Efficient refrigeration module

Abstract

The utility model relates to an efficient refrigeration module which comprises a machine box, an upper cover, a semiconductor refrigeration sheet, an aluminum alloy cooling fin, a red copper heat exchange water tank, a temperature sensor and a temperature switch, and the semiconductor refrigeration sheet, the aluminum alloy cooling fin and the red copper heat exchange water tank are arranged in the machine box. The red copper heat exchange water tank is contacted and fixed on the heating surface of the semiconductor chilling plate; the temperature sensor comprises a first sensor and a second sensor; the temperature switch is installed at the bottom of the machine box, the signal input end of the temperature switch is connected with the second sensor, and the control end of the temperature switch is connected into a single-path series loop of the semiconductor chilling plates. According to the efficient refrigeration module, the temperature control switch and the temperature sensor are additionally arranged to rapidly respond to the refrigeration effect, layout and assembly are conducted based on the efficient semiconductor refrigeration piece, the aluminum cooling fin, the red copper heat exchange water tank and other basic structures, the design of efficient cold conduction of the heat insulation structure, rapid condensate water drainage and the like is matched, efficient cold conduction and heat dissipation are achieved, and the service life of the module is prolonged. And the refrigeration effect and the cold conduction efficiency are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of biochemical instruments, in particular to a high-efficiency refrigeration module applied to a reagent disk of a full-automatic chemiluminescence immunoassay analyzer. Background Art

[0002] To ensure the activity of diagnostic reagents, the fully automatic chemiluminescence immunoassay analyzer must provide a stable environment of 2°C-8°C for the reagents per unit time, so a refrigeration system is required to cool the reagent tray containing the reagents and maintain the target temperature. However, due to the difference in temperature of the environment itself in different seasons, the existing refrigeration system will have unstable cooling effect and cooling efficiency due to different seasonal ambient temperatures. Utility Model Content

[0003] The technical problem to be solved by the utility model is: to overcome the defects of the existing refrigeration module applied to the reagent disk of the fully automatic chemiluminescence immunoassay instrument, that is, the unstable refrigeration effect and cooling efficiency due to the different seasonal ambient temperatures, and to provide a high-efficiency refrigeration module, which quickly responds to the refrigeration effect by adding a temperature control switch and a temperature sensor, and is laid out and assembled based on basic structures such as high-efficiency semiconductor refrigeration sheets, aluminum heat sinks, and copper water exchange tanks, and is equipped with designs such as high-efficiency cooling conduction with an insulating structure and quick discharge of condensed water, to achieve efficient cooling and heat dissipation, thereby improving the refrigeration effect and cooling efficiency.

[0004] The high-efficiency refrigeration module includes a machine box and an upper cover, a refrigeration mechanism, a cooling mechanism, and a heat dissipation mechanism arranged in the machine box, and also includes a temperature sensor and a temperature switch, wherein the refrigeration mechanism includes a plurality of single-channel series-connected semiconductor refrigeration plates, the cooling mechanism adopts an aluminum alloy heat sink, and the heat dissipation mechanism adopts a copper heat exchanger tank; the contact of the aluminum alloy heat sink is fixed on the cooling surface of the semiconductor refrigeration plate, and the contact of the copper heat exchanger tank is fixed on the heating surface of the semiconductor refrigeration plate; the temperature sensor includes a first sensor installed on the aluminum alloy heat sink and a second sensor installed on the copper heat exchanger tank; the temperature switch is installed at the bottom of the machine box, the signal input end of the temperature switch is connected to the second sensor, and the control end of the temperature switch is connected to the single-channel series circuit of the semiconductor refrigeration plate.

[0005] Furthermore, a heat-insulating interlayer cavity is provided inside the box, and the heat-insulating interlayer cavity is filled with polyurethane filler.

[0006] Furthermore, a water inlet interface and a water outlet interface are provided at the bottom of the copper water exchange water tank, and the water inlet interface and the water outlet interface pass through the bottom of the machine box.

[0007] Furthermore, a drainage pipe is provided in the machine box, and the drainage pipe extends from the upper surface of the substrate of the aluminum alloy heat sink downward to the bottom of the machine box and passes out.

[0008] Furthermore, the upper cover is provided with a fan hole for installing a fixed fan and a circulation hole for air intake.

[0009] Specifically, the semiconductor refrigeration chip adopts six TEC1-12708AC semiconductor refrigeration chips with two series and three parallels; the temperature sensor adopts two CWF4B-103F3950 plug-in temperature sensors; and the temperature switch adopts three SEKI_ST-22_70 temperature switches.

[0010] Specifically, the aluminum alloy heat sink adopts a 6063 aluminum alloy radiator with integrated substrate and fins, and the copper water exchange water tank adopts a T2 copper wall box.

[0011] Specifically, the machine box adopts an oxidized aluminum sheet metal box body; the upper cover adopts an EPS polystyrene foam cover plate.

[0012] The utility model discloses a high-efficiency refrigeration module, which overcomes the defects of the existing refrigeration module used on the reagent disk of the fully automatic chemiluminescence immunoassay instrument, that is, the refrigeration effect and the cooling efficiency are unstable due to the different seasonal ambient temperatures. The module quickly responds to the refrigeration effect by adding a temperature control switch and a temperature sensor, and is laid out and assembled based on basic structures such as high-efficiency semiconductor refrigeration sheets, aluminum heat sinks, and copper water exchange tanks. It is equipped with designs such as high-efficiency cooling conduction with an insulating structure and fast condensed water discharge, so as to achieve efficient cooling conduction and heat dissipation, thereby improving the refrigeration effect and cooling efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] The following is a further description of a high-efficiency refrigeration module of the utility model in conjunction with the accompanying drawings:

[0014] Figure 1 This is a top view of the three-dimensional structure of the high-efficiency refrigeration module;

[0015] Figure 2 This is a schematic diagram of the three-dimensional structure of the high-efficiency refrigeration module when viewed from above;

[0016] Figure 3 This is a schematic diagram of the planar structure of the high-efficiency refrigeration module when viewed from above;

[0017] Figure 4 yes Figure 3 AA section view.

[0018] In the figure:

[0019] 1-machine box, 2-upper cover, 3-refrigeration mechanism, 4-cooling mechanism, 5-heat dissipation mechanism, 6-temperature sensor, 7-temperature switch;

[0020] 11-polyurethane filler, 12-drainage pipe; 21-fan hole, 22-circulation hole; 51-water inlet interface, 52-water outlet interface; 61-first sensor, 62-second sensor. DETAILED DESCRIPTION

[0021] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0022] In the description of the present invention, it should be understood that the terms "left", "right", "front", "back", "top", "bottom", "inside", "outside", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the present invention.

[0023] The technical solution of the utility model is further described below with specific embodiments, but the protection scope of the utility model is not limited to the following embodiments.

[0024] Implementation method 1: Figures 1 to 4As shown, the high-efficiency refrigeration module includes a machine box 1 and an upper cover 2, a refrigeration mechanism 3, a cooling mechanism 4, and a heat dissipation mechanism 5 arranged in the machine box 1, and also includes a temperature sensor 6 and a temperature switch 7, wherein the refrigeration mechanism 3 includes a plurality of semiconductor refrigeration sheets connected in series in a single circuit, the cooling mechanism 4 uses an aluminum alloy heat sink, and the heat dissipation mechanism 5 uses a copper heat exchanger tank; the contact of the aluminum alloy heat sink is fixed on the cooling surface of the semiconductor refrigeration sheet, and the contact of the copper heat exchanger tank is fixed on the heating surface of the semiconductor refrigeration sheet; the temperature sensor 6 includes a first sensor 61 installed on the aluminum alloy heat sink and a second sensor 62 installed on the copper heat exchanger tank; the temperature switch 7 is installed at the bottom of the machine box 1, the signal input end of the temperature switch 7 is connected to the second sensor 62, and the control end of the temperature switch 7 is connected to the single-circuit series circuit of the semiconductor refrigeration sheet. The upper cover 2 is provided with a fan hole 21 for installing a fixed fan and a circulation hole 22 for air intake. After power is turned on, the refrigeration circuit board converts the external power supply into a constant voltage DC to drive the semiconductor refrigeration board for refrigeration. The aluminum alloy heat sink conducts and diffuses the cold generated by the semiconductor refrigeration board's cold surface outward, and the copper heat exchanger heat tank exchanges heat with the heating surface through the inlet and outlet water circulation through the box wall; the smaller semiconductor refrigeration plate is used as the cooling source, and the cooling surface adopts an aluminum heat sink with a faster heat dissipation effect to dissipate the cold, and the heat dissipation surface adopts a copper material water tank with fast heat absorption to dissipate the heat, and cooperates with the internal water circulation for heat exchange to improve the cooling effect and heat dissipation capacity. The first temperature sensor is used to collect the refrigeration signal at a regular time and send it to the external display components such as the LCD screen. When the second temperature sensor detects that the temperature of the heat dissipation water tank exceeds the preset temperature value, the temperature switch disconnects the power supply of the semiconductor refrigeration plate to protect the refrigeration mechanism. When the temperature drops, power is supplied again for refrigeration, thereby protecting the safe operation of the whole machine.

[0025] Embodiment 2: This high-efficiency refrigeration module The inner part of the housing 1 is provided with an insulating interlayer cavity, and the insulating interlayer cavity is filled with a polyurethane filler 11 to reduce the diffusion of the generated cold through the walls around and reduce the refrigeration efficiency.

[0026] Embodiment 3: This high-efficiency refrigeration module The copper heat exchange water tank is provided with a water inlet interface 51 and a water outlet interface 52 at the bottom, and the water inlet interface 51 and the water outlet interface 52 pass through the bottom of the machine box 1. It is used for the heat exchange water to circulate in and out. The machine box 1 is provided with a drainage pipe 12, which extends from the upper surface of the substrate of the aluminum alloy heat sink downward to the bottom of the machine box 1. It is used to remove condensed water and keep the system clean.

[0027] Implementation 4: The semiconductor refrigeration plate of this high-efficiency refrigeration module adopts six TEC1-12708AC semiconductor refrigeration plates with two series and three parallels; the temperature sensor 6 adopts two CWF4B-103F3950 plug-in temperature sensors; the temperature switch 7 adopts three SEKI_ST-22_70 temperature switches. The aluminum alloy heat sink adopts a 6063 aluminum alloy radiator with integrated substrate fins, and the copper heat exchange water tank adopts a T2 copper wall box. The machine box 1 adopts an aluminum oxidized sheet metal box; the upper cover 2 adopts an EPS polystyrene foam cover.

[0028] When in use: install a fan on the upper cover above the cooling mechanism, and install the reagent tray of the high-efficiency chemiluminescent immunoassay analyzer above the fan. When the fan is turned on, a circulating airflow is formed, and cold air enters the reagent tray above the refrigeration box. After 7-8 minutes, the system can be cooled to 2-8℃. The generated water vapor is condensed and discharged through the drainage channel under the refrigeration box, keeping the refrigeration system and the reagent tray clean and pollution-free.

[0029] This high-efficiency refrigeration module overcomes the defects of the existing refrigeration modules used on the reagent disk of the fully automatic chemiluminescence immunoassay analyzer, which have unstable refrigeration effect and cooling efficiency due to different seasonal ambient temperatures. It quickly responds to the refrigeration effect by adding temperature control switches and temperature sensors, and is laid out and assembled based on basic structures such as high-efficiency semiconductor refrigeration plates, aluminum heat sinks, and copper water exchange tanks. It is equipped with designs such as high-efficiency cooling conduction with an insulating structure and quick discharge of condensed water to achieve efficient cooling and heat dissipation, thereby improving the refrigeration effect and cooling efficiency.

[0030] The above description shows the main features, basic principles, and advantages of the utility model. For those skilled in the art, it is obvious that the utility model is not limited to the details of the above exemplary embodiments or embodiments, and the utility model can be implemented in other specific forms without departing from the spirit or basic features of the utility model. Therefore, the above embodiments or embodiments should be regarded as exemplary and non-restrictive. The scope of the utility model is defined by the attached claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims are included in the utility model. Any figure mark in the claims should not be regarded as limiting the claims involved.

[0031] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A high-efficiency refrigeration module, characterized by: The invention comprises a machine box (1) and an upper cover (2), a refrigeration mechanism (3), a cooling mechanism (4), and a heat dissipation mechanism (5) arranged in the machine box (1), and further comprises a temperature sensor (6) and a temperature switch (7), wherein: The refrigeration mechanism (3) comprises a plurality of semiconductor refrigeration sheets connected in series in a single circuit, the cooling mechanism (4) adopts an aluminum alloy heat sink, and the heat dissipation mechanism (5) adopts a copper heat exchanger tank; the aluminum alloy heat sink is fixed to the cooling surface of the semiconductor refrigeration sheet, and the copper heat exchanger tank is fixed to the heating surface of the semiconductor refrigeration sheet; The temperature sensor (6) comprises a first sensor (61) mounted on an aluminum alloy heat sink and a second sensor (62) mounted on a copper water exchange tank; the temperature switch (7) is mounted on the bottom of the machine box (1), the signal input end of the temperature switch (7) is connected to the second sensor (62), and the control end of the temperature switch (7) is connected to the single-channel series circuit of the semiconductor refrigeration plate.

2. The high-efficiency refrigeration module according to claim 1 is characterized in that: The interior of the machine box (1) is provided with a heat-insulating interlayer cavity, and the heat-insulating interlayer cavity is filled with a polyurethane filler (11).

3. The high-efficiency refrigeration module according to claim 2 is characterized in that: A water inlet interface (51) and a water outlet interface (52) are provided at the bottom of the copper water exchange water tank, and the water inlet interface (51) and the water outlet interface (52) pass through the bottom of the machine box (1).

4. The high-efficiency refrigeration module according to claim 3 is characterized in that: A drainage pipe (12) is provided in the machine box (1), and the drainage pipe (12) extends from the upper surface of the base plate of the aluminum alloy heat sink downward to the bottom of the machine box (1) and passes out.

5. The high-efficiency refrigeration module according to claim 4 is characterized in that: The upper cover (2) is provided with a fan hole (21) for installing a fixed fan and a circulation hole (22) for air intake.

6. The high-efficiency refrigeration module according to claim 5 is characterized in that: The semiconductor refrigeration sheet adopts six TEC1-12708AC semiconductor refrigeration sheets in two series and three parallel configurations; the temperature sensor (6) adopts two CWF4B-103F3950 plug-in temperature sensors; and the temperature switch (7) adopts three SEKI_ST-22_70 temperature switches.

7. The high-efficiency refrigeration module according to claim 6 is characterized in that: The aluminum alloy heat sink adopts a 6063 aluminum alloy radiator with integrated base plate and fins, and the copper water exchange water tank adopts a T2 copper wall box.

8. The high-efficiency refrigeration module according to claim 7 is characterized in that: The machine box (1) adopts an oxidized aluminum sheet metal box body; the upper cover (2) adopts an EPS polystyrene foam cover plate.

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