Semiconductor chilling plate with reliable heating function

Abstract

The utility model discloses a reliable heating semiconductor chilling plate, which relates to the technical field of refrigeration and heating, and comprises a ceramic substrate and an MCH ceramic heating plate, a plurality of thermoelectric semiconductor particles are arranged between the ceramic substrate and the MCH ceramic heating plate, and the tops of the thermoelectric semiconductor particles are fixed with the surface of the ceramic substrate through an upper metal conductor. The bottoms of the thermoelectric semiconductor particles are fixed to the surface of the MCH ceramic heating piece through the lower layer metal conductor, the thermoelectric semiconductor particles are sequentially connected in series through the upper layer metal conductor and the lower layer metal conductor to form a complete loop, the loop is externally connected with a power supply through a wire interface arranged on the lower layer metal conductor, and the MCH ceramic heating piece is externally connected with a wire. And the thermoelectric semiconductor particles and the MCH ceramic heating sheet are relatively insulated. According to the utility model, the semiconductor chilling plate and the ceramic heating plate are integrated, and reliable heating of the semiconductor chilling plate is realized in a limited space.

Description

Technical Field

[0001] The utility model relates to the field of refrigeration and heating technology, in particular to a semiconductor refrigeration sheet with reliable heating. Background Art

[0002] Semiconductor refrigeration is also known as electronic refrigeration or thermoelectric refrigeration. It uses a PN junction composed of special semiconductor materials to form a thermocouple pair to produce the Peltier effect, that is, cooling through direct current.

[0003] The working principle of semiconductor refrigerator is: when a piece of N-type semiconductor material and a piece of P-type semiconductor material are connected to form an electric couple, after the direct current is connected in this circuit, energy transfer can be generated. The current flows from the N-type element to the joint of the P-type element to absorb heat and become the cold end; the current flows from the P-type element to the joint of the N-type element to release heat and become the hot end.

[0004] The structure of the semiconductor refrigeration sheet is composed of multiple groups of N-type and P-type semiconductor particles arranged with each other, and the N / P are connected by metal conductors to form a complete circuit. The upper and lower parts are sandwiched by two ceramic sheets, which are required to be insulated and have good thermal conductivity.

[0005] The temperatures of the hot and cold ends of a semiconductor refrigeration chip tend to be consistent, so there is a maximum temperature difference between the hot and cold ends. Taking refrigeration as an example, it is necessary to continuously dissipate heat from the hot end to lower the temperature of the hot end so that the cold end can work normally.

[0006] Existing semiconductor refrigerators are mainly used for cooling. When the use environment requires both cooling and heating, if the heating temperature requirement is not high, the cold end and hot end of the semiconductor refrigerator are directly used for cooling and heating, and the hot and cold ends are changed by exchanging the direction of the current. Since the maximum temperature difference between the cold and hot ends of a general semiconductor refrigerator is about 45 to 65°C, and the maximum heating temperature that can be provided is about 90°C, this heating temperature is not enough to heat water to boiling, thus limiting the occasions where the heating function can be used. If a higher heating temperature is required, the existing solution is to add another separate heater for heating, and the heater is independent of the semiconductor refrigerator or fixed to the semiconductor refrigerator by bonding or other means. However, adding another heater to meet the heating function requirement increases components, has a complex structure, requires a larger installation space, and is not conducive to miniaturization and compact use. Utility Model Content

[0007] The purpose of the utility model is to overcome the shortcomings of the prior art and provide a semiconductor refrigeration plate for reliable heating, integrating the semiconductor refrigeration plate and the ceramic heating plate into one, so as to realize reliable heating of the semiconductor refrigeration plate in a limited space.

[0008] The purpose of the utility model is achieved through the following technical solutions: this reliable heating semiconductor refrigeration plate includes a ceramic substrate and an MCH ceramic heating plate, a plurality of thermoelectric semiconductor particles are arranged between the two, the top of the thermoelectric semiconductor particles is fixed to the surface of the ceramic substrate through an upper metal conductor, the bottom of the thermoelectric semiconductor particles is fixed to the surface of the MCH ceramic heating plate through a lower metal conductor, and the upper metal conductor and the lower metal conductor connect the thermoelectric semiconductor particles in series in sequence to form a complete loop, the loop is externally powered by a wire interface provided on the lower metal conductor, the MCH ceramic heating plate is externally connected with a wire, and the thermoelectric semiconductor particles and the MCH ceramic heating plate are relatively insulated;

[0009] When the thermoelectric semiconductor particles are powered on and the MCH ceramic heating sheet is not powered on, the MCH ceramic heating sheet transfers the cold to the outside to achieve cooling;

[0010] When the thermoelectric semiconductor particles are not powered and the MCH ceramic heating plate is powered, the MCH ceramic heating plate transfers heat to the outside to achieve heating.

[0011] As a further technical solution, the thermoelectric semiconductor particles and the MCH ceramic heating plate are both connected to a temperature control system to achieve precise control of cooling and heating temperatures.

[0012] As a further technical solution, a heat sink or a fan is installed on the outer surface of the ceramic substrate.

[0013] As a further technical solution, the upper metal conductor and the lower metal conductor are solder pads, and the melting point of the solder is higher than the operating temperature of the MCH ceramic heating plate.

[0014] As a further technical solution, the gaps formed around the thermoelectric semiconductor particles and the ceramic substrate and the MCH ceramic heating plate are filled with resin for packaging and protection.

[0015] The beneficial effects of the utility model are:

[0016] 1. The ceramic substrate is replaced with MCH ceramic heating plate, which can achieve a higher heating temperature (heating temperature is above 100°C, enough to heat water to boiling), broadening the application range of semiconductor refrigeration plates in achieving cooling and heating;

[0017] 2. The ceramic heating plate has the same good insulation and thermal conductivity, and will not affect the cooling effect of the refrigeration plate; and compared with the solution of adding a heater outside the refrigeration plate, the structure is more compact, which is conducive to miniaturization;

[0018] 3. Connecting the thermoelectric semiconductor particles and MCH ceramic heating plates to the temperature control system can achieve precise control of cooling and heating temperatures, prevent overcooling or overheating, and ensure safe and reliable use. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a three-dimensional structural schematic diagram of the utility model.

[0020] Figure 2 It is a schematic diagram of the explosion structure of the utility model.

[0021] Explanation of the reference numerals: ceramic substrate 1 , upper metal conductor 2 , thermoelectric semiconductor particles 3 , lower metal conductor 4 , wire interface 41 , MCH ceramic heating plate 5 , wire 6 . DETAILED DESCRIPTION

[0022] The utility model will be described in detail below with reference to the accompanying drawings:

[0023] Example: As shown in the attached Figure 1 , 2 As shown, this reliable heating semiconductor cooling plate includes a ceramic substrate 1, an upper metal conductor 2, thermoelectric semiconductor particles 3, a lower metal conductor 4, a wire interface 41, an MCH ceramic heating plate 5 and a wire 6.

[0024] Reference Figure 2 The ceramic substrate 1, the upper metal conductor 2, a plurality of thermoelectric semiconductor particles 3, the lower metal conductor 4, and the MCH ceramic heating plate 5 are arranged in sequence from top to bottom, the top of each thermoelectric semiconductor particle 3 is welded and fixed to the surface of the ceramic substrate 1 through the upper metal conductor 2, and the bottom of each thermoelectric semiconductor particle 3 is welded and fixed to the surface of the MCH ceramic heating plate 5 through the lower metal conductor 4, and the upper metal conductor 2 and the lower metal conductor 4 connect the thermoelectric semiconductor particles 3 in series in sequence to form a complete loop. Preferably, the upper metal conductor 2 and the lower metal conductor 4 are pads, and the melting point of the solder is higher than the operating temperature of the MCH ceramic heating plate 5.

[0025] Further, such as Figure 1As shown, two wire interfaces 41 are provided on the lower metal conductor 4, and the two ends of the complete loop formed by each thermoelectric semiconductor particle 3 are electrically connected to the external circuit through a wire interface 41 to realize external power supply. At the same time, the MCH ceramic heating plate 5 is connected with a wire 6 that can be powered externally separately, so that the thermoelectric semiconductor particles 3 and the MCH ceramic heating plate 5 are relatively insulated. When the thermoelectric semiconductor particles 3 are energized through the wire interface 41 and the MCH ceramic heating plate 5 is not energized, the MCH ceramic heating plate 5 transfers the cold to the outside to achieve refrigeration. Preferably, a radiator or fan is installed on the surface outside the ceramic substrate 1 to help reduce the temperature of the hot end and maintain the refrigeration effect of the cold end. When the thermoelectric semiconductor particles 3 are not energized and the MCH ceramic heating plate 5 is energized through the wire 6, the MCH ceramic heating plate 5 is used as a heater to transfer heat to the outside to achieve heating. The heating temperature of the MCH ceramic heating plate 5 is above 100°C, which is enough to heat water to boiling, broadening the application range of semiconductor refrigeration plates in achieving refrigeration and heating.

[0026] Preferably, both the thermoelectric semiconductor particles 3 and the MCH ceramic heating plate 5 can be connected to the temperature control system to achieve precise control of the cooling and heating temperatures, prevent overcooling or overheating, and ensure safe and reliable use. In addition, resin can be filled in the gaps formed by the ceramic substrate 1 and the MCH ceramic heating plate 5 around the thermoelectric semiconductor particles 3 for packaging and protection. In actual use, the MCH ceramic heating plate 5 is arranged at the cold end of the thermoelectric semiconductor particles 3, and the ceramic substrate 1 is located at the hot end of the thermoelectric semiconductor particles 3. Whether cooling or heating, heat is exchanged with the outside world through the surface of the MCH ceramic heating plate 5.

[0027] The working process of this utility model:

[0028] When used as a refrigerator, the thermoelectric semiconductor particles 3 are powered through the wire interface 41, and the MCH ceramic heating plate 5 is not powered. Direct current passes through the thermoelectric semiconductor particles 3, generating low temperature at the cold end (i.e., the end where the MCH ceramic heating plate 5 is located). The material of the MCH ceramic heating plate 5 has good thermal conductivity, so the cold is transferred to the outside through the MCH ceramic heating plate 5 (which does not work itself, but only plays the role of heat transfer), and the surface of the MCH ceramic heating plate 5 is placed close to the items that need to be cooled. A radiator or fan can be placed at the hot end (ceramic substrate 1) to help reduce the temperature of the hot end and maintain the cooling effect of the cold end.

[0029] When used as a heater, the thermoelectric semiconductor particles 3 are not energized, and the MCH ceramic heating plate 5 is energized through the wire 6. The printed circuit resistance inside the MCH ceramic heating plate 5 generates heat and transfers the heat to the outside. Ceramic heating plates of different powers can be selected according to usage requirements.

[0030] It is understandable that, for those skilled in the art, any equivalent replacement or change to the technical solution and the concept of the utility model should fall within the protection scope of the claims attached to the utility model.

Claims

1. A semiconductor refrigeration sheet with reliable heating, characterized in that: The invention comprises a ceramic substrate (1) and an MCH ceramic heating plate (5), wherein a plurality of thermoelectric semiconductor particles (3) are arranged between the two, wherein the top of the thermoelectric semiconductor particles (3) is fixed to the surface of the ceramic substrate (1) via an upper metal conductor (2), and the bottom of the thermoelectric semiconductor particles (3) is fixed to the surface of the MCH ceramic heating plate (5) via a lower metal conductor (4), and the upper metal conductor (2) and the lower metal conductor (4) sequentially connect the thermoelectric semiconductor particles (3) in series to form a complete circuit, wherein the circuit is externally powered via a wire interface (41) provided on the lower metal conductor (4), and an external wire (6) is connected to the MCH ceramic heating plate (5), and the thermoelectric semiconductor particles (3) and the MCH ceramic heating plate (5) are relatively insulated; When the thermoelectric semiconductor particles (3) are powered and the MCH ceramic heating plate (5) is not powered, the MCH ceramic heating plate (5) transfers cold energy to the outside to achieve refrigeration; When the thermoelectric semiconductor particles (3) are not energized and the MCH ceramic heating plate (5) is energized, the MCH ceramic heating plate (5) transfers heat to the outside to achieve heating.

2. The reliable heating semiconductor refrigeration sheet according to claim 1 is characterized in that: The thermoelectric semiconductor particles (3) and the MCH ceramic heating plate (5) are both connected to a temperature control system to achieve precise control of cooling and heating temperatures.

3. The reliable heating semiconductor refrigeration sheet according to claim 1 is characterized in that: A heat sink or a fan is installed on the outer surface of the ceramic substrate (1).

4. The reliable heating semiconductor refrigeration sheet according to claim 1 is characterized in that: The upper metal conductor (2) and the lower metal conductor (4) are solder pads, and the melting point of the solder is higher than the operating temperature of the MCH ceramic heating plate (5).

5. The reliable heating semiconductor refrigeration sheet according to claim 1 is characterized in that: The gaps formed by the periphery of the thermoelectric semiconductor particles (3) and the ceramic substrate (1) and the MCH ceramic heating plate (5) are filled with resin for packaging and protection.

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