

[0065] Battery compartment C; through hole K; first hole section K11; second hole section K12; boss portion K13; reinforcing rib K14; first through hole K12a; second through hole K12b;

[0066] Baffle 30; back cover 202; circuit board 300; main circuit board 301; auxiliary circuit board 302; battery 400; fixed end surface 401;

[0067] Camera module 500; heating element 600; first heat-conducting member 701; second heat-conducting member 702; first interface heat-conducting material 801; second interface heat-conducting material 802; bonding structure 901; circuit board bracket 902; first direction e1; second direction e2. DETAILED DESCRIPTION

[0068] The technical solutions in the embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments.

[0069] In the embodiments of the present application, the terms "exemplary" or "for example" are used to indicate examples, illustrations or descriptions. Any embodiment or design described as "exemplary" or "for example" in the embodiments of the present application should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of words such as "exemplary" or "for example" is intended to present related concepts in a specific way.

[0070] In the embodiments of the present application, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features.

[0071] In the description of the embodiments of the present application, "and / or" is only a description of the association relationship of the associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in the present application generally indicates that the associated objects before and after are in an "or" relationship.

[0072] In the embodiments of the present application, it should be understood that the directional terms mentioned, such as "top", "bottom", "inside", "outside", etc., are only references to the directions of the drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the embodiments of the present application, rather than indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the embodiments of the present application.

[0073] In the description of the embodiments of the present application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense. For example, "connected" can be detachably connected or non-detachably connected; it can be directly connected or indirectly connected through an intermediate medium. Among them, "fixed connection" means that the two are connected to each other and the relative position relationship after connection remains unchanged.

[0074] In the description of the embodiments of the present application, the terms "parallel" and "perpendicular" include the described situations and situations similar to the described situations, and the range of the similar situations is within the acceptable deviation range. For example, "parallel" includes absolute parallelism and approximately parallelism, and "perpendicular" includes absolute perpendicularity and approximately perpendicularity, wherein the acceptable deviation range of approximately parallelism and approximately perpendicularity can be, for example, a deviation within 5°, 10° or 15°.

[0075] For ease of understanding, before a detailed introduction to the electronic device in the embodiments of the present application, the relevant terms involved in the embodiments of the present application are first explained.

[0076] Thermal conduction connection: refers to a connection with heat transfer between two components.

[0077] Strength: It is one of the mechanical properties that indicates the resistance of engineering materials to fracture and excessive deformation. Common strength performance indicators include tensile strength and yield strength (or yield point).

[0078] Thermal interface materials (TIM) are materials commonly used in integrated circuit (IC) packaging and electronic heat dissipation. They are mainly used to fill the micro gaps and holes on the uneven surface generated when two materials are joined or contacted, reduce heat transfer resistance, and improve heat dissipation performance.

[0079] Heat flux: also known as heat flux density, refers to the heat energy passing through a unit area per unit time.

[0080] High modulus aluminum: refers to an aluminum alloy with a certain proportion of high modulus (elastic modulus). The modulus of high modulus aluminum can reach 90GPa or even higher. The composition of high modulus aluminum can be adjusted according to specific needs, and some alloying elements (such as copper, zinc, magnesium, etc.) are usually added to improve the hardness and strength of high modulus aluminum. The addition of these alloying elements will change the crystal structure of aluminum, so that it has a higher modulus.

[0081] The middle frame and electronic device in the embodiment of the present application split the middle plate into a middle plate body and a heat dissipation structure, and set a first area for heat conduction connection with the heating device and a second area for fixing the battery on the heat dissipation structure, so that the heat absorbed by the heat dissipation structure can be quickly diffused from the heat source area to the cold area; at the same time, by setting the second area to be concave relative to the first area, the thickness of the part corresponding to the second area in the heat dissipation structure can be reduced, which is conducive to reducing the superimposed thickness of the battery and the heat dissipation structure, and is conducive to increasing the volume of the battery. Therefore, the middle frame and electronic device in the embodiment of the present application can ensure that the electronic device has good heat dissipation performance while realizing the light and thin design of the electronic device and the large capacity design of the battery.

[0082] The embodiment of the present application provides an electronic device, which includes but is not limited to mobile phones, tablet computers, laptop computers, personal computers, vehicle-mounted devices, electronic readers, smart screens (TVs), displays, speakers, walkmans, radios, wearable devices, medical devices, etc. Among them, wearable devices include but are not limited to augmented reality (AR) glasses, AR helmets, virtual reality (VR) glasses, VR helmets, watches, bracelets, headphones, etc.

[0083] The electronic device may be a foldable electronic device (such as a foldable screen mobile phone, etc.) or a non-foldable electronic device (such as a straight-screen mobile phone, etc.). In this embodiment, the electronic device is a foldable screen mobile phone as an example for description.

[0084] See also Figure 1-Figure 2 , Figure 1 A three-dimensional diagram of an electronic device 1000 in an unfolded state provided in some embodiments of the present application, Figure 2 for Figure 1 The electronic device 1000 is shown in a schematic diagram in a folded state. The electronic device 1000 includes a screen 100 and a housing assembly 200 .

[0085] Understandably, Figure 1 and Figure 2 The following figures and the related drawings only schematically illustrate some components of the electronic device 1000, and the actual shapes, sizes, positions and structures of these components are not limited to the following. Figure 1 and Figure 2 and the accompanying drawings below.

[0086] The screen 100 is used to display images, videos, etc. The screen 100 in this embodiment can switch between an unfolded state and a folded state. Specifically, the screen 100 includes a first display portion 100a, a second display portion 100b, and a third display portion 100c, and the third display portion 100c is connected between the first display portion 100a and the second display portion 100b. At least the third display portion 100c of the screen 100 is a flexible screen structure. In this way, the third display portion 100c can be bent and deformed after being subjected to an external force, so that the screen 100 is Figure 1 Shown expanded state collapsed to Figure 2 The first display part 100a and the second display part 100b of the screen 100 may be a flexible screen structure, or a hard screen structure, or a partially flexible screen structure and a partially hard screen structure, which is not specifically limited here.

[0087] It should be noted that, for the sake of convenience, Figure 1 and Figure 2 The first display part 100a, the second display part 100b and the third display part 100c are schematically divided by dotted lines, which may not actually exist in the screen 100. The dotted lines on other components in the following text can be understood in the same way and will not be described one by one.

[0088] The housing assembly 200 is used to support the screen 100 and allow the screen 100 to switch between an unfolded state and a folded state. Figure 2 In this embodiment, when the electronic device 1000 is in the folded state, the screen 100 is located outside the housing assembly 200, and the electronic device 1000 is an external folding electronic device. In other embodiments, when the electronic device 1000 is in the folded state, the housing assembly 200 can also be protected outside the screen 100, and the screen 100 is invisible to the user. In this case, the electronic device 1000 is an internal folding electronic device.

[0089] See also Figure 1-Figure 2 The housing assembly 200 includes a first housing 200a, a second housing 200b and a hinge mechanism 200c. The first housing 200a is used to carry the first display portion 100a, and the second housing 200b is used to carry the second display portion 100b. The hinge mechanism 200c is connected between the first housing 200a and the second housing 200b, and is used to carry the third display portion 100c. The first housing 200a and the second housing 200b are relatively rotated by the hinge mechanism 200c to realize the switching of the electronic device 1000 between the unfolded state and the folded state.

[0090] The first housing 200a and the second housing 200b can also be used to accommodate and protect electronic devices. Figure 3 , Figure 3 for Figure 1 The electronic device 1000 is shown as a top view with the screen 100 hidden. Figure 3 The top view shown is a schematic diagram of looking from the screen 100 of the electronic device 1000 toward the housing assembly 200. The first housing 200a may be provided with electronic components such as a circuit board 300, a battery 400, and a camera module 500, and the second housing 200b may be provided with electronic components such as a battery 400. Since the circuit board 300, the battery 400, the camera module 500, and other electronic components are located inside the first housing 200a and / or the second housing 200b, Figure 3 Indicated by dotted lines.

[0091] In this embodiment, the types and layouts of the electronic components in the first shell 200a and the second shell 200b are different. It is understandable that in other embodiments, the types and layouts of the electronic components in the first shell 200a and the second shell 200b may be the same. In addition, the structure of the first shell 200a and the structure of the second shell 200b may be the same, and the structure of the first shell 200a is taken as an example for description.

[0092] See also Figure 4-Figure 5 , Figure 4 for Figure 1 The schematic diagram of the partial structure of the electronic device 1000 is shown. Figure 5 for Figure 4 The cross-sectional view of the electronic device 1000 shown is taken along the AA line. In this embodiment, the first shell 200a is generally in the shape of a rectangular parallelepiped. In order to facilitate the description of the embodiments below, an XYZ coordinate system is established for the first shell 200a. Specifically, the width direction of the first shell 200a is defined as the X-axis direction, the length direction of the first shell 200a is defined as the Y-axis direction, and the thickness direction of the first shell 200a is defined as the Z-axis direction. It can be understood that the coordinate system setting of the electronic device 1000 can be flexibly set according to actual needs, and no specific limitation is made here. In some other embodiments, the shape of the first shell 200a can also be square, circular, elliptical, etc.

[0093] See also Figure 5 , the first shell 200a includes a middle frame 201 and a back cover 202. The middle frame 201 includes a frame 10 and a middle plate 20. The frame 10 can be annular. For example, the frame 10 can be roughly rectangular. The screen 100 can be fixed to the frame 10. The middle plate 20 can be used as a supporting skeleton of the electronic device 1000. The middle plate 20 is roughly plate-shaped, the edge of the middle plate 20 is fixedly connected to the inner surface of the frame 10, and the middle plate 20 is located between the screen 100 and the back cover 202. Specifically, the middle plate 20 and the back cover 202 are spaced apart in the Z-axis direction. The middle plate 20, the back cover 202 and the frame 10 can be enclosed to form an internal accommodation space of the electronic device 1000. The circuit board 300, the battery 400, etc. can be fixed to the middle plate 20 and accommodated in the accommodation space.

[0094] It is understandable that in other embodiments, the back cover 202 may also be replaced by a display screen.

[0095] In some embodiments, the middle plate 20 is a metal part. Specifically, the middle plate 20 can be made of a metal material with relatively high strength. Exemplarily, the middle plate 20 can be an aluminum alloy part, a magnesium-aluminum alloy part, etc. In this way, the structural strength of the middle plate 20 can be improved, the supporting stability of the middle plate 20 can be ensured, and the impact resistance and fracture resistance of the middle plate 20 can be improved, which can meet the safety requirements of the battery 400, thereby improving the safety of the electronic device 1000.

[0096] In some embodiments, the frame 10 is a plastic part. The frame 10 can be formed on the outer edge of the middle plate 20 by an injection molding process. In this way, the connection strength between the frame 10 and the middle plate 20 can be improved, and the processing cost of the middle frame 201 can be reduced. It is understandable that in other embodiments, the middle frame 201 can also be an integral structural member, that is, the frame 10 and the middle plate 20 are integrally formed. Or the middle plate 20 and the frame 10 can also be fixedly connected by gluing, welding, clamping, fastener connection, etc. Among them, the fasteners include but are not limited to screws, pins, rivets, bolts, etc.

[0097] It should be noted that the "integrated structural part" described in the embodiments of the present application refers to a structural part formed by one-time processing, rather than a structural part formed by connecting separate parts through secondary processing. An integrated structural part can also be referred to as an integrally formed part. For example, an integrated structural part can be integrally formed by processes such as stamping, etching, casting, forging, and computerized numerical control (CNC).

[0098] See also Figure 4 The circuit board 300 includes a main circuit board 301 and a sub-circuit board 302. Both the main circuit board 301 and the sub-circuit board 302 can be used to carry electronic components. The main circuit board 301 and the sub-circuit board 302 can be electrically connected through electrical connection structures such as flexible circuit boards and signal lines to achieve data and signal transmission between the main circuit board 301 and the sub-circuit board 302. It can be understood that in other embodiments, the main circuit board 301 and the sub-circuit board 302 can also be integrated into one.

[0099] Electronic components include but are not limited to processors (also known as chips), antenna modules, Bluetooth modules, WiFi modules, GPS modules, charging modules or screen display and operation modules, resistors, capacitors, inductors, potentiometers, electron tubes, electromechanical components, connectors, semiconductor discrete devices, sensors, power supplies, switches, micro motors, electronic transformers, relays, SIM card holders, universal serial bus (USB) devices, etc.

[0100] The main circuit board 301 and the auxiliary circuit board 302 can be fixedly connected to the middle board 20. For example, see Figure 5 The main circuit board 301 can be fixedly connected to the middle plate 20 through the circuit board bracket 902. The assembly method between the auxiliary circuit board 302 and the middle plate 20 can be designed with reference to the assembly method between the main circuit board 301 and the middle plate 20.

[0101] The battery 400 is used to provide power to components such as the screen 100, the circuit board 300, and the camera module 500 in the electronic device 1000. In addition, the electronic device 1000 may also include a charging management module, a power management module, an audio module, a speaker, a receiver, a microphone, an earphone interface, a sensor module, buttons, etc. electrically connected to the processor.

[0102] In some embodiments, see Figure 5 A battery compartment C is formed on the middle plate 20, and the battery 400 is accommodated in the battery compartment C. Exemplarily, the battery 400 can be fixedly connected to the bottom wall of the battery compartment C by gluing, snapping, etc. The bottom wall of the battery compartment C refers to the inner wall of the battery compartment C facing the back cover 202.

[0103] In some embodiments, see Figure 5 A retaining wall 30 is provided on the surface of the middle plate 20 facing the back cover 202, and a battery compartment C can be defined between the retaining wall 30 and the middle plate 20. The retaining wall 30 and the middle plate 20 can be formed as an integral structural member. It is understood that in other implementations, the battery compartment C can also be formed by the surface of the middle plate 20 facing the back cover 202 being recessed in a direction away from the back cover 202.

[0104] Please continue reading Figure 5 , the electronic device 1000 further includes a heating device 600. The heating device 600 is a device other than the battery 400 in the electronic device 1000 that can generate heat. For example, the heating device 600 can be a chip such as a system on chip (SOC), a central processing unit (CPU), a graphics processing unit (GPU), or a circuit board 300, a camera module 500, a flash, etc. Among them, when the heating device 600 is a chip, the heating device 600 can be arranged on the main circuit board 301 or the auxiliary circuit board 302.

[0105] Since the heat generating device 600 will inevitably generate power consumption during operation, in some embodiments, in order to facilitate the heat generated by the heat generating device 600 to be dissipated outwards, please refer to Figure 5The electronic device 1000 further includes a first heat conductive member 701 and a second heat conductive member 702. The first heat conductive member 701 can be connected between the heating device 600 and the middle plate 20, and the second heat conductive member 702 can be disposed on a surface of the middle plate 20 on a side away from the battery 400. The first heat conductive member 701 and the second heat conductive member 702 can include, but are not limited to, thermally conductive glue, a vapor chamber (VC), a graphite sheet, a metal sheet, and the like.

[0106] In this way, the heat generated by the heating device 600 can be transferred to the middle plate 20 through the first heat conductive member 701, and diffused from the area of ​​the middle plate 20 corresponding to the heating device 600 (that is, the heat source area) to other areas of the middle plate 20 (that is, the cold area), for example, the area for fixing the battery 400, and then the heat of the middle plate 20 is transferred to the frame 10, and dissipated to the outside of the electronic device 1000 through the frame 10. At the same time, the heat of the middle plate 20 can also be radiated to the screen 100 through the second heat conductive member 702, and dissipated to the outside of the electronic device 1000 through the screen 100, so as to prevent the temperature of the heating device 600 from being too high.

[0107] As the electronic device 1000 is developing towards being thinner and lighter with longer battery life, in order to increase the capacity of the battery 400 while reducing the thickness of the electronic device 1000, please refer to Figure 6 , Figure 6 1 is a cross-sectional view of an electronic device 1000 provided in some other embodiments of the present application. Figure 5 The difference of the electronic device 1000 in the illustrated embodiment is that, in this embodiment, the middle plate 20 includes a middle plate body 21 and a support plate 22. A through hole K is formed in the middle plate body 21.

[0108] For details, please refer to Figure 6 The middle plate body 21 includes a first top surface 21a and a first bottom surface 21b that are opposite to each other in a first direction e1. The first direction e1 may be a thickness direction of the middle plate body 21. For example, the first direction e1 may be parallel to the Z-axis direction. The first top surface 21a faces the screen 100. The through hole K penetrates the first top surface 21a and the first bottom surface 21b.

[0109] The support plate 22 is generally plate-shaped. The support plate 22 is disposed at the through hole K. At least a portion of the battery compartment C is defined between the middle plate body 21 and the support plate 22. Specifically, the bottom wall of the battery compartment C is formed on the support plate 22. The support plate 22 and the middle plate body 21 can be fixed by at least one of bonding, welding, clamping, and fastener connection.

[0110] In some embodiments, the strength of the support plate 22 is greater than the strength of the middle plate body 21. In this way, by splitting the middle plate 20 into two structural parts, the middle plate body 21 and the support plate 22, the support plate 22 can be processed with a material (such as a metal material) having a strength greater than that of the middle plate body 21, which is conducive to reducing the thickness of the support plate 22 while improving the overall structural strength of the middle plate 20, so that the volume of the battery 400 can be increased without increasing the thickness of the electronic device 1000, thereby increasing the capacity of the battery 400. At the same time, it is also possible to reduce the superimposed thickness of the support plate 22 and the battery 400 while keeping the volume of the battery 400 unchanged, so as to achieve the purpose of reducing the thickness of the electronic device 1000 and realizing the light and thin design of the electronic device 1000. As a result, the capacity of the battery 400 can be increased and the endurance of the electronic device 1000 can be improved under the premise that the volume and thickness of the electronic device 1000 are certain, and the light and thin design of the electronic device 1000 and the large capacity design of the battery 400 can be taken into account.

[0111] However, in the electronic device 1000 of this embodiment, after the middle plate 20 is split into the middle plate body 21 and the support plate 22, the contact thermal resistance between the middle plate body 21 and the support plate 22 increases sharply, and the thermal conductivity coefficient of the support plate 22 is usually lower than the thermal conductivity coefficient of the middle plate body 21, and the thickness of the support plate 22 is usually less than the thickness of the middle plate body 21, resulting in a decrease in the heat flux of the middle plate 20. Therefore, after the heat on the heating device 600 is transferred to the middle plate body 21, it cannot be quickly and effectively transferred to the support plate 22, so that the heat cannot be quickly transferred from the heat source area of ​​the middle plate 20 to the cold area, resulting in a serious deterioration in the heat dissipation capacity of the electronic device 1000.

[0112] To solve the above technical problems, please refer to Figure 7 , Figure 7 1 is a cross-sectional view of an electronic device 1000 provided in some embodiments of the present application. The electronic device 1000 includes a middle frame 201, a back cover 202, a screen 100, a battery 400 and a heating device 600. The middle frame 201 includes a middle plate 20 and a frame 10. The electronic device 1000 in this embodiment is Figure 6 The difference between the electronic device 1000 in the embodiment shown is that the structure of the middle plate 20 in this embodiment is different from that in the embodiment shown in FIG. Figure 6 The structure of the back cover 202, the screen 100 and other components in this embodiment and the assembly method between the back cover 202, the screen 100 and the middle frame 201 can be designed with reference to any embodiment of the present application, and will not be repeated here.

[0113] See also Figure 7The middle plate 20 includes a middle plate body 21 and a heat dissipation structure 23. The middle plate body 21 includes a first top surface 21a and a first bottom surface 21b that are opposite to each other in a first direction e1 (i.e., the thickness direction of the middle plate body 21). The first top surface 21a can face the screen 100, and the first bottom surface 21b can face the back cover 202. A through hole K is provided on the middle plate body 21, and the through hole K passes through the first top surface 21a and the first bottom surface 21b. That is, the through hole K is a through hole.

[0114] Please continue reading Figure 7 , the heat dissipation structure 23 is arranged in the through hole K. The heat dissipation structure 23 includes a second top surface m1 and a second bottom surface m2 facing each other, and the direction of the second bottom surface m2 is the same as that of the first bottom surface 21b. That is, the second bottom surface m2 also faces the back cover 202. The second bottom surface m2 includes a first area m21 and a second area m22. Among them, the first area m21 is used for thermal conduction connection with the heating device 600. Specifically, the heating device 600 can be thermally connected with the first area m21 of the heat dissipation structure 23. In order to facilitate the thermal conduction connection between the heating device 600 and the heat dissipation structure 23, the orthographic projection of the heating device 600 on the second bottom surface m2 overlaps with the first area m21.

[0115] In some embodiments, a first interface thermal conductive material 801 may be provided between the heating device 600 and the heat dissipation structure 23, and the heating device 600 and the heat dissipation structure 23 may be connected by thermal conduction through the first interface thermal conductive material 801. The first interface thermal conductive material 801 includes, but is not limited to, thermal conductive glue, thermal conductive pads, thermal conductive films, etc. In this way, it is beneficial to increase the contact area between the heating device 600 and the heat dissipation structure 23, thereby reducing the contact thermal resistance between the heating device 600 and the heat dissipation structure 23, so that the heat on the heating device 600 can be quickly transferred to the heat dissipation structure 23, which is beneficial to improve the heat exchange efficiency between the heating device 600 and the heat dissipation structure 23.

[0116] In some other embodiments, the heat generating device 600 may also be in direct contact with the first region m21 of the heat dissipation structure 23 to achieve a heat conduction connection, so that the heat on the heat generating device 600 can also be transferred to the heat dissipation structure 23 .

[0117] The second region m22 is used to fix the battery 400. That is, the battery 400 can be fixedly connected to the second region m22 of the heat dissipation structure 23. Exemplarily, the battery 400 can be fixed to the second region m22 by bonding with the bonding structure 901. Of course, the battery 400 can also be fixed to the heat dissipation structure 23 by means of snap connection or the like. The bonding structure 901 includes but is not limited to double-sided adhesive, hot melt adhesive, thermosensitive adhesive, ultraviolet light curing adhesive, etc.

[0118] In this way, the heat on the heating device 600 can be quickly transferred to the second area m22 (also known as the cold area) corresponding to the battery 400 in the heat dissipation structure 23 through the first area m21 (also known as the heat source area) corresponding to the heating device 600 in the heat dissipation structure 23, which is conducive to reducing the thermal resistance between the heat source area and the cold area, and can improve the heat dissipation efficiency of the heating device 600, and avoid heat accumulation inside or around the heating device 600, thereby helping to improve the reliability of the heating device 600 and reduce the power consumption of the heating device 600. At the same time, it can also reduce the perceived temperature of the electronic device 1000, and help to extend the battery life of the electronic device 1000, thereby improving the overall reliability of the electronic device 1000 and helping to improve the user experience.

[0119] In some embodiments, see Figure 7 , the second region m22 is concave relative to the first region m21 toward the second top surface m1. That is, the first region m21 is located on the side of the second region m22 away from the second top surface m1. In this way, on the one hand, it is conducive to reducing the thickness of the portion corresponding to the second region m22 in the heat dissipation structure 23, which can reduce the overlapping thickness of the heat dissipation structure 23 and the battery 400, thereby reducing the overlapping thickness of the middle plate 20 and the battery 400, and is conducive to expanding the assembly space of the battery 400. Under the premise that the volume and thickness of the electronic device 1000 are certain, the volume of the battery 400 can be increased, thereby increasing the capacity of the battery 400, improving the endurance of the electronic device 1000, and realizing the light and thin design of the electronic device 1000 and the large capacity design of the battery 400; on the other hand, it is also conducive to reducing the distance between the heating device 600 and the heat dissipation structure 23, thereby shortening the heat conduction path between the heating device 600 and the heat dissipation structure 23, improving the heat exchange efficiency between the heating device 600 and the heat dissipation structure 23, and further improving the heat dissipation efficiency of the heating device 600.

[0120] Therefore, the electronic device 1000 in the embodiment of the present application can ensure that the heating device 600 has a high heat dissipation efficiency while achieving a lightweight design of the electronic device 1000 and a large-capacity design of the battery 400, thereby improving the heat dissipation performance of the middle frame 201 and the electronic device 1000.

[0121] In some embodiments, see Figure 7, the second area m22 is recessed relative to the first bottom surface 21b toward the first top surface 21a. Specifically, the second area m22 is located on the side of the first bottom surface 21b close to the first top surface 21a. In this way, the thickness of the portion corresponding to the second area m22 in the heat dissipation structure 23 can be further reduced, and at least part of the battery compartment C can be defined between the heat dissipation structure 23 and the middle plate body 21, which is conducive to further expanding the assembly space of the battery 400, and is conducive to further reducing the stacking thickness of the middle plate 20 and the battery 400, so as to further increase the capacity of the battery 400 while reducing the thickness of the electronic device 1000.

[0122] See also Figure 7 , the battery 400 includes a fixed end face 401 facing the second area m22, and the battery 400 is fixedly connected to the second area m22 by means of the fixed end face 401. The second area m22 is formed as the bottom wall surface of the battery compartment C. The orthographic projection of the fixed end face 401 on the reference plane is located within the orthographic projection of the second area on the reference plane. Among them, the reference plane is perpendicular to the first direction e1. Specifically, the orthographic projection of the fixed end face 401 on the reference plane is the first projection, the orthographic projection of the second area on the reference plane is the second projection, and the first projection is located within the second projection. That is, the area of ​​the second projection is greater than or equal to the area of ​​the first projection.

[0123] In this way, on the one hand, it is beneficial to increase the heat conduction area between the battery 400 and the heat dissipation structure 23, thereby improving the heat exchange efficiency between the battery 400 and the heat dissipation structure 23, and improving the heat dissipation efficiency of the heating device 600 and the battery 400. On the other hand, it is also beneficial to improve the connection reliability between the battery 400 and the heat dissipation structure 23, and can improve the stability of the assembly position of the battery 400.

[0124] In some embodiments, see Figure 7 , the first region m21 may protrude relative to the first bottom surface 21b in a direction away from the first top surface 21a. Specifically, the first region m21 may be located on a side of the first bottom surface 21b away from the first top surface 21a. In this way, the distance between the heating device 600 and the heat dissipation structure 23 may be further reduced, thereby further shortening the heat conduction path between the heating device 600 and the heat dissipation structure 23, and improving the heat dissipation efficiency of the heating device 600.

[0125] It is understandable that, in other embodiments, the first region m21 may also be recessed relative to the first bottom surface 21b toward the first top surface 21a. In this case, the first region m21 is located on the side of the first bottom surface 21b close to the first top surface 21a. In this way, an avoidance space can be formed between the first region m21 and the first bottom surface 21b of the middle plate body 21, which can avoid the heating device 600 with a larger height, which is beneficial to reduce the stacking thickness of the heating device 600 and the middle plate 20. In some other embodiments, the first region m21 may also be flush with the first bottom surface 21b. The positional relationship between the first region m21 and the first bottom surface 21b can be reasonably designed according to the height of the heating device 600.

[0126] In some embodiments, the number of the first regions m21 may be one or more. When there are multiple first regions m21, the spacing between at least two first regions m21 and the second top surface m1 is different. In this way, the heat dissipation structure 23 can be connected to the corresponding heat conduction of the multiple first regions m21 respectively with the multiple heat-generating devices 600, which can meet the heat dissipation requirements of the heat-generating devices 600 at different heights and adapt to the stacking environment of the heat-generating devices 600.

[0127] See also Figure 8 Combined with Fig. 9 , Figure 8 for Figure 6 The top view of the heat dissipation structure 23 is shown. Fig. 9 for Figure 8 The cross-sectional view of the heat dissipation structure 23 at line BB is shown. Figure 8 The top view shown is a schematic diagram of looking from the second top surface m1 of the heat dissipation structure 23 to the second bottom surface m2. The heat dissipation structure 23 includes a first heat dissipation portion 231 and a second heat dissipation portion 232 arranged in a second direction e2. The second direction e2 is perpendicular to the first direction e1. That is, the second direction e2 is parallel to the XY plane. Exemplarily, the second direction e2 is parallel to the X axis.

[0128] It is understandable that the specific arrangement direction of the first heat dissipation portion 231 and the second heat dissipation portion 232 (that is, the second direction e2) can be adaptively adjusted according to the arrangement direction of the heating device 600 and the battery 400. In other embodiments, for example, when the electronic device 1000 is a straight phone or an inward folding phone, the second direction e2 can also be parallel to the Y-axis direction.

[0129] See also Fig. 9, the first region m21 is formed on the first heat dissipation portion 231, and the second region m22 is formed on the second heat dissipation portion 232. The first heat dissipation portion 231 protrudes from the first region m21. Specifically, the thickness of the first heat dissipation portion 231 may be greater than the thickness of the second heat dissipation portion 232. The thickness of the first heat dissipation portion 231 refers to the size of the first heat dissipation portion 231 in the first direction e1. Similarly, the thickness of the second heat dissipation portion 232 refers to the size of the second heat dissipation portion 232 in the first direction e1.

[0130] In some embodiments, at least a portion of the second heat dissipation portion 232 and at least a portion of the first heat dissipation portion 231 form an integral structure. Specifically, a portion of the second heat dissipation portion 232 and a portion of the first heat dissipation portion 231 may form an integral structure, or the entire second heat dissipation portion 232 and a portion of the first heat dissipation portion 231 may form an integral structure, or the entire second heat dissipation portion 232 and the first heat dissipation portion 231 may form an integral structure, or a portion of the second heat dissipation portion 232 and the first heat dissipation portion 231 may form an integral structure.

[0131] In this way, the contact thermal resistance between the first heat dissipation part 231 and the second heat dissipation part 232 can be further reduced, so that the heat absorbed by the first heat dissipation part 231 can be quickly transferred to the second heat dissipation part 232, so that the heat on the heating device 600 can be quickly diffused to the second area m22 through the first area m21 of the heat dissipation structure 23, which can further improve the heat dissipation efficiency of the heating device 600.

[0132] In some embodiments, see Fig. 9 The first heat dissipation part 231 includes a first housing 2311, a first cooling medium ( Fig. 9 The first shell 2311 is provided with a first cooling chamber Q1, and the first cooling medium and the first capillary structure 2313 are both arranged in the first cooling chamber Q1. The first cooling chamber Q1 is a vacuum chamber. That is, the first heat dissipation part 231 in this embodiment can be formed as a heat spreader. Specifically, the first cooling chamber Q1 includes an evaporation chamber and a capillary chamber, and the capillary chamber is formed in the first capillary structure 2313. The capillary chamber is used to transport the first cooling medium in liquid form. The first cooling medium can be water, methanol, ethanol, etc. The first capillary structure 2313 can be at least one of a copper mesh, a steel mesh, a titanium mesh, a sintered copper powder, a sintered steel powder, and a sintered titanium powder.

[0133] In this way, after the heat of the heating device 600 is transferred to the first heat dissipation part 231, the liquid first cooling medium in the first cooling cavity Q1 is heated and vaporized. At this time, the first cooling medium absorbs heat energy and expands rapidly in volume. The gas phase first cooling medium diffuses in the evaporation cavity, diffuses from the evaporation area to the condensation area, and quickly fills the entire evaporation cavity. When the gas phase first cooling medium contacts the inner wall of the evaporation cavity with a lower temperature, it condenses into a liquid and releases heat. The condensed liquid first cooling medium returns to the evaporation area under the capillary force of the first capillary structure 2313, thereby completing the heat transfer cycle. This heat cycle process will be repeated in the first cooling cavity Q1 to achieve a rapid heat dissipation effect, and evenly distributed to the entire first heat dissipation part 231, so that the heat absorbed by the first heat dissipation part 231 can be quickly dissipated to the second heat dissipation part 232, thereby improving the heat dissipation performance of the middle frame 201 and the electronic device 1000.

[0134] In addition, by setting the first cooling cavity Q1 in the first heat dissipation part 231, on the one hand, it is helpful to increase the size of the first cooling cavity Q1 in the first direction e1 (that is, the depth of the first cooling cavity Q1), thereby increasing the volume of the first cooling cavity Q1, ensuring that the first heat dissipation part 231 has good heat dissipation performance, and further increasing the heat exchange efficiency between the heating device 600 and the heat dissipation structure 23, and improving the heat dissipation performance of the middle frame 201 and the electronic device 1000. On the other hand, it is also helpful to reduce the thickness of the second heat dissipation part 232, which is conducive to further expanding the assembly space of the battery 400, thereby increasing the volume of the battery 400 and realizing a large-capacity design of the battery 400.

[0135] In some embodiments, please refer to Fig. 9 The first housing 2311 includes a first cover 2311a and a second cover 2311b arranged in a first direction e1, and a first cooling cavity Q1 is defined between the first cover 2311a and the second cover 2311b. Exemplarily, the first cover 2311a and the second cover 2311b can be fixed by at least one of welding (such as laser welding, brazing, etc.), bonding, and fastener connection.

[0136] Specifically, in this embodiment, a first groove that is recessed in a direction away from the second cover 2311b is formed on the first cover 2311a, and a second groove that is recessed in a direction away from the first cover 2311a is formed on the second cover 2311b. After the first cover 2311a and the second cover 2311b are docked, a first cooling cavity Q1 can be formed between the first cover 2311a and the second cover 2311b. Exemplarily, the first cover 2311a can be formed by an etching process, or by an etching process combined with a stamping process. Similarly, the second cover 2311b can also be formed by an etching process or by an etching process combined with a stamping process.

[0137] In this way, it is convenient to form the first cooling cavity Q1 in the first shell 2311 , and the difficulty of processing the first shell 2311 can be reduced, thereby improving the processing efficiency of the first shell 2311 and reducing the cost of the heat dissipation structure 23 .

[0138] It is understandable that in other embodiments, the first groove may be formed only on the first cover 2311a without forming the second groove on the second cover 2311b, or the second groove may be formed only on the second cover 2311b without forming the first groove on the first cover 2311a. In this way, the first cooling cavity Q1 can also be defined between the first cover 2311a and the second cover 2311b.

[0139] See also Fig. 9 , the first region m21 can be formed on the surface of the second cover 2311b that is away from the first cover 2311a. The first capillary structure 2313 can be fixedly connected to the inner wall surface of the first cooling cavity Q1 that is away from the first region m21. Specifically, the first capillary structure 2313 is fixedly connected to the second cover 2311b. Exemplarily, the first capillary structure 2313 and the second cover 2311b can be fixed by welding, bonding, etc. In this way, it is beneficial to shorten the heat conduction path between the first capillary structure 2313 and the heating device 600, and it is beneficial to increase the heat conduction area between the first capillary structure 2313 and the heating device 600, which is convenient for the liquid first cooling medium in the capillary cavity to absorb heat and vaporize, and then it is beneficial to improve the heat exchange efficiency between the first heat dissipation part 231 and the heating device 600.

[0140] In some embodiments, in order to further improve the overall structural strength of the first heat dissipation portion 231 and prevent the first heat dissipation portion 231 from being deformed, a support column 2315 is provided in the first cooling cavity Q1. Exemplarily, the support column 2315 can be provided on the first cover 2311a. The support column 2315 and the first cover 2311a can be integrally formed. It is understood that in other embodiments, the support column 2315 can also be provided on the second cover 2311b. In this case, the support column 2315 can be provided on the first cover 2311a, or the support column 2315 can be not provided.

[0141] In some embodiments, the second heat dissipation portion 232 is a metal plate. Fig. 9, the second heat dissipation portion 232 is plate-shaped. The second heat dissipation portion 232 and the first cover body 2311a form an integral structure. In this case, the entire second heat dissipation portion 232 and a portion of the first heat dissipation portion 231 form an integral structure. That is, the second heat dissipation portion 232 and the first cover body 2311a are integrally formed. Exemplarily, the second heat dissipation portion 232 and the first cover body 2311a can be integrally formed by stamping, casting, forging, CNC and other processes. In this case, the second heat dissipation portion 232 and the first cover body 2311a can reuse the same metal plate.

[0142] In this way, on the one hand, the contact thermal resistance between the first heat dissipation part 231 and the second heat dissipation part 232 can be reduced. After the heat on the heating device 600 is transferred to the heat dissipation structure 23, it can quickly diffuse to the second area m22 through the first area m21, thereby further improving the heat dissipation efficiency of the heating device 600 and reducing the temperature of the heating device 600; on the other hand, by setting the second heat dissipation part 232 as a metal plate, the thickness of the second heat dissipation part 232 can be reduced while ensuring that the second heat dissipation part 232 has a high structural strength, which is beneficial to increase the capacity of the battery 400, and can achieve a large-capacity design of the battery 400 while reducing the thickness of the electronic device 1000.

[0143] On the basis of any of the above embodiments, in order to improve the overall structural strength of the middle plate 20 while reducing the superimposed thickness of the battery 400 and the middle plate 20, the heat dissipation structure 23 includes a first metal part, and the middle plate body 21 includes a second metal part. The strength of the first metal part is greater than the strength of the second metal part. That is, the tensile strength of the first metal part is greater than the tensile strength of the second metal part, and the yield strength of the first metal part is greater than the yield strength of the second metal part. In this way, the structural strength of the heat dissipation structure 23 can be improved, which is beneficial to improving the overall structural strength of the middle plate 20 and the middle frame 201, thereby improving the fracture resistance and impact resistance of the middle plate 20 and the middle frame 201, and further improving the safety performance of the battery 400.

[0144] For example, in some embodiments, the first cover 2311a, the second cover 2311b, and the second heat dissipation portion 232 may all be first metal parts. That is, the first cover 2311a, the second cover 2311b, and the second heat dissipation portion 232 are all made of the first metal material. In other embodiments, one or both of the first cover 2311a, the second cover 2311b, and the second heat dissipation portion 232 may be first metal parts. That is, one or both of the first cover 2311a, the second cover 2311b, and the second heat dissipation portion 232 are made of the first metal material.

[0145] Exemplarily, the first metal part may be a stainless steel part, a titanium alloy part, a high-modulus aluminum part, a copper part or a copper alloy part. Alternatively, the first metal part may also be a composite part formed by laminating two metal plates of different materials. For example, the first metal part may be a copper-steel composite part. These materials have high structural strength and high thermal conductivity, and can meet the strength and heat dissipation requirements of the heat dissipation structure 23.

[0146] Similarly, the entire middle plate body 21 can be made of the second metal part. That is, the entire middle plate body 21 is made of the second metal material. A part of the middle plate body 21 can also be made of the second metal part. That is, a part of the middle plate body 21 is made of the second metal material. Exemplarily, the second metal part can be an aluminum alloy part, a magnesium-aluminum alloy part, etc. In this way, the structural strength of the middle plate 20 can be improved, and the supporting performance of the middle plate 20 can be improved.

[0147] In some embodiments, see Fig. 9 , the spacing d1 between the first area m21 and the second top surface m1 is greater than or equal to 0.2mm and less than or equal to 0.4mm. That is, the thickness of the first heat dissipation portion 231 may be greater than or equal to 0.2mm and less than or equal to 0.4mm. Exemplarily, the spacing d1 between the first area m21 and the second top surface m1 may be 0.2mm, 0.25mm, 0.3mm, 0.35mm, 0.4mm, etc. In this way, it is beneficial to increase the thickness of the first heat dissipation portion 231. When the first heat dissipation portion 231 includes the first cooling cavity Q1, it is beneficial to increase the depth and volume of the first cooling cavity Q1, and it can ensure that the first heat dissipation portion 231 has good heat dissipation performance, which is beneficial to increase the heat exchange efficiency between the heating device 600 and the heat dissipation structure 23, and improve the heat dissipation performance of the middle frame 201 and the electronic device 1000. In addition, it is also beneficial to reduce the processing difficulty of the heat dissipation structure 23, thereby reducing the cost of the heat dissipation structure 23.

[0148] In some embodiments, the spacing d2 between the second region m22 and the second top surface m1 is greater than or equal to 0.1 mm and less than or equal to 0.25 mm. That is, the thickness of the second heat dissipation portion 232 is greater than or equal to 0.1 mm and less than or equal to 0.25 mm. Exemplarily, the spacing d2 between the second region m22 and the first top surface 21a can be 0.1 mm, 0.12 mm, 0.15 mm, 0.18 mm, 0.2 mm, etc. In this way, while ensuring that the second heat dissipation portion 232 has a high structural strength, the thickness of the second heat dissipation portion 232 can be reduced, which is conducive to further expanding the assembly space of the battery 400, thereby further increasing the volume of the battery 400, and realizing a large-capacity design of the battery 400 while reducing the thickness of the electronic device 1000.

[0149] On the basis of any of the above embodiments, in order to facilitate the assembly between the heat dissipation structure 23 and the middle plate body 21, please refer to Fig.10 , Fig.10 for Figure 7 An exploded view of the middle frame 201 in the electronic device 1000 is shown. The through hole K includes a first hole segment K11 and a second hole segment K12 arranged and connected in the first direction e1, the first hole segment K11 penetrates the first top surface 21a, and the second hole segment K12 penetrates the first bottom surface 21b. That is, the opening of the first hole segment K11 away from the second hole segment K12 is located on the first top surface 21a. The opening of the second hole segment K12 away from the first hole segment K11 is located on the first bottom surface 21b. At least part of the inner wall surface of the second hole segment K12 protrudes from the inner wall surface of the first hole segment K11, forming a boss portion K13.

[0150] Specifically, a part of the inner wall surface of the second hole segment K12 may protrude from the inner wall surface of the first hole segment K11, or the entire inner wall surface of the second hole segment K12 may protrude from the inner wall surface of the first hole segment K11. For example, during assembly, the heat dissipation structure 23 may be assembled from the first hole segment K11 to the through hole K. The boss portion K13 may be a whole, for example, the boss portion K13 may be annular. Alternatively, the boss portion K13 may also include a plurality of sub-bosses, which are spaced apart in the circumferential direction of the through hole K.

[0151] The heat dissipation structure 23 is fixedly connected to the boss portion K13. Figure 7 The heat dissipation structure 23 can be fixed to the end surface of the boss portion K13 facing away from the first bottom surface 21b. Exemplarily, the heat dissipation structure 23 and the boss portion K13 can be fixed by at least one of gluing, clamping, welding, and fastener connection. In this way, the assembly difficulty between the heat dissipation structure 23 and the middle plate body 21 can be reduced, which is conducive to improving the assembly efficiency of the middle frame 201 and the electronic device 1000.

[0152] In some embodiments, see Fig.10 The middle frame 201 further includes a reinforcing rib K14, both ends of which are connected to the inner wall surface of the through hole K. Specifically, the reinforcing rib K14 can be connected to the inner wall surface of the second hole segment K12, and divide the second hole segment K12 into a first through hole K12a and a second through hole K12b arranged in the second direction e2. In this way, the structural strength of the middle plate 20 can be improved, the supporting performance of the middle plate 20 can be improved, and deformation of the middle plate 20 can be avoided.

[0153] Specifically, the orthographic projection of the first region m21 on the reference plane is located within the orthographic projection of the first through hole K12a on the reference plane. That is, the orthographic projection area of ​​the first region m21 on the reference plane is less than or equal to the orthographic projection area of ​​the first through hole K12a on the reference plane. The reference plane is perpendicular to the first direction e1. Exemplarily, at least a portion of the first heat dissipation portion 231 may be located within the first through hole K12a. In this way, it can be ensured that the second region m22 is exposed to the first through hole K12a, which is beneficial to increase the heat conduction area between the heating device 600 and the heat dissipation structure 23, thereby facilitating the improvement of the heat exchange efficiency between the heating device 600 and the heat dissipation structure 23.

[0154] The second heat dissipation portion 232 is opposite to the second through hole K12b. Specifically, the orthographic projection of the second through hole K12b on the reference plane is located within the orthographic projection of the second region m22 on the reference plane. That is, the orthographic projection area of ​​the second through hole K12b on the reference plane is less than or equal to the orthographic projection area of ​​the second region m22 on the reference plane. In this way, it can be ensured that the entire fixed end surface 401 of the battery 400 can be fixedly connected to the second region m22, which is beneficial to increase the heat conduction area between the battery 400 and the heat dissipation structure 23, and is beneficial to improve the connection reliability between the battery 400 and the heat dissipation structure 23, and can improve the stability of the assembly position of the battery 400.

[0155] It is understandable that in other embodiments, the middle frame 201 may not include the aforementioned reinforcing rib K14.

[0156] In other embodiments, see Fig.11 , Fig.11 The cross-sectional view of the heat dissipation structure 23 provided in some other embodiments of the present application. Fig. 9 The difference between the heat dissipation structure 23 in the embodiment shown is that the first capillary structure 2313 in this embodiment is Fig. 9 The first capillary structure 2313 in the illustrated embodiment is different. The first capillary structure 2313 in the embodiment can be applied to the heat dissipation structure 23 in any embodiment of the present application.

[0157] For details, please refer to Fig.11 In this embodiment, the first capillary structure 2313 includes a first capillary portion 2313a and a second capillary portion 2313b arranged in the first direction e1, the first capillary portion 2313a is disposed on the first cover 2311a, and the second capillary portion 2313b is disposed on the second cover 2311b. The first capillary portion 2313a may be one or more. The number of the second capillary portion 2313b is the same as the number of the first capillary portion 2313a.

[0158] A first concave pit is formed on the first capillary portion 2313a, and a second concave pit is formed on the second capillary portion 2313b. After the first capillary portion 2313a and the second capillary portion 2313b are connected, a capillary cavity can be defined between the first capillary portion 2313a and the second capillary portion 2313b. In this way, it is convenient to form a capillary cavity in the first capillary structure 2313, and the first capillary structure 2313 can be used to support the first cooling cavity Q1, which can improve the structural strength of the first heat dissipation portion 231 and help prevent the first heat dissipation portion 231 from deforming.

[0159] In this embodiment, the capillary cavity is formed by the first pit and the second pit docking. It is understandable that in other embodiments, the first pit can be formed only on the first capillary portion 2313a, or the second pit can be formed only on the second capillary portion 2313b.

[0160] In some embodiments, the first capillary portion 2313a and the first cover 2311a are formed as an integral structure. That is, the first capillary portion 2313a and the first cover 2311a are integrally formed. The second capillary portion 2313b and the second cover 2311b are formed as an integral structure. The first capillary portion 2313a and the second capillary portion 2313b can both be formed by an etching process. In this way, the processing difficulty of the first capillary structure 2313 can be reduced, and the connection strength between the first capillary portion 2313a and the first cover 2311a and the connection strength between the second capillary portion 2313b and the second cover 2311b can be effectively improved. In addition, when the first capillary portion 2313a and / or the second capillary portion 2313b are processed by an etching process, the roughness of the inner wall surface of the capillary cavity can also be increased, and it is beneficial to reduce the width of the capillary cavity, thereby increasing the specific surface area of ​​the first capillary structure 2313, which is beneficial to enhance the capillary force of the first capillary structure 2313, improve the heat dissipation performance of the first heat dissipation portion 231, and further help to improve the heat dissipation efficiency of the heating device 600.

[0161] In some embodiments, the width w of the capillary cavity is greater than or equal to 30 μm and less than or equal to 80 μm. The width w of the capillary cavity may be the size of the capillary cavity in the second direction e2. For example, the width of the capillary cavity may be 30 μm, 40 μm, 50 μm, 60 μm, 70 μm, 80 μm, etc. In this way, the specific surface area of ​​the first capillary structure 2313 can be increased, which is conducive to improving the capillary force of the first capillary structure 2313.

[0162] On the basis of any of the above embodiments, in order to enhance the capillary force of the vapor chamber, an auxiliary capillary structure (not shown) may be provided inside the vapor chamber. The auxiliary capillary structure may be a fiber structure.

[0163] In some other embodiments, see Fig.12 , Fig.12 sectional views of the heat dissipation structure 23 provided in some other embodiments of the present application. Fig. 9 The difference between the heat dissipation structure 23 in the illustrated embodiment is that the first heat dissipation portion 231 in the present embodiment does not include the first capillary structure 2313. In this case, the first cooling cavity Q1 can be a vacuum cavity or a non-vacuum cavity, as long as the first cooling cavity Q1 is a sealed cavity. The first heat dissipation portion 231 in the present embodiment can be applied to the heat dissipation structure 23 in any embodiment of the present application.

[0164] In this embodiment, the heat on the heating device 600 can be transferred to the first cooling medium 2312 through the first housing 2311, and the heat generated by the heating device 600 is absorbed by the first cooling medium 2312. In this way, it is also beneficial to improve the heat exchange efficiency between the first cooling medium 2312 and the heating device 600, thereby improving the heat dissipation efficiency of the heating device 600.

[0165] In some embodiments, the first cooling medium 2312 may be a liquid. For example, the first cooling medium 2312 may be water, ethylene glycol solution, propylene glycol solution, fluorinated liquid, liquid metal, etc. In this way, the first cooling medium 2312 has good fluidity, and the heat on the heating device 600 can be taken away in time through the first cooling medium 2312, which is beneficial to improving the heat exchange efficiency between the first cooling medium 2312 and the heating device 600, thereby improving the heat dissipation efficiency of the heating device 600.

[0166] In other embodiments, the first cooling medium 2312 may also be a gas (such as nitrogen) or a phase change material. The phase change material may be a solid-liquid phase change material, a gas-liquid phase change material, etc. For example, the phase change material may be paraffin.

[0167] In order to improve the heat dissipation performance of the first heat dissipation portion 231 , the thermal conductivity of the first cooling medium 2312 may be greater than the thermal conductivity of the first housing 2311 .

[0168] In some other embodiments, see Fig.13 , Fig.13 2 is a cross-sectional view of a heat dissipation structure 23 provided in some other embodiments of the present application. The heat dissipation structure 23 in this embodiment is different from the heat dissipation structure 23 in any of the above embodiments in that the first heat dissipation portion 231 in this embodiment includes, in addition to the first housing 2311 and the first cooling medium ( Fig.13In addition to the first housing 2311 (not shown), the first housing 2311 also includes a carrier plate 2314, and the first housing 2311 and the carrier plate 2314 are stacked in the first direction e1. The first region m21 is formed on the surface of the first housing 2311 that is away from the carrier plate 2314. In this embodiment, the second heat dissipation portion 232 is a metal plate, and the entire second heat dissipation portion 232 and the carrier plate 2314 form an integrated structure. In this case, the second heat dissipation portion 232 and the carrier plate 2314 can reuse the same metal plate.

[0169] In this way, after the first heat dissipation part 231 absorbs the heat of the heating device 600, it can be quickly transferred to the carrier plate 2314, and quickly diffused from the carrier plate 2314 to the second heat dissipation part 232. Therefore, the thermal resistance between the first area m21 and the second area m22 can also be reduced, so that the heat on the heating device 600 can be quickly diffused to the cold area through the heat source area of ​​the heat dissipation structure 23.

[0170] In some embodiments, the heat dissipation structure 23 further includes a second interface thermal conductive material 802, and the second interface thermal conductive material 802 is connected between the first shell 2311 and the carrier plate 2314. The second interface thermal conductive material 802 includes, but is not limited to, thermal conductive glue, thermal conductive pads, thermal conductive films, etc. In this way, it is beneficial to increase the contact area between the first shell 2311 and the carrier plate 2314, thereby improving the heat conduction efficiency between the first heat dissipation part 231 and the carrier plate 2314, so that the heat absorbed by the first heat dissipation part 231 can be quickly transferred to the carrier plate 2314, and quickly diffused from the carrier plate 2314 to the second heat dissipation part. In this way, the heat dissipation performance of the heat dissipation structure 23 can be further improved, and then the heat dissipation efficiency of the heating device 600 can be improved.

[0171] It is understandable that in other embodiments, the second interface thermal conductive material 802 may also be replaced by double-sided adhesive, UV curing adhesive, hot melt adhesive, thermosensitive adhesive, etc. In addition, the carrier plate 2314 in this embodiment may be applied to the heat dissipation structure 23 in any embodiment of the present application.

[0172] In some other embodiments, see Fig.14 , Fig.14 The cross-sectional view of the heat dissipation structure 23 provided in some other embodiments of the present application is that the heat dissipation structure 23 in this embodiment is different from the heat dissipation structure 23 in any of the above embodiments in that the structure of the second heat dissipation portion 232 in this embodiment is different from the structure of the second heat dissipation portion 232 in any of the above embodiments.

[0173] Specifically, in this embodiment, the second heat dissipation portion 232 includes a second housing 2321 and a second cooling medium 2322. A second cooling cavity Q2 is formed in the second housing 2321, and the second cooling medium 2322 is disposed in the second cooling cavity Q2.

[0174] In some embodiments, see Fig.14 The second housing 2321 includes a first sub-shell 2321a and a second sub-shell 2321b. The first sub-shell 2321a is fixedly connected to the second sub-shell 2321b, and a second cooling chamber Q2 is defined between the first sub-shell 2321a and the second sub-shell 2321b. One of the first sub-shell 2321a and the second sub-shell 2321b can be formed as an integral structure with the first cover 2311a. That is, a part of the second heat dissipation portion 232 and a part of the first heat dissipation portion 231 are formed as an integral structure.

[0175] In this way, after the first heat dissipation portion 231 absorbs the heat of the heating device 600, the first cover 2311a can be quickly diffused to the second heat dissipation portion 232, which can also reduce the contact thermal resistance between the first heat dissipation portion 231 and the second heat dissipation portion 232, so that the heat on the heating device 600 can be quickly diffused to the cold area through the heat source area of ​​the heat dissipation structure 23. In addition, the heat dissipation structure 23 in this embodiment can improve the heat exchange efficiency between the battery 400 and the second heat dissipation portion 232 by forming the second cooling cavity Q2 in the second heat dissipation portion 232, thereby further improving the heat dissipation efficiency of the heating device 600.

[0176] For example, see Fig.14 A first concave cavity is formed on the first subshell 2321a, and the second subshell 2321b is plate-shaped, and the second subshell 2321b is sealed and connected to the open mouth of the first concave cavity. The open mouth of the first concave cavity can be formed on the outer surface of the first subshell 2321a. The first subshell 2321a and the first cover 2311a form an integral structure. In this way, a second cooling cavity Q2 can be defined between the first subshell 2321a and the second subshell 2321b, which is conducive to reducing the processing difficulty of the heat dissipation structure 23.

[0177] It is understandable that the second sub-shell 2321b may also be formed with a second concave cavity. In this case, the first sub-shell 2321a may be formed with a first concave cavity or may not be formed with a second concave cavity.

[0178] Among them, the material of the second shell 2321 and the assembly method of the second shell 2321 can be designed with reference to the first shell 2311, and the second cooling medium 2322 can be designed with reference to the first cooling medium 2312, which will not be repeated here.

[0179] In some other embodiments, the second heat dissipation portion 232 may also be a heat spreader. Fig.15 , Fig.15 The second heat dissipation portion 232 includes a second housing 2321 and a second cooling medium ( Fig.15In addition to the second capillary structure 2323, the second cooling chamber Q2 may be formed as a vacuum chamber. In this way, the heat exchange efficiency between the battery 400 and the second heat dissipation portion 232 can be further improved, thereby further improving the heat dissipation efficiency of the heating device 600.

[0180] The second capillary structure 2323 can be designed with reference to the first capillary structure 2313 in any embodiment of the present application, which will not be described in detail. In addition, the second heat dissipation portion 232 in this embodiment can be applied to the heat dissipation structure 23 in any embodiment of the present application.

[0181] In some other embodiments, when the first heat dissipation portion 231 includes a carrier plate 2314, one of the first sub-shell 2321a and the second sub-shell 2321b can be formed as an integral structure with the carrier plate 2314. Fig.16 , Fig.16 The cross-sectional view of the heat dissipation structure 23 provided in some other embodiments of the present application. The first sub-shell 2321a and the carrier plate 2314 are formed as an integral structure.

[0182] In this way, after the first heat dissipation part 231 absorbs the heat of the heating device 600, it can be quickly diffused to the first sub-shell 2321a through the supporting plate 2314, so that the heat can be quickly transferred from the first heat dissipation part 231 to the second heat dissipation part 232. At the same time, the contact thermal resistance between the first heat dissipation part 231 and the second heat dissipation part 232 can be reduced, so that the heat on the heating device 600 can be quickly diffused to the cold area through the heat source area of ​​the heat dissipation structure 23.

[0183] Other structures of the first heat dissipation portion 231 in this embodiment can be designed with reference to the first heat dissipation portion 231 in any embodiment of the present application. Similarly, other structures of the second heat dissipation portion 232 in this embodiment can be designed with reference to the second heat dissipation portion 232 in any embodiment of the present application.

[0184] In some other embodiments, the first heat dissipation portion 231 may also be formed as a metal plate. The first heat dissipation portion 231 may replace the first heat dissipation portion 231 in any embodiment of the present application. Fig.17 , Fig.17 2 is a cross-sectional view of a heat dissipation structure 23 provided in some other embodiments of the present application. Fig.17 As shown in (a) in FIG. 1 , the first heat dissipation portion 231 and the second heat dissipation portion 232 are both formed as metal plates, and the thickness of the first heat dissipation portion 231 is greater than the thickness of the second heat dissipation portion 232. In this case, the first heat dissipation portion 231 and the second heat dissipation portion 232 are integrally formed as an integrated structural member. That is, the heat dissipation structure 23 is an integrally formed member.

[0185] For example, Fig.17As shown in (b) of FIG. 1 , when the first heat dissipation part 231 is a metal plate, the second heat dissipation part 232 may include a second housing 2321 and a second cooling medium 2322. Fig.17 As shown in (c) in FIG. 1 , when the first heat dissipation part 231 is a metal plate, the second heat dissipation part 232 may also be a heat spreader. Fig.17 (b) and Fig.17 In the embodiment shown in (c), one of the first sub-shell 2321a and the second sub-shell 2321b can be formed as an integral structure with the second heat dissipation portion 232. That is, a part of the second heat dissipation portion 232 and the first heat dissipation portion 231 as a whole form an integral structure.

[0186] In this way, the contact thermal resistance between the first heat dissipation portion 231 and the second heat dissipation portion 232 can also be reduced, so that the heat on the heating device 600 can be quickly diffused to the cold area through the heat source area of ​​the heat dissipation structure 23.

[0187] In some other embodiments, see Fig.18 , Fig.18 The cross-sectional view of the heat dissipation structure 23 provided in some other embodiments of the present application is different from the heat dissipation structure 23 in any of the above embodiments in that the heat dissipation structure 23 in this embodiment includes a third heat dissipation portion 233 and a fourth heat dissipation portion 234 arranged in the first direction e1.

[0188] The fourth heat dissipation portion 234 protrudes from one side surface of the third heat dissipation portion 233 , the first region m21 is formed on the surface of the fourth heat dissipation portion 234 away from the third heat dissipation portion 233 , and the second region m22 is formed on the third heat dissipation portion 233 .

[0189] The third heat dissipation unit 233 includes a third housing 2331, a third cooling medium ( Fig.18 The third cooling chamber Q3 is formed in the third housing 2331, and the third cooling medium and the third capillary structure 2333 are both arranged in the third cooling chamber Q3. The third cooling chamber Q3 can be a vacuum chamber. In this case, the third heat dissipation portion 233 is formed as a heat spreader.

[0190] Since the third heat dissipation portion 233 and the fourth heat dissipation portion 234 are arranged in the first direction e1, it is beneficial to increase the heat conduction area between the third heat dissipation portion 233 and the fourth heat dissipation portion 234, and therefore, it is beneficial to reduce the contact thermal resistance between the third heat dissipation portion 233 and the fourth heat dissipation portion 234. In this way, the heat on the heating device 600 can be quickly transferred to the third heat dissipation portion 233 through the fourth heat dissipation portion 234, which can reduce the thermal resistance between the first area m21 and the second area m22, so that the heat on the heating device 600 can be quickly diffused from the heat source area of ​​the heat dissipation structure 23 to the cold area, thereby improving the heat dissipation efficiency of the heating device 600. At the same time, by setting the third heat dissipation portion 233 as a heat spreader, the heat exchange efficiency between the battery 400 and the heat spreader can be further improved, which is beneficial to further improve the heat dissipation efficiency of the heating device 600.

[0191] In some embodiments, in order to further reduce the contact thermal resistance between the third heat dissipation portion 233 and the fourth heat dissipation portion 234, at least a portion of the fourth heat dissipation portion 234 and a portion of the third housing 2331 are formed as an integral structure. Specifically, the entire fourth heat dissipation portion 234 and a portion of the third housing 2331 may be formed as an integral structure, or a portion of the fourth heat dissipation portion 234 and a portion of the third housing 2331 may be formed as an integral structure.

[0192] For example, see Fig.18 The third housing 2331 includes a third cover 2331a and a fourth cover 2331b arranged in the first direction e1, a third cooling chamber Q3 is defined between the third cover 2331a and the fourth cover 2331b, and the fourth heat dissipation portion is located on the side of the third cover 2331a away from the fourth cover 2331b. At least a portion of the fourth heat dissipation portion 234 is formed as an integral structure with the third cover 2331a. Exemplarily, the fourth heat dissipation portion 234 is a metal part, in which case the entire fourth heat dissipation portion 234 is formed as an integral structure with the third cover 2331a.

[0193] Among them, the third cooling medium can be designed with reference to the first cooling medium 2312 in any embodiment of the present application, the third capillary structure 2333 can be designed with reference to the first capillary structure 2313 in any embodiment of the present application, and the material and assembly method of the third shell 2331 can be designed with reference to the first shell 2311, which will not be repeated here.

[0194] On this basis, in order to further improve the heat dissipation performance of the heat dissipation structure 23, the orthographic projection of the third cooling cavity Q3 on the reference plane overlaps with the orthographic projection of the fourth heat dissipation portion 234 on the reference plane. The reference plane is perpendicular to the first direction e1. In this way, it is beneficial to improve the heat exchange efficiency between the fourth heat dissipation portion 234 and the third heat dissipation portion 233, thereby improving the heat dissipation performance of the heat dissipation structure and improving the heat dissipation efficiency of the heating device.

[0195] It is understandable that, in other embodiments, the fourth heat dissipation portion 234 may also be a heat spreader or a heat pipe. In this case, the fourth shell of the fourth heat dissipation portion 234 and a portion of the third shell 2331 form an integral structure. That is, a portion of the fourth heat dissipation portion 234 and a portion of the third heat dissipation portion 233 form an integral structure. In this way, the contact thermal resistance between the fourth heat dissipation portion 234 and the third heat dissipation portion 233 is further reduced, and the contact thermal resistance between the first area m21 and the second area m22 can be further reduced, so that the heat on the heating device 600 can quickly diffuse from the heat source area of ​​the heat dissipation structure 23 to the cold area, thereby improving the heat dissipation efficiency of the heating device 600.

[0196] Of course, in other embodiments, the fourth heat dissipation portion 234 and the third heat dissipation portion 233 may also be separate parts, in which case a third interface thermal conductive material may be disposed between the fourth heat dissipation portion 234 and the third heat dissipation portion 233. In this way, the contact thermal resistance between the third heat dissipation portion 233 and the fourth heat dissipation portion 234 can also be reduced to a certain extent.

[0197] In some other embodiments, see Fig.19 , Fig.19 23 is a cross-sectional view of a heat dissipation structure 23 provided in some other embodiments of the present application. The heat dissipation structure 23 in this embodiment includes a fifth housing 235, a fifth cooling medium ( Fig.19 The fifth outer shell 235 has a fifth cooling cavity Q5 formed therein, and the fifth cooling medium and the fifth capillary structure 236 are disposed in the fifth cooling cavity Q5.

[0198] The fifth cooling cavity Q5 is a vacuum cavity. In this case, the heat dissipation structure 23 is formed as a heat spreader of unequal thickness. Of course, in other embodiments, the heat dissipation structure 23 may not include the fifth capillary structure 236. In this case, the fifth cooling cavity Q5 may be a vacuum cavity or a non-vacuum cavity, as long as the fifth cooling cavity Q5 is a sealed cavity.

[0199] See also Fig.19The fifth housing 235 includes a first wall plate 2351a and a second wall plate 2352a opposite to each other in the first direction e1, the second bottom surface m2 is formed on the surface of the first wall plate 2351a away from the second wall plate 2352a, and the second top surface m1 is formed on the surface of the second wall plate 2352a away from the first wall plate 2351a. Specifically, the fifth housing 235 includes a fifth cover 2351 and a sixth cover 2352 arranged in the first direction e1, and a fifth cooling chamber Q5 is defined between the fifth cover 2351 and the sixth cover 2352. The first wall plate 2351a is a part of the fifth cover 2351, and the second wall plate 2352a is a part of the sixth cover 2352.

[0200] Please continue reading Fig.19 The first wall plate 2351a includes a body portion 2351a1 and a protrusion portion 2351a2, the protrusion portion 2351a2 is connected to the body portion 2351a1, and the protrusion portion 2351a2 is arched relative to the body portion 2351a1 in a direction away from the second wall plate 2352a, the first region m21 is formed on the surface of the protrusion portion 2351a2 away from the second wall plate 2352a, and the second region m22 is formed on the surface of the body portion 2351a1 away from the second wall plate 2352a. The interior of the protrusion portion 2351a2 may be hollow, so as to form a part of the fifth cooling chamber Q5 inside the protrusion portion 2351a2. In this way, the heat dissipation structure 23 can be formed into a heat spreader of unequal thickness, which can reduce the thermal resistance between the first area m21 and the second area m22, so that the heat on the heating device 600 can quickly diffuse from the heat source area of ​​the heat dissipation structure 23 to the cooling area, and can meet the different requirements of the heat dissipation structure 23 corresponding to the first area m21 and the second area m22 for the thickness of the heat dissipation structure 23, thereby increasing the capacity of the battery 400 and realizing the light and thin design of the electronic device 1000.

[0201] In order to objectively evaluate the heat dissipation performance of the electronic device 1000 and the capacity of the battery 400 in the embodiment of the present application, the heat dissipation capacity of the electronic device 1000, the thickness gain of the middle frame 201, and the capacity gain of the battery 400 of different schemes are compared as follows for exemplary description. Among them, the structure and material of the middle plate 20, the heat dissipation capacity of the electronic device 1000, the thickness gain of the middle frame 201, and the capacity gain of the battery 400 in the electronic device 1000 of different schemes are shown in Table 1.

[0202] Table 1

[0203]

[0204] In the embodiment of the present application, the test method of the heat dissipation capacity of the electronic device 1000 is: after the electronic device 1000 is kept running for a certain period of time at a certain brightness, a certain volume, and a certain power, the temperature change value of the electronic device 1000 is obtained. The calculation formula of the heat dissipation capacity is: heat dissipation capacity = power consumption / temperature change value. Among them, the larger the value of the heat dissipation capacity, the better the heat dissipation performance of the electronic device 1000.

[0205] The calculation formula of the battery capacity is: battery capacity = volume of the battery 400 * energy density of the battery 400. The energy density refers to the amount of electricity that the battery 400 can store in a certain space, and the unit is Wh / L.

[0206] It can be seen from Table 1 that the heat dissipation performance of the electronic device 1000 in Solution 1 is better, reaching 49.5 mA / °C, but the thickness gain of the middle frame 201 and the capacity gain of the battery 400 are both 0.

[0207] In schemes 2, 3 and 4, the thickness of the middle frame 201 can be reduced by 0.15mm, and the capacity of the battery 400 can be increased by 80mAh. However, the heat dissipation capacity of the electronic device 1000 in scheme 2 is significantly weaker, only 43mA / ℃, the heat dissipation capacity of the electronic device 1000 in scheme 3 is the best, reaching 50mA / ℃, and the heat dissipation capacity of the electronic device 1000 in scheme 4 is 45.5mA / ℃, which is less than the heat dissipation capacity of the electronic device 1000 in scheme 1 and greater than the heat dissipation capacity of the electronic device 1000 in scheme 2.

[0208] It can be seen that the electronic device 1000 in solution 3 can reduce the thickness of the middle frame 201 while increasing the capacity of the battery 400, and can improve the heat dissipation capability. The electronic device 1000 in solution 4 can reduce the thickness of the middle frame 201, ensure the capacity gain of the battery 400, and reduce the decrease in heat dissipation capability.

[0209] In summary, the middle frame 201 and the electronic device 1000 in the embodiment of the present application can increase the capacity of the battery 400 while reducing the thickness of the electronic device 1000, and can ensure that the electronic device 1000 has good heat dissipation capability, and can take into account both the heat dissipation performance of the electronic device 1000 and the need for thinning the entire device.

[0210] In the description of this specification, specific features, structures, materials or characteristics may be combined in an appropriate manner in any one or more embodiments or examples.

[0211] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A middle frame, characterized in that: include: A middle plate body, the middle plate body comprising a first top surface and a first bottom surface opposite to each other in a first direction, the middle plate body being provided with a through hole, the through hole penetrating the first bottom surface and the first top surface; a heat dissipation structure, the heat dissipation structure being arranged in the through hole, the heat dissipation structure comprising a second top surface and a second bottom surface opposite to each other, the second bottom surface being oriented in the same direction as the first bottom surface, the second bottom surface comprising a first area and a second area, the second area being recessed relative to the first area toward the second top surface; The first area is used for thermally conducting connection with the heating device, and the second area is used for fixing the battery.

2. The middle frame according to claim 1, characterized in that: The heat dissipation structure includes a first heat dissipation portion and a second heat dissipation portion arranged in a second direction, the second direction is perpendicular to the first direction, the first area is formed in the first heat dissipation portion, and the second area is formed in the second heat dissipation portion; At least a portion of the second heat dissipation portion and at least a portion of the first heat dissipation portion form an integral structure.

3. The middle frame according to claim 2, characterized in that: The first heat dissipation part includes a first shell and a first cooling medium. A first cooling cavity is formed in the first shell. The first cooling medium is disposed in the first cooling cavity.

4. The middle frame according to claim 3, characterized in that: The first heat dissipation portion includes a first capillary structure, and the first capillary structure is disposed in the first cooling cavity, and the first cooling cavity is a vacuum cavity.

5. The middle frame according to claim 3 or 4, characterized in that: The first housing includes a first cover and a second cover arranged in the first direction, the first cooling cavity is defined between the first cover and the second cover, and the first area is formed on a surface of the second cover away from the first cover; At least a portion of the second heat dissipation portion and the first cover body form an integral structure.

6. The middle frame according to claim 3 or 4, characterized in that: The first heat dissipation portion includes a carrier plate, the first housing and the carrier plate are stacked in the first direction, and the first area is formed on a surface of the first housing facing away from the carrier plate; At least a portion of the second heat dissipation portion and the supporting plate form an integral structure.

7. The middle frame according to any one of claims 2 to 6, characterized in that: The second heat dissipation portion is a metal plate.

8. The middle frame according to any one of claims 2 to 6, characterized in that: The second heat dissipation portion includes a second shell and a second cooling medium. A second cooling cavity is formed in the second shell. The second cooling medium is disposed in the second cooling cavity.

9. The middle frame according to claim 1, characterized in that: The heat dissipation structure comprises a third heat dissipation portion and a fourth heat dissipation portion arranged in a first direction, the fourth heat dissipation portion protrudes from a side surface of the third heat dissipation portion, the first area is formed on a surface of the fourth heat dissipation portion away from the third heat dissipation portion, and the second area is formed on the third heat dissipation portion; The third heat dissipation part includes a third shell and a third cooling medium. A third cooling cavity is formed in the third shell. The third cooling medium is disposed in the third cooling cavity.

10. The middle frame according to claim 9, characterized in that: The fourth heat dissipation part is a metal block, a heat spreader or a heat pipe.

11. The middle frame according to claim 9 or 10, characterized in that: The third housing includes a third cover and a fourth cover arranged in the first direction, the third cooling cavity is defined between the third cover and the fourth cover, and the fourth heat dissipation portion is located on a side of the third cover away from the fourth cover; At least a portion of the fourth heat dissipation portion and the third cover body form an integral structure.

12. The middle frame according to claim 1, characterized in that: The heat dissipation structure includes a fifth housing and a fifth cooling medium, a fifth cooling cavity is formed in the fifth housing, and the fifth cooling medium is arranged in the fifth cooling cavity; The fifth shell includes a first wall plate and a second wall plate opposite to each other in the first direction, the first wall plate includes a main body portion and a protrusion portion, the protrusion portion is connected to the main body portion, and the protrusion portion is arched relative to the main body portion in a direction away from the second wall plate, the first area is formed on a surface of the protrusion portion away from the second wall plate, and the second area is formed on a surface of the main body portion away from the second wall plate.

13. The middle frame according to claim 12, characterized in that: The heat dissipation structure includes a fifth capillary structure, and the fifth capillary structure is arranged in the fifth cooling cavity, and the fifth cooling cavity is a vacuum cavity.

14. The middle frame according to any one of claims 1 to 13, characterized in that: The heat dissipation structure includes a first metal component, the middle plate body includes a second metal component, and the strength of the first metal component is greater than the strength of the second metal component.

15. The middle frame according to any one of claims 1 to 14, characterized in that: The distance between the first area and the second top surface is greater than or equal to 0.1 mm and less than or equal to 0.25 mm; and / or A distance between the second region and the second top surface is greater than or equal to 0.2 mm and less than or equal to 0.4 mm.

16. The middle frame according to any one of claims 1 to 15, characterized in that: Also includes: A frame, the frame being fixedly connected to the outer edge of the middle plate body; A back cover is fixedly connected to the frame, and the back cover is spaced apart from the middle plate body in the first direction.

17. An electronic device, characterized in that: include: A middle frame, wherein the middle frame is the middle frame according to any one of claims 1 to 16; a heating device, the heating device being thermally conductively connected to the first region; A battery is fixedly connected to the second area.

18. The electronic device according to claim 17, characterized in that: The battery includes a fixed end surface facing the second region, and an orthographic projection of the fixed end surface on the first bottom surface is located within an orthographic projection of the first region on the first bottom surface.

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