Dotting mechanism for checking defective products of large semiconductor raw sheets

Abstract

The utility model discloses a semiconductor large raw sheet defective product inspection dotting mechanism which comprises a workbench, a top plate, a first supporting column, a first L-shaped connecting block, a first rotating shaft, a shaft sleeve, a bearing table, a first rotating disc, a second rotating disc, a first hanging bracket, a second hanging bracket, an identification film, a transmission mechanism and a control module. The first L-shaped connecting blocks are fixedly installed on the left side and the right side of the workbench. According to the mechanism, after the defect of the large semiconductor original sheet is detected through the CCD camera, the dotting device is started to spray ink on the dotting film to mark the marking point corresponding to the defect position of the large semiconductor original sheet, then the dotting film is correspondingly attached to the large semiconductor original sheet, and during subsequent manual reinspection, the reinspection position of the dotting film is uncovered, so that the production efficiency is improved. Therefore, the high light transmission of the large semiconductor raw film is maintained, and the efficiency and the accuracy during reinspection analysis can be improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor chip production, in particular to a semiconductor large original chip defective product inspection and marking mechanism. Background Art

[0002] Semiconductor wafers are also called wafers, which refer to silicon chips used in the manufacture of silicon semiconductor integrated circuits. Because of their round shape, they are called silicon wafers. The original material is silicon. Silica ore is refined by electric arc furnace, chlorinated with hydrochloric acid, and distilled to make high-purity polysilicon. The wafer manufacturing plant then melts this polysilicon, plants seed crystals in the melt, and then slowly pulls it out to form a cylindrical single-crystal silicon rod. The silicon rod is then cut, rolled, sliced, and packaged to become the basic raw material silicon wafer for making integrated circuits. When visually inspecting semiconductor wafers, when defective products are found, the defective positions are marked by inkjet dotting through a dotting device. The defective products are then manually re-inspected and analyzed. When the inkjet dotting marks on the semiconductor wafers are touched, they are easily smeared and dispersed, making it difficult to determine the defective mark positions during subsequent manual re-inspection. In addition, the inkjet marking points will affect the light transmittance of the semiconductor wafers during manual re-inspection, which will reduce the efficiency and accuracy of manual re-inspection. Summary of the invention

[0003] The technical problem to be solved by the utility model is to provide a defective product inspection dotting mechanism which can simultaneously perform inkjet marking of the corresponding defect position on a dotting film when defects of a large semiconductor wafer are visually detected.

[0004] In order to solve the above technical problems, the present invention is achieved through the following technical solutions: a semiconductor large wafer defective product inspection and dotting mechanism, including a workbench, a top plate, a first support column, a first L-shaped connecting block, a first rotating shaft, a sleeve, a bearing platform, a first turntable, a second turntable, a first hanger, a second hanger, an identification film, a transmission mechanism and a control module, the first L-shaped connecting block is fixedly installed on the left and right sides of the workbench, the upper and lower ends of the first support column are respectively fixedly connected to the top plate and the first L-shaped connecting block, two sleeves are fixedly installed on the workbench, the first rotating shaft is rotatably installed in the sleeve, the bearing platform is fixedly installed on the workbench through the second support column, the bearing platform is set to a transparent structure, and a container is set in the bearing platform. A slot is provided in which a light source is fixedly installed, a sliding bearing platform is provided at the upper end of the first rotating shaft on the left side, the first turntable is fixedly installed on the top of the first rotating shaft on the left side, the second turntable is fixedly installed on the top of the first rotating shaft on the right side, the first hanger and the second hanger are fixedly installed on the top plate respectively, a CCD camera is fixedly installed on the first hanger, and a dotting device is fixedly installed on the second hanger, a first belt rack and a second belt rack of an annular closed structure are arranged on the outer cylindrical surfaces of the first turntable and the second turntable, the CCD camera and the dotting device are respectively located above the right side of the first turntable and the second turntable, and the first turntable and the second turntable are respectively provided with limiting columns screwed in a 360° annular array;

[0005] The transmission mechanism consists of a motor bracket, a servo motor, a driving shaft, a first belt gear and a second belt gear. The motor bracket is fixedly mounted on a workbench, the servo motor is fixedly mounted on the motor bracket, the driving shaft is rotatably mounted on the top of the motor bracket through a ball bearing, the driving shaft is drivingly connected to the output shaft of the servo motor, the first belt gear and the second belt gear are respectively sleeved and fixedly mounted on the top and middle positions of the driving shaft, the first belt gear is connected to the first belt rack through a belt transmission, and the second belt gear is connected to the first belt rack and the second belt rack through a belt transmission;

[0006] The servo motor, CCD camera and dotting device are respectively connected to the control module through circuits.

[0007] Furthermore, a protective cover is fixedly installed on the top of the workbench, and the top of the protective cover exceeds the top surface of the first turntable and the second turntable by 3-5 cm.

[0008] Furthermore, serial number identification points are correspondingly arranged on the top surfaces of the limiting columns of the first turntable and the second turntable.

[0009] Furthermore, mesh anti-slip patterns are arranged on the outer surface of the limiting column.

[0010] Compared with the prior art, the advantages of the utility model are as follows: after the mechanism detects defects in the semiconductor large original wafer through a CCD camera, it starts the dotting device to inkjet mark the identification points corresponding to the defect positions of the conductor large original wafer on the dotting film, and then the dotting film is correspondingly pasted on the semiconductor large original wafer. During the subsequent manual re-inspection, the re-inspection position of the dotting film can be uncovered, so that the semiconductor large original wafer maintains high light transmittance, which can improve the efficiency and accuracy of the re-inspection analysis. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] The utility model is further described below in conjunction with the accompanying drawings.

[0012] Figure 1 It is a structural schematic diagram of the utility model.

[0013] Figure 2 yes Figure 1 Enlarged structural diagram at M. DETAILED DESCRIPTION

[0014] The utility model is described in detail below in conjunction with specific implementation methods:

[0015] like Figure 1 and Figure 2The semiconductor large wafer defective product inspection and dotting mechanism shown in the figure includes a workbench 1, a top plate 2, a first support column 21, a first L-shaped connecting block 22, a first rotating shaft 3, a sleeve 31, a bearing platform 4, a first turntable 5, a second turntable 6, a first hanger 7, a second hanger 8, an identification film 101, a transmission mechanism and a control module, wherein the first L-shaped connecting block 22 is fixedly installed on the left and right sides of the workbench 1, the upper and lower ends of the first support column 21 are respectively fixedly connected to the top plate 2 and the first L-shaped connecting block 22, two sleeves 31 are fixedly installed on the workbench 1, the first rotating shaft 3 is rotatably installed in the sleeve 31, the bearing platform 4 is fixedly installed on the workbench 1 through the second support column 40, the bearing platform 4 is set to a transparent structure, a receiving groove 51 is provided in the bearing platform 4, a light source 52 is fixedly installed in the receiving groove 51, and the light of the light source 52 is vertical Irradiating upward, a sliding bearing platform 4 is provided at the upper end of the first rotating shaft 3 on the left side, the first rotating disk 5 is fixedly mounted on the top of the first rotating shaft 3 on the left side, the second rotating disk 6 is fixedly mounted on the top of the first rotating shaft 3 on the right side, the first hanger 7 and the second hanger 8 are fixedly mounted on the top plate 2 respectively, a CCD camera 71 is fixedly mounted on the first hanger 7, a dotting device 81 is fixedly mounted on the second hanger 8, a first belt rack 54 and a second belt rack 61 of an annular closed structure are provided on the outer cylindrical surfaces of the first rotating disk 5 and the second rotating disk 6, the CCD camera 71 and the dotting device 81 are respectively located above the right side of the first rotating disk 5 and the second rotating disk 6, the CCD camera 71 is located directly above the light source 52, and the first rotating disk 5 and the second rotating disk 6 are respectively provided with limit posts 103 and 104 screwed in a 360° annular array;

[0016] The transmission mechanism consists of a motor bracket 9, a servo motor 91, a drive shaft 82, a first belt gear 92 and a second belt gear 93. The motor bracket 9 is fixedly mounted on the workbench 1, the servo motor 91 is fixedly mounted on the motor bracket 9, the drive shaft 82 is rotatably mounted on the top of the motor bracket 9 through a ball bearing, the drive shaft 82 is transmission-connected with the output shaft of the servo motor 91, the first belt gear 92 and the second belt gear 93 are respectively sleeved and fixedly mounted on the top and middle positions of the drive shaft 82, the first belt gear 92 is connected to the first belt rack 54 through a belt transmission, and the second belt gear 93 is connected to the second belt rack 61 through a belt transmission to connect the first belt rack and the second belt rack;

[0017] The servo motor 91, CCD camera 71, and dotting device 81 are connected to the control module through circuits. After the control module receives the product defect signal from the CCD camera 71, it controls the dotting device 81 to start in time.

[0018] A protective cover 11 is fixedly installed on the top of the workbench 1, and the top of the protective cover 11 exceeds the top surface of the first turntable 5 and the second turntable 6 by 4 cm to form a comprehensive protection to prevent the operator's gloves or clothes from being clamped when the gears and racks are meshing and transmitting, thereby playing a safety protection role.

[0019] Corresponding serial number identification points are arranged on the top surfaces of the limiting posts 103 of the first turntable 5 and the second turntable 6. For example, corresponding letter serial number identification points A, B, C, and D are arranged on the limiting posts 103 of the first turntable 5 and the second turntable 6 to achieve corresponding positions of the large original film on the first turntable 5 and the identification film 102 on the second turntable 6.

[0020] The outer surface of the limiting column 103 is provided with a mesh anti-skid pattern to prevent the operator from slipping when rotating the limiting column 103 .

[0021] The semiconductor wafer 101 is placed on the first turntable 5, and four limiting posts 103 are screwed in to limit the radial freedom of the semiconductor wafer 101. The dotting film 102 with a transparent structure is placed on the second turntable 6. The four limiting posts 104 are screwed in to press the edge of the dotting film 102 onto the second turntable 6. The starting servo motor drives the driving shaft 82 to rotate, and the first and second turntables 5 and 6 are synchronously driven to rotate in the same direction through the first belt gear 92 and the second belt gear 93 on the driving shaft 82. The semiconductor wafer 101 and the dotting film 102 rotate synchronously with the first and second turntables 5 and 6 respectively. The number of inkjet heads of the dotting device 81 is 6-10, extending from the center position of the second turntable 6 to its rightmost edge position. Increasing the number of inkjet heads can improve the accuracy of the dotting mark position. The CCD camera 71 visually detects defects on the rotating semiconductor wafer 101. When the CCD camera 71 detects that the semiconductor wafer 101 has product defects, the data is sent to the control module. The control module controls the dotting device 81 to start and perform inkjet dotting on the dotting film 102. The dotting film 102 is the same size as the semiconductor wafer 101 and rotates synchronously in the same direction. Therefore, the defect identification points on the dotting film 102 correspond to the defect positions of the semiconductor wafer 101. When a defective product appears, the control module controls the servo motor to stop running, and the operator writes the serial number identification points on the transparent dotting film 102 by hand, and then sticks the dotting film 102 on the semiconductor wafer 101 accordingly, so as to facilitate the subsequent manual inspection and analysis of the semiconductor wafer 101.

Claims

1. A semiconductor large wafer defective product inspection and marking mechanism, characterized in that: The invention comprises a workbench (1), a top plate (2), a first supporting column (21), a first L-shaped connecting block (22), a first rotating shaft (3), a shaft sleeve (31), a bearing platform (4), a first rotating disk (5), a second rotating disk (6), a first hanger (7), a second hanger (8), a transmission mechanism and a control module, wherein the first L-shaped connecting block (22) is fixedly mounted on the left and right sides of the workbench (1), the upper and lower ends of the first supporting column (21) are respectively fixedly connected to the top plate (2) and the first L-shaped connecting block (22), two shaft sleeves (31) are fixedly mounted on the workbench (1), the first rotating shaft (3) is rotatably mounted in the shaft sleeve (31), the bearing platform (4) is fixedly mounted on the workbench (1) via the second supporting column (40), the bearing platform (4) is arranged as a transparent structure, a containing groove (51) is arranged in the bearing platform (4), a light source (52) is fixedly mounted in the containing groove (51), and a light source (52) is located in the containing groove (51). A sliding bearing platform (4) is provided at the upper end of the first rotating shaft (3) on the left side, the first rotating disc (5) is fixedly mounted on the top of the first rotating shaft (3) on the left side, the second rotating disc (6) is fixedly mounted on the top of the first rotating shaft (3) on the right side, the first hanging bracket (7) and the second hanging bracket (8) are respectively fixedly mounted on the top plate (2), a CCD camera (71) is fixedly mounted on the first hanging bracket (7), and a dotting device (81) is fixedly mounted on the second hanging bracket (8), a first belt rack (54) and a second belt rack (61) of an annular closed structure are provided on the outer cylindrical surfaces of the first rotating disc (5) and the second rotating disc (6), the CCD camera (71) and the dotting device (81) are respectively located above the right side of the first rotating disc (5) and the second rotating disc (6), and limiting posts (103, 104) are respectively provided on the first rotating disc (5) and the second rotating disc (6) in a 360° annular array with screw connections; The transmission mechanism comprises a motor support (9), a servo motor (91), a drive shaft (82), a first belt gear (92) and a second belt gear (93); the motor support (9) is fixedly mounted on the workbench (1); the servo motor (91) is fixedly mounted on the motor support (9); the drive shaft (82) is rotatably mounted on the top of the motor support (9) via a ball bearing; the drive shaft (82) is transmission-connected to the output shaft of the servo motor (91); the first belt gear (92) and the second belt gear (93) are respectively sleeved and fixedly mounted on the top and middle of the drive shaft (82); the first belt gear (92) is connected to the first belt rack (54) via a belt transmission; the second belt gear (93) is connected to the second belt rack (61) via a belt transmission; The servo motor (91), the CCD camera (71), and the dotting device (81) are respectively connected to the control module via circuits.

2. The semiconductor wafer defective product inspection and dotting mechanism according to claim 1 is characterized in that: A protective cover (11) is fixedly mounted on the top of the workbench (1), and the top of the protective cover (11) protrudes 3-5 cm above the top surfaces of the first rotating disk (5) and the second rotating disk (6).

3. The semiconductor wafer defective product inspection and dotting mechanism according to claim 1 is characterized in that: Serial number identification points are correspondingly arranged on the top surfaces of the limiting columns (103) of the first rotating disk (5) and the second rotating disk (6).

4. The semiconductor wafer defective product inspection and dotting mechanism according to claim 1 is characterized in that: The outer surface of the limiting column (103) is provided with mesh anti-slip patterns.

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