Assembly equipment and module production line

By designing automated assembly equipment, the automatic assembly of the camera module is achieved using glue transfer and bonding mechanisms, the problem of difficult to control the amount of glue in manual assembly is solved, and the yield and efficiency of production are improved.

CN222811047UActive Publication Date: 2025-04-29DONG GUAN GAO WEI GUANG XUE DIAN ZI YOU XIAN GONG SI
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Patent Information

Application Number
CN202421958311.4
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-08-13
Publication Date
2025-04-29
Estimated Expiration
2034-08-13

AI Technical Summary

Technical Problem

During the production process of camera modules of electronic equipment, manual assembly makes it difficult to control the amount of glue, resulting in problems such as overglue and poor appearance, affecting production yield and efficiency.

Method used

An assembly equipment is designed to transport a vehicle equipped with the first material using the first conveying track, and automatically assemble through a glue transfer mechanism and a bonding mechanism to ensure the control and uniformity of the glue usage.

Benefits of technology

Through automated assembly, appearance problems such as spilling and poor viscose are reduced, and production yield and efficiency are improved.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses assembling equipment and a module production line, the assembling equipment comprises a base table, a first conveying track and a laminating device, the first conveying track is arranged on the base table, the first conveying track is used for conveying a carrier for bearing a first material, and the first conveying track is provided with a laminating station. The laminating device comprises a movement mechanism as well as a glue moving mechanism and a laminating mechanism which are connected with each other, the movement mechanism is arranged on the base table, the glue moving mechanism and the laminating mechanism are both connected to the movement mechanism, the movement mechanism is used for driving the glue moving mechanism and the laminating mechanism to move relative to the base table, and the glue moving mechanism is used for carrying out glue moving operation on the first material on the carrier; the attaching mechanism is used for picking up the second material and enabling the second material to be attached to the first material to form a product module. According to the assembling equipment and the module production line, automatic operation of module fitting can be achieved, and the yield and the production efficiency of products can be improved.
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Description

Technical Field

[0001] The present application relates to the field of automated production, and in particular to an assembly device and a module production line. Background Art

[0002] In the production process of camera modules of electronic devices, such as flash modules of mobile phones, it is usually necessary to transfer glue to achieve the fitting assembly between the lens and the protective cover. In the related art, a transfer glue stick is usually used to dip glue and gently press it onto the protective cover, and then a suction pen is used to suck the lens and place it on the protective cover with glue to complete the assembly of the lens and the protective cover. However, this manual assembly method is difficult to operate, and it is impossible to control the amount of glue used, resulting in problems such as overflowing glue and poor appearance, which seriously affects the production yield and production efficiency. Utility Model Content

[0003] The embodiments of the present application disclose an assembly device and a module production line, which can realize automated operation and are beneficial to improving product yield and production efficiency.

[0004] In order to achieve the above objectives, in a first aspect, an embodiment of the present application discloses an assembly device, comprising:

[0005] abutment;

[0006] A first conveying track, the first conveying track is arranged on the base, the first conveying track is used to convey a carrier carrying a first material, and the first conveying track is provided with a bonding station;

[0007] The bonding device includes a moving mechanism and an interconnected glue transferring mechanism and a bonding mechanism, the moving mechanism is arranged on the base, the glue transferring mechanism and the bonding mechanism are both connected to the moving mechanism, the moving mechanism is used to drive the glue transferring mechanism and the bonding mechanism to move relative to the base, the glue transferring mechanism is used to transfer the first material on the carrier, and the bonding mechanism is used to pick up the second material and bond the second material to the first material to form a product module.

[0008] As an optional implementation, in an embodiment of the first aspect of the present application, the motion mechanism includes a driving structure, a guide structure and a mounting structure, the guide structure is arranged on the base, the guide structure extends along the direction of the first conveying track, the mounting structure is slidably connected to the guide structure, the output end of the driving structure is connected to the mounting structure, and is used to drive the mounting structure to move along the guide structure, and the glue transfer mechanism and the bonding mechanism are both connected to the mounting structure.

[0009] As an optional implementation, in an embodiment of the first aspect of the present application, a mounting seat is provided on the mounting structure, the mounting seat is movable relative to the mounting structure, the glue transfer mechanism includes a first lifting structure, an adjustment structure and a glue head, the first lifting structure is connected to the mounting seat, the adjustment structure is connected to the first lifting structure, the glue head is connected to an end of the adjustment structure, the glue head is used to transfer the first material on the carrier, and the first lifting structure is used to drive the adjustment structure and the glue head to move up and down;

[0010] The bonding mechanism includes a second lifting structure and a picking structure, the second lifting structure is connected to the mounting seat, the picking structure is connected to the second lifting structure, the second lifting structure drives the picking structure to move up and down, the picking structure is configured to pick up the second material and bond the second material to the first material, and a UV lamp is provided on the periphery of the picking structure, and the UV lamp is used to pre-cure the product module.

[0011] As an optional implementation, in an embodiment of the first aspect of the present application, the laminating device further comprises a visual detection mechanism, the visual detection mechanism is arranged between the laminating mechanism and the glue transfer mechanism, and the visual detection mechanism is connected to the mounting structure;

[0012] The visual inspection mechanism is configured to position the second material when the bonding mechanism picks up the material, and the visual inspection mechanism is also configured to perform appearance inspection on a product module formed after the second material is bonded to the first material.

[0013] As an optional implementation, in an embodiment of the first aspect of the present application, the assembly equipment also includes a glue supply device, the glue supply device includes a glue supply component and a glue cleaning component, the glue supply component and the glue cleaning component are arranged on one side of the first conveying track along the extension direction of the first conveying track, the glue supply component is used to provide glue to the glue transfer mechanism, and the glue cleaning component is used to clean the glue on the glue head of the glue transfer mechanism.

[0014] As an optional implementation, in an embodiment of the first aspect of the present application, the assembly equipment also includes a conveying channel, which is arranged on the other side of the first conveying track, and the conveying channel is consistent with the extension direction of the first conveying track. A lifting mechanism is provided in the conveying channel, and the conveying channel includes an upper channel and a lower channel arranged at intervals along the height direction of the base, the upper channel is used to convey the tray supporting the second material, and the lower channel is used to reflow the tray, the lifting mechanism can be lifted and connected between the upper channel and the lower channel, and the lifting mechanism is configured to lift the tray supporting the second material when the bonding mechanism picks up the second material, and the lifting mechanism is also configured to lower the tray to the lower channel after the second material in the tray is picked up.

[0015] As an optional implementation, in an embodiment of the first aspect of the present application, there are two laminating stations, and the two laminating stations are arranged at intervals along the extension direction of the first conveying track. Each laminating station is correspondingly provided with a laminating device, and one laminating device is configured to complete the assembly of part of the first material on the carrier, and the other laminating device is configured to complete the assembly of another part of the first material on the carrier.

[0016] In the second aspect, the present application also discloses a module production line, which includes a first loading device, an assembly device as described in the first aspect above, a second loading device and an unloading device arranged in sequence, the first loading device is connected to the first conveying track of the assembly device, and is used to load the first material onto a carrier and convey the carrier carrying the first material to the first conveying track, the second loading device is connected to the first conveying track, the second loading device is used to load the second material to the assembly device, and the unloading device is used to unload the products assembled by the assembly device and to reflow the carrier.

[0017] As an optional implementation, in an embodiment of the second aspect of the present application, the first feeding device includes a material feeding mechanism, a carrier feeding mechanism and a feeding swing plate mechanism, the material feeding mechanism and the carrier feeding mechanism are arranged relative to each other in a direction perpendicular to the first conveying track, the carrier feeding mechanism includes a first conveying structure and a second conveying track, the first conveying structure is arranged corresponding to the second conveying track, the first conveying structure is used to load the carrier onto the second conveying track, a loading station is provided on the second conveying track, the second conveying track is docked with the first conveying track to transport the carrier to the assembly equipment, the material feeding mechanism is used to load the first material, and the feeding swing plate mechanism is arranged between the material feeding mechanism and the carrier feeding mechanism, and is used to place the first material on the material feeding mechanism onto the carrier on the second conveying track;

[0018] The second loading equipment includes a second conveying structure and a third conveying track. The third conveying track passes through the second conveying structure and is connected to the first conveying track of the assembly equipment for receiving the products assembled by the assembly equipment. The second conveying structure is used to convey the pallet carrying the second material to the assembly equipment.

[0019] As an optional implementation, in an embodiment of the second aspect of the present application, there are multiple assembly devices, and the multiple assembly devices are arranged at intervals along the extension direction of the first conveying track. A second loading device is provided between two adjacent assembly devices, and the two ends of the third conveying track of the second loading device are respectively connected to the first conveying tracks of the two adjacent assembly devices, and at least part of the second conveying structure is connected to the conveying channel of the assembly device to respectively convey the second material to the two adjacent assembly devices.

[0020] Compared with the prior art, the beneficial effects of this application are:

[0021] The present application provides an assembly device and a module production line. The assembly device can use a first conveying track to convey a carrier containing a first material to a bonding station, and then use a glue transfer mechanism to transfer glue to the first material on the carrier, and then pick up the second material through the bonding mechanism and assemble the second material onto the first material after the glue transfer. The assembly process is completed by automated equipment, which can free up manual operation, and the glue transfer mechanism can better control the amount of glue, balance the uniformity of glue transfer, reduce appearance defects such as overflow and poor adhesion, and improve production yield and production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0023] Figure 1 It is a schematic diagram of the three-dimensional structure of the assembly equipment disclosed in this application;

[0024] Figure 2 It is a structural schematic diagram of the laminating device disclosed in this application;

[0025] Figure 3 It is a structural schematic diagram of the glue supply assembly disclosed in this application;

[0026] Figure 4 This is a schematic diagram of the structure of the glue cleaning component disclosed in this application;

[0027] Figure 5 This is a schematic diagram of the structure of the module production line disclosed in this application;

[0028] Figure 6 This is a structural schematic diagram of the first feeding device disclosed in this application;

[0029] Figure 7 It is a structural schematic diagram of the second feeding equipment disclosed in this application;

[0030] Figure 8 It is a schematic diagram of the three-dimensional structure of the blanking equipment disclosed in this application;

[0031] Fig. 9 It is a side view schematic diagram of the unloading equipment disclosed in this application.

[0032] Description of reference numerals:

[0033] 100, assembly equipment; 101, carrier; 102, second material; 10, base; 20, first conveying track; 20a, laminating station; 30, laminating device; 31, movement mechanism; 311, driving structure; 312, guide structure; 313, mounting structure; 313a, guide assembly; 3131, mounting seat; 32, glue transfer mechanism; 321, first lifting structure; 322, adjustment structure; 323, glue head; 33, laminating mechanism; 331, second lifting structure; 332, picking structure; 333, UV lamp; 34, visual inspection mechanism; 40, glue supply device; 41, glue supply assembly; 411, steel plate; 412, glue cup; 413, glue scraping member; 42, glue cleaning assembly; 421, first film roll; 422, second film roll; 423, mounting platform; 50, conveying channel; 5 1. Upper channel; 52. Lower channel; 200. Module production line; 201. First loading device; 2011. Material loading mechanism; 20111. Cache structure; 20111a. Feeding cache assembly; 20111b. Unloading cache assembly; 20111c. Lifting assembly; 20112. Conveying assembly; 2012. Carrier loading mechanism; 20121. First conveying structure; 20122. Second conveying track; 2013. Loading plate mechanism; 202. Second loading device; 2021. Second conveying structure; 2022. Third conveying track; 203. Unloading device; 2031. Curing mechanism; 2032. Product unloading mechanism; 2033. Carrier unloading mechanism; 20331. Fourth conveying track; 20332. Reflux assembly; 2034. Unloading plate mechanism. DETAILED DESCRIPTION

[0034] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0035] In the present application, the terms "upper", "lower", "left", "right", "front", "back", "top", "bottom", "inner", "outer", "vertical", "horizontal", "lateral", "longitudinal" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings. These terms are mainly used to better describe the present application and its embodiments, and are not used to limit the indicated structures, elements or components to have a specific orientation, or to be constructed and operated in a specific orientation.

[0036] In addition, some of the above terms may be used to express other meanings in addition to indicating orientation or positional relationship. For example, the term "on" may also be used to express a certain dependency or connection relationship in some cases. For those of ordinary skill in the art, the specific meanings of these terms in this application can be understood according to specific circumstances.

[0037] In addition, the terms "installed", "set", "provided with", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection, or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be an internal connection between two structures, elements, or components. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0038] In addition, the terms "first", "second", etc. are mainly used to distinguish different structures, elements or components (the specific types and structures may be the same or different), and are not used to indicate or imply the relative importance and quantity of the indicated structures, elements or components. Unless otherwise specified, "plurality" means two or more.

[0039] The technical solution of the present application will be further described below in conjunction with embodiments and drawings.

[0040] See also Figure 1 and Figure 2 In the first aspect, the embodiment of the present application discloses an assembly device 100, which includes a base 10, a first conveying track 20 and a bonding device 30, wherein the first conveying track 20 is arranged on the base 10, and the first conveying track 20 is used to convey a carrier 101 carrying a first material, and the first conveying track 20 is provided with a bonding station 20a. The bonding device 30 includes a motion mechanism 31 and a glue transfer mechanism 32 and a bonding mechanism 33 connected to each other, the motion mechanism 31 is arranged on the base 10, the glue transfer mechanism 32 and the bonding mechanism 33 are both connected to the motion mechanism 31, the motion mechanism 31 is used to drive the glue transfer mechanism 32 and the bonding mechanism 33 to move relative to the base 10, the glue transfer mechanism 32 is used to transfer the first material on the carrier 101, and the bonding mechanism 33 is used to pick up the second material 102 and bond the second material 102 with the first material to form a product module.

[0041] The assembly equipment 100 of the embodiment of the present application can use the first conveying track 20 to convey the carrier 101 loaded with the first material to the bonding station 20a, and then use the glue transfer mechanism 32 to transfer the first material on the carrier 101, and then pick up the second material 102 through the bonding mechanism 33 and assemble the second material 102 to the first material after the glue transfer. The assembly process is completed by automated equipment, which can free up manual operation. At the same time, the glue transfer mechanism 32 can better control the amount of glue, balance the uniformity of the glue transfer, reduce the appearance defects such as overflowing glue and poor glue, which is conducive to improving the production yield and production efficiency.

[0042] Optionally, the product module may include but is not limited to functional components in electronic devices such as camera modules and flash modules. Taking the flash module as an example, the first material may be a lens, the second material may be a protective cover, the lens is mounted on the carrier 101 and transported to the assembly equipment, and the assembly of the lens and the protective cover is completed by the bonding device 30.

[0043] Optionally, a positioning structure and a barcode scanner may be lifted up on the first conveying track 20 to realize actions such as conveying, positioning, and barcode scanning of the carrier 101 .

[0044] In some possible embodiments, the motion mechanism 31 may include a driving structure 311, a guide structure 312 and a mounting structure 313, wherein the guide structure 312 is disposed on the base 10, the guide structure 312 extends in the direction of the first conveying track 20, the mounting structure 313 is slidably connected to the guide structure 312, the output end of the driving structure 311 is connected to the mounting structure 313, and is used to drive the mounting structure 313 to move along the guide structure 312, and the glue-shifting mechanism 32 and the bonding mechanism 33 are both slidably connected to the mounting structure 313. Thus, under the driving action of the driving structure 311, the mounting structure 313 and the glue-shifting mechanism 32 and the bonding mechanism 33 connected to the mounting structure 313 can move along the guide structure 312, and the glue-shifting mechanism 32 and the bonding mechanism 33 can move along the mounting structure 313, so that the glue-shifting mechanism 32 and the bonding mechanism 33 can move between the material-retrieving station and the bonding station 20a. Specifically, after the glue transfer mechanism 32 performs the glue transfer operation and transfers the glue to the first material, the bonding mechanism 33 can move to the storage place of the second material 102, pick up the second material 102 and move to the bonding station 20a to assemble the second material 102 on the first material, so as to complete the assembly of multiple first materials on the carrier 101.

[0045] Optionally, the driving structure 311 can be a double-actuator XY linear motor, and the driving structure 311 can drive the glue transfer mechanism 32 and the bonding mechanism 33 to move in the horizontal direction. The guide structure 312 can include but is not limited to a linear guide rail, a linear slide, etc. arranged on the base 10, and the mounting structure 313 can include but is not limited to mounting beams, trusses, linear slides, etc. The extension direction of the mounting structure 313 intersects with the length extension direction of the guide structure 312, and one end of the mounting structure 313 is slidably connected to the guide structure 312, so that the mounting structure 313 can move relative to the guide structure 312 along the direction of the first conveying track 20.

[0046] It can be understood that the glue transfer mechanism 32 and the bonding mechanism 33 can move relative to the guide structure 312 or relative to the mounting structure 313. For example, the extension direction of the mounting structure 313 can be perpendicular to the extension direction of the guide structure 312, that is, the mounting structure 313 extends in a direction perpendicular to the first conveying track 20, thereby, the glue transfer mechanism 32 and the bonding mechanism 33 can realize the movement in the X direction and the Y direction.

[0047] In order to enable the glue transfer mechanism 32 and the bonding mechanism 33 to move relative to the mounting structure 313, a guide component 313a may be provided on the mounting structure 313. The guide component 313a may include a guide rail, a slide groove, etc. The extension direction of the guide component 313a is consistent with the length direction of the mounting structure 313. Under the driving action of the driving structure 311, the bonding mechanism 33 may slide along the guide component 313a to achieve the picking and bonding of the second material 102.

[0048] In some possible implementations, a mounting seat 3131 is provided on the mounting structure 313, and the mounting seat 3131 is movable relative to the mounting structure 313. At this time, the glue transfer mechanism 32 and the bonding mechanism 33 can be connected to the mounting seat 3131, that is, the glue transfer mechanism 32 and the bonding mechanism 33 can be integrated through the mounting seat 3131. With such an arrangement, on the one hand, the glue transfer structure does not need to be provided with a set of driving systems separately, thereby simplifying the structure and making the overall structure of the bonding device 30 more compact; on the other hand, the glue transfer mechanism 32 and the bonding mechanism 33 can achieve synchronous movement under the action of the driving structure 311, that is, the positions of the glue transfer mechanism 32 and the bonding mechanism 33 are relatively fixed. When the glue transfer mechanism 32 completes the glue transfer work on the first material, the bonding mechanism 33 can directly perform bonding, which is convenient for the bonding process and is conducive to controlling the accuracy.

[0049] In the examples of this application, see Figure 2, the glue transfer mechanism 32 may include a first lifting structure 321, an adjustment structure 322 and a glue head 323. The first lifting structure 321 is connected to the mounting seat 3131, the adjustment structure 322 is connected to the first lifting structure 321, the glue head 323 is connected to the end of the adjustment structure 322, the glue head 323 is used to transfer the first material on the carrier 101, and the first lifting structure 321 is used to drive the adjustment structure 322 and the glue head 323 to move up and down. When performing the glue transfer operation, the glue transfer mechanism 32 is first moved to the bonding station 20a under the action of the driving structure 311, and is aligned above the first material to be transferred. The glue head 323 can move up and down driven by the first lifting structure 321 to complete the glue transfer work.

[0050] Among them, the adjustment structure 322 may include an adjustment platform, a pressure detector and a laser measurer. The adjustment platform can be raised and lowered and connected to the first lifting structure. The pressure detector and the laser measurer are both arranged on the adjustment platform, and the pressure detector can be arranged corresponding to the glue head 323. The pressure detector can be used for pressure detection of the glue head 323, so as to adjust the pressure of the glue head 323 when transferring glue to the first material according to the pressure detection standard. The laser measurer can measure the distance from the glue head 323 to the first material through laser, so as to adjust and calibrate the glue head 323 according to the measurement result.

[0051] Furthermore, the bonding mechanism 33 may include a second lifting structure 331 and a picking structure 332. The second lifting structure 331 is connected to the mounting base 3131, and the picking structure 332 is connected to the second lifting structure 331. The second lifting structure 331 drives the picking structure 332 to move up and down. The picking structure 332 is configured to pick up the second material 102 and bond the second material 102 to the first material. In this way, the second lifting structure 331 can drive the second material 102 to move horizontally through the mounting seat 3131, and the second lifting structure 331 drives the picking structure 332 and the adsorbed second material 102 to move up and down, that is, the second lifting structure 331 drives the picking structure 332 to move up and down, so as to absorb and lower the second material 102, and realize the function of avoiding the position; the mounting seat 3131 can drive the second lifting structure 331 and the picking structure 332 to move forward and backward and left and right under the drive of the driving structure 311, and can repeatedly move between the placement position of the second material 102 and the bonding station 20a, so as to jointly realize the smooth picking and bonding of the second material 102.

[0052] After the second material 102 is assembled onto the first material to which the glue transfer has been completed through the pick-up structure 332, in order to cure the glue of the assembled product module, in some embodiments, a UV lamp 333 may be provided on the periphery of the pick-up structure 332, and the UV lamp 333 may be used to pre-cure the product module. Since the glue can be pre-cured after the second material 102 is assembled, the product module can avoid the problem of the second material 102 and the first material being loosely bonded and deviated or even falling due to the uncured glue when the product module continues to flow to the next station along the first conveying track 20, thereby helping to ensure the integrity of the product module.

[0053] In addition, by setting the UV lamp 333 on the periphery of the picking structure 332 instead of setting it separately, not only can the timeliness of curing of the assembled product module be improved, but also the overall structure of the bonding structure can be made more compact, integrating the bonding function and the curing function into one, thereby improving the functional integration of the bonding structure.

[0054] Optionally, the number of the UV lamps 333 can be two, three, four, etc., and the multiple UV lamps 333 can be spaced and evenly arranged along the periphery of the pickup structure 332 to make the irradiation of the UV lamps 333 uniform, thereby making the curing degree of the product module more uniform.

[0055] Optionally, the first lifting structure 321 and the second lifting structure 331 can be cylinders, including a cylinder body and a piston. For example, the cylinder body is connected to the mounting seat 3131, and the piston of the first lifting structure 321 can be connected to the adjustment platform, so as to drive the adjustment platform and the rubber head 323 connected to the adjustment platform to move up and down. In addition, the picking structure 332 can be a suction head, a clamping claw, etc., to meet the needs of picking up the second material. Preferably, the picking structure 332 can be a suction head, which picks up the second material 102 by adsorption. The use of adsorption can reduce the impact on the appearance of the second material 102, and the structure is simple and compact, which is more conducive to the peripheral arrangement of UV lamps 333.

[0056] In some possible implementations, see Figure 1 and Figure 2The laminating device 30 may also include a visual inspection mechanism 34, which is disposed between the laminating mechanism 33 and the glue transfer mechanism 32, and is connected to the mounting structure 313. Specifically, the visual inspection mechanism 34 is connected to the mounting seat 3131. The visual inspection mechanism 34 is configured to position the second material 102 when the laminating mechanism 33 picks up the material, and the visual inspection mechanism 34 is also configured to perform an appearance inspection on the product module formed after the second material 102 is laminated with the first material. The visual inspection mechanism 34 is connected to the mounting seat 3131 to realize an integrated arrangement with the glue transfer mechanism 32 and the laminating mechanism 33, and is located between the two. When the appearance of the glue transfer can be inspected and the assembled product module can be inspected, the response speed of the visual inspection mechanism 34 can be improved, which is conducive to improving the inspection efficiency of the visual inspection mechanism 34.

[0057] It can be understood that the above-mentioned glue transfer mechanism 32, bonding mechanism 33 and visual inspection mechanism 34 are all integrally connected to the mounting structure 313 through the mounting seat 3131, realizing the automatic glue transfer of the first material, the bonding of the second material 102 and the first material, the glue appearance inspection and the pre-curing of the product module after bonding.

[0058] Optionally, the visual inspection mechanism 34 may include structures such as a visual camera and a light source. The visual camera may be responsible for capturing the image of the inspected object, and the light source may provide a stable and uniform lighting environment for the inspected object, thereby ensuring the quality and stability of image acquisition and improving the inspection accuracy.

[0059] In some possible implementations, the assembly device 100 may further include a glue supply device 40, which includes a glue supply component 41 and a glue cleaning component 42. The glue supply component 41 and the glue cleaning component 42 are arranged on one side of the first conveying track 20 along the extension direction of the first conveying track 20. The glue supply component 41 is used to provide glue to the glue transfer mechanism 32, and the glue cleaning component 42 is used to clean the glue on the glue head 323 of the glue transfer mechanism 32. By adopting the design that the glue supply device 40 includes the glue supply component 41 and the glue cleaning component 42, the continuity of the glue transfer mechanism 32 taking glue can be guaranteed. Even when it is necessary to replenish glue to the glue supply component 41, the operation of the glue transfer mechanism 32 is not affected, thereby ensuring the continuity of the operation of the bonding device 30, which is beneficial to the assembly efficiency. In addition, by timely cleaning the glue on the glue head 323 of the glue transfer mechanism 32 through the glue cleaning component 42, the cleanliness of the glue head 323 can be effectively guaranteed, and inconsistent and uneven glue usage due to glue residue can be avoided, which is beneficial to well control the amount of glue used and the uniformity of the glue used, thereby helping to improve the effect of glue transfer onto the first material.

[0060] Alternatively, see Figure 3and Figure 4 The glue supply component 41 may include a steel plate 411, a glue cup 412, a glue scraper 413, etc. The glue supply component 41 can provide glue in a stable shape through the pattern etched on the steel plate 411 and the glue cup 412, so that the glue head 323 of the glue transfer mechanism 32 can take the glue in an amount and uniformly. The glue cleaning component 42 may include a mounting platform 423 and two first and second film rolls 421 and 422 with adhesive tapes wound around them. The first and second film rolls 421 and 422 are connected to the base 10 through the mounting platform 423. The adhesive tape is tensioned between the two film rolls. The first film roll 421 is used to wind clean adhesive tape, and the second film roll 422 is used to recycle adhesive tapes that have been cleaned of adhesive tapes. The cleaning of the adhesive head 323 is achieved through automatic cleaning, which frees up manual operation and improves automated production efficiency.

[0061] In some possible implementations, such as Figure 1 As shown, the assembly equipment 100 may further include a conveying channel 50, which is disposed on the other side of the first conveying track 20. The conveying channel 50 is consistent with the extension direction of the first conveying track 20. A lifting mechanism (not shown) is provided in the conveying channel 50. The conveying channel 50 includes an upper channel 51 and a lower channel 52 which are spaced apart along the height direction of the base 10. The upper channel 51 is used to convey a tray carrying the second material 102, and the lower channel 52 is used to return the tray. The lifting mechanism can be lifted and lowered between the upper channel 51 and the lower channel 52. The lifting mechanism is configured to lift the tray carrying the second material 102 when the bonding mechanism 33 picks up the second material 102, and the lifting mechanism is also configured to lower the tray to the lower channel 52 after the second material 102 in the tray is picked up. By setting up the conveying channel 50, the second material 102 can be directly transported to the designated position. This makes it easier for the assembly equipment 100 to connect to the automatic loading equipment to realize automatic loading without the need to manually carry the second material 102 to the assembly equipment 100. This can save manpower and improve the degree of automation of the assembly equipment 100.

[0062] In addition, the conveying channel 50 adopts a two-layer channel design, and the tray carrying the second material 102 is transported to the designated loading station through the upper channel 51, and the tray carrying the second material 102 is lifted up by the lifting mechanism. After the picking structure 332 of the laminating mechanism 33 picks up the second material 102, the lifting mechanism lowers the empty tray to the lower channel 52 for transportation, thereby completing the recycling of the empty tray. The entire process of feeding and closing the tray is automated, without manual intervention, which greatly improves the automation of loading and unloading the second material 102.

[0063] It can be understood that the conveying channel 50 and the glue supply device 40 are arranged on both sides of the first conveying track 20 relative to each other, that is, the loading station of the second material 102 and the glue supply device 40 are arranged at intervals along a direction perpendicular to the first conveying track 20. Therefore, the glue transfer mechanism 32 and the bonding mechanism 33 can reciprocate between the glue supply device 40 and the loading station of the second material 102 along the extension direction of the first conveying track 20 and the direction perpendicular to the first conveying track 20 to achieve smooth assembly of the second material 102 and the first material.

[0064] In some possible implementations, there may be two laminating stations 20a, and the two laminating stations 20a are arranged at intervals along the extension direction of the first conveying track 20, and each laminating station 20a is provided with a laminating device 30, one laminating device 30 is configured to complete the assembly of a part of the first material on the carrier 101, and the other laminating device 30 is configured to complete the assembly of another part of the first material on the carrier 101. That is, one assembly device 100 may be provided with two laminating stations 20a, and the two laminating stations 20a are each provided with a set of completed laminating devices 30, and the two laminating stations 20a complete the same combination action, thereby improving the assembly efficiency of the assembly device 100, and distributing the first material on the same carrier 101 to be completed in two stations, which can avoid the situation where the assembly device 100 takes too long due to one station completing the assembly of all the first materials on a carrier 101, resulting in a backlog of the first material, which is not conducive to balancing the production capacity of the upstream and downstream stations of the assembly device 100.

[0065] Combined with the design of the above-mentioned conveying channel 50, in the case of a double station, the assembly of the second material 102 and the first material will be briefly described. It can be understood that in the case where two bonding stations 20a are provided on the assembly device 100, two loading stations for the second material 102 are also provided. As can be seen from the above, after the second material 102 is transported from the upper channel 51 to the first loading station, the tray will be lifted up by the lifting mechanism. At this time, the next tray of the second material 102 can continue to be transported to the second loading station and lifted up by the lifting mechanism for the bonding mechanism 33 to pick up the material. At the same time, the carrier 101 carrying the first material from the upstream is transported to the first bonding station 20a. Under the action of the driving structure 311, the bonding mechanism 33 picks up the second material 102 on the corresponding loading station and completes the assembly of a product module. After the first bonding station 20a completes the assembly of a part (for example, half) of the first material on a carrier 101, the other part (the other half) of the first material that has not yet been assembled is transported to the second bonding station 20a along the first conveying track 20, and the bonding and assembly action is repeated to complete the assembly of the other part of the first material, and then transported to the downstream station. At this time, another carrier 101 carrying the first material transported by the upstream station will reach the first bonding station 20a again, repeating the assembly process, and so on. The two bonding stations 20a jointly complete the assembly of all first materials on the same carrier 101.

[0066] It is understandable that the quantity of the first material on the carrier 101 completed at the two laminating stations 20a can be set according to the actual situation. For example, if two laminating stations 20a are set, one laminating station 20a can complete the laminating of half of the first material, and the other laminating station 20a can complete the laminating of the other half of the first material. If four laminating stations are set, each laminating station 20a can complete the laminating of one quarter of the first material on the carrier 101.

[0067] In a second aspect, the present application also discloses a module production line 200, see Figure 5The module production line 200 includes a first loading device 201, an assembly device 100 such as the one in the above embodiment, a second loading device 202 and an unloading device 203 which are arranged in sequence. The first loading device 201 is connected to the first conveying track 20 of the assembly device 100, and is used to load the first material onto the carrier 101 and convey the carrier 101 carrying the first material to the first conveying track 20. The second loading device 202 is connected to the first conveying track 20, and the second loading device 202 is used to load the second material 102 onto the assembly device 100. The unloading device 203 is used to unload the products assembled by the assembly device 100 and to reflow the carrier 101. By docking the first loading device 201 upstream of the assembly equipment 100, the loading of the first material and the transportation of the carrier 101 carrying the first material can be completed, thereby realizing automated operation. In addition, by docking the second loading device 202 and the unloading device 203 downstream of the assembly equipment 100, the automatic loading of the second material 102 and the unloading of the assembled product module can be completed, which greatly improves the degree of automation of the module production line 200 and is also beneficial to improving the production capacity of the module production line 200.

[0068] In some possible implementations, there may be multiple assembly devices 100, and the multiple assembly devices 100 are arranged at intervals along the extension direction of the first conveying track 20, and a second loading device 202 is provided between two adjacent assembly devices 100, and the two ends of the third conveying track 2022 of the second loading device 202 are respectively connected to the first conveying tracks 20 of the two adjacent assembly devices 100, and at least part of the second conveying structure 2021 is connected to the transmission channel 50 of the assembly device 100 to respectively convey the second material 102 to the two adjacent assembly devices 100. That is, a second loading device 202 can be connected between two assembly devices 100, so as to realize the simultaneous conveyance of the second material 102 to the two assembly devices 100. By using multiple assembly devices 100 to assemble product modules, the assembly efficiency of the module production line 200 can be improved, thereby improving the production capacity of the module production line 200.

[0069] It should be noted that multiple assembly devices 100 can jointly complete the assembly of the first material on the same carrier 101, which can avoid the situation of transportation backlog of the carrier 101 on the first conveying track 20, and reasonably allocate the assembly time, balance the hourly output quantity of each device, so that the time used by each device tends to be balanced, which is conducive to improving production capacity.

[0070] The first material is usually supplied in the form of a plastic pallet, and the assembly of the first material and the second material 102 in the assembly device 100 needs to be carried out in the dedicated carrier 101. Therefore, upstream of the assembly device 100, the transfer of the first material needs to be completed, that is, the first material needs to be transferred from the original pallet to the dedicated carrier 101, in order to facilitate the transfer of the first material and the loading of the dedicated carrier 101. In some possible implementations, the first loading device 201 may include a material loading mechanism 2011, a carrier loading mechanism 2012, and a loading swing plate mechanism 2013, and through the cooperation between the three, the carrier 101 carrying the first material is transported to the first conveying track 20 of the assembly device 100.

[0071] Among them, see Figure 6 The material loading mechanism 2011 and the carrier loading mechanism 2012 can be arranged relative to each other in a direction perpendicular to the first conveying track 20. The carrier loading mechanism 2012 includes a first conveying structure 20121 and a second conveying track 20122. The first conveying structure 20121 is arranged corresponding to the second conveying track 20122. The first conveying structure 20121 is used to load the carrier 101 onto the second conveying track 20122. A loading station is provided on the second conveying track 20122. The second conveying track 20122 is docked with the first conveying track 20 to transport the carrier 101 to the assembly equipment 100. The material loading mechanism 2011 is used to load the first material. The loading plate mechanism 2013 is arranged between the material loading mechanism 2011 and the carrier loading mechanism 2012, and is used to place the first material on the material loading mechanism 2011 onto the carrier 101 on the second conveying track 20122. In this way, the carrier 101 is loaded onto the second conveying track 20122 through the first conveying structure 20121, the first material is loaded to the designated position via the material loading mechanism 2011, and the first material is transferred to the carrier 101 through the loading plate mechanism 2013. The carrier 101 carrying the first material is transported to the first conveying track 20 of the assembly equipment 100 under the action of the second conveying track 20122, and the assembly of the product module is completed according to the above-mentioned embodiment.

[0072] Optionally, the material loading mechanism 2011 may include a buffer structure 20111 and a conveying component 20112, the conveying component 20112 is arranged in parallel with the second conveying track 20122, the buffer structure 20111 may include a feed buffer component 20111a, a discharge buffer component 20111b and a lifting component 20111c, the feed buffer component 20111a and the discharge buffer component 20111b are arranged at intervals in the vertical direction, and the lifting component 20111c may be arranged between the feed buffer component 20111a and the discharge buffer component 20111b. The feeding buffer assembly 20111a can move up and down between the components 20111b, and the feeding buffer assembly 20111a can transport the plastic pallet loaded with the first material to the lifting assembly 20111c. At this time, the lifting assembly 20111c can dock with the conveying assembly 20112 and transfer the plastic pallet to the conveying assembly 20112. Under the action of the conveying assembly 20112, the plastic pallet carrying the first material is transported to the designated position. At this time, the first material is picked up by the feeding swing plate mechanism 2013 and transferred to the carrier 101 on the second conveying track 20122. After the transfer of the first material is completed, the empty plastic pallet flows back to the lifting assembly 20111c through the conveying assembly 20112, and the lifting assembly 20111c descends to dock with the unloading buffer assembly 20111b, and the empty plastic pallet is recovered by the unloading buffer assembly 20111b. The conveying assembly 20112 can be a structure with a transmission function, such as a track or a conveyor belt arranged parallel to the second conveying track 20122.

[0073] Optionally, the feed buffer component 20111a and the unload buffer component 20111b can be transmission structures such as conveyor belts and conveyor tracks. Taking the conveyor belt as an example, the tray loaded with the first material can move along the conveyor belt until it docks with the lifting component 20111c. In addition, the lifting component 20111c can include a linear module, a synchronous belt conveyor line, and a blocking cylinder. The silo loaded with materials can be lifted and lowered along the linear module, and the materials can be positioned at a preset position by the blocking cylinder to transmit the materials.

[0074] Optionally, the first conveying structure 20121 may also have the same structure as the cache structure 20111, and is used to convey the carrier 101 to the second conveying track 20122. Please refer to the above introduction for details, and no further details will be given here.

[0075] The loading and panning mechanism 2013 may include an XY linear module, a four-head ZR module, a visual positioning component, and a gripping structure. The gripping structure can take the first material out of the plastic tray relative to the XY linear module under the drive of the four-head ZR module, and accurately place the first material into the fixture through visual positioning and program control.

[0076] In addition, the first loading equipment 201 may include an appearance AOI component and a position AOI group, wherein the appearance AOI component can perform appearance inspection on the first material in the plastic pallet, identify and mark defective products with scratches, bumps, etc., and the position AOI component can detect the placement position of the first material in the fixture, and only when the position is correctly placed can it be transported to the next workstation.

[0077] In some embodiments, see Figure 7 The second loading device 202 may include a second conveying structure 2021 and a third conveying track 2022. The third conveying track 2022 is arranged through the second conveying structure 2021, and the third conveying track 2022 is connected to the first conveying track 20 of the assembly device 100, and is used to receive the products assembled by the assembly device 100. The second conveying structure 2021 is used to convey the tray carrying the second material 102 to the assembly device 100. Specifically, the second conveying structure 2021 is connected to the conveying channel 50 of the assembly device 100. When the second material 102 is loaded, the second material 102 can be conveyed to the conveying channel 50 through the second conveying structure 2021, and under the action of the conveying channel 50, the second material 102 is transported to the designated position for the laminating mechanism 33 to pick up. It can be understood that one end of the lower channel 52 of the transmission channel 50 is also connected to the second conveying structure 2021, and the second conveying structure 2021 can also reflux the empty pallet to complete the automatic loading and unloading of the second material 102, thereby greatly improving the degree of automation of loading and unloading, saving operation time and improving operation efficiency.

[0078] It can be understood that the function of the second conveying structure 2021 of the second loading device 202 is the same as that of the material loading mechanism 2011, both of which are to load the material to the designated position and recycle the empty pallet. Therefore, the second conveying structure 2021 of the second loading device 202 is roughly the same as the design of the cache structure 20111 of the material loading mechanism 2011, and may also include a cache structure 20111 and a conveying component 20112. The conveying component 20112 can be connected to the transmission channel 50. The cache structure 20111 can include a feed cache component 20111a, a unloading cache component 20111b and a lifting component 20111c. The feed cache component 20111a and the unloading cache component 20111b are arranged at intervals in the vertical direction. The lifting component 20111c can move up and down between the feed cache component 20111a and the unloading cache component 20111b, and the lifting component 20111c can be connected to the conveying component 20112. The feeding buffer component 20111a can transport the pallet with the second material 102 to the lifting component 20111c. At this time, the lifting component 20111c can be lowered and docked with the conveying component 20112, and the pallet with the second material 102 can be transported to the conveying component 20112. Under the action of the conveying component 20112, the plastic pallet carrying the second material 102 is transported to the designated position of the conveying channel 50, so that the laminating mechanism 33 of the assembly device 100 can pick up the second material 102 and assemble it with the first material. The empty pallet that has picked up the second material 102 can flow back to the conveying component 20112 through the lower channel 52 of the conveying channel 50, and then the lifting component 20111c that is docked can be lowered to dock with the unloading buffer component 20111b to realize the reflux of the empty pallet.

[0079] It should be noted that the composition of the second conveying structure 2021 is roughly the same as the structural composition of the material feeding mechanism 2011, but the specific extension length of the buffer structure 20111 will be different and can be adjusted according to the material transmission requirements.

[0080] Alternatively, see Figure 8 and Fig. 9The unloading device 203 may include a curing mechanism 2031, a product unloading mechanism 2032, a carrier unloading mechanism 2033 and a unloading plate mechanism 2034. The curing mechanism 2031 is arranged corresponding to the first conveying track 20 of the assembly equipment 100, and is used to cure the assembled product module. The product unloading mechanism 2032 and the carrier unloading mechanism 2033 are arranged opposite to each other. The product unloading mechanism 2032 is used for unloading the product modules that have been cured. The carrier unloading mechanism 2033 includes a fourth conveying track 20331 and a reflux component 20332. The fourth conveying track 20331 is used for conveying the carrier 101 carrying the product modules. The reflux component 20332 is used for refluxing the carrier 101. The unloading plate mechanism 2034 is arranged between the fourth conveying track 20331 and the carrier unloading mechanism 2033, and is used for placing the product modules in the carrier 101 on the fourth conveying track 20331 onto the carrier unloading mechanism 2033. By integrating the curing mechanism 2031 into the unloading equipment 203 and docking it with the first conveying track 20, the product modules conveyed via the first conveying track 20 directly flow to the curing mechanism 2031 for curing, thereby realizing the curing of the entire tray of product modules. There is no need to separately set up the curing mechanism 2031 outside the module production line 200, but the assembled product modules need to be transported to the curing mechanism 2031, thereby saving the intermediate transportation process and improving production efficiency.

[0081] In addition, through the product unloading mechanism 2032 and the reflux component 20332, the unloading of the product module and the recycling of the carrier 101 can be realized respectively, and the whole process is automated, which greatly improves the automation degree and efficiency of unloading.

[0082] It can be understood that when unloading the cured product module, it is necessary to load the empty pallet through the product unloading mechanism 2032 and transport the empty pallet to the designated location. After the product module is transferred to the empty pallet, the pallet carrying the product module is reflowed. It can be seen that the function of the product unloading mechanism 2032 is the same as that of the material loading mechanism 2011. The only difference is that the material loaded is a pallet carrying material or an empty pallet. Therefore, the structural composition of the product unloading mechanism 2032 can refer to the above introduction, and no further elaboration will be made here.

[0083] Optionally, the unloading equipment may also include an appearance AOI (Automated Optical Inspection) component and a concentricity AOI component. The appearance AOI component may include an XY linear module and a top-down vision component, which may perform a certain degree of appearance inspection on the product module on the carrier 101. The concentricity AOI component may include a top-down vision component, which may inspect the mounting concentricity of the product module from the bottom.

[0084] In addition, the unloading and swinging plate mechanism 2034 may include an XY linear module, a four-head ZR module, a visual positioning component, and a gripping structure. The gripping structure can take the product module out of the carrier relative to the XY linear module under the drive of the four-head ZR module, and accurately place the product module into the fixture through visual positioning and program control. The defective products marked by the AOI component inspection can be placed in the defective product tray.

[0085] It should be noted that the carriers or pallets on the conveying track or transmission channel of the module production line 200 in the embodiment of the present application are all positioned by jacking during operation. In this way, the operation process does not occupy the conveying flow channel, thereby ensuring the smoothness of the operation process.

[0086] The above is a detailed introduction to the assembly equipment and module production line disclosed in the embodiments of the present application. Specific examples are used in this article to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the assembly equipment and module production line of the present application and its core ideas. At the same time, for general technical personnel in this field, according to the ideas of the present application, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. An assembly device (100), characterized in that: include: abutment(10); A first conveying track (20), the first conveying track (20) being arranged on the base platform (10), the first conveying track being used to convey a carrier (101) carrying a first material, the first conveying track (20) being provided with a bonding station (20a); A bonding device (30), the bonding device (30) comprising a moving mechanism (31) and a glue transfer mechanism (32) and a bonding mechanism (33) connected to each other, the moving mechanism (31) being arranged on the base (10), the glue transfer mechanism (32) and the bonding mechanism (33) being both connected to the moving mechanism (31), the moving mechanism (31) being used to drive the glue transfer mechanism (32) and the bonding mechanism (33) to move relative to the base (10), the glue transfer mechanism (32) being used to perform a glue transfer operation on the first material on the carrier (101), and the bonding mechanism (33) being used to pick up a second material (102) and bonding the second material (102) to the first material to form a product module.

2. The assembly device (100) according to claim 1, characterized in that: The motion mechanism (31) comprises a driving structure (311), a guiding structure (312) and a mounting structure (313); the guiding structure (312) is arranged on the base (10); the guiding structure (312) extends along the direction of the first conveying track (20); the mounting structure (313) is slidably connected to the guiding structure (312); the output end of the driving structure (311) is connected to the mounting structure (313) for driving the mounting structure (313) to move along the guiding structure (312); the glue transfer mechanism (32) and the bonding mechanism (33) are both connected to the mounting structure (313).

3. The assembly device (100) according to claim 2, characterized in that: The mounting structure (313) is provided with a mounting seat (3131), and the mounting seat (3131) is movable relative to the mounting structure (313). The glue transfer mechanism (32) comprises a first lifting structure (321), an adjusting structure (322) and a glue head (323). The first lifting structure (321) is connected to the mounting seat (3131), the adjusting structure (322) is connected to the first lifting structure (321), and the glue head 323 is connected to the end of the adjusting structure (322). The glue head (323) is used to transfer the first material on the carrier (101), and the first lifting structure (321) is used to drive the adjusting structure (322) and the glue head (323) to move up and down. The bonding mechanism (33) includes a second lifting structure (331) and a picking structure (332), wherein the second lifting structure (331) is connected to the mounting seat (3131), and the picking structure (332) is connected to the second lifting structure (331), and the second lifting structure (331) drives the picking structure (332) to move up and down, and the picking structure (332) is configured to pick up the second material (102) and make the second material (102) bond with the first material, and a UV lamp (333) is provided on the periphery of the picking structure (332), and the UV lamp (333) is used to pre-cure the product module.

4. The assembly device (100) according to claim 2, characterized in that: The laminating device (30) further comprises a visual detection mechanism (34), wherein the visual detection mechanism (34) is arranged between the laminating mechanism (33) and the glue transfer mechanism (32), and the visual detection mechanism (34) is connected to the mounting structure (313); The visual inspection mechanism (34) is configured to position the second material (102) when the bonding mechanism (33) picks up the material, and the visual inspection mechanism (34) is also configured to perform appearance inspection on a product module formed after the second material (102) is bonded to the first material.

5. The assembly device (100) according to claim 1, characterized in that: The assembly equipment (100) further comprises a glue supply device (40), wherein the glue supply device (40) comprises a glue supply component (41) and a glue cleaning component (42), wherein the glue supply component (41) and the glue cleaning component (42) are arranged on one side of the first conveying track (20) along the extension direction of the first conveying track (20), wherein the glue supply component (41) is used to provide glue to the glue transfer mechanism (32), and the glue cleaning component (42) is used to clean the glue on the glue head (323) of the glue transfer mechanism (32).

6. The assembly device (100) according to claim 5, characterized in that: The assembly equipment (100) further comprises a conveying channel (50), wherein the conveying channel (50) is arranged at the other side of the first conveying track (20), and the extending direction of the conveying channel (50) is consistent with that of the first conveying track (20). A lifting mechanism is arranged in the conveying channel (50), and the conveying channel (50) comprises an upper channel (51) and a lower channel (52) which are arranged at intervals along the height direction of the base (10), wherein the upper channel (51) is used to convey a tray carrying the second material (102), and the lower channel (52) is used to reflow the tray, and the lifting mechanism can be lifted and connected between the upper channel (51) and the lower channel (52), and the lifting mechanism is configured to lift the tray carrying the second material (102) when the bonding mechanism (33) picks up the second material (102), and the lifting mechanism is further configured to lower the tray to the lower channel (52) after the second material (102) in the tray is picked up.

7. The assembly device (100) according to any one of claims 1 to 6, characterized in that: There are two laminating stations (20a), and the two laminating stations (20a) are arranged at intervals along the extension direction of the first conveying track (20). Each laminating station (20a) is correspondingly provided with a laminating device (30), one laminating device (30) is configured to complete the assembly of a part of the first material on the carrier (101), and the other laminating device (30) is configured to complete the assembly of another part of the first material on the carrier (101).

8. A module production line (200), characterized in that: The module production line (200) includes a first loading device (201), an assembly device (100) according to any one of claims 1 to 7, a second loading device (202) and an unloading device (203) which are arranged in sequence, the first loading device (201) being connected to a first conveying track (20) of the assembly device (100) and being used to load the first material onto a carrier (101) and to convey the carrier (101) carrying the first material to the first conveying track (20), the second loading device (202) being connected to the first conveying track (20), the second loading device (202) being used to load the second material (102) onto the assembly device (100), and the unloading device (203) being used to unload products assembled by the assembly device (100) and to reflow the carrier (101).

9. The module production line (200) according to claim 8, characterized in that: The first loading device (201) comprises a material loading mechanism (2011), a carrier loading mechanism (2012) and a loading swing plate mechanism (2013); the material loading mechanism (2011) and the carrier loading mechanism (2012) are arranged relative to each other in a direction perpendicular to the first conveying track (20); the carrier loading mechanism (2012) comprises a first conveying structure (20121) and a second conveying track (20122); the first conveying structure (20121) is arranged corresponding to the second conveying track (20122); the first conveying structure (20121) is used to load the carrier (101) onto the second conveying track (20122); A conveying track (20122), a loading station is provided on the second conveying track (20122), the second conveying track (20122) is docked with the first conveying track (20) to transport the carrier (101) to the assembly equipment (100), the material loading mechanism (2011) is used for loading the first material, and the loading plate mechanism (2013) is provided between the material loading mechanism (2011) and the carrier loading mechanism (2012) and is used for placing the first material on the material loading mechanism (2011) onto the carrier (101) on the second conveying track (20122); The second loading device (202) includes a second conveying structure (2021) and a third conveying track (2022); the third conveying track (2022) is arranged to pass through the second conveying structure (2021), and the third conveying track (2022) is connected to the first conveying track (20) of the assembly device (100) for receiving the products assembled by the assembly device (100); the second conveying structure (2021) is used to convey a pallet carrying the second material (102) to the assembly device (100).

10. The module production line (200) according to claim 9, characterized in that: There are multiple assembly devices (100), and the multiple assembly devices (100) are arranged at intervals along the extension direction of the first conveying track (20), and a second loading device (202) is arranged between two adjacent assembly devices (100). The two ends of the third conveying track (2022) of the second loading device (202) are respectively connected to the first conveying tracks (20) of the two adjacent assembly devices (100), and at least a part of the second conveying structure (2021) is connected to the transmission channel (50) of the assembly device (100) to respectively transport the second material (102) to the two adjacent assembly devices (100).