Optical module dismounting device

Abstract

The utility model discloses an optical module dismounting device, comprising a heat conduction main body member connected with an electric heating member; the heat transfer and conduction piece is connected with the heat conduction main body piece, and a containing part penetrating through the heat transfer and conduction piece and containing the optical module is formed in the heat transfer and conduction piece; an annular heat conduction melting part is formed at the bottom of the heat transfer and conduction piece on the periphery of the accommodating part, and the heat conduction melting part is attached to the pin positions on the periphery of the circuit substrate when the optical module is placed in place; the annular embedding part is formed at the bottom of the heat conduction melting part and arranged along the circumference of the containing part, and soldering tin is embedded in the annular embedding part; and the wall thickness of the heat conduction melting part is gradually reduced from top to bottom in the height direction of the heat transfer and conduction piece. According to the optical module dismounting device provided by the utility model, soldering tin at all pins of the optical module can be almost heated and melted at the same time, so that the soldering tin is uniformly heated, the purpose of quickly dismounting the optical module is achieved, and an LCC optical module, a PCB (Printed Circuit Board) and other components are prevented from being damaged in the dismounting process.

Description

Technical Field

[0001] The utility model relates to the technical field of optical modules, in particular to an improvement on the structure of an optical module removal device. Background Art

[0002] Some existing optical modules, such as LCC optical modules, are often repaired during use after assembly due to the influence of the use environment and need to be removed.

[0003] Due to the small size and irregular shape of the LCC module, its repair and removal becomes a difficult task.

[0004] Dismantling is mainly done by melting the pins of the optical module to separate it from the packaging device.

[0005] The existing removal method mainly uses an electric soldering iron or a drying gun to heat the pins of the optical module to melt the solder at the pins, thereby achieving the purpose of removing the optical module.

[0006] When the electric soldering iron is heated, the heating area is located around the module, and multiple electric soldering irons are required for heating. Generally, 4 to 5 soldering irons are required for heating. This requires multiple people to operate synchronously, and the synchronization of operations cannot be guaranteed. The solder at the pins cannot melt at the same time, and the module removal is difficult. In addition, due to the small size of the LCC module, it is inconvenient to operate and it is easy to burn the optical fiber ribbon.

[0007] When the hot air gun is heating, the direction of the hot air cannot be controlled, which can easily heat other components and cause failure. For example, heating the metal shell of the LCC optical module can easily cause the sealing resin to crack or fall off; heating other components on the PCB board can also cause other components to fail.

[0008] The above information disclosed in the background technology is only used to increase the understanding of the background technology of the present application, and therefore, it may include information that does not constitute the prior art known to ordinary technicians in the field. Utility Model Content

[0009] In response to the problems pointed out in the background technology, the utility model proposes an optical module removal device, which can heat the solder at all pins of the optical module at the same time with a consistent heating rate, so that the solder melts at the same time, reducing the heating of the metal shell, optical fiber ribbon and other components on the PCB board.

[0010] In order to achieve the above-mentioned utility model purpose, the utility model adopts the following technical solutions:

[0011] In some embodiments of the present application, an optical module removal device is provided, wherein the optical module includes a circuit substrate, and pins are arranged around the circuit substrate;

[0012] The device comprises: a heat-conducting main body connected to the electric heating element to receive heat from the electric heating element;

[0013] A heat transfer and heat conducting member connected to the heat conduction main body member to receive heat from the heat conduction main body member, wherein the heat transfer and heat conducting member has an accommodation portion formed therein which penetrates the heat transfer and heat conducting member and accommodates the optical module;

[0014] An annular heat-conducting melting portion is formed at the bottom of the heat-conducting member located around the accommodating portion. The heat-conducting melting portion is attached to the pin positions around the circuit substrate when the optical module is placed in place, and is used to transfer the heat of the heat-conducting member to the pins to melt the solder;

[0015] An annular embedding portion is formed at the bottom of the heat-conducting melting portion and is arranged along the circumference of the accommodating portion, and solder is embedded in the annular embedding portion;

[0016] The wall thickness of the heat-conducting melting portion gradually decreases from top to bottom along the height direction of the heat transfer and heat conducting component.

[0017] Compared with the prior art, the advantages and positive effects of the utility model are:

[0018] The optical module removal device provided in the utility model can realize uniform and stable heating of the pins of the circuit base by providing a heat-conducting melting part at the bottom of the heat-conducting member and uniformly surrounding the circuit base plate.

[0019] By arranging an annular embedding portion at the bottom of the heating and melting portion and arranging solder inside the annular embedding portion, the melted liquid solder flows to the pin positions around the circuit substrate to connect the solders at all the pins into an integral structure. When the heat conduction melting portion transfers heat, it can be transferred to the entire structure to heat it uniformly, thereby ensuring heating uniformity and avoiding the problem that a single solder is difficult to heat and the heating is uneven.

[0020] By arranging the heating and melting part into a structure in which the wall thickness gradually decreases from top to bottom, it is also possible to collect heat in a centralized manner so that the heat is integrated into the bottom area, thereby being able to quickly heat the pins at the bottom position, thereby improving the heating efficiency of the pins.

[0021] After reading the specific embodiments of the present invention in conjunction with the accompanying drawings, other features and advantages of the present invention will become more clear. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0023] Figure 1 A three-dimensional structure of an embodiment of the optical module removal device according to the embodiment Figure 1 ;

[0024] Figure 2 A three-dimensional structure of an embodiment of the optical module removal device according to the embodiment Figure 2 ;

[0025] Figure 3 A top view of an embodiment of an optical module removal device according to an embodiment;

[0026] Figure 4 A schematic diagram of a heat transfer path of an embodiment of an optical module removal device according to an embodiment;

[0027] Figure 5 A three-dimensional structure of another embodiment of the optical module removal device according to the embodiment Figure 1 ;

[0028] Figure 6 A schematic structural diagram of another embodiment of the optical module removal device according to the embodiment cooperating with the optical module;

[0029] Figure 7 A three-dimensional structure of another embodiment of the optical module removal device according to the embodiment Figure 2 ;

[0030] Figure 8 The three-dimensional structure of the first heat transfer component of another embodiment of the optical module removal device according to the embodiment Figure 1 ;

[0031] Fig. 9 The three-dimensional structure of the first heat transfer component of another embodiment of the optical module removal device according to the embodiment Figure 2 ;

[0032] Fig.10 for Fig. 9 AA section view;

[0033] Fig.11 FIG. 1 is a schematic diagram of a heat transfer path of another embodiment of the optical module removal device according to the embodiment.

[0034] Reference numerals:

[0035] 100, optical module; 110, circuit substrate; 111, pin; 120, optical fiber ribbon; 130, metal shell; 200, heat-conducting main body; 300, heat-conducting heat-conducting component; 310, accommodating portion; 320, heat-conducting melting portion; 321, annular embedding portion; 330, heat-conducting heat-conducting main body; 340, heat-conducting surrounding member; 341, baseline outlet; 342, avoidance portion; 343, heat-conducting barrier portion; 350, first heat-conducting Component; 351, first heat-conducting part; 3511, first heat-conducting section; 3512, second heat-conducting section; 352, heat-conducting main body; 353, heat-conducting bending part; 3531, first heat-conducting arm; 3532, second heat-conducting arm; 360, second heat-conducting component; 361, second heat-conducting part; 3611, third heat-conducting section; 3612, fourth heat-conducting section; 370, heat-conducting isolation part; 380, optical fiber outlet; 390, notch. DETAILED DESCRIPTION

[0036] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0037] In the description of the present application, it should be understood that the terms "center", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0038] The terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise specified, "plurality" means two or more.

[0039] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0040] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0041] The disclosure below provides many different embodiments or examples for realizing different structures of the utility model. In order to simplify the disclosure of the utility model, the components and settings of specific examples are described below. Of course, they are merely examples, and the purpose is not to limit the utility model. In addition, the utility model may repeat reference numbers and / or reference letters in different examples, and such repetition is for the purpose of simplification and clarity, and does not itself indicate the relationship between the various embodiments and / or settings discussed. In addition, the utility model provides various specific examples of processes and materials, but those of ordinary skill in the art may be aware of the application of other processes and / or the use of other materials.

[0042] In some embodiments of the present application, a device for removing an optical module 100 is provided, which is used to remove and repair the optical module 100 .

[0043] The optical module 100 includes a circuit substrate 110 , and pins 111 for connection are arranged around the circuit substrate 110 . The pins 111 are soldered to the circuit substrate 110 . If the pins 111 need to be removed, the solder needs to be melted.

[0044] A metal housing 130 is provided on the top of the circuit substrate 110 .

[0045] An optical fiber ribbon 120 is disposed on one side of the circuit substrate 110 and is led outward from the circuit substrate 110 .

[0046] The optical module 100 removal device includes: a heat-conducting main body 200, connected to the electric heating element, for receiving heat from the electric heating element;

[0047] In some embodiments, the electric heating element is a constant temperature soldering iron or a component that can generate heat when powered on.

[0048] The heat-conducting main body 200 is used to absorb and conduct the heat generated by the electric heating element.

[0049] In some embodiments, in order to achieve the connection between the heat-conducting main body 200 and the electric heating element, a hollow cavity is formed inside the heat-conducting main body 200, and an internal thread is provided on the inner wall of the cavity.

[0050] The electric heating element may be provided with an external thread, which is screwed and fixed on the heat-conducting main body 200 to achieve connection with the heat-conducting main body 200 .

[0051] The heat-conducting main body 200 is configured as a threaded structure so that it can be used to adapt to electric heating elements of different models and powers, thereby improving the versatility of the device.

[0052] In order to enhance the heat transfer performance, the heat conducting main body 200 may be made of metal with good heat transfer performance, such as copper or aluminum.

[0053] The heat transfer and heat conducting member 300 is connected to the heat transfer main member 200 to receive heat from the heat transfer main member 200. The heat transfer and heat conducting member 300 has an accommodation portion 310 formed therein to penetrate the heat transfer and heat conducting member 300 and accommodate the optical module 100.

[0054] The heat transfer conductive member 300 is connected to the heat conductive main member 200 , and can transfer the heat of the heat conductive main member 200 to itself. The heat transfer conductive member 300 is mainly used to heat the pins 111 of the optical module 100 .

[0055] An annular heat-conducting melting portion 320 is formed at the bottom of the heat-conducting member 300 around the accommodating portion 310. The heat-conducting melting portion 320 is attached to the pins 111 around the circuit substrate 110 when the optical module 100 is placed in place, and is used to transfer the heat of the heat-conducting member 300 to the pins 111 so that the solder at the pins 111 melts;

[0056] The receiving portion 310 formed in the heat transfer and conductive member 300 is used to accommodate the entire optical module 100 . The optical module 100 is structurally arranged in such a manner that the metal housing 130 is located above the circuit substrate 110 .

[0057] When the optical module 100 is entirely placed inside the receiving portion 310 , the metal housing 130 is arranged at an upper position of the receiving portion 310 , and the circuit substrate 110 is arranged at a bottom position of the receiving portion 310 .

[0058] The heat-conducting melting portion 320 formed at the bottom circumference of the heat-conducting component 300 can be exactly adapted to correspond to the position of the pin 111 on the circuit substrate 110 at the bottom position, so as to fit the position of the pin 111 around the circuit substrate 110, heat the solder at the pin 111, melt the solder, and then the module can be removed.

[0059] Since the heat-conducting melting portion 320 is arranged at the bottom circumference of the heat-conducting member 300, it fits with the pins 111 around the circuit substrate 110, so that the pins 111 around the circuit substrate 110 are all wrapped by the heat-conducting melting portion 320. When transferring heat, the heat can be evenly transferred to the pins 111 around the circuit substrate 110 at the same time, so as to achieve uniform and stable heating of the solder at the pins 111, avoiding the problem of multiple operations and non-uniform heating caused by the existing electric soldering iron structure;

[0060] An annular embedding portion 321 is formed at the bottom of the heat-conducting melting portion 320 and arranged along the circumference of the accommodation portion 310 , and solder is embedded in the annular embedding portion 321 ;

[0061] In some embodiments, the annular embedding portion is an annular embedding groove formed on the bottom surface of the heat-conducting melting portion 320 and arranged circumferentially along the accommodating portion 310 .

[0062] After being heated, the solder melts and flows to the solder positions of the pins 111 around the circuit substrate 110. The melted solder has high heat and temperature, and can transfer heat to the solder at the pins 111, so that the solder at the pins 111 melts quickly.

[0063] Another convenience is that the melted liquid solder flows to the pins 111 around the circuit substrate 110, and the solders at all the pins 111 can be connected into an integral structure rather than a single separate structure. In this way, when the heat conductive melting part 320 transfers heat, it can be transferred to the whole to heat it evenly, ensuring the heating uniformity and avoiding the problem that a single solder is difficult to heat and the heating is uneven.

[0064] In some embodiments, the wall thickness of the heat-conducting melting portion 320 gradually decreases from top to bottom along the height direction of the heat transfer and heat conducting component 300 .

[0065] The heat-conducting melting part 320 is mainly used to heat the pin 111 . The wall thickness is set to a gradually decreasing structure to achieve a concentrated heat effect. The transferred heat is finally integrated into the thinner area at the bottom to achieve rapid melting of the solder at the pin 111 .

[0066] The optical module 100 removal device provided in this embodiment can achieve uniform and stable heating of the pins 111 of the circuit substrate by providing a heat-conducting melting portion 320 at the bottom of the heat-conducting member 300 and evenly surrounding the circuit substrate 110;

[0067] By arranging an annular embedding portion 321 at the bottom of the heating and melting portion and arranging solder inside the annular embedding portion 321, the melted liquid solder flows to the positions of the pins 111 around the circuit substrate 110, and the solders at all the pins 111 can be connected into an integral structure. When the heat-conducting melting portion 320 transfers heat, the heat can be transferred to the entire structure to heat it uniformly, thereby ensuring heating uniformity and avoiding the problem that a single solder is difficult to heat and the heating is uneven.

[0068] By arranging the heating and melting part into a structure in which the wall thickness gradually decreases from top to bottom, it is also possible to collect heat in a centralized manner so that the heat is integrated into the bottom area, thereby being able to quickly heat the pin 111 at the bottom position, thereby improving the heating efficiency of the pin 111.

[0069] In some embodiments, the accommodation portion 310 includes a first accommodation cavity and a second accommodation cavity communicating therewith, and the second accommodation cavity is surrounded by the heat-conducting melting portion 320 .

[0070] The minimum inner diameter of the first accommodation cavity is greater than the outer diameter of the metal shell 130 . When placed, the metal shell 130 is located in the first accommodation cavity, and the circuit substrate 110 is located in the second accommodation cavity.

[0071] In some embodiments, the heat transfer and heat conducting component 300 includes: a heat transfer and heat conducting main body portion 330 and a heat conduction melting portion 320 connected below the heat transfer and heat conducting main body portion 330 .

[0072] The first accommodating cavity is formed by enclosing the heat transfer and heat conducting main body 330 , and its size is set to be larger than the outer contour of the metal shell 130 , which can ensure that the metal shell 130 will not be heated and damaged by the transferred heat when it is built inside.

[0073] The second accommodating cavity is formed by surrounding the heat-conducting melting portion 320, and its contour shape is adapted to the circuit substrate 110 to ensure that it can maintain a close fit with the pins 111 around the circuit substrate 110, thereby ensuring the effectiveness of heat transfer and ensuring that the solder at the pins 111 on the circuit substrate 110 can be melted quickly.

[0074] In some embodiments of the present application, the heat transfer and heat conducting member 300 is provided in one piece, and includes:

[0075] A plurality of heat-conducting surrounding components 340 are provided, and the plurality of heat-conducting surrounding components 340 are connected to each other. The accommodation portion 310 is formed by surrounding the plurality of heat-conducting surrounding components 340 , and a baseline outlet portion 341 is opened at the side of any heat-conducting surrounding component 340 .

[0076] The base line outlet portion 341 can be used to lead the optical fiber ribbon 120 to the outside to prevent the optical fiber ribbon 120 from being heated.

[0077] The heat transfer and heat conducting component 300 is integrally formed, and the heat conduction surrounding member 340 is a heat conduction surrounding plate. Four heat conduction surrounding plates are provided and connected to each other to form a frame-shaped heat transfer and heat conducting component 300 .

[0078] In some embodiments, the inner wall of the first accommodating cavity is a slope, and the inner diameter of the first accommodating cavity gradually increases from bottom to top, ensuring that the distance between the metal shell 130 and the first accommodating cavity is larger as it is closer to the heat-conducting main body 200. The large distance is used to achieve isolation to avoid heat transfer, so as to avoid heat being transferred to the metal shell 130 as much as possible, causing the metal shell 130 to be heated.

[0079] In addition, since the pin 111 of the circuit substrate 110 is heated by directly transferring heat to the pin 111 through the heat-conducting melting portion 320 on the heat-conducting component 300, this direct contact heating method of the pin 111 can also avoid as much as possible the problem of using an air gun to heat the components on the circuit substrate 110 due to heat flow.

[0080] In some embodiments of the present application, a relief portion 342 for avoiding a corner of the circuit substrate 110 is formed at the bottom between any two adjacent heat-conducting surrounding components 340 .

[0081] The avoidance portion 342 is an avoidance gap arranged between the heat-conducting surrounding components 340 , and can be used to avoid the four corners of the circuit substrate 110 to ensure that the circuit substrate 110 can be quickly placed in the accommodating portion 310 .

[0082] In some embodiments, the heat-conductive main component 200 is connected to any one of the heat-conductive surrounding components 340, and a heat-conductive blocking portion 343 is provided below the connection position between the heat-conductive main component 200 and the heat-conductive surrounding component to block the heat conducted by the heat-conductive surrounding component directly connected to the heat-conductive main component 200, so that the heat is evenly transferred to the heat-conductive melting portion 320 on the surrounding heat-conductive surrounding components.

[0083] The heat transferred by the thermally conductive main component 200 will be directly transferred to the thermally conductive surrounding component 340 to which it is connected. If there is no barrier during heat transfer, the heat will inevitably be transferred vertically downward along the shortest path. In this way, the heat transferred from the thermally conductive main component 200 will be transferred to one thermally conductive surrounding component, affecting the uniformity of heat transfer.

[0084] The heat can be blocked by the heat-conducting blocking part arranged on the heat-conducting enclosure to prevent the heat from being directly transferred downward, and the heat is evenly transferred to the heat-conducting enclosures on both sides, thereby ensuring the uniformity of heat transfer.

[0085] In some embodiments, the thermally conductive barrier portion is a thermally conductive barrier hole opened on the thermally conductive enclosure. The thermally conductive barrier hole passes through the thermally conductive enclosure and is opened along the length direction of the thermally conductive enclosure. Both ends of the thermally conductive barrier hole are spaced apart from the end of the thermally conductive enclosure.

[0086] The heat-conducting insulation holes achieve the effect of isolating heat through air.

[0087] The heat-conducting barrier holes are arranged in two sections and the two ends of the heat-conducting surrounding parts have a spacing, mainly to ensure that the heat transferred from the heat-conducting main body 200 can continue to be transferred to the sides and downward without being completely blocked.

[0088] In some embodiments, the heat transfer and heat conductive main body 330 is annular, and the heat transfer main body 200 is obliquely connected to one of the side walls of the heat transfer and heat conductive main body 330. The oblique arrangement of the heat transfer main body 200 can ensure that when the pin 111 of the circuit substrate 110 is heated, it can transfer the inclined force to the heat transfer and heat conductive component 300 after being subjected to force, thereby ensuring that the heat transfer and heat conductive component 300 and the pin 111 of the circuit substrate 110 maintain a tight fit.

[0089] The heat-conducting melting portion 320 connected below the heat-conducting main body portion 330 is ring-shaped.

[0090] The annular embedding groove is formed at the bottom surface of the annular heat-conducting melting portion 320 , and solder is buried inside.

[0091] Specifically, the heat transfer and heat conduction main body portion 330 is a heat transfer and heat conduction main body segment, and the heat conduction melting portion 320 is a heat conduction melting segment connected below the heat transfer and heat conduction main body segment.

[0092] In some embodiments, the heat transfer element 300 includes:

[0093] The first heat transfer component 350 includes a first heat conducting portion 351.

[0094] The second heat transfer component 360 is symmetrically arranged with respect to the first heat transfer component 350 , and includes a second heat conduction portion 361 , which is spliced ​​with the first heat conduction portion 351 to form the heat conduction melting portion 320 .

[0095] That is, the heat transfer component is composed of two parts, namely, the first heat transfer component 350 and the second heat transfer component 360.

[0096] The corresponding heat-conducting main body 200 includes a first heat-conducting main body and a second heat-conducting main body. The first heat-conducting main body is connected to the first heat transfer component 350, and the first heat-conducting main body is correspondingly connected to an electric heating element. The second heat-conducting main body is connected to the second heat transfer component 360, and the second heat-conducting main body is correspondingly connected to an electric heating element.

[0097] During heating, two handheld electric heaters can be used to transfer heat to the first heat-conducting main body and the second heat-conducting main body respectively, and finally to the first heat-conducting part 351 and the second heat-conducting part 361. The first heat-conducting part 351 and the second heat-conducting part 361 arranged around the circuit substrate 110 can achieve uniform heating of the pin 111.

[0098] In some embodiments, the first heat conducting portion 351 is bent and arranged to include a first heat conducting segment 3511 and a second heat conducting segment 3512 disposed perpendicular to the first heat conducting segment 3511 ;

[0099] The second heat conducting portion 361 is bent and includes a third heat conducting segment 3611 and a fourth heat conducting segment 3612 arranged perpendicular to the third heat conducting segment 3611 .

[0100] When in use, the first heat conducting section 3511 and the second heat conducting section 3512 are spliced ​​with the third heat conducting section 3611 and the fourth heat conducting section 3612 to form a square heat conducting frame, and the four heat conducting sections are respectively abutted against the pins 111 around the circuit substrate 110.

[0101] In some embodiments, the first heat transfer component 350 includes: a heat transfer main body 352 connected to the heat conductive main body 200, and the heat conductive main body 200 is arranged obliquely;

[0102] A heat transfer bending portion 353 is connected below the heat transfer main body portion 352 , and the first heat conduction portion 351 is disposed at the bottom of the heat transfer bending portion 353 . The second heat transfer component 360 has the same structure as the first heat transfer component 350 .

[0103] When in use, the first heat transfer component 350 and the second heat transfer component 360 are clamped onto the circuit substrate 110 from both sides respectively, so that the first heat conductive part 351 and the second heat conductive part 361 are arranged in contact with the pins 111 around the circuit substrate 110, and then the electric heating element is turned on, and the electric heating element transfers heat to the heat conductive main body 200, and the heat conductive main body 200 transfers heat to the first heat transfer component 350 and the second heat transfer component 360, and the first heat transfer component 350 finally transfers heat to the heat conductive melting part 320 at the bottom position to heat the pins 111.

[0104] In some embodiments, a first L-shaped groove is provided at the bottom of the first heat conducting portion 351, and a second L-shaped groove is provided on the second heat conducting portion 361. The first L-shaped groove and the second L-shaped groove are butt-jointed to form an annular embedding groove. Solder is embedded in both the first L-shaped groove and the second L-shaped groove. After being heated, the solder melts and flows to the solder positions of the pins 111 around the circuit substrate 110, so that heat can be transferred to the solder at the pins 111 to make it melt quickly.

[0105] Another convenience is that all the pins 111 are connected into a whole by soldering, and the heat-conducting melting part 320 can be evenly heated when transferring heat, thereby ensuring heating uniformity.

[0106] In some embodiments, the surfaces of the first heat transfer component 350 and the second heat transfer component 360 are plated with chrome to prevent tin creeping and increase the service life.

[0107] In some embodiments, a fiber outlet portion 380 is disposed on the first heat transfer component 350 or the second heat transfer component 360 to lead the optical fiber ribbon 120 outward.

[0108] In some embodiments, the heat transfer bending portion 353 includes a first heat transfer arm 3531 and a second heat transfer arm 3532. The first heat transfer arm 3531 is arranged perpendicular to the second heat transfer arm 3532. A heat conductive partition portion 370 is formed in the upper area where the first heat transfer arm 3531 and the second heat transfer arm 3532 intersect and connect. The heat conductive partition portion 370 partially penetrates the first heat transfer arm 3531 and partially penetrates the second heat transfer arm 3532.

[0109] The heat conduction blocking portion 370 is a heat conduction blocking hole, which is opened at the intersection of the first heat transfer arm 3531 and the second heat transfer arm 3532 , with one end extending toward the first heat transfer arm 3531 and the other end extending toward the second heat transfer arm 3532 .

[0110] The heat conduction blocking holes are provided to block the heat and prevent the heat from being directly transferred vertically downward. The heat transfer path is forced to change by blocking the heat and the heat is transferred to the first heat transfer arm 3531 and the second heat transfer arm 3532 at both sides.

[0111] Since the heat-conducting barrier is disposed in the upper region, heat can be forced to transfer to the lower region of the first heat transfer arm 3531 and the second heat transfer arm 3532 , thereby ensuring uniform heating of the pin 111 .

[0112] In some embodiments, the inner wall of the first accommodating cavity is configured as a vertical surface, which can also always maintain a large distance between itself and the heat transfer and conductive component 300 to achieve heat isolation.

[0113] In some embodiments, a notch 390 is disposed at a corner of the first heat transfer component, and a notch 390 is also disposed at the second heat transfer component to avoid the corner of the circuit substrate 110 .

[0114] In the description of the above embodiments, specific features, structures, materials or characteristics may be combined in a suitable manner in any one or more embodiments or examples.

[0115] The above is only a specific implementation of the utility model, but the protection scope of the utility model is not limited to this. Any changes or substitutions that can be easily thought of by technicians familiar with the technical field within the technical scope disclosed by the utility model should be included in the protection scope of the utility model. Therefore, the protection scope of the utility model should be based on the protection scope of the claims.

Claims

1. An optical module removal device, the optical module includes a circuit substrate, and pins are arranged around the circuit substrate; It is characterized in that The device comprises: a heat-conducting main body connected to the electric heating element to receive heat from the electric heating element; A heat transfer and heat conducting member connected to the heat conduction main body member to receive heat from the heat conduction main body member, wherein the heat transfer and heat conducting member has an accommodation portion formed therein which penetrates the heat transfer and heat conducting member and accommodates the optical module; An annular heat-conducting melting portion is formed at the bottom of the heat-conducting member located around the accommodating portion. The heat-conducting melting portion is attached to the pin positions around the circuit substrate when the optical module is placed in place, and is used to transfer the heat of the heat-conducting member to the pins to melt the solder; An annular embedding portion is formed at the bottom of the heat-conducting melting portion and is arranged along the circumference of the accommodating portion, and solder is embedded in the annular embedding portion; The wall thickness of the heat-conducting melting portion gradually decreases from top to bottom along the height direction of the heat transfer and heat conducting component.

2. The optical module removal device according to claim 1, characterized in that: The heat transfer and heat conducting member is provided with one, including: A plurality of heat-conducting enclosure components are provided, the plurality of heat-conducting enclosure components are interconnected, adjacent heat-conducting enclosure components are perpendicular to each other, the accommodating portion is formed by the plurality of heat-conducting enclosure components, and a baseline outlet portion is opened on the side of any of the heat-conducting enclosure components.

3. The optical module removal device according to claim 2, characterized in that: A relief portion for avoiding the corner position of the circuit substrate is formed at the bottom position between any two adjacent heat-conducting surrounding components.

4. The optical module removal device according to claim 2, characterized in that: The heat-conducting main body is connected to any one of the heat-conducting surrounding components, and a heat-conducting barrier is provided below the connection position between the heat-conducting main body and the heat-conducting surrounding component to block the heat conducted by the heat-conducting surrounding component directly connected to the heat-conducting main body, so that the heat is evenly transferred to the heat-conducting melting part on the surrounding heat-conducting surrounding components.

5. The optical module removal device according to claim 4, characterized in that: The heat-conducting barrier portion is a heat-conducting barrier hole opened on the heat-conducting enclosure. The heat-conducting barrier hole penetrates the heat-conducting enclosure and is opened along the length direction of the heat-conducting enclosure. Both ends of the heat-conducting barrier hole are spaced from the ends of the heat-conducting enclosure.

6. The optical module removal device according to claim 1, characterized in that: The heat transfer and heat conducting component comprises: a heat transfer and heat conducting main body part in an annular shape, and the heat transfer and heat conducting main body part is obliquely connected to one of the side walls of the heat transfer and heat conducting main body part; And the heat-conducting melting part connected below the heat-conducting main body part is ring-shaped.

7. The optical module removal device according to claim 1, characterized in that: The heat transfer and heat conducting member comprises: A first heat transfer component, the first heat transfer component includes a first heat conducting portion; And a second heat transfer component symmetrically arranged with the first heat transfer component comprises a second heat conduction part which is spliced ​​with the first heat conduction part to form the heat conduction melting part.

8. The optical module removal device according to claim 7, characterized in that: The first heat conducting portion is bent and arranged to include a first heat conducting section and a second heat conducting section arranged perpendicular to the first heat conducting section; The second heat conducting portion is arranged in a bent manner and comprises a third heat conducting segment and a fourth heat conducting segment arranged perpendicular to the third heat conducting segment.

9. The optical module removal device according to claim 7, characterized in that: The first heat transfer component comprises: a heat transfer main body connected to a heat conducting main body, the heat conducting main body being arranged obliquely; A heat transfer bending portion is connected below the heat transfer main body portion, the first heat conduction portion is arranged on the heat transfer bending portion, and the second heat transfer component has the same structure as the first heat transfer component.

10. The optical module removal device according to claim 9, characterized in that: The heat transfer bending portion includes a first heat transfer arm and a second heat transfer arm. The first heat transfer arm is arranged perpendicular to the second heat transfer arm. A heat conduction partition portion is formed in the upper area where the first heat transfer arm and the second heat transfer arm intersect and connect. The heat conduction partition portion partially penetrates the first heat transfer arm and partially penetrates the second heat transfer arm.

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