Circuit board structure with efficient heat dissipation

Abstract

The utility model discloses an efficient heat dissipation circuit board structure which comprises a circuit board body, a plurality of electronic components are installed on the circuit board body, two guide rails are symmetrically and fixedly connected to the side wall of the upper side of the circuit board body, and the same wind shield is connected between the two guide rails. The inner wall of the upper side of the wind shield is fixedly connected with a first heat dissipation piece and a second heat dissipation piece, the first heat dissipation piece and the second heat dissipation piece are both located in the wind shield, a gap is formed between the first heat dissipation piece and the second heat dissipation piece, and the inner wall of the wind shield is fixedly connected with a heat dissipation fan. According to the utility model, the air flow blown out by the cooling fan can be reasonably distributed according to the calorific value of the electronic component, so that the utilization rate of the cooling air flow of the cooling fan can be improved, the cooling effect of the circuit board is effectively improved, and the arranged wind shield can reduce the loss of the air flow blown out by the cooling fan, so that the service life of the circuit board is prolonged. And the heat dissipation effect and efficiency are further improved.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, in particular to a circuit board structure with high efficiency in heat dissipation. Background Art

[0002] Circuit boards are an important component of electronic products. They are mainly used to install electronic components and can serve as structural supports for electronic components. They play an important role in the mass production of fixed circuits and in optimizing the layout of electrical appliances.

[0003] When an existing circuit board is in use, the electronic components on the circuit board will generate a large amount of heat during operation. This heat will cause the operating stability of the electronic components on the circuit board to increase, thereby reducing the stability of the electronic components. Therefore, it is necessary to install a heat dissipation structure for auxiliary heat dissipation. However, the heat dissipation structure of the existing circuit board adopts an integrated heat dissipation part, and the airflow blown by the cooling fan has the same heat dissipation efficiency for electronic components that emit different amounts of heat. The air volume of the cooling fan cannot be accurately guided according to the heat generated by the electronic components, thereby reducing the heat dissipation effect of the heat dissipation structure of the circuit board. Utility Model Content

[0004] The purpose of the utility model is to provide a circuit board structure with high efficiency in heat dissipation, so as to solve the problems raised in the above background technology.

[0005] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0006] The utility model provides a circuit board structure with high efficiency in heat dissipation, including a circuit board body, wherein a plurality of electronic components are mounted on the circuit board body, the side walls on the upper side of the circuit board body are symmetrically fixedly connected to two guide rails, a same wind shield is connected between the two guide rails, a first heat dissipation member and a second heat dissipation member are fixedly connected to the inner wall on the upper side of the wind shield, the first heat dissipation member and the second heat dissipation member are both located in the wind shield, a gap is arranged between the first heat dissipation member and the second heat dissipation member, a heat dissipation fan is fixedly connected to the inner wall of the wind shield, the heat dissipation fan is located on the right side of the first heat dissipation member and the second heat dissipation member, an air outlet direction of the heat dissipation fan is toward the first heat dissipation member and the second heat dissipation member, an air guide duct is fixedly connected to the vertical side walls of the heat dissipation fan, one end of the air guide duct is aligned with the first heat dissipation member, an air guide plate is fixedly connected to the heat dissipation fan, and the air guide plate is located between the second heat dissipation member and the air guide duct.

[0007] In the present invention, the structure of the first heat sink is similar to that of the second heat sink. The first heat sink includes a vertical plate fixedly connected to the wind shield, and the side walls on both sides of the vertical plate are fixedly connected with a plurality of heat dissipation fins, and a plurality of heat dissipation plates are fixedly connected between the upper and lower adjacent heat dissipation fins.

[0008] Furthermore, a plurality of through holes are provided through the heat dissipation fins.

[0009] Furthermore, both guide rails are provided with T-slots, and the vertical inner wall of the wind shield is symmetrically fixedly connected with two T-shaped plug plates matching the T-slots, and the two T-shaped plug plates are movably inserted in the two T-slots respectively. Screw holes are provided on the guide rails, and limit bolts are threadedly sleeved in the screw holes, and the limit bolts are located on the right side of the T-shaped plug plates.

[0010] Furthermore, two gaskets are symmetrically fixedly connected to the outer wall on the upper side of the windshield, and the specific material of the gaskets is rubber.

[0011] Furthermore, a plurality of screws are threadedly connected between the side wall on the upper side of the wind shield and the first heat sink and the second heat sink.

[0012] Furthermore, the specific materials of the first heat sink and the second heat sink are both aluminum, and the material of the air guide duct and the air guide plate is the same as that of the first heat sink.

[0013] Furthermore, the upper end of the limiting bolt is fixedly connected with a twisting plate.

[0014] Furthermore, thermal conductive silicone grease is coated between the circuit board body and the first heat sink and the second heat sink.

[0015] Compared with the prior art, the beneficial effects of the utility model are:

[0016] The utility model comprises a circuit board body, electronic components, guide rails, a wind shield, a first heat sink, a second heat sink, a heat fan, an air guide duct and an air guide plate. When in use, the wind shield is installed on the two guide rails. The arranged first heat sink and the second heat sink can absorb heat from the circuit board body and the electronic components, control the operation of the heat dissipation fan, and the heat dissipation fan blows air in the direction of the first heat sink and the second heat sink. The airflow guiding amount of the air guide duct and the air guide plate that can be arranged is such that most of the airflow blown out by the heat dissipation fan can be guided to the first heat sink, and a small part of the airflow can be guided to the second heat sink, thereby achieving auxiliary heat dissipation of different efficiencies for the first heat sink and the second heat sink, and the airflow blown out by the heat dissipation fan can be reasonably distributed according to the heat generation of the electronic components, thereby improving the utilization rate of the heat dissipation airflow of the heat dissipation fan, effectively improving the heat dissipation effect of the circuit board, and the arranged wind shield can reduce the loss of the airflow blown out by the heat dissipation fan, further improving the heat dissipation effect and efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0018] Figure 2It is a top view of the utility model;

[0019] Figure 3 This is a schematic diagram of the structure of the utility model after the windshield is removed;

[0020] Figure 4 for Figure 1 A schematic diagram of the connection structure between the cooling fan and the first and second cooling elements;

[0021] Figure 5 for Figure 1 Schematic diagram of the structure of the middle guide rail;

[0022] Figure 6 for Figure 5 Schematic diagram of the structure of part A.

[0023] In the figure: 1. circuit board body; 2. electronic components; 3. guide rails; 4. wind shield; 5. first heat sink; 6. second heat sink; 7. cooling fan; 8. air duct; 9. air guide plate; 10. vertical plate; 11. cooling fins; 12. heat sink; 13. T-slot; 14. T-plug plate; 15. limit bolt; 16. gasket; 17. screw; 18. screw plate; 19. thermal grease. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0025] See also Figure 1-6 The utility model provides a circuit board structure with high efficiency in heat dissipation, including a circuit board body 1, on which a plurality of electronic components 2 are mounted, and a side wall on the upper side of the circuit board body 1 is symmetrically fixedly connected with two guide rails 3, between which the same wind shield 4 is connected, and an inner wall on the upper side of the wind shield 4 is fixedly connected with a first heat sink 5 and a second heat sink 6, the first heat sink 5 and the second heat sink 6 are both located in the wind shield 4, and a gap is provided between the first heat sink 5 and the second heat sink 6, and the inner wall of the wind shield 4 is fixedly connected with a heat dissipation fan 7, the heat dissipation fan 7 is located on the right side of the first heat sink 5 and the second heat sink 6, the air outlet direction of the heat dissipation fan 7 is toward the first heat sink 5 and the second heat sink 6, the vertical side wall of the heat dissipation fan 7 is fixedly connected with an air guide duct 8, one end of the air guide duct 8 is aligned with the first heat sink 5, and an air guide plate 9 is fixedly connected to the heat dissipation fan 7, and the air guide plate 9 is located between the second heat sink 6 and the air guide duct 8.

[0026] The components on the circuit board structure may include components that generate very large amounts of heat, such as processors, as well as general heat generating components, such as resistors, etc. The first heat sink 5 may be disposed close to the components that generate very large amounts of heat, while the second snare component 6 may be disposed close to the general heat generating components. By distributing the air guide 8 and the air guide plate 9, the airflow may be distributed so that more airflow is directed to the first heat sink 5, and the heat dissipation is more targeted, thereby improving the balance of the heat dissipation.

[0027] In the above embodiment, when in use, the wind shield 4 is installed on the two guide rails 3, and the first heat sink 5 and the second heat sink 6 are capable of absorbing the heat on the circuit board body 1 and the electronic components 2, and the cooling fan 7 is controlled to run, and the cooling fan 7 blows out airflow in the direction of the first heat sink 5 and the second heat sink 6. The wind guide duct 8 can guide most of the airflow blown out by the cooling fan 7 to the first heat sink 5, and the wind guide plate 9 can guide a small part of the airflow to the second heat sink 6, so that the first heat sink 5 and the second heat sink 6 can be assisted in cooling with different efficiencies, and the airflow blown out by the cooling fan 7 can be reasonably distributed according to the heat generation of the electronic components 2, so as to improve the utilization rate of the cooling airflow of the cooling fan 7, effectively improve the cooling effect of the circuit board, and the wind shield 4 can reduce the loss of the airflow blown out by the cooling fan 7, further improving the cooling effect and efficiency.

[0028] The structure of the first heat sink 5 is similar to that of the second heat sink 6. The first heat sink 5 includes a vertical plate 10 fixedly connected to the wind shield 4. The side walls on the front and rear sides of the vertical plate 10 are fixedly connected with a plurality of heat sink fins 11. A plurality of heat sink plates 12 are fixedly connected between the upper and lower adjacent heat sinks 11. The hollow structure can improve the heat dissipation effect of the first heat sink 5 and the second heat sink 6.

[0029] Among them, a plurality of through holes are arranged on the heat dissipation fins 11 to improve the heat dissipation effect. At the same time, due to the setting of the wind shield 4, the airflow will not directly flow out of the first heat dissipation component 5 and the second heat dissipation component 6, and can efficiently take away heat from the hollowing and through holes of the first heat dissipation component 5 and the second heat dissipation component 6.

[0030] The two guide rails 3 are each provided with a T-slot 13, and the vertical inner wall of the wind shield 4 is symmetrically fixedly connected with two T-slot plates 14 matching the T-slot 13. The two T-slot plates 14 are movably inserted in the two T-slots 13 respectively. The guide rails 3 are provided with a screw hole, and the inner thread of the screw hole is sleeved with a limiting bolt 15, and the limiting bolt 15 is located on the right side of the T-slot plate 14. The T-slot 13 and the T-slot plate 14 cooperate with each other to improve the convenience and stability of the installation of the wind shield 4. The set limiting bolt 15 can limit the T-slot plate 14, thereby improving the stability of the installation of the wind shield 4.

[0031] The outer wall on the upper side of the wind shield 4 is symmetrically fixedly connected with two gaskets 16, and the specific material of the gaskets 16 is rubber, which can ensure that there is a gap between the upper side of the wind shield 4 and other components, thereby improving the heat dissipation efficiency.

[0032] A plurality of screws 17 are threadedly connected between the side wall on the upper side of the wind shield 4 and the first heat sink 5 and the second heat sink 6. The screws 17 can improve the stability of the connection between the first heat sink 5 and the second heat sink 6 and the wind shield 4.

[0033] The specific materials of the first heat sink 5 and the second heat sink 6 are both aluminum. The material of the air guide duct 8 and the air guide plate 9 is the same as that of the first heat sink 5. Aluminum has good thermal conductivity and can improve the heat dissipation efficiency of the first heat sink 5 and the second heat sink 6.

[0034] The upper end of the limiting bolt 15 is fixedly connected with a screwing plate 18 , which can improve the convenience of screwing the limiting bolt 15 and the convenience of installing the wind shield 4 .

[0035] A thermal conductive silicone grease 19 is coated between the circuit board body 1 and the first heat sink 5 and the second heat sink 6. The thermal conductive silicone grease 19 can improve the heat absorption efficiency of the first heat sink 5 and the second heat sink 6, thereby improving the heat dissipation efficiency of the first heat sink 5 and the second heat sink 6.

[0036] Working principle: When in use, the wind shield 4 is installed on the two guide rails 3. The first heat sink 5 and the second heat sink 6 can absorb the heat on the circuit board body 1 and the electronic components 2, and the cooling fan 7 is controlled to run. The cooling fan 7 blows air in the direction of the first heat sink 5 and the second heat sink 6. The air flow guiding amount of the air guide duct 8 and the air guide plate 9 can be set, so that most of the air flow blown out by the cooling fan 7 can be guided to the first heat sink 5, and a small part of the air flow can be guided to the second heat sink 6, so that the first heat sink 5 and the second heat sink 6 can be assisted in cooling with different efficiencies, and the air flow blown out by the cooling fan 7 can be reasonably distributed according to the heat generation of the electronic components 2, so as to improve the utilization rate of the cooling airflow of the cooling fan 7, effectively improve the cooling effect of the circuit board, and the wind shield 4 can reduce the loss of the air flow blown out by the cooling fan 7, further improving the cooling effect and efficiency.

[0037] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0038] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A circuit board structure with high heat dissipation efficiency, comprising a circuit board body (1), characterized in that: A plurality of electronic components (2) are mounted on the circuit board body (1); two guide rails (3) are symmetrically fixedly connected to the side wall on the upper side of the circuit board body (1); a same wind shield (4) is connected between the two guide rails (3); a first heat sink (5) and a second heat sink (6) are fixedly connected to the inner wall on the upper side of the wind shield (4); the first heat sink (5) and the second heat sink (6) are both located inside the wind shield (4); a gap is provided between the first heat sink (5) and the second heat sink (6); the wind shield (4) ) is fixedly connected to the inner wall of the first heat sink (5) and the second heat sink (6). The heat sink fan (7) is located on the right side of the first heat sink (5) and the second heat sink (6). The air outlet direction of the heat sink fan (7) is toward the first heat sink (5) and the second heat sink (6). The vertical side wall of the heat sink fan (7) is fixedly connected to an air guide duct (8). One end of the air guide duct (8) is aligned with the first heat sink (5). The heat sink fan (7) is fixedly connected to an air guide plate (9). The air guide plate (9) is located between the second heat sink (6) and the air guide duct (8).

2. The circuit board structure with high heat dissipation efficiency according to claim 1, characterized in that: The first heat sink (5) has a similar structure to the second heat sink (6). The first heat sink (5) comprises a vertical plate (10) fixedly connected to the wind shield (4), the side walls on both the front and rear sides of the vertical plate (10) are fixedly connected to a plurality of heat sink fins (11), and a plurality of heat sink plates (12) are fixedly connected between two adjacent heat sink fins (11) above and below.

3. The circuit board structure with high heat dissipation efficiency according to claim 2, characterized in that: The heat dissipation fin (11) is provided with a plurality of through holes.

4. The circuit board structure with high heat dissipation efficiency according to claim 1, characterized in that: The two guide rails (3) are each provided with a T-shaped slot (13); the vertical inner wall of the wind shield (4) is symmetrically fixedly connected with two T-shaped plug plates (14) matching the T-shaped slots (13); the two T-shaped plug plates (14) are respectively movably plugged into the two T-shaped slots (13); a screw hole is provided on the guide rail (3); and a limit bolt (15) is threadedly sleeved in the screw hole; the limit bolt (15) is located on the right side of the T-shaped plug plate (14).

5. The circuit board structure with high heat dissipation efficiency according to claim 1, characterized in that: Two gaskets (16) are symmetrically and fixedly connected to the outer wall on the upper side of the windshield (4), and the specific material of the gaskets (16) is rubber.

6. The circuit board structure with high heat dissipation efficiency according to claim 1, characterized in that: A plurality of screws (17) are threadedly connected between the side wall on the upper side of the wind shield (4) and the first heat sink (5) and the second heat sink (6).

7. The circuit board structure with high heat dissipation efficiency according to claim 1, characterized in that: The specific material of the first heat sink (5) and the second heat sink (6) is aluminum, and the material of the air guide pipe (8) and the air guide plate (9) is the same as that of the first heat sink (5).

8. The circuit board structure with high heat dissipation efficiency according to claim 4, characterized in that: The upper end of the limiting bolt (15) is fixedly connected with a twisting plate (18).

9. The circuit board structure with high heat dissipation efficiency according to claim 1, characterized in that: Thermal conductive silicone grease (19) is coated between the circuit board body (1) and the first heat sink (5) and the second heat sink (6).

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