Pin support, chip packaging support, infrared receiving head and processing equipment

Abstract

The utility model discloses a pin support, a chip packaging support, an infrared receiving head and processing equipment, and particularly discloses a pin support, which comprises a support main body and first bending parts, the first bending parts are arranged at two ends of the support main body, and each first bending part comprises a first crease unit and a second crease unit, the first folding mark unit and the second folding mark unit are bent to form the pin, through the above structure arrangement, because the two ends of the pin support are provided with the first bending parts, and the first bending parts comprise the first folding mark unit and the second folding mark unit, when a chip is processed, only acting force needs to be applied to the first bending parts, and the first folding mark unit and the second folding mark unit are bent to form the pin. The pin can be formed by bending the first crease unit and the second crease unit, the structure is simple, operation is convenient and fast, a user can machine support bodies of different sizes and specifications through one machining device to form the pin, production and machining are flexible, and the production cost is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of chip packaging, in particular to a pin bracket, a chip packaging bracket, an infrared receiving head and processing equipment. Background Art

[0002] Currently, existing chips need to be packaged with specific equipment for production and processing to form pins. When faced with chips of different specifications, different equipment is required, which results in poor product manufacturing flexibility and high costs. Utility Model Content

[0003] The purpose of the utility model is to address the technical problems existing in the background technology and to propose a pin bracket, comprising a bracket body and a first bending portion, the first bending portion being arranged at both ends of the bracket body, the first bending portion comprising a first crease unit and a second crease unit, the first crease unit and the second crease unit being bent to form a pin.

[0004] Furthermore, the first bending portion also includes a first bending unit and a second bending unit, one end of the first bending unit is connected to the bracket body, and the other end is connected to one end of the first crease unit, and the other end of the first crease unit is connected to one end of the second bending unit.

[0005] Furthermore, the bracket body is also provided with an IC chip and a sensor, the IC chip is electrically connected to the bracket body, and the sensor is electrically connected to the IC chip.

[0006] Furthermore, it also includes a shielding cover, which is arranged on a side of the bracket body close to the IC chip.

[0007] Furthermore, the shielding cover is provided with a window penetrating the shielding cover.

[0008] Furthermore, it also includes a second bending portion, and the shielding cover is connected to the bracket body through the second bending portion.

[0009] Furthermore, the second bending portion includes a third bending unit, a third crease unit and a fourth crease unit, one end of the third crease unit is connected to the bracket body, and the other end is connected to the third bending unit, the other end of the third bending unit is connected to one end of the fourth crease unit, and the other end of the fourth crease unit is connected to the shielding cover.

[0010] Further, it comprises a plurality of pin supports as described above, the chip package support comprises a plurality of cutting units, and the cutting units are arranged between two adjacent pin supports.

[0011] Furthermore, the utility model also provides an infrared receiving head, including the pin bracket of the utility model.

[0012] Furthermore, the utility model also provides a processing device, which is applied to the production and processing of the infrared receiving head of the utility model.

[0013] Compared with the prior art, the utility model has the following beneficial technical effects: since the pin bracket of the utility model is provided with a first bending portion at both ends, and the first bending portion includes a first crease unit and a second crease unit, when processing the chip, it is only necessary to apply a force to the first bending portion to bend the first crease unit and the second crease unit to form a pin. The structure is simple and the operation is convenient. The user can use one processing equipment to process the bracket body of different sizes to form pins. The production and processing are flexible and the production cost is reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a top view of the pin bracket of the utility model. DETAILED DESCRIPTION

[0015] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other.

[0016] In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or component referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "first", "second", etc. are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, features defined as "first", "second", etc. may explicitly or implicitly include one or more features. In the description of the present utility model, unless otherwise specified, "multiple" means two or more.

[0017] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or a specific connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood by specific circumstances.

[0018] The specific embodiments of the present utility model are described in detail below with reference to the accompanying drawings.

[0019] like Figure 1 As shown, the utility model proposes a pin bracket, including a bracket body 1 and a first bending portion 11, the first bending portion 11 is arranged at both ends of the bracket body 1, for forming a pin, the bracket body 1 is used to carry a chip, specifically, in this embodiment, the first bending portion 11 includes a first crease unit 111 and a second crease unit 112, the first crease unit 111 and the second crease unit 112 are configured to be easy to bend, so as to facilitate limiting the bending direction of the first bending portion 11.

[0020] It can be understood that since the pin bracket of the utility model is provided with a first bending portion 11 at both ends, and the first bending portion 11 includes a first crease unit 111 and a second crease unit 112, when processing the chip, it is only necessary to apply a force to the first bending portion 11 to bend the first crease unit 111 and the second crease unit 112 to form a pin. Through the above-mentioned structural setting, the user can use one processing equipment to process the bracket body 1 of different sizes to form pins, which makes the production and processing flexible and reduces the production cost.

[0021] Further, in this embodiment, the first bending portion 11 further includes a first bending unit 1101 and a second bending unit 1102. One end of the first bending unit 1101 is connected to the bracket body 1, and the other end is connected to one end of the first crease unit 111. The other end of the first crease unit 111 is connected to one end of the second bending unit 1102. Based on the above configuration, the first bending unit 1101 and the second bending unit 1102 can be bent to form a pin body. The structure is simple and the operation is convenient.

[0022] Furthermore, in this embodiment, the bracket body 1 is also provided with an IC chip 13 and a sensor 12, the IC chip 13 is electrically connected to the bracket body 1, and the sensor 12 is electrically connected to the IC chip 13. The bracket body 1 also includes a shielding cover 14, the shielding cover 14 is provided with a window 141 that penetrates the shielding cover 14, and the shielding cover 14 is provided on a side of the bracket body 1 close to the IC chip 13 for signal shielding.

[0023] Furthermore, in this embodiment, in order to facilitate the production and processing of the shielding cover 14, the bracket body 1 further includes a second bending portion 15, and the shielding cover 14 is connected to the bracket body 1 through the second bending portion 15. Specifically, the second bending portion 15 includes a third bending unit 151, a third crease unit 1501, and a fourth crease unit 1502. One end of the third crease unit 1501 is connected to the bracket body 1, and the other end is connected to the third bending unit 151. The other end of the third bending unit 151 is connected to one end of the fourth crease unit 1502, and the other end of the fourth crease unit 1502 is connected to the shielding cover 14. Based on the above configuration, the shielding cover 14 can be installed to a suitable position only by bending the third crease unit 1501 and the fourth crease unit 1502.

[0024] Furthermore, the present embodiment also provides a chip packaging bracket, which includes a plurality of pin brackets 10 of the present embodiment. Specifically, the chip packaging bracket includes a plurality of cutting units 101, which are arranged between two adjacent pin brackets 10, and the cutting units 101 are used to separate the pin brackets 10. Through the above structural arrangement, the processing equipment can realize batch production of chips by processing the chip packaging bracket.

[0025] Furthermore, this embodiment also provides an infrared receiving head, including the pin bracket 10 of this embodiment.

[0026] Furthermore, this embodiment also provides a processing device, which is applied to the production and processing of the infrared receiving head of this embodiment.

[0027] The above are one or more implementation methods provided in combination with specific contents, and it is not intended that the specific implementation of the present utility model is limited to these descriptions. Any method, structure, etc. similar to or identical to the present utility model, or any technical deduction or replacement based on the concept of the present utility model, shall be deemed to be within the protection scope of the present utility model.

Claims

1. A pin bracket, characterized in that: The invention comprises a bracket body (1) and a first bending portion (11), wherein the first bending portion (11) is arranged at two ends of the bracket body (1), and the first bending portion (11) comprises a first folding unit (111) and a second folding unit (112), and the first folding unit (111) and the second folding unit (112) are bent to form a pin.

2. A pin bracket according to claim 1, characterized in that: The first bending portion (11) further comprises a first bending unit (1101) and a second bending unit (1102), wherein one end of the first bending unit (1101) is connected to the bracket body (1), and the other end is connected to one end of the first crease unit (111), and the other end of the first crease unit (111) is connected to one end of the second bending unit (1102).

3. A pin bracket according to claim 1, characterized in that: The support body (1) is also provided with an IC chip (13) and a sensor (12); the IC chip (13) is electrically connected to the support body (1), and the sensor (12) is electrically connected to the IC chip (13).

4. A pin bracket according to claim 3, characterized in that: It also comprises a shielding cover (14), wherein the shielding cover (14) is arranged on a side of the bracket body (1) close to the IC chip (13).

5. A pin bracket according to claim 4, characterized in that: The shielding cover (14) is provided with a window (141) penetrating the shielding cover (14).

6. The pin bracket according to claim 4, characterized in that: It also comprises a second bending portion (15), and the shielding cover (14) is connected to the bracket body (1) via the second bending portion (15).

7. A pin bracket according to claim 6, characterized in that: The second bending portion (15) includes a third bending unit (151), a third crease unit (1501) and a fourth crease unit (1502), wherein one end of the third crease unit (1501) is connected to the bracket body (1), and the other end is connected to the third bending unit (151), the other end of the third bending unit (151) is connected to one end of the fourth crease unit (1502), and the other end of the fourth crease unit (1502) is connected to the shielding cover (14).

8. A chip packaging bracket, characterized in that: It comprises a plurality of lead supports (10) as described in any one of claims 1 to 7, wherein the chip package support comprises a plurality of cutting units (101), and the cutting units (101) are arranged between two adjacent lead supports (10).

9. An infrared receiving head, characterized in that: It comprises the pin bracket (10) described in any one of claims 1 to 7.

10. A processing equipment, characterized in that: Applicable to the production and processing of the infrared receiving head described in claim 9.

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