Semiconductor optical fiber coupling laser
By welding the COS chip on the housing plate and setting a heat dissipation channel, making each chip the same spacing as the channel, the problem of indirect water-cooled heat dissipation in the existing technology affecting the chip life, achieving more effective heat dissipation and stable output.
Patent Information
- Application Number
- CN202421706174.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-18
- Publication Date
- 2025-04-25
- Estimated Expiration
- 2034-07-18
AI Technical Summary
The indirect water-cooled heat dissipation method of existing fiber coupling modules affects the life and power output of a single-tube chip, and lacks a design to directly dissipate heat within the module.
A semiconductor fiber coupled laser is designed to achieve direct and uniform heat dissipation by welding COS chips on the housing plate and setting a heat dissipation channel inside the housing plate, so that each COS chip is kept at the same distance from the heat dissipation channel.
This design effectively improves the heat dissipation performance of semiconductor lasers, extends service life, ensures stable output of high-power semiconductor lasers, and simplifies structural composition.
Smart Images
Figure CN222802327U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of laser technology, and in particular to a semiconductor fiber-coupled laser. Background Art
[0002] Multi-single-tube semiconductor fiber-coupled lasers have the advantages of high photoelectric efficiency and long life. They are usually made by arranging multiple single-tubes in a stepwise manner and then spatially combining them after fast and slow axis collimation. The multi-path spatially stacked light beams are combined by polarizers, and after wavelength combination, they are focused and coupled into optical fibers.
[0003] For multi-single-tube fiber coupling modules, multiple COS (Chip on Substrate) are often welded to the corresponding unit heat sink, and then installed on the stepped bottom plate heat sink for heat dissipation; or directly welded to the stepped bottom plate heat sink. Reasonable heat dissipation is conducive to extending the life of the semiconductor laser and ensuring the stability of the output power.
[0004] With the development of single-tube chip technology in recent years, the power of a single-tube chip is increasing year by year, and the heat generated during operation is also increasing; in order to effectively ensure the life of high-power semiconductor lasers and the stability of output power, a reasonable heat dissipation structure should be designed to ensure the heat dissipation of the single tube.
[0005] At present, most fiber-coupled modules still use indirect water cooling for heat dissipation. There is no water cooling channel on the bottom plate of the module. The heat dissipation of the fiber-coupled module is carried out through a water-cooling plate with a water-cooling medium, rather than the water-cooling medium being directly located inside the fiber-coupled module. This indirect heat dissipation method affects the life and power output of the single-tube chip. Utility Model Content
[0006] The purpose of this application is to provide a semiconductor fiber-coupled laser with good heat dissipation performance, so that the semiconductor laser system can achieve good heat dissipation, increase reliability, extend service life, and have a simple structure, which is convenient for achieving stable output of high-power semiconductor lasers.
[0007] In order to achieve the above-mentioned purpose, the utility model provides a semiconductor fiber-coupled laser, comprising: a shell plate, on which a plurality of COS chips are welded, and relative to the horizontal plate surface of the shell plate, the installation height of each COS chip is the same, and a heat dissipation channel is arranged inside the shell plate, and the welding position of each COS chip is at the same distance from the heat dissipation channel.
[0008] In an optional embodiment, the COS chips are arranged in a row on the housing plate, and an extension direction of the heat dissipation channel is parallel to a layout direction of the COS chips.
[0009] In an optional embodiment, the heat dissipation channel includes a water cooling channel with a circular cross-section, and the welding position of the COS chip is vertically opposite to the layout position of the water cooling channel.
[0010] In an optional embodiment, the COS chips have the same specifications, and the welding position of each COS chip has the same axial distance with the water cooling channel.
[0011] In an optional embodiment, an indirect heat sink plate is welded on the horizontal plate surface of the shell plate, and the indirect heat sink plate includes a flat plate structure with uniform thickness and welded to the horizontal plate surface, and each COS chip is welded on the top wall of the indirect heat sink plate.
[0012] In an optional embodiment, the water cooling channel includes a water inlet and a water outlet, and the water inlet and the water outlet are arranged on the bottom wall of the shell flat plate, or the water inlet and the water outlet are arranged on the side wall of the shell and have the same height.
[0013] In an optional embodiment, the water cooling channel includes a chip water cooling channel and a lens water cooling channel that are interconnected and located on the same horizontal plane, the chip water cooling channel is arranged directly below the COS chip, and the lens water cooling channel is arranged on the outside of the chip water cooling channel.
[0014] In an optional embodiment, the COS chip is provided with a corresponding reflective lens, and the reflective lens includes first reflective lenses arranged in a row, the reflective mirror surfaces of the first reflective lenses are all tilted upward, and the tilt angles of all the first reflective lenses are the same.
[0015] In an optional embodiment, the reflective lens further includes a second reflective lens, which is dispersedly arranged on the housing flat plate and is used to reflect the reflected light beam of the first reflective lens and focus it through a focusing lens.
[0016] In an optional embodiment, the installation heights of the first reflective lenses are the same, and the lens water cooling channel is arranged directly below the first reflective lenses.
[0017] By welding the COS chip on the shell plate and providing a heat dissipation channel inside the shell plate, the shell plate can be directly cooled and the COS chip can be effectively cooled.
[0018] Relative to the horizontal plate surface of the shell plate, the installation height of each COS chip is the same, which makes the chips evenly installed without steps, simplifies the structural composition and reduces the processing difficulty.
[0019] Combined with the same spacing between the welding position of each COS chip and the heat dissipation channel, an equidistant heat dissipation relationship can be formed, achieving equally effective heat dissipation for each COS chip, making the heat dissipation distribution of the chip more reasonable, effectively extending the life of the semiconductor laser and ensuring the stability of the output power.
[0020] Other features and advantages of the present application will be described in detail in the subsequent detailed description. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.
[0022] Figure 1 This is a schematic diagram of the structure of the semiconductor fiber-coupled laser in this application;
[0023] Figure 2 This is a schematic diagram of the distribution structure of the heat dissipation channels on the shell plate in this application;
[0024] Figure 3 It is a schematic diagram of the structure of the shell plate and the indirect heat sink plate in this application;
[0025] Figure 4 This is a schematic diagram of the installation structure of the optical path component on the housing plate in this application.
[0026] icon:
[0027] 1- Shell plate;
[0028] 2-COS chip;
[0029] 3- heat dissipation channel; 3a- chip water cooling channel; 3b- lens water cooling channel; 31- water inlet; 32- water outlet;
[0030] 4- Indirect heat sink plate;
[0031] 5- first reflective lens;
[0032] 6- second reflective lens;
[0033] 7- Focusing lens;
[0034] 8-Fast axis collimator;
[0035] 9- Slow axis collimator. DETAILED DESCRIPTION
[0036] In order to make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the technical scheme in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all of the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.
[0037] In the description of this application, it should be noted that the terms "inside", "outside", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the product of the application is usually placed when in use, which is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application. In addition, the terms "first", "second", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.
[0038] In the description of this application, it should also be noted that, unless otherwise clearly specified and limited, the terms "disposed" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.
[0039] See also Figure 1 , and combined with Figure 2-Figure 4 The semiconductor fiber-coupled laser in the present application is specifically configured by setting a heat dissipation channel 3 in the heat sink plate, changing the installation arrangement of the COS chip 2 on the heat sink plate, and controlling the COS chip 2 to maintain the same distance with the heat dissipation channel 3, so that each COS chip 2 can obtain the same uniform and equally effective heat dissipation, thereby achieving more reasonable heat dissipation, realizing good heat dissipation of the semiconductor laser as a whole, extending the service life of the laser, and ensuring the stable output of the high-power semiconductor laser.
[0040] With reference to the accompanying drawings, the semiconductor fiber coupled laser in the present invention has a main structure comprising a shell plate 1 as a heat sink plate, and a plurality of COS chips 2 are welded on the shell plate 1 .
[0041] Specifically, the heat sink plate in the present application mainly includes a flat plate structure with uniform thickness. At the same time, the shell plate 1 includes a flat plate surface located at the top, and a welding area is arranged on the horizontal plate surface at the top of the flat plate surface. The COS chip 2 is welded and installed on the welding area.
[0042] When the shell plate 1 is in a horizontal arrangement state, the installation height of each COS chip 2 on the shell plate 1 is the same relative to the horizontal plate surface at the top. That is to say, the installation of the COS chip 2 in the present application is specifically a heat sink plate sharing the same horizontal height, or an installation form of an indirect heat sink sharing the same horizontal height on the basis of the shell plate 1.
[0043] By installing all COS chips 2 at the same height on the heat sink plate, the structural composition and connection form of the COS chip 2 on the housing plate 1 can be simplified, and it is more conducive to forming the same heat dissipation effect for each COS chip 2 .
[0044] In order to ensure the heat dissipation effect, a heat dissipation channel 3 is arranged inside the shell plate 1 in the present application. Compared with the heat transfer between the existing heat sink plate and other cooling components, the heat dissipation channel 3 arranged inside the shell can dissipate heat to the heat sink plate more directly, thereby enhancing the heat dissipation effect.
[0045] Furthermore, based on the same installation height of each COS chip 2 on the shell plate 1, by making the welding position of each COS chip 2 and the spacing between the heat dissipation channel 3 the same, it is possible to achieve a heat transfer interval between each COS chip 2 and the heat dissipation channel 3, so that each COS chip 2 can obtain the same heat dissipation effect. Combined with the heat dissipation channel 3 being directly arranged in the shell plate 1, equally effective heat dissipation can be achieved for each COS chip 2, and the heat dissipation structure of the single-tube COS chip 2 can be reasonably distributed to the greatest extent.
[0046] In one specific embodiment, the COS chips 2 are arranged in a row on the housing plate 1, see Figure 1 In the layout structure, COS chips 2 are arranged in two rows on the shell plate 1, and the two rows of COS chips 2 are respectively provided with heat dissipation channels 3. In order to effectively dissipate heat accordingly, the extension direction of the heat dissipation channel 3 is parallel to the layout direction of each row of COS chips 2.
[0047] Preferably, in order to more clearly define the equidistant heat dissipation relationship between each COS chip 2 and the heat dissipation channel 3, the heat dissipation channel 3 includes a water cooling channel with a circular cross-section. During operation, by introducing cooling water into the water cooling channel with a circular cross-section, the flow resistance can be reduced, thereby promoting the refrigerant to flow smoothly in the heat dissipation channel 3.
[0048] At the same time, the welding position of COS chip 2 is directly opposite to the layout position of the water cooling channel, which can shorten the conduction distance to the greatest extent, and the cold energy of the refrigerant medium acts on COS chip 2 with the minimum heat transfer distance, ensuring efficient heat dissipation of COS chip 2.
[0049] The COS chips 2 in the present invention have the same specifications, which determines that the heat dissipation of each COS chip 2 is the same. On this basis, in order to enable each COS chip 2 to obtain relatively uniform cooling, the welding position of each COS chip 2 is at the same axial distance from the water-cooling channel. Combined with the water-cooling channel with a circular cross-section, the conduction of the same cooling amount can be maintained, ensuring a uniform heat dissipation effect.
[0050] The COS chip 2 can be directly welded to the COS chip 2 welding area on the shell plate 1, or can be welded at a distance in the COS chip 2 welding area. Specifically, when performing the distance welding, an indirect heat sink plate 4 is welded on the horizontal plate surface of the shell plate 1, and the indirect heat sink plate 4 is installed in the COS chip 2 welding area.
[0051] In order to ensure that the heat transfer distance of each COS chip 2 is the same, the indirect heat sink plate 4 includes a flat plate structure with uniform thickness and welded to the horizontal plate surface. The bottom wall of the indirect heat sink plate 4 is completely in contact with the top plate surface of the shell plate 1, which can form a smooth heat transfer channel. Combined with each COS chip 2 being welded to the top wall of the indirect heat sink plate 4, it is ensured that the heat dissipation effect of each COS chip 2 on the indirect heat sink plate 4 is the same.
[0052] From the structural perspective of the heat dissipation channel 3, in another specific embodiment, the water cooling channel includes a water inlet 31 and a water outlet 32, and the water inlet 31 and the water outlet 32 are arranged on the bottom wall of the shell plate 1, or the water inlet 31 and the water outlet 32 are arranged at the same height position of the shell side wall.
[0053] Through this arrangement, the water inlet and outlet forms of the refrigerant at the bottom or side of the shell plate 1 can be flexibly adjusted to meet the specific transportation requirements of different working media.
[0054] It should be pointed out that no matter what form is adopted, the heat dissipation channel 3 is at the same height relative to the thickness direction of the shell plate 1, which can promote each COS chip 2 to maintain the same heat transfer distance with the heat dissipation channel 3 and ensure the maintenance of the same heat dissipation amount.
[0055] Furthermore, the water cooling channel includes a chip water cooling channel 3a and a lens water cooling channel 3b which are interconnected and located at the same horizontal plane. Specifically, the chip water cooling channel 3a is arranged directly below the COS chip 2 to provide cooling capacity for the COS chip 2.
[0056] Two rows of COS chips 2 are arranged adjacent to each other, and the lens water cooling channel 3b is arranged outside the chip water cooling channel 3a to provide cooling capacity for the optical lens components corresponding to each row of COS chips 2.
[0057] Since the chip water cooling channel 3a and the lens water cooling channel 3b are arranged on the same horizontal plane, the optical lens corresponding to the COS chip 2 can be evenly cooled, so that the semiconductor laser as a whole can obtain a relatively uniform heat dissipation effect.
[0058] The COS chip 2 is provided with a corresponding reflective lens, which includes first reflective lenses 5 arranged in a row. The first reflective lenses 5 are specifically small reflective mirrors corresponding to the COS chip 2. The reflective mirror surfaces of the first reflective lenses 5 are all tilted upward, and the tilt angles of all the first reflective lenses are the same, that is, the reflective mirror surfaces of all the small reflective mirrors can be arranged in a row at the same tilt angle, so that the light beams corresponding to the COS chip 2 are arranged in an array in the spatial direction. The light beams between the COS chips 2 do not affect each other during the reflection process, and are finally reflected by the large reflector and focused by the focusing mirror 7 into the optical fiber, so as to realize the fiber-coupled output of the semiconductor laser.
[0059] The reflective surfaces of all small reflectors are arranged in a row at the same tilt angle. The mechanism is that due to the near and far arrangement of the COS chips 2, combined with the same tilt angle of the reflective surfaces of the small reflectors, in the height direction of the optical path transmission, array beams of mutually parallel and tilted transmission with different heights will be formed, forming an array arrangement of light beams in the spatial direction. The different spacings between adjacent light beams can also be adjusted by adjusting the size of the tilt angle.
[0060] The reflective lens also includes a second reflective lens 6, which is the aforementioned large reflective mirror. Each row of COS chips 2 and each row of small reflective mirrors are provided with two large reflective mirrors arranged in pairs.
[0061] The large reflectors are dispersedly arranged on the housing flat plate 1 , and are used to reflect the reflected light beam of the first reflector lens 5 and focus it through the focusing lens 7 .
[0062] It should be noted that the small reflectors have the same tilt angle and are installed at the same height on the housing plate 1. The lens water cooling channel 3b is arranged directly below the small reflectors, so that the corresponding small reflectors can obtain a relatively uniform heat dissipation effect.
[0063] At the same time, the small reflector is installed at the same height as the housing plate 1, and the lens and the module base are easy to process without a complex step structure. By adjusting the pitch position and the yaw position of the small reflector, the superposition of the light beam in the fast axis direction is achieved.
[0064] The housing plate 1 in the utility model is made of high thermal conductivity materials, such as copper, brass, aluminum nitride and other high thermal conductivity materials, and the housing plate 1 is combined with the heat dissipation channel 3 arranged inside to form a tube shell structure. The tube shell is provided with a COS chip 2 welding area and a lens adjustment area. A plurality of heat dissipation channels 3 are distributed inside the tube shell, and the heat dissipation medium is introduced from the bottom or the side to achieve effective heat dissipation of the semiconductor laser. The heat dissipation channels 3 are distributed at the bottom of the COS chip 2 welding area to achieve effective heat dissipation of each COS chip 2.
[0065] After the semiconductor single tube is packaged into a COS chip 2, it is welded to the COS chip 2 welding area. The distance from each COS chip 2 welding position to the bottom heat dissipation channel 3 is equal. The COS chip 2 is collimated by the fast axis collimator 8 and the slow axis collimator 9, and then reflected by a small reflector to achieve spatial beam combining arrangement, and then coupled and focused by subsequent lenses into the optical fiber.
[0066] The distance between adjacent COS chips 2 can also be enlarged to facilitate the heat dissipation of each higher-power COS chip 2 and achieve effective heat dissipation of each COS chip 2 .
[0067] The COS chips 2 can also be arranged in a front-to-back staggered manner, and multiple rows of COS chips 2 can be arranged in a bundle, effectively reducing the volume of the module. The COS chips 2 can be placed in opposite directions or in the same direction, which enhances the flexibility in the actual assembly process.
[0068] It should be noted that, in the absence of conflict, the features in the embodiments of this application may be combined with each other.
[0069] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims
1. A semiconductor fiber-coupled laser, characterized in that: include: A shell plate, on which a plurality of COS chips are welded, each COS chip is installed at the same height relative to the horizontal surface of the shell plate, a heat dissipation channel is provided inside the shell plate, and a welding position of each COS chip is at the same distance from the heat dissipation channel.
2. The semiconductor fiber-coupled laser according to claim 1, characterized in that: The COS chips are arranged in a row on the housing plate, and the extension direction of the heat dissipation channel is parallel to the arrangement direction of the COS chips.
3. The semiconductor fiber-coupled laser according to claim 1 or 2, characterized in that: The heat dissipation channel includes a water cooling channel with a circular cross section, and the welding position of the COS chip is vertically opposite to the layout position of the water cooling channel.
4. The semiconductor fiber-coupled laser according to claim 3, characterized in that: The COS chips have the same specifications, and the welding position of each COS chip is at the same distance from the axis of the water cooling channel.
5. The semiconductor fiber-coupled laser according to claim 3, characterized in that: An indirect heat sink plate is welded on the horizontal plate surface of the shell plate. The indirect heat sink plate includes a flat plate structure with uniform thickness and welded to the horizontal plate surface. Each COS chip is welded on the top wall of the indirect heat sink plate.
6. The semiconductor fiber-coupled laser according to claim 3, characterized in that: The water cooling channel comprises a water inlet and a water outlet, wherein the water inlet and the water outlet are arranged on the bottom wall of the shell flat plate, or the water inlet and the water outlet are arranged on the side wall of the shell and have the same height.
7. The semiconductor fiber-coupled laser according to claim 3, characterized in that: The water cooling channel includes a chip water cooling channel and a lens water cooling channel which are interconnected and located at the same horizontal plane. The chip water cooling channel is arranged directly below the COS chip, and the lens water cooling channel is arranged outside the chip water cooling channel.
8. The semiconductor fiber-coupled laser according to claim 7, characterized in that: The COS chip is provided with a reflective lens corresponding to the first reflective lens. The reflective lens includes first reflective lenses arranged in a row. The reflective mirror surfaces of the first reflective lenses are all tilted upward, and the tilt angles of all the first reflective lenses are the same.
9. The semiconductor fiber-coupled laser according to claim 8, characterized in that: The reflective lens also includes a second reflective lens, which is dispersedly arranged on the housing flat plate and is used to reflect the reflected light beam of the first reflective lens and focus it through a focusing lens.
10. The semiconductor fiber-coupled laser according to claim 8, characterized in that: The installation heights of the first reflective lenses are the same, and the lens water cooling channel is arranged directly below the first reflective lenses.