Heat dissipation shielding case

Abstract

The utility model discloses a heat radiation shielding case, comprising a shielding case body, the shielding case body comprises a square top surface and four side surfaces surrounding the top surface, the top surface is provided with a recessed heat radiation sinking table, the long edge of the heat radiation sinking table is parallel to the short edge of the top surface, and the short edge of the heat radiation sinking table is parallel to the long edge of the top surface. Concave heat dissipation grooves are formed in the periphery of the heat dissipation sinking table, the heat dissipation grooves comprise transverse grooves formed in the length direction of the top face and vertical grooves formed in the width direction of the top face, the transverse grooves are formed between the short edge of the heat dissipation sinking table and the long edge of the top face at intervals, and the lengths of the transverse grooves are gradually increased from the short edge of the heat dissipation sinking table to the long edge of the top face; the vertical grooves are formed between the long edge of the heat dissipation sinking table and the short edge of the top face at intervals, and the length of the vertical groove on the innermost side is smaller than that of the vertical groove on the outermost side. A heat dissipation body is arranged in the heat dissipation sinking table and comprises a base and heat dissipation fins. According to the utility model, the heat dissipation area is increased, the heat dissipation performance is improved, and the shielding effect is ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of shielding covers, in particular to a heat dissipation shielding cover. Background Art

[0002] When the electronic components installed on the circuit board are working, they will generate electromagnetic radiation and interfere with each other. In addition, external electromagnetic interference will also affect the normal operation of the electronic components. In order to avoid the influence of electromagnetic radiation, it is common practice to set a shielding cover outside the electronic components. However, electronic components generate a lot of heat when working, and it is necessary to ensure the heat dissipation of electronic components while shielding electromagnetic radiation. Some heat dissipation methods are to open holes in the shielding cover. Opening holes can improve the heat dissipation effect of internal devices during operation, but this will sacrifice part of the shielding effect. Utility Model Content

[0003] In view of the above-mentioned technical problems, the purpose of the utility model is to provide a heat dissipation shielding cover to improve the heat dissipation effect and ensure the shielding function.

[0004] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0005] 10. The heat dissipation shielding cover as claimed in claim 1, wherein the shielding cover body comprises a square top surface and four side surfaces surrounding the top surface, wherein a recessed heat sink is arranged on the top surface, the long side of the heat sink is parallel to the short side of the top surface, the short side of the heat sink is parallel to the long side of the top surface, and a recessed heat dissipation groove is arranged around the heat sink, wherein the heat dissipation groove comprises a transverse groove arranged along the length direction of the top surface and a vertical groove arranged along the width direction of the top surface, wherein the transverse groove is arranged at intervals between the short side of the heat sink and the long side of the top surface, and the length of the transverse groove gradually increases from the short side of the heat sink to the long side of the top surface, and the vertical groove is arranged at intervals between the long side of the heat sink and the short side of the top surface, and the length of the innermost vertical groove is less than the length of the outermost vertical groove; a heat sink is arranged in the heat sink, and the heat sink comprises a base and heat sinks, the base is in contact with the bottom surface of the heat sink, and a plurality of the heat sinks are perpendicular to the base and arranged at intervals along the length direction of the base.

[0006] Preferably, the shielding cover body is integrally formed.

[0007] Preferably, the connection between the heat dissipation sink and the top surface is smoothly transitioned.

[0008] Preferably, the cross section of the heat dissipation slot is arc-shaped.

[0009] Preferably, the height of the heat sink is not higher than the top surface.

[0010] Preferably, thermal conductive silicone grease is provided on a side of the heat dissipation sink facing away from the heat dissipation body.

[0011] Preferably, the span of the outermost transverse groove is not less than the distance between the two outermost vertical grooves.

[0012] Due to the application of the above technical solution, the utility model has the following advantages compared with the prior art:

[0013] The heat dissipation shielding cover of the utility model comprises a shielding cover body, the shielding cover body comprises a square top surface and four side surfaces surrounding the top surface, a recessed heat dissipation sink is arranged on the top surface, the long side of the heat dissipation sink is parallel to the short side of the top surface, the short side of the heat dissipation sink is parallel to the long side of the top surface, and a recessed heat dissipation groove is arranged around the heat dissipation sink, the heat dissipation groove comprises a transverse groove arranged along the length direction of the top surface and a vertical groove arranged along the width direction of the top surface, the transverse groove is arranged at intervals between the short side of the heat dissipation sink and the long side of the top surface, the length of the transverse groove gradually increases from the short side of the heat dissipation sink to the long side of the top surface, the vertical groove is arranged at intervals between the long side of the heat dissipation sink and the short side of the top surface, the length of the innermost vertical groove is less than the length of the outermost vertical groove, a heat dissipation body is arranged in the heat dissipation sink, so as to further improve the heat dissipation effect. The utility model makes the shielding cover body structure more reliable, increases the heat dissipation area, improves the heat dissipation performance and ensures the shielding effect at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The technical solution of the utility model is further described below in conjunction with the accompanying drawings:

[0015] Attached Figure 1 It is a three-dimensional diagram of the heat dissipation shielding cover of the utility model;

[0016] Attached Figure 2 A three-dimensional diagram of the shielding cover body of the heat dissipation shielding cover of the utility model;

[0017] Attached Figure 3 It is a three-dimensional diagram of the heat dissipation shielding cover of the utility model when viewed from above.

[0018] Among them: 1. Top surface; 2. Side surface; 3. Heat dissipation sink; 4. Horizontal groove; 5. Vertical groove; 6. Heat dissipation body. DETAILED DESCRIPTION

[0019] The preferred embodiments of the present invention are described in detail below in conjunction with the accompanying drawings so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making a clearer and more definite definition of the protection scope of the present invention.

[0020] It should be noted that when a component is referred to as being "fixed to" another component, it may be directly on the other component or there may also be a component centered. When a component is considered to be "connected to" another component, it may be directly connected to the other component or there may also be a component centered. When a component is considered to be "set on" another component, it may be directly set on the other component or there may also be a component centered. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0021] As attached Figure 1 The heat dissipation shield of the utility model is shown, including a shield body, the shield body including a square top surface 1 and four side surfaces 2 surrounding the top surface 1, a concave heat dissipation sink 3 is formed on the top surface 1, the long side of the heat dissipation sink 3 is parallel to the short side of the top surface 1, the short side of the heat dissipation sink 3 is parallel to the long side of the top surface 1, and a concave heat dissipation groove is formed around the heat dissipation sink 3. The existence of the heat dissipation groove increases the surface area of ​​the top surface 1, and obtains more heat dissipation surface. The heat dissipation groove includes a transverse groove 4 arranged along the length direction of the top surface 1 and a vertical groove 5 arranged along the width direction of the top surface 1. The transverse groove 4 is arranged at intervals between the short side of the heat dissipation sink 3 and the long side of the top surface 1. The length of the transverse groove 4 gradually increases from the short side of the heat dissipation sink 3 to the long side of the top surface 1. The vertical groove 5 is arranged at intervals between the long side of the heat dissipation sink 3 and the short side of the top surface 1, thereby increasing the strength of the shielding cover body. The length of the innermost vertical groove 5 is smaller than the length of the outermost vertical groove 5, and the span of the outermost transverse groove 4 is not smaller than the distance between the two outermost vertical grooves 5, thereby avoiding bending of the shielding cover body at the intervals of the vertical grooves 5, thereby making the structure more reliable.

[0022] The shielding cover body is integrally formed, which simplifies the installation process, improves production efficiency, and avoids gaps that affect the shielding effect.

[0023] The connection between the heat sink 3 and the top surface 1 is smooth, and the cross section of the heat sink is arc-shaped to reduce stress concentration. The height of the heat sink is not higher than the top surface 1, making the overall structure more compact and occupying less space.

[0024] A heat sink 6 is installed in the heat sink 3. The heat sink 6 includes a base and a heat sink. The base fits the bottom surface of the heat sink 3. A number of heat sinks are perpendicular to the base and spaced along the length of the base to further improve the heat dissipation function. The side of the heat sink 3 facing away from the heat sink 6 is coated with thermal grease. The heat sink 3 fits the chip to better conduct heat.

[0025] The utility model discloses a heat dissipation shielding cover which shields electromagnetic radiation and ensures heat dissipation of electronic components at the same time, and it is unnecessary to open holes on the shielding cover, thereby increasing the heat dissipation area, improving the heat dissipation performance and ensuring the shielding effect at the same time.

[0026] The above description is only an embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the present invention specification, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A heat dissipation shield, characterized in that: The heat dissipation device is a heat dissipation device, and the heat dissipation device is a heat dissipation device. The heat dissipation device is a heat dissipation device, and the heat dissipation device is a heat dissipation device. The heat dissipation device is a heat dissipation device, and the heat dissipation device is a heat dissipation device.

2. The heat dissipation shield according to claim 1, characterized in that: The shielding cover body is integrally formed.

3. The heat dissipation shield according to claim 1, characterized in that: The junction between the heat dissipation sink and the top surface is smoothly transitioned.

4. The heat dissipation shield according to claim 1, characterized in that: The cross section of the heat dissipation slot is arc-shaped.

5. The heat dissipation shield according to claim 1, characterized in that: The height of the heat sink is no higher than the top surface.

6. The heat dissipation shield according to claim 1, characterized in that: The heat dissipation sink is provided with thermal conductive silicone grease on one side facing away from the heat dissipation body.

7. The heat dissipation shield according to claim 1, characterized in that: The span of the outermost transverse groove is not less than the distance between the two outermost vertical grooves.

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