Cooling device for refractory material processing

Abstract

The utility model discloses a cooling device for refractory material processing. The cooling device comprises a bracket and a turnover mechanism, the upper surface of the support is fixedly connected with a cooling bin, the upper surface of the cooling bin is fixedly connected with evenly-distributed water pipes, evenly-distributed water conveying pipes are arranged at the bottom ends of the water pipes, the bottom ends of the water conveying pipes extend into the cooling bin, and the bottom ends of the water conveying pipes are fixedly connected with sprayers. The turnover mechanism comprises a rotating shaft, rubber strips and a placement plate, the rotating shaft is rotationally connected between the front inner wall and the rear inner wall of the middle of the cooling bin, the outer surface of the rotating shaft is fixedly connected with the placement plate, and the rubber strips which are evenly distributed are arranged on the upper surface of the placement plate. Therefore, non-uniform shrinkage caused by local temperature difference is reduced, cracks or deformation of the material in the cooling process can be avoided, and the workload is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of refractory material processing, in particular to a cooling device for refractory material processing. Background Art

[0002] Refractory materials are usually used in high temperature environments, such as furnaces, high temperature processing equipment, etc. In these high temperature environments, the materials are easily affected by high temperatures and lose their performance. The cooling device can effectively reduce the temperature of the refractory materials, protect their physical and chemical properties under high temperature conditions, and extend their service life;

[0003] The cooling device of traditional refractory processing is transported by electric conveyor belt, and then air or water is sprayed on the surface of refractory material by fan or spray device to accelerate heat dissipation and cooling;

[0004] The traditional cooling device for refractory material processing has the following problems: since the traditional cooling device for refractory material processing can only cool one side of the refractory material, uneven temperature distribution on the surface of the refractory material is prone to occur, resulting in some areas being cooled more while other areas may be too hot, which may cause uneven shrinkage or cracks in the material. For this reason, we propose a cooling device for refractory material processing. Utility Model Content

[0005] The technical problem to be solved by the utility model is to overcome the existing defects and provide a cooling device for refractory material processing, which can ensure that the entire surface is evenly cooled, thereby reducing the uneven shrinkage caused by local temperature differences, and can effectively solve the problems in the background technology.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a cooling device for refractory material processing, comprising a bracket and a turnover mechanism;

[0007] Bracket: The upper surface of the bracket is fixedly connected with a cooling bin, the upper surface of the cooling bin is fixedly connected with evenly distributed water pipes, the bottom ends of the water pipes are provided with evenly distributed water delivery pipes, the bottom ends of the water delivery pipes extend to the interior of the cooling bin, and the bottom ends of the water delivery pipes are fixedly connected with nozzles;

[0008] Flipping mechanism: It includes a rotating shaft, a rubber strip and a placement plate. The rotating shaft is rotatably connected between the front and rear inner walls in the middle of the cooling bin. The outer surface of the rotating shaft is fixedly connected to the placement plate. The upper surface of the placement plate is provided with evenly distributed rubber strips, which can ensure that the entire surface is evenly cooled, thereby reducing uneven shrinkage caused by local temperature differences, helping to avoid cracks or deformation of the material during the cooling process and reducing workload.

[0009] Furthermore, it also includes a single-chip microcomputer, which is arranged at the right end of the front side of the cooling bin, and the input end of the single-chip microcomputer is electrically connected to an external power supply to facilitate the regulation of the operation of various electrical appliances.

[0010] Furthermore, electric conveyor belts are provided at the openings at the left and right ends of the cooling bin, and the input end of the electric conveyor belt is electrically connected to the output end of the single-chip microcomputer to transport the refractory material.

[0011] Furthermore, it also includes an infrared sensor, which is arranged on the rear inner wall of the cooling bin. The infrared sensor is bidirectionally electrically connected to the single-chip microcomputer to avoid congestion or collision.

[0012] Furthermore, the flipping mechanism also includes a gear, a guide groove and a rack plate. The guide groove is opened on the front bottom wall of the cooling bin, and the inner wall of the guide groove is slidably connected with the rack plate. The gear is fixedly sleeved on the front end of the rotating shaft, and the gear is meshingly connected with the rack plate, so as to realize high-precision transmission.

[0013] Furthermore, the flipping mechanism also includes an electric push rod, which is arranged on the front bottom wall of the cooling bin, the telescopic end of the electric push rod is fixedly connected to the left side of the rack plate, and the input end of the electric push rod is electrically connected to the output end of the single-chip microcomputer to drive the flipping mechanism to operate.

[0014] Furthermore, it also includes a water pump, which is arranged at the upper end of the rear side of the cooling bin. The water pump and the top of the outer surface of the water pipe are connected by a hose. The input end of the water pump is electrically connected to the output end of the single-chip microcomputer to facilitate cooling of the refractory material.

[0015] Compared with the prior art, the beneficial effects of the utility model are: the cooling device for refractory material processing has the following advantages:

[0016] The electric conveyor belt continues to convey until the first refractory material is conveyed to the middle of the cooling bin, and then the refractory material is conveyed to the upper surface of the placement plate. At the same time, the infrared sensor is controlled by the single-chip microcomputer. When the infrared sensor detects that an object is parked on the upper surface of the placement plate, it will generate a pulse signal and transmit the signal to the connected single-chip microcomputer. The single-chip microcomputer makes a judgment and controls the electric conveyor belt on the left to stop running, ensuring that the objects move in an orderly manner on the conveyor belt to avoid congestion or collision. Then the single-chip microcomputer controls the operation of the electric push rod. The telescopic end of the electric push rod pushes the rack plate to move to the right by sliding on the inner wall of the guide chute. The rack plate meshes and rotates with the gear, and the gear drives the rotating shaft to rotate. The rotating shaft drives the placement plate to rotate a certain angle, turning the refractory material over and falling on the electric conveyor belt on the right. Then the single-chip microcomputer controls the operation of the electric conveyor belt on the right, and the electric conveyor belt on the right transports the cooled refractory material to the outside. By flipping the refractory material, it can be ensured that the entire surface is evenly cooled, thereby reducing the uneven shrinkage caused by local temperature differences, helping to avoid cracks or deformation of the material during the cooling process and reducing workload. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the structure of the utility model;

[0018] Figure 2 It is a schematic diagram of the structure of the utility model in a front side section;

[0019] Figure 3 It is a schematic diagram of the structure of the utility model enlarged at A;

[0020] Figure 4 It is a partial cross-sectional structural schematic diagram of the turning mechanism of the utility model;

[0021] Figure 5 It is a schematic diagram of the structure enlarged at B of the utility model.

[0022] In the figure: 1 electric conveyor belt, 2 cooling chamber, 3 nozzle, 4 water pipe, 5 water pump, 6 water pipe, 7 hose, 8 bracket, 9 single chip microcomputer, 10 flip mechanism, 101 rotating shaft, 102 gear, 103 guide slide, 104 rack plate, 105 rubber strip, 106 placement plate, 107 electric push rod, 11 infrared sensor. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0024] See also Figure 1-5 ,This embodiment provides a technical solution: a cooling device for refractory material processing, including a bracket 8 and a turnover mechanism 10;

[0025] Bracket 8: The upper surface of the bracket is fixedly connected with a cooling bin 2, the upper surface of the cooling bin 2 is fixedly connected with evenly distributed water pipes 6, the bottom ends of the water pipes 6 are provided with evenly distributed water delivery pipes 4, the bottom ends of the water delivery pipes 4 extend to the interior of the cooling bin 2, the bottom ends of the water delivery pipes 4 are fixedly connected with nozzles 3, and also include water pumps 5, the water pumps 5 are arranged at the upper end of the rear side of the cooling bin 2, the water pumps 5 and the top of the outer surface of the water pipes 6 are connected by a hose 7, the input end of the water pump 5 is electrically connected to the output end of the single-chip microcomputer 9, and also include the single-chip microcomputer 9, The single-chip microcomputer 9 is arranged at the right end of the front side of the cooling bin 2, and the input end of the single-chip microcomputer 9 is electrically connected to the external power supply. The openings at the left and right ends of the cooling bin 2 are provided with electric conveyor belts 1, the opening on the left is the feed port, and the opening on the right is the discharge port. The input end of the electric conveyor belt 1 is electrically connected to the output end of the single-chip microcomputer 9, and also includes an infrared sensor 11, which is arranged on the inner wall of the rear side of the cooling bin 2. The infrared sensor 11 is bidirectionally electrically connected to the single-chip microcomputer 9. The refractory material is placed on the electric conveyor belt 1 on the left, and then the water The water inlet of the pump 5 is connected to an external water source, and then the single chip computer 9 controls the operation of the electric conveyor belt 1 on the left side. The electric conveyor belt 1 starts to work and transports the refractory materials from left to right in sequence. During the transportation process, the single chip computer 9 controls the operation of the water pump 5, and the water pump 5 transports the water source to the water pipe 6 through the hose 7 through the mechanical supercharger. The water source in the water pipe 6 is diverted through the water pipe 4 evenly distributed at the bottom, and then diverted to the water pipe 4 in sequence, and then sprayed on the refractory material through the nozzle 3 for cooling, and then the electric conveyor The belt 1 continues to convey until the first refractory material is conveyed to the middle of the cooling bin 2, and then conveys the refractory material to the upper surface of the placement plate 106. At the same time, the infrared sensor 11 is controlled by the single chip microcomputer 9 to operate. When the infrared sensor 11 detects that an object is parked on the upper surface of the placement plate 106, it generates a pulse signal and transmits the signal to the connected single chip microcomputer 9. The single chip microcomputer 9 makes a judgment and controls the electric conveyor belt 1 on the left to stop running, so as to ensure that the objects move in an orderly manner on the conveyor belt to avoid congestion or collision.

[0026] The flipping mechanism 10 includes a rotating shaft 101, a rubber strip 105 and a placement plate 106. The rotating shaft 101 is rotatably connected between the front and rear inner walls of the middle part of the cooling bin 2. The outer surface of the rotating shaft 101 is fixedly connected with the placement plate 106. The upper surface of the placement plate 106 is provided with uniformly distributed rubber strips 105. The placement plate 106 is located between the two electric transmission belts 1. The rotating shaft 101 is fixedly connected to the eccentric right end of the placement plate 106. The flipping mechanism 10 also includes a gear 102, a guide chute 103 and a rack plate 104. The guide chute 103 is opened on the front bottom wall of the cooling bin 2. The inner wall of the guide chute 103 is slidably connected with the rack plate 104. The gear 102 is fixedly sleeved on the front end of the rotating shaft 101, and the gear 102 is meshed and connected with the rack plate 104. The flip mechanism 10 also includes an electric push rod 107, which is arranged on the front bottom wall of the cooling bin 2. The telescopic end of the electric push rod 107 is fixedly connected to the left side of the rack plate 104. The input end of the electric push rod 107 is electrically connected to the output end of the single-chip microcomputer 9, and then the single-chip microcomputer 9 is used to control the operation of the electric push rod 107. The telescopic end of the electric push rod 107 pushes the rack plate 104 to move to the right by sliding on the inner wall of the guide slot 103. The rack plate 104 meshes and rotates with the gear 102, and the gear 102 drives the rotating shaft 101 to rotate. The rotating shaft 101 drives the placing plate 106 to rotate a certain angle, and the refractory material is turned over and falls onto the electric conveyor belt 1 on the right side. Then, the electric conveyor belt 1 on the right side is controlled to operate by the single chip microcomputer 9. The electric conveyor belt 1 on the right side transports the cooled refractory material to the outside. By turning over the refractory material, it can be ensured that the entire surface is evenly cooled, thereby reducing the uneven shrinkage caused by local temperature differences, which helps to avoid cracks or deformation of the material during the cooling process and reduce the workload. Then, the electric push rod 107 is operated by the single chip microcomputer 9, and the telescopic end of the electric push rod 107 is telescoped backward to drive the rack plate 104 to slide to the left on the inner wall of the guide slot 103. The rack plate 104 meshes and rotates with the gear 102, the gear 102 drives the rotating shaft 101 to rotate in the opposite direction, the rotating shaft 101 drives the placing plate 106 to rotate in the opposite direction for a certain angle until it is level with the electric conveyor belt 1 on the left. At the same time, when the infrared sensor 11 detects that there is no object parked on the upper surface of the placing plate 106, it will generate a pulse signal and transmit the signal to the connected single-chip microcomputer 9. The single-chip microcomputer 9 makes a judgment and regulates the operation of the electric conveyor belt 1 on the left to transport the next refractory material. By flipping the refractory material, the overall temperature distribution can be more uniform, the operation frequency is reduced, and the work intensity of the staff is reduced.

[0027] The working principle of a cooling device for refractory material processing provided by the utility model is as follows: the refractory material is placed on the electric conveyor belt 1 on the left, and then the water inlet of the water pump 5 is connected to an external water source, and then the electric conveyor belt 1 on the left is regulated to operate by the single-chip microcomputer 9, and the electric conveyor belt 1 starts to work to transport the refractory material from left to right in sequence, and during the transportation process, the water pump 5 is regulated to operate by the single-chip microcomputer 9, and the water pump 5 transports the water source to the water pipe 6 through the hose 7 through the mechanical supercharger, and the water source in the water pipe 6 is diverted through the water pipe 4 evenly distributed at the bottom, and is diverted to the water pipe 4 in sequence, and then sprayed on the refractory material through the nozzle 3 for cooling, and then the electric conveyor belt 1 continues to transport until The first refractory material is transported to the middle of the cooling bin 2, and then the refractory material is transported to the upper surface of the placement plate 106. At the same time, the infrared sensor 11 is controlled by the single-chip microcomputer 9. When the infrared sensor 11 detects that an object is parked on the upper surface of the placement plate 106, it will generate a pulse signal and transmit the signal to the connected single-chip microcomputer 9. The single-chip microcomputer 9 makes a judgment and controls the electric conveyor belt 1 on the left to stop running, ensuring that the objects move in an orderly manner on the conveyor belt to avoid congestion or collision. Then the electric push rod 107 is controlled by the single-chip microcomputer 9 to operate. The telescopic end of the electric push rod 107 pushes the rack plate 104 to move to the right by sliding on the inner wall of the guide slot 103. The rack plate 104 and the gear The wheel 102 meshes and rotates, the gear 102 drives the rotating shaft 101 to rotate, and the rotating shaft 101 drives the placing plate 106 to rotate a certain angle, turning the refractory material over and dropping it onto the electric conveyor belt 1 on the right, and then the electric conveyor belt 1 on the right is controlled to operate by the single chip microcomputer 9, and the electric conveyor belt 1 on the right transports the cooled refractory material to the outside. By turning over the refractory material, it can ensure that the entire surface is evenly cooled, thereby reducing the uneven shrinkage caused by local temperature differences, helping to avoid cracks or deformation of the material during the cooling process, and reducing the workload. Then, the electric push rod 107 is operated by the single chip microcomputer 9, and the telescopic end of the electric push rod 107 is telescoped backward to drive the rack plate 104 to slide As the inner wall of the guide slot 103 moves to the left, the rack plate 104 meshes and rotates with the gear 102, the gear 102 drives the rotating shaft 101 to rotate in the opposite direction, and the rotating shaft 101 drives the placing plate 106 to rotate in the opposite direction for a certain angle until it is level with the electric conveyor belt 1 on the left. At the same time, when the infrared sensor 11 detects that there is no object parked on the upper surface of the placing plate 106, it will generate a pulse signal and transmit the signal to the connected single-chip microcomputer 9. The single-chip microcomputer 9 makes a judgment and regulates the operation of the electric conveyor belt 1 on the left to transport the next refractory material. By flipping the refractory material, the overall temperature distribution can be more uniform, the operation frequency is reduced, and the work intensity of the staff is reduced.

[0028] It is worth noting that the specific model of the single chip microcomputer 9 disclosed in the above embodiment is S7-200, the electric conveyor belt 1 is recommended to use KY-09, the water pump 5 can use I RG40-160, the electric push rod 107 is preferably SM-38STG-1000N, and the infrared sensor 11 can use CPK-TR40MR3. The single chip microcomputer 9 controls the operation of the electric conveyor belt 1, the water pump 5, the electric push rod 107 and the infrared sensor 11 using methods commonly used in the prior art.

[0029] The above description is only an embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the specification and drawings of the present invention, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A cooling device for refractory material processing, characterized in that: It comprises a bracket (8) and a turning mechanism (10); The bracket (8) has a cooling bin (2) fixedly connected to its upper surface, and evenly distributed water pipes (6) fixedly connected to the upper surface of the cooling bin (2), and evenly distributed water pipes (4) are provided at the bottom ends of the water pipes (6), and the bottom ends of the water pipes (4) extend to the interior of the cooling bin (2), and the bottom ends of the water pipes (4) are fixedly connected to the nozzles (3); The turning mechanism (10) comprises a rotating shaft (101), a rubber strip (105) and a placement plate (106); the rotating shaft (101) is rotatably connected between the front and rear inner walls of the middle of the cooling bin (2); the outer surface of the rotating shaft (101) is fixedly connected to the placement plate (106); and the upper surface of the placement plate (106) is provided with uniformly distributed rubber strips (105).

2. A cooling device for refractory material processing according to claim 1, characterized in that: It also includes a single-chip microcomputer (9), which is arranged at the right end of the front side of the cooling bin (2), and the input end of the single-chip microcomputer (9) is electrically connected to an external power supply.

3. A cooling device for refractory material processing according to claim 2, characterized in that: The openings at the left and right ends of the cooling bin (2) are both provided with electric transmission belts (1), and the input end of the electric transmission belt (1) is electrically connected to the output end of the single chip computer (9).

4. A cooling device for refractory material processing according to claim 2, characterized in that: It also comprises an infrared sensor (11), wherein the infrared sensor (11) is arranged on the rear inner wall of the cooling chamber (2), and the infrared sensor (11) is bidirectionally electrically connected to the single-chip computer (9).

5. A cooling device for refractory material processing according to claim 2, characterized in that: The flip mechanism (10) also includes a gear (102), a guide slot (103) and a rack plate (104); the guide slot (103) is provided on the front bottom wall of the cooling bin (2); the inner wall of the guide slot (103) is slidably connected with the rack plate (104); the gear (102) is fixedly sleeved on the front end of the rotating shaft (101); the gear (102) is meshingly connected with the rack plate (104).

6. A cooling device for refractory material processing according to claim 5, characterized in that: The flip mechanism (10) further comprises an electric push rod (107), wherein the electric push rod (107) is arranged on the front bottom wall of the cooling bin (2), the telescopic end of the electric push rod (107) is fixedly connected to the left side of the rack plate (104), and the input end of the electric push rod (107) is electrically connected to the output end of the single chip computer (9).

7. A cooling device for refractory material processing according to claim 2, characterized in that: It also includes a water pump (5), which is arranged at the upper end of the rear side of the cooling chamber (2), and the water pump (5) is connected to the top of the outer surface of the water pipe (6) through a hose (7), and the input end of the water pump (5) is electrically connected to the output end of the single-chip computer (9).

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