DSP-based power amplifier structure
By using DSP chips in the amplifier equipment for audio processing and setting up silicone shock pads in key areas, the problem of component performance degradation in the face of sound wave vibration is solved, achieving higher stability and audio quality.
Patent Information
- Application Number
- CN202421734271.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-22
- Publication Date
- 2025-04-25
- Estimated Expiration
- 2034-07-22
AI Technical Summary
When existing amplifier equipment is vibrating in the face of sound waves, electronic components are prone to deterioration or failure due to physical displacement, loose connections or breakage, and lack effective earthquake resistance.
A DSP-based amplifier structure is designed, using a DSP chip for audio processing, and a silicone shock-resistant pad is installed between the bottom of the housing and between the oblique strut and the main control board to resist and filter out vibration caused by sound waves.
It improves the adaptability and stability of the amplifier equipment in the physical environment, protects electronic components, provides a better quality and personalized audio experience, and reduces maintenance costs.
Smart Images
Figure CN222803003U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of power amplifier technology, specifically to a power amplifier structure based on DSP. Background Technology
[0002] A power amplifier, or power amplifier for short, is a crucial device in an audio system. Its applications are wide-ranging: in music performances and live shows, it enables music to travel further and makes the sound clearer and more dynamic. In recording studios and music production, it drives professional monitor speakers, allowing music producers to hear high-quality music for better mixing, post-production, and other tasks. In home theaters and audio systems, it enhances the overall sound quality, allowing home users to enjoy an immersive music and movie experience at home.
[0003] Power amplifiers contain many vibration-sensitive electronic components, such as integrated circuits, transistors, and capacitors. When subjected to the vibrations of sound waves, especially in venues like concerts, these components may experience performance degradation or failure due to physical displacement, loose connections, or breakage. Furthermore, current power amplifiers do not have directly incorporated vibration-damping components; the entire device is simply fixed in place or mounted via the housing, without considering effective handling and damping of vibrations from sound waves.
[0004] Traditional Class A and Class B power amplifiers often use different types of power amplifiers and signal processing chips depending on the application. Class A power amplifiers generally have good linearity and low distortion, but lower efficiency and higher heat generation.
[0005] With the increasing prevalence of digital signal processing technology, many traditional power amplifiers are now adopting DSP (Digital Signal Processor) chips to further enhance their audio processing capabilities and adaptability. DSP chips can perform real-time processing and adjustment of audio signals, providing a richer and more personalized audio experience.
[0006] Therefore, to address the above problems, a DSP-based power amplifier structure is needed. Utility Model Content
[0007] The purpose of this invention is to provide a DSP-based power amplifier structure. This power amplifier, utilizing a DSP chip, offers advantages such as strong audio processing capabilities, good adaptability and adjustability, strong adaptability to physical environments, high integration and cost savings, high stability and reliability, convenient interface and integration, and ease of upgrades and maintenance. These advantages have led to the widespread application of DSP power amplifiers in modern audio systems, providing users with a higher quality and more personalized audio experience. Furthermore, the silicone anti-vibration pads at the bottom of the housing and between the diagonal brace and the main control board further filter vibrations inside the housing after the outer casing has absorbed most of the sound waves, thus further protecting the electronic components on the main control board. This invention is highly practical.
[0008] This utility model is implemented as follows:
[0009] A DSP-based power amplifier structure includes a housing, with support columns fixed at both ends of a base plate inside the housing, diagonal braces fixed on both sides of the support columns, a first anti-vibration pad abutting against the diagonal braces, and a main control board fixedly connected to the first anti-vibration pad.
[0010] A DSP processing unit is fixedly mounted on the main control board. An audio signal processing unit is connected to the input terminal of the DSP processing unit. The audio signal processing unit is connected to a signal connection unit. The DSP processing unit is connected to a sound control unit.
[0011] A signal input interface is provided on one side of the outer wall of the housing. A volume adjustment knob and a sound effect control knob are provided on the side of the housing opposite to the side with the input interface. Both the volume adjustment knob and the sound effect control knob are connected to the sound control unit.
[0012] Furthermore, the control unit uses a TPA3116D2 control chip, the DSP processing unit uses a DU562 processing chip, and the signal connection unit is a Bluetooth unit or a Wi-Fi unit. The signal input interface is an RCA interface, a coaxial interface, an XLR interface, a PHONO interface, a USB interface, or a 6.35mm interface. Second anti-vibration pads are provided at each of the four corners of the bottom of the housing; both the first and second anti-vibration pads are made of silicone.
[0013] Compared with existing technologies, this utility model, using a DSP chip-based power amplifier, offers advantages such as strong audio processing capabilities, good adaptability and adjustability, strong adaptability to physical environments, high integration and cost savings, high stability and reliability, convenient interface and integration, and ease of upgrades and maintenance. These advantages have led to the widespread application of DSP power amplifiers in modern audio systems, providing users with a higher quality and more personalized audio experience. Furthermore, the silicone anti-vibration pads at the bottom of the housing and between the diagonal support rod and the main control board further filter vibrations inside the housing after the outer shell has absorbed most of the sound waves, thus further protecting the electronic components on the main control board. This utility model is highly practical. Attached Figure Description
[0014] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained from these drawings without creative effort.
[0015] Figure 1 This is a schematic diagram of the structure of the device of this utility model;
[0016] Figure 2 This is a system structure diagram of this utility model;
[0017] Figure 3 This is a circuit diagram of the DSP processing unit of this utility model;
[0018] The components include: housing 1, RCA interface 11, USB interface 12, second anti-vibration pad 2, main control board 3, support column 4, diagonal brace 41, and first anti-vibration pad 5. Detailed Implementation
[0019] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this utility model, not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are within the scope of protection of this utility model. Therefore, the following detailed description of the embodiments of this utility model provided in the accompanying drawings is not intended to limit the scope of the claimed utility model, but merely represents selected embodiments of this utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are within the scope of protection of this utility model.
[0020] Please see Figure 1-3 A DSP-based power amplifier structure includes a housing 1, with support columns 4 fixedly installed at both ends of a bottom plate inside the housing 1, and diagonal braces 41 fixedly installed on both sides of the support columns 4. A first anti-vibration pad 5 is abutted against the diagonal braces 41, and a main control board 3 is fixedly connected to the first anti-vibration pad 5.
[0021] A DSP processing unit is fixedly mounted on the main control board 3. An audio signal processing unit is connected to the input terminal of the DSP processing unit. The audio signal processing unit is connected to a signal connection unit. The DSP processing unit is connected to a sound control unit.
[0022] A signal input interface is provided on one side of the outer wall of the housing. A volume adjustment knob and a sound effect control knob are provided on the side of the housing opposite to the side with the input interface. Both the volume adjustment knob and the sound effect control knob are connected to the sound control unit.
[0023] In this embodiment, the control unit uses a TPA3116D2 control chip, the DSP processing unit uses a DU562 processing chip, and the signal connection unit is a Bluetooth unit or a Wi-Fi unit. The signal input interface is an RCA interface, a COAXIAL coaxial interface, an XLR interface, a PHONO interface, a USB interface, or a 6.35mm interface. Second anti-vibration pads 2 are provided at each of the four corners of the bottom of the housing; both the first anti-vibration pad 5 and the second anti-vibration pad 2 are made of silicone.
[0024] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of this utility model should be included within the protection scope of this utility model.
Claims
1. A DSP-based power amplifier structure, characterized in that: It comprises a shell (1), support columns (4) are fixedly provided at both ends of a bottom plate in the shell (1), oblique support rods (41) are fixedly provided on both sides of the support columns (4), a first anti-vibration pad (5) is abutted against the oblique support rod (41), and a main control board (3) is fixedly connected to the first anti-vibration pad (5); A DSP processing unit is fixedly provided on the main control board (3), an audio signal processing unit is connected to the input end of the DSP processing unit, the audio signal processing unit is connected to a signal connection unit, and the DSP processing unit is connected to a sound control unit; A signal input interface is provided on the outer wall of one side of the shell, and a volume adjustment knob and a sound effect control knob are provided on the shell on the side opposite to the input interface, and both the volume adjustment knob and the sound effect control knob are connected to the sound control unit.
2. A DSP-based power amplifier structure according to claim 1, characterized in that: The control unit adopts a TPA3116D2 control chip, and the DSP processing unit adopts a DU562 processing chip.
3. A DSP-based power amplifier structure according to claim 1, characterized in that: The signal connection unit is a Bluetooth unit or a Wifi unit.
4. The DSP-based power amplifier structure according to claim 1, characterized in that: The signal input interface is an RCA interface, a COAXIAL coaxial interface, an XLR interface, a PHONO interface, a USB interface or a 6.35mm interface.
5. The DSP-based power amplifier structure according to claim 1, characterized in that: Second anti-vibration pads (2) are provided at the four corners of the bottom end of the shell, and the first anti-vibration pads (5) and the second anti-vibration pads (2) are both made of silicone.