Water cooling device based on semiconductor chilling plate dehumidifier

Abstract

The utility model relates to the technical field of semiconductor chilling plates, and discloses a water cooling device based on a semiconductor chilling plate dehumidifier, which comprises a chilling plate, a radiating fin is arranged on one side of the chilling plate, radiating fans are arranged on two sides of the radiating fin, a cold guide block is arranged at the top of the chilling plate, and a water inlet is formed in the top of the chilling plate. And a collecting assembly for collecting water condensed by the cold conduction block is arranged on one side of the heat dissipation fins. Through the arrangement of the collecting assembly and the water cooling assembly, a refrigerating sheet is matched with a cold guide block to condense moisture in air into water drops, the collecting assembly collects the water drops, and after the water drops are collected to a certain degree, a control terminal enables the water cooling assembly to spray condensed water on a water absorption sponge block; the water absorption sponge block can evenly disperse condensate water to the heat dissipation fins to assist heat dissipation, and due to the fact that the water locking performance of the water absorption sponge block is low, the condensate water in the water absorption sponge block can directly flow to the heat dissipation fins and then drop to the outside of the device through the heat dissipation fins.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor refrigeration sheets, in particular to a water cooling device based on a semiconductor refrigeration sheet dehumidifier. Background Art

[0002] At present, the principle of semiconductor refrigerators is that when direct current passes through a galvanic couple formed by two different semiconductor materials in series, heat can be absorbed and released at both ends of the galvanic couple respectively, thereby realizing the refrigeration function. When the semiconductor refrigerator is cooling, it will condense the moisture in the air. The condensed water droplets will adhere to the cooling block and then drip along the fins of the cooling block to the outside of the equipment, thus achieving the required cooling and air dehumidification.

[0003] A semiconductor refrigeration plate is disclosed in a Chinese utility model patent with announcement number CN218645803U. Although the above-mentioned prior art strengthens the structural strength between the conductive plates on the semiconductor refrigeration plate body and improves the impact resistance and heat dissipation effect of the conductive plates on the semiconductor refrigeration plate body, the moisture in the air is condensed by the refrigeration plate and the cooling block. After condensing into water droplets, it will be directly discharged from the equipment through the cooling block. In this way, the condensed water will be discharged from the equipment without any additional function, which is a waste of water resources. Therefore, it is necessary to design a water cooling device for a semiconductor refrigeration plate dehumidifier that can utilize the condensed water to save water resources. Utility Model Content

[0004] In order to solve the technical problem that directly draining away the water condensed from the refrigeration plate and the cooling block will cause a waste of water resources, the utility model provides a water cooling device based on a semiconductor refrigeration plate dehumidifier.

[0005] The utility model is implemented by the following technical scheme: a water cooling device based on a semiconductor refrigeration plate dehumidifier, comprising a refrigeration plate, a heat dissipation fin is arranged on one side of the refrigeration plate, heat dissipation fans are installed on both sides of the heat dissipation fin, a cooling block is arranged on the top of the refrigeration plate, a collecting component for collecting water condensed from the cooling block is arranged on one side of the heat dissipation fin, a water cooling component for spraying the collected water on the heat dissipation fins for water cooling is arranged on one side of the collecting component, and the collecting component comprises a collecting box fixedly mounted on one side of two heat dissipation fans and a miniature water level sensor fixedly mounted on the inner wall of the collecting box.

[0006] Through the above technical solution, the refrigeration plate cooperates with the cooling block to generate condensed water, the collection component collects the condensed water, and then the water cooling component pours the condensed water onto the cooling fins to assist in heat dissipation.

[0007] As a further improvement of the above scheme, the water cooling assembly includes a micro water pump fixedly installed on one side of the collection box, a water inlet pipe fixedly connected to the water inlet end of the micro water pump, a water outlet pipe fixedly connected to the water outlet end of the micro water pump, a sprinkler pipe fixedly connected to one end of the water outlet pipe, and a plurality of sprinkler heads installed on one side of the sprinkler pipe.

[0008] Through the above technical solution, the condensed water will be transported to the sprinkler pipe by the micro water pump, and then sprinkled on the water-absorbing sponge block by the sprinkler head. Finally, the condensed water will be evenly dispersed to the cooling fins by the water-absorbing sponge block to perform water cooling on the cooling fins.

[0009] As a further improvement of the above solution, the cooling block is provided with a plurality of NTC temperature probes for monitoring the temperature of the refrigeration plate and the cooling block.

[0010] Through the above technical solution, the NTC temperature probe will monitor the temperature of the refrigeration plate and the cooling block to avoid frost due to low temperature.

[0011] As a further improvement of the above solution, a control terminal is provided on one side of the heat sink fin, and the micro water level sensor, micro water pump, NTC temperature probe and cooling plate are all connected to the control terminal.

[0012] Through the above technical solution, the control terminal can monitor the components in the device.

[0013] As a further improvement of the above solution, a water-absorbing sponge block is provided on one side of the heat dissipation fin.

[0014] Through the above technical solution, the absorbent sponge block will evenly spread the condensed water on the heat sink fins, and the water-locking property of the absorbent sponge block is not strong, and it also prevents water droplets from splashing on the heat sink fins.

[0015] As a further improvement of the above solution, a plurality of support plates are fixedly installed on both sides of the sprinkler pipe, each of the support plates is arranged in an "L" shape, and one end of each support plate is fixedly installed on one side of an adjacent cooling fan.

[0016] Through the above technical solution, the support plate will support the sprinkler pipe, making it convenient to dissipate heat from the heat sink fins.

[0017] Compared with the prior art, the beneficial effects of the present invention are:

[0018] The utility model sets a collection component and a water cooling component. The refrigeration plate cooperates with the cooling block to condense the moisture in the air into water droplets, and the collection component collects the water droplets. When a certain degree of collection is reached, the control terminal will let the water cooling component sprinkle the condensed water on the water-absorbing sponge block, and the water-absorbing sponge block will evenly spread the condensed water on the cooling fins to assist in heat dissipation. Since the water-locking property of the water-absorbing sponge block is relatively low, the condensed water inside the water-absorbing sponge block will directly flow to the cooling fins, and then drip from the cooling fins to the outside of the equipment. This arrangement completes the utilization of the condensed water and avoids the waste of water resources caused by the direct discharge of the condensed water from the equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the three-dimensional structure of the utility model;

[0020] Figure 2 It is a schematic diagram of the structure of the utility model having a collection component;

[0021] Figure 3 It is a schematic diagram of the structure of the utility model with a water cooling component.

[0022] Description of main symbols:

[0023] 1. Refrigeration plate; 2. Heat dissipation fins; 3. Cooling fan; 4. Cooling block; 501. Collection box; 502. Mini water level sensor; 601. Mini water pump; 602. Water inlet pipe; 603. Water outlet pipe; 604. Sprinkler pipe; 605. Sprinkler head; 7. NTC temperature probe; 8. Control terminal; 9. Water-absorbing sponge block; 10. Support plate. DETAILED DESCRIPTION

[0024] The present invention is further described below in conjunction with the accompanying drawings and specific implementation methods. It should be noted that, under the premise of no conflict, the various embodiments or technical features described below can be arbitrarily combined to form a new embodiment.

[0025] Please combine Figure 1-Figure 3 , a water cooling device based on a semiconductor refrigeration plate dehumidifier of the present embodiment includes a refrigeration plate 1, a heat dissipation fin 2 is provided on one side of the refrigeration plate 1, and cooling fans 3 are installed on both sides of the cooling fin 2. A cooling block 4 is provided on the top of the refrigeration plate 1, and a collecting component for collecting water condensed from the cooling block 4 is provided on one side of the cooling fin 2. A water cooling component for pouring the collected water on the cooling fin 2 for water cooling and heat dissipation is provided on one side of the collecting component. The collecting component includes a collecting box 501 fixedly installed on one side of two cooling fans 3 and a miniature water level sensor 502 fixedly installed on the inner wall of the collecting box 501. The refrigeration plate 1 cooperates with the cooling block 4 to generate condensed water, and the collecting component collects the condensed water, and then the water cooling component pours the condensed water on the cooling fin 2 to assist it in heat dissipation.

[0026] Combination Figure 1-Figure 3 The water cooling component includes a micro water pump 601 fixedly installed on one side of the collection box 501, a water inlet pipe 602 fixedly connected to the water inlet end of the micro water pump 601, a water outlet pipe 603 fixedly connected to the water outlet end of the micro water pump 601, a sprinkler pipe 604 fixedly connected to one end of the water outlet pipe 603, and a plurality of sprinkler heads 605 installed on one side of the sprinkler pipe 604. The condensed water will be transported to the sprinkler pipe 604 by the micro water pump 601, and then sprinkled on the water-absorbing sponge block 9 by the sprinkler head 605. Finally, the condensed water will be evenly dispersed to the heat sink fins 2 by the water-absorbing sponges 9 to cool the heat sink fins 2 by water.

[0027] Combination Figure 1-Figure 3 A plurality of NTC temperature probes 7 for monitoring the temperature of the refrigeration plate 1 and the refrigeration block 4 are provided on the cooling block 4. A control terminal 8 is provided on one side of the heat sink 2. The micro water level sensor 502, the micro water pump 601, the NTC temperature probe 7 and the refrigeration plate 1 are all connected to the control terminal 8. The NTC temperature probe 7 will monitor the temperature of the refrigeration plate 1 and the refrigeration block 4 to avoid frost due to low temperature. The control terminal 8 will monitor the components in the device.

[0028] Combination Figure 1-Figure 3 A water-absorbing sponge block 9 is provided on one side of the heat dissipation fin 2, and a plurality of support plates 10 are fixedly installed on both sides of the sprinkler pipe 604. Each support plate 10 is arranged in an "L" shape, and one end of each support plate 10 is fixedly installed on one side of an adjacent heat dissipation fan 3. The water-absorbing sponge block 9 will evenly spread the condensed water on the heat dissipation fin 2, and the water-absorbing sponge block 9 has a weak water-locking property, and also prevents water droplets from splashing on the heat dissipation fin 2.

[0029] The implementation principle of a water cooling device based on a semiconductor refrigeration plate dehumidifier in the embodiment of the present application is as follows: when the refrigeration plate 1 and the cooling block 4 cooperate to dehumidify, the condensed water on the cooling block 4 will drip into the collection box 501. When the water accumulates to a certain level, the micro water level sensor 502 will sense it, and the control terminal 8 will start the micro water pump 601, so that the water inside the collection box 501 will be transported to the inside of the sprinkler pipe 604 and sprinkled on the water-absorbing sponge block 9 by the sprinkler head 605. The water-absorbing sponge block 9 will evenly spread the condensed water on the heat dissipation fins 2, and the water-locking property of the water-absorbing sponge block 9 is not strong, so the water absorption The condensed water on the water sponge block 9 will flow onto the heat sink fins 2, slide on the heat sink fins 2 and drip to the outside of the device, thereby water-cooling the heat sink fins 2. This arrangement can also prevent water droplets on the heat sink fins 2 from splashing onto the circuit. This arrangement is because the evaporation rate of the condensed water is much slower than the condensation rate of water in the air, so the water in the condensed water will not return to the air, avoiding useless dehumidification operations. In this way, the condensed water can also be utilized to avoid wasting water resources by directly discharging the equipment, and the user can connect to the control terminal 8 via a mobile phone or computer to monitor the dehumidifier in real time.

[0030] The above-mentioned implementation modes are only preferred implementation modes of the present invention, and cannot be used to limit the protection scope of the present invention. Any non-substantial changes and substitutions made by technicians in this field on the basis of the present invention shall fall within the scope of protection required by the present invention.

Claims

1. A water cooling device based on a semiconductor refrigeration plate dehumidifier, comprising a refrigeration plate (1), a heat dissipation fin (2) is provided on one side of the refrigeration plate (1), a heat dissipation fan (3) is installed on both sides of the heat dissipation fin (2), and a cooling block (4) is provided on the top of the refrigeration plate (1), characterized in that: A collecting component for collecting water condensed from the cooling block (4) is provided on one side of the heat dissipation fin (2), and a water cooling component for spraying the collected water onto the heat dissipation fin (2) for water cooling is provided on one side of the collection component. The collection component comprises a collection box (501) fixedly mounted on one side of two cooling fans (3) and a micro water level sensor (502) fixedly mounted on the inner wall of the collection box (501).

2. A water cooling device based on a semiconductor refrigeration plate dehumidifier as claimed in claim 1, characterized in that: The water cooling assembly comprises a micro water pump (601) fixedly mounted on one side of the collection box (501), a water inlet pipe (602) fixedly connected to the water inlet end of the micro water pump (601), a water outlet pipe (603) fixedly connected to the water outlet end of the micro water pump (601), a water sprinkler pipe (604) fixedly connected to one end of the water outlet pipe (603), and a plurality of water sprinkler heads (605) mounted on one side of the water sprinkler pipe (604).

3. A water cooling device based on a semiconductor refrigeration plate dehumidifier as claimed in claim 2, characterized in that: The cooling block (4) is provided with a plurality of NTC temperature probes (7) for monitoring the temperature of the refrigeration plate (1) and the cooling block (4).

4. A water cooling device based on a semiconductor refrigeration plate dehumidifier as claimed in claim 3, characterized in that: A control terminal (8) is provided on one side of the heat dissipation fin (2), and the micro water level sensor (502), the micro water pump (601), the NTC temperature probe (7) and the refrigeration plate (1) are all connected to the control terminal (8).

5. A water cooling device based on a semiconductor refrigeration plate dehumidifier as claimed in claim 1, characterized in that: A water-absorbing sponge block (9) is provided on one side of the heat dissipation fin (2).

6. A water cooling device based on a semiconductor refrigeration plate dehumidifier as claimed in claim 2, characterized in that: A plurality of support plates (10) are fixedly mounted on both sides of the water sprinkler pipe (604); each of the support plates (10) is arranged in an "L" shape; one end of each of the support plates (10) is fixedly mounted on one side of an adjacent cooling fan (3).

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