Binding wire connection structure of power module

Abstract

The utility model discloses a binding wire connecting structure of a power module, which comprises a printed circuit board, an electrode and at least two bonding wires, the electrode comprises a transversely extending connecting part, at least two step parts are formed at the top of the connecting part, the step heights of the at least two step parts are different, and the bonding wires are arranged on the connecting part. The bonding wires are in one-to-one correspondence with the step parts, one ends of the two bonding wires are respectively connected to the printed circuit board, and the other ends of the two bonding wires are respectively connected to the two step parts. According to the utility model, the step design is carried out on the wire binding area, so that the problems of bonding wire interference and the like in the ultrasonic bonding process are effectively avoided, the distance between wire binding points is eliminated, and the space occupied by the wire binding connection area can be effectively reduced.

Description

Technical Field

[0001] The utility model relates to a power module, in particular to a wire binding connection structure of a power module. Background Art

[0002] In the design and development of power modules, the bonding wire bonding process is involved, that is, the various devices are connected together by bonding wires combined with ultrasonic bonding to meet the requirements of circuit topology construction. Conventional power module design solutions are as follows: Figure 1 As shown, due to the design specifications of the bonding wire bonding process, there must be a certain distance Y between the binding points (connection points) of the bonding wire 103 and the device 102, otherwise there will be interference between the binding points during ultrasonic bonding, which may damage the bonding force between the bonding wire and the device or deform the binding points, resulting in poor module quality. Utility Model Content

[0003] The technical problem to be solved by the utility model is to provide a wire binding connection structure for a power module which can eliminate the distance between binding points and avoid binding point interference in an ultrasonic bonding process in view of the deficiencies of the prior art.

[0004] In order to solve the above technical problems, the utility model adopts the following technical solutions.

[0005] A wire binding connection structure for a power module includes a printed circuit board, an electrode and at least two bonding wires, wherein the electrode includes a laterally extending connecting portion, the top of the connecting portion is formed with at least two step portions, the step heights of the at least two step portions are different, the bonding wires correspond to the step portions one by one, one ends of the two bonding wires are respectively connected to the printed circuit board, and the other ends of the two bonding wires are respectively connected to the two step portions.

[0006] Preferably, it comprises a bottom plate and a shell fixed on the bottom plate, the printed circuit board is fixed on the bottom plate, and the electrodes are fixed on the shell.

[0007] Preferably, the electrodes extend in a "Z" shape.

[0008] Preferably, a step height of the step portion close to the printed circuit board is smaller than a step height of the step portion far from the printed circuit board.

[0009] Preferably, a straight welding portion is formed at the end of the bonding wire, the welding portions of the two bonding wires are respectively attached to the two step portions, and the welding portion and the step portions are ultrasonically welded.

[0010] In the wire binding connection structure of the power module disclosed by the utility model, the printed circuit board and the electrode are connected by bonding wires, one end of the two bonding wires is respectively connected to the printed circuit board, and for the other ends of the two bonding wires, at least two step portions with different step heights are arranged on the laterally extending connection portion of the electrode, and the other ends of the at least two bonding wires are respectively connected to the at least two step portions. Based on the above structure, the utility model effectively avoids problems such as bonding wire interference in the ultrasonic bonding process by performing a step design on the wire binding area, and at the same time eliminates the distance between the wire binding points, which can effectively reduce the space occupied by the wire binding connection area. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 It is a partial structural diagram of an existing power module;

[0012] Figure 2 This is a wiring connection structure diagram of the power module of the utility model;

[0013] Figure 3 for Figure 2 Enlarged view of part A. DETAILED DESCRIPTION

[0014] The present invention will be described in more detail below with reference to the accompanying drawings and embodiments.

[0015] The utility model discloses a wire binding connection structure of a power module, combined with Figure 2 and Figure 3 As shown, it includes a printed circuit board 1, an electrode 2 and at least two bonding wires 3, the bonding wires 3 can be aluminum wires, copper wires, and gold wires, the electrode 2 includes a laterally extending connecting portion 20, the top of the connecting portion 20 is formed with at least two step portions 21, the step heights of the at least two step portions 21 are different, the bonding wires 3 correspond to the step portions 21 one by one, one end of the at least two bonding wires 3 is respectively connected to the printed circuit board 1, and the other end of the at least two bonding wires 3 is respectively connected to the at least two step portions 21.

[0016] In the above structure, the printed circuit board 1 and the electrode 2 are connected by bonding wires 3, and one end of the two bonding wires 3 is respectively connected to the printed circuit board 1, and for the other ends of the two bonding wires 3, at least two step portions 21 with different step heights are arranged on the laterally extending connection portion 20 of the electrode 2, and the other ends of the at least two bonding wires 3 are respectively connected to the at least two step portions 21. Based on the above structure, the utility model effectively avoids problems such as bonding wire interference in the ultrasonic bonding process by performing a step design on the wire binding area, and at the same time eliminates the distance between the wire binding points, which can effectively reduce the space occupied by the wire binding connection area.

[0017] For the specific structure of the power module, see Figure 2 This embodiment includes a base plate 4 and a shell 5 fixed on the base plate 4 , the printed circuit board 1 is fixed on the base plate 4 , and the electrode 2 is fixed on the shell 5 .

[0018] As a preferred embodiment, the electrode 2 extends in a "Z" shape. The connecting portion 20 is located at the end of the "Z"-shaped extending electrode and extends laterally.

[0019] See also Figure 3 In this embodiment, the step height of the step portion 21 close to the printed circuit board 1 is smaller than the step height of the step portion 21 away from the printed circuit board 1. In the above structure, the step heights of the two step portions 21 gradually increase relative to the direction away from the bonding wire 3, which can keep the two bonding wires 3 parallel and facilitate welding.

[0020] In this embodiment, see Figure 3 A straight welding portion 30 is formed at the end of the bonding wire 3, and the welding portions 30 of the two bonding wires 3 are respectively attached to the two step portions 21, and the welding portion 30 and the step portion 21 are ultrasonically welded.

[0021] Please compare Figure 1 and Figure 3 , due to the design specifications of the bonding wire bonding process, assuming that the size of the binding point is X and the distance between the binding points is Y, the existing technology ( Figure 1 ) must meet the size requirement of 2X+Y. However, in this embodiment, by performing a step design on the wire binding area, the distance between the wire binding points is significantly eliminated. The width of the welding area only needs to meet the size requirement of 2X, which can effectively reduce the space occupied by the welding area.

[0022] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions or improvements made within the technical scope of the present invention should be included in the scope of protection of the present invention.

Claims

1. A wire binding connection structure for a power module, characterized in that: The invention comprises a printed circuit board (1), an electrode (2) and at least two bonding wires (3), wherein the electrode (2) comprises a connecting portion (20) extending laterally, wherein at least two step portions (21) are formed on the top of the connecting portion (20), wherein the step heights of the at least two step portions (21) are different, wherein the bonding wires (3) correspond to the step portions (21) one by one, wherein one end of the at least two bonding wires (3) is respectively connected to the printed circuit board (1), and the other end of the at least two bonding wires (3) is respectively connected to the at least two step portions (21).

2. The wire binding connection structure of the power module according to claim 1, characterized in that: It comprises a base plate (4) and a shell (5) fixed on the base plate (4), the printed circuit board (1) is fixed on the base plate (4), and the electrode (2) is fixed on the shell (5).

3. The wire binding connection structure of the power module according to claim 1, characterized in that: The electrode (2) extends in a "Z" shape.

4. The wire binding connection structure of the power module according to claim 1, characterized in that: The step height of the step portion (21) close to the printed circuit board (1) is smaller than the step height of the step portion (21) far from the printed circuit board (1).

5. The wire binding connection structure of the power module according to claim 1, characterized in that: A straight welding portion (30) is formed at the end of the bonding wire (3), the welding portions (30) of the two bonding wires (3) are respectively attached to the two step portions (21), and the welding portion (30) and the step portions (21) are welded by ultrasonic wave.

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