Battery module capable of enhancing heat dissipation

Abstract

The utility model provides a battery module capable of enhancing heat dissipation. The battery module comprises a battery, a circuit mainboard, a shell and a heat conduction structure, the circuit mainboard is provided with one or more heating sources, and the shell is provided with a heat dissipation area with heat dissipation capability; the one or more heat conduction structures are sequentially connected to form a heat conduction path, the starting point of the heat conduction path is connected with one or more heating sources, and the end point of the heat conduction path is connected with one or more heat dissipation areas; at least two heat conduction paths are respectively connected with different heat dissipation areas so as to enhance heat dissipation. According to the battery module capable of enhancing heat dissipation provided by the invention, the internal structure layout of the battery module is optimized, the heat dissipation effect is improved, no noise is caused in the heat dissipation process, and the weight is relatively light; specifically, through the connection arrangement of the heat dissipation structures, different heat dissipation paths are formed, the heat dissipation area is increased, and the layout of the heat dissipation structures is improved, so that the heat dissipation capability and the heat dissipation efficiency are improved, and the heat dissipation of the battery module can be accelerated.

Description

Technical Field

[0001] The present application relates to the field of battery technology, and in particular to a battery module with enhanced heat dissipation. Background Art

[0002] When the battery is in the state of charging and discharging, chemical reactions will occur inside it to generate energy. These energies are released in the form of heat, causing the battery to heat up. Such heating phenomenon is very normal, but excessive heating may cause safety hazards or affect battery performance.

[0003] Take the battery of a photographic light as an example. Since photographic lights usually use high-power light sources, they have higher requirements on the amount of power supplied by the battery. Under long-term, high-intensity operation, the battery is prone to generate a lot of heat, causing the battery to heat up.

[0004] In the prior art, the heat dissipation layout of the battery is poor and the heat dissipation effect is poor, which can easily lead to damage to the battery or the equipment. The heat dissipation of a part of the battery is mainly achieved by setting a fan, which will bring about a series of problems such as increased battery manufacturing cost, increased battery volume, and increased battery weight. Moreover, setting a fan to dissipate heat for the battery will also bring about noise problems, affecting normal shooting.

[0005] Therefore, there is a need for a solution to solve the above problems. Utility Model Content

[0006] In view of the defects in the prior art, the present application proposes a battery module with enhanced heat dissipation, which has a good heat dissipation effect to reduce the temperature of the battery.

[0007] A battery module with enhanced heat dissipation, comprising: a battery, a circuit mainboard, a housing and a heat-conducting structure;

[0008] The battery is electrically connected to the circuit mainboard, one or more heat sources are present on the circuit mainboard, and a heat dissipation area with heat dissipation capability is at least partially present on the housing;

[0009] One or more of the heat-conducting structures are connected in sequence to form a heat-conducting path from the heat source to the heat-dissipating area, the starting point of the heat-conducting path is connected to one or more of the heat sources, and the end point of the heat-conducting path is connected to one or more of the heat-dissipating areas;

[0010] There are at least two heat conduction paths respectively connected to different heat dissipation areas to enhance heat dissipation.

[0011] In a specific embodiment, the heat-conducting structure includes: any one or more of a graphene heat sink, an aluminum alloy heat sink or a heat-conducting silicone member.

[0012] In a specific embodiment, the heat dissipation area is distributed with first heat dissipation holes for air to enter and second heat dissipation holes for air to exit;

[0013] The first heat dissipation hole is located on one side of the shell, and the second heat dissipation hole is located on the other side of the shell, so as to form a heat dissipation duct from the first heat dissipation hole to the second heat dissipation hole.

[0014] In a specific embodiment, the aperture of the first heat dissipation hole is not smaller than the aperture of the second heat dissipation hole, so as to speed up the air circulation speed inside the housing.

[0015] In a specific embodiment, a support member is provided on either or both of the circuit main board and the shell, so as to mount the circuit main board on the shell and form a heat dissipation space between the circuit main board and the shell.

[0016] In a specific embodiment, an electrical connector and a connecting piece are also provided, wherein the electrical connector is used to electrically connect to an external device, one end of the connecting piece is connected to the circuit main board, and the other end of the connecting piece is connected to the electrical connector, so that the electrical connector is mounted on the circuit main board to form a spatial gap between the electrical connector and the circuit main board.

[0017] In a specific embodiment, the outer surface of the shell is evenly distributed with concave and convex structures to increase the heat dissipation area.

[0018] A battery module with enhanced heat dissipation comprises: a battery, a circuit mainboard, a housing and a heat-conducting structure; the battery and the circuit mainboard are both located in the housing;

[0019] The side of the circuit main board facing the battery is the first side; an accommodation space for accommodating the heat-conducting structure is formed between the first side, the battery and the shell;

[0020] There are one or more heat sources on the circuit main board, and there is a heat dissipation area with heat dissipation capability on at least part of the shell 3 facing the first surface. There is at least one heat conduction path from the heat source to the heat dissipation area formed by connecting one or more heat conduction structures in sequence, and the heat conduction path runs through the accommodating space.

[0021] In a specific embodiment, a DC circuit board is further provided on the first surface, and the DC circuit board is horizontally placed in the accommodation space;

[0022] The heat conduction path includes a first section and a second section, the first section respectively connects the circuit main board and the DC circuit board, and the second section respectively connects the DC circuit board and the shell, so as to achieve a compact layout of the battery module.

[0023] In a specific embodiment, the thermally conductive structure includes: any one or more of a graphene heat sink, an aluminum alloy heat sink or a thermally conductive silicone member; the thermally conductive structures in the first section and the second section respectively connected to the circuit main board both include thermally conductive silicone members.

[0024] In a specific embodiment, the circuit main board includes a first area corresponding to the position of the accommodation space and a second area corresponding to other positions;

[0025] The side of the circuit main board facing away from the first side is the second side, one or more heat sources are present on the second side, a heat dissipation area with heat dissipation capability is present on at least part of the shell facing the second side, and at least one heat conduction path is formed by sequentially connecting one or more heat conduction structures; one end of the heat conduction path is connected to the heat source on the second side, and the other end of the heat conduction path is connected to the heat dissipation area on the shell facing the second side;

[0026] The heat conduction path connected to the first surface is used to conduct the heat of the heat source in the first area, and the heat conduction path connected to the second surface is used to conduct the heat of the heat source in the second area.

[0027] In a specific embodiment, the shell facing the first surface includes a metal shell, and the shell facing the second surface includes a non-conductive shell.

[0028] A battery module with enhanced heat dissipation, comprising:

[0029] Insulating housing;

[0030] A heat dissipation housing connected to the insulating housing and enclosing an installation space;

[0031] A circuit main board is arranged in the insulating housing;

[0032] A battery is arranged in the installation space, the battery is electrically connected to the circuit main board; the circuit main board is located between the battery and the insulating shell;

[0033] The first heat-conducting component is connected to the circuit main board and the heat-dissipating housing; the first heat-conducting component and the battery are both located on the same side of the circuit main board.

[0034] In a specific embodiment, the first heat-conducting component includes an input connector, which is electrically connected to the circuit board or the battery, and the insulating housing is provided with a socket for an external power source to be inserted and connected to the input connector.

[0035] In a specific embodiment, the first heat conducting component further includes:

[0036] A first flexible heat-conducting member connects the input connector and the circuit main board; and / or,

[0037] A second flexible heat-conducting member, a heat-conducting plate and a heat-conducting sheet, wherein the second flexible heat-conducting member is connected to the input connector and the heat-conducting plate, and the heat-conducting sheet at least partially adheres to the heat-conducting plate and the heat dissipation housing.

[0038] In a specific embodiment, the first heat-conducting component is arranged on one side of the battery, and in the direction in which the circuit main board faces the battery, the first flexible heat-conducting member, the input connector, the second flexible heat-conducting member, the heat-conducting plate and the heat-conducting sheet are arranged in sequence.

[0039] In a specific embodiment, the battery module with enhanced heat dissipation also includes a second heat-conducting component, which is located on the side of the circuit main board facing away from the battery, and the second heat-conducting component connects the circuit main board and the insulating shell; and / or, the battery module with enhanced heat dissipation is a V-mouth battery module.

[0040] Beneficial effects:

[0041] The present application provides a battery module with enhanced heat dissipation, optimizes the internal structure layout of the battery module, improves the heat dissipation effect, does not cause noise during the heat dissipation process, and has a light weight; specifically, through the connection setting of the heat dissipation structure, different heat dissipation paths are formed, the heat dissipation area is increased, and the heat dissipation structure layout is improved, thereby improving the heat dissipation capacity and heat dissipation efficiency, and can accelerate the dissipation of heat from the battery module. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0043] Figure 1 The battery module structure of this embodiment explodes Figure 1 ;

[0044] Figure 2 The battery module structure of this embodiment explodes Figure 2 ;

[0045] Figure 3 A magnified view of the battery module details of this embodiment Figure 1 ;

[0046] Figure 4 A magnified view of the battery module details of this embodiment Figure 2 ;

[0047] Figure 5 is a cross-sectional view of the battery module of this embodiment;

[0048] Figure 6 The battery module of this embodiment is three-dimensional Figure 1 ;

[0049] Figure 7 The battery module of this embodiment is three-dimensional Figure 2 .

[0050] Reference numerals:

[0051] 1-battery; 2-circuit board; 21-heat source; 22-DC circuit board; 23-electronic components; 24-first side; 25-second side; 3-shell; 31-upper shell; 32-bottom shell; 33-heat dissipation area; 4-thermal conductive structure; 41-graphene heat sink; 42-aluminum alloy heat sink; 43-thermal conductive silicone member; 44-thermal conductive path; 441-first section; 442-second section; 51-first heat dissipation hole; 52-second heat dissipation hole; 60-connector; 61-electric connector; 62-support member; 7-concave-convex structure; 81-clip; 82-slot; 9-accommodating space. DETAILED DESCRIPTION

[0052] In the following, various embodiments of the present disclosure will be described more fully. The present disclosure may have various embodiments, and adjustments and changes may be made therein. However, it should be understood that there is no intention to limit the various embodiments of the present disclosure to the specific embodiments disclosed herein, but rather the present disclosure should be understood to cover all adjustments, equivalents and / or alternatives that fall within the spirit and scope of the various embodiments of the present disclosure.

[0053] Hereinafter, the terms "include" or "may include" used in various embodiments of the present disclosure indicate the presence of disclosed functions, operations, or elements, and do not limit the addition of one or more functions, operations, or elements. In addition, as used in various embodiments of the present disclosure, the terms "include", "have", and their cognates are intended only to indicate specific features, numbers, steps, operations, elements, components, or a combination of the foregoing, and should not be understood as first excluding the presence of one or more other features, numbers, steps, operations, elements, components, or a combination of the foregoing or the possibility of adding one or more features, numbers, steps, operations, elements, components, or a combination of the foregoing.

[0054] In various embodiments of the present disclosure, the expression "or" or "at least one of A or / and B" includes any combination or all combinations of the words listed at the same time. For example, the expression "A or B" or "at least one of A or / and B" may include A, may include B, or may include both A and B.

[0055] The expressions (such as "first", "second", etc.) used in the various embodiments of the present disclosure may modify the various constituent elements in the various embodiments, but may not limit the corresponding constituent elements. For example, the above expressions do not limit the order and / or importance of the elements. The above expressions are only used for the purpose of distinguishing one element from other elements. For example, the first user device and the second user device indicate different user devices, although both are user devices. For example, without departing from the scope of the various embodiments of the present disclosure, the first element may be referred to as the second element, and similarly, the second element may also be referred to as the first element.

[0056] It should be noted that if it is described that one component element is “connected” to another component element, the first component element may be directly connected to the second component element, and a third component element may be “connected” between the first component element and the second component element. Conversely, when one component element is “directly connected” to another component element, it can be understood that there is no third component element between the first component element and the second component element.

[0057] The term “user” used in various embodiments of the present disclosure may indicate a person using an electronic device or a device (eg, an artificial intelligence electronic device) using the electronic device.

[0058] The terms used in the various embodiments of the present disclosure are only used for the purpose of describing specific embodiments and are not intended to limit the various embodiments of the present disclosure. As used herein, the singular form is intended to also include the plural form, unless the context clearly indicates otherwise. Unless otherwise defined, all terms (including technical terms and scientific terms) used herein have the same meaning as the meanings commonly understood by ordinary technicians in the field to which the various embodiments of the present disclosure belong. The terms (such as the terms defined in the generally used dictionary) will be interpreted as having the same meaning as the contextual meaning in the relevant technical field and will not be interpreted as having an idealized meaning or an overly formal meaning, unless clearly defined in the various embodiments of the present disclosure.

[0059] Example 1

[0060] The present application embodiment provides a battery module with enhanced heat dissipation, such as Figures 1 to 7 As shown, it includes: a battery 1, a circuit main board 2, a housing 3 and a heat-conducting structure 4;

[0061] The battery 1 is electrically connected to the circuit board 2. There are one or more heat sources 21 on the circuit board 2. At least part of the housing 3 has a heat dissipation area 33 with heat dissipation capability. Figure 5 As shown, the elliptical dotted area in the figure is the approximate area range of the heat source 21, and the rectangular dotted area in the figure is the approximate area range of the heat dissipation area 33. Of course, there is no limitation on the number and positional relationship of the heat source 21 and the heat dissipation area 33.

[0062] One or more heat-conducting structures 4 are connected in sequence to form a heat-conducting path 44 from the heat source 21 to the heat dissipation area 33. In some embodiments of the present application, for example Figure 1 , Figure 2 , Figure 3 and Figure 5 As shown, the arrow direction is the approximate direction of the heat conduction path 44. Of course, there is no limitation on the specific direction of the heat conduction path 44, which can be determined according to the internal space shape of the battery module.

[0063] Optionally, a heat-conducting path 44 can be formed by a heat-conducting structure 4, or by a combination of multiple heat-conducting structures 4. By connecting the heat-conducting structures 4 in sequence, heat can be transferred in sequence and gradually dissipated, forming a sequential heat-conducting and heat-dissipating effect. Each heat-conducting structure 4 can absorb, conduct and dissipate heat at different positions, thereby achieving hierarchical heat dissipation, avoiding excessive reliance on a single heat-conducting structure 4, effectively utilizing the internal space of the entire battery module, and achieving a more efficient heat dissipation effect.

[0064] Through the arrangement of the heat-conducting structure 4, the starting point of the heat-conducting path 44 can be connected to one or more heat sources 21, and the end point of the heat-conducting path 44 can be connected to one or more heat-dissipating areas 33;

[0065] Among them, a heat conduction path 44 can connect a heat source 21 and a heat dissipation area 33, a heat conduction path 44 can also connect a heat source 21 and multiple heat dissipation areas 33, a heat conduction path 44 can also connect multiple heat sources 21 and a heat dissipation area 33; a heat conduction path 44 can also connect multiple heat sources 21 and multiple heat dissipation areas 33 at the same time.

[0066] Of course, there is no limitation on the number of heat sources 21 and the number of heat dissipation areas 33 connected to the heat conduction path 44 , and they can be adjusted according to actual design.

[0067] It can be understood that the heat conduction path 44 is used to conduct the heat generated by the heat source 21 to the heat dissipation area 33, which speeds up the conduction and dissipation of heat to achieve the effect of accelerating the heat dissipation and cooling of the circuit mainboard 2, thereby reducing the temperature of the battery module and facilitating the normal operation of the battery module.

[0068] There are at least two heat conduction paths 44 respectively connected to different heat dissipation areas 33 to enhance heat dissipation.

[0069] The heat source 21 is connected to the heat dissipation area 33 through the heat conduction path 44 formed by the heat conduction structure 4. At least two heat conduction paths 44 connecting different heat dissipation areas 33 achieve a relatively good heat conduction effect, fully utilize the contact surface between the shell 3 and the outside world, and disperse the heat to different heat dissipation areas 33 of the shell 3, thereby improving the heat conduction efficiency of the heat source 21, increasing the heat dissipation area of ​​the heat dissipation area 33, and improving the overall heat dissipation function of the battery module, which is beneficial to improving the cooling speed of the battery module.

[0070] Specifically, in some embodiments of the present application, two heat conduction paths 44 are formed, one for conducting the heat on the circuit main board 2 to the upper shell 31, and the other for conducting the heat on the circuit main board 2 to the bottom shell 32;

[0071] Among them, the heat conduction path 44 used to conduct the heat on the circuit main board 2 to the upper shell 31 is formed by a combination of a thermally conductive silicone component 43 and a graphene heat sink 41, and another heat conduction path 44 is formed by a thermally conductive silicone component 43, a DC circuit board 22, another thermally conductive silicone component 43, an aluminum alloy heat sink 42, and a graphene heat sink 41 which are spliced ​​and combined in sequence.

[0072] Furthermore, the heat-conducting structure 4 includes any one or more of a graphene heat sink 41 , an aluminum alloy heat sink 42 or a heat-conducting silicone member 43 .

[0073] The graphene heat sink 41, the aluminum alloy heat sink 42, and the thermally conductive silicone member 43 all have good thermal conductivity, and can quickly conduct heat away from the heat source 21, effectively reduce the temperature of the battery module, and maintain its normal working state; wherein, the graphene heat sink 41 and the aluminum alloy heat sink 42 have low density and weight, and can reduce the overall weight of the device; the aluminum alloy heat sink 42 also has good plasticity, and can be processed and manufactured according to the shape and size of the device, so as to better meet the heat dissipation requirements of different regions; the thermally conductive silicone member 43 can fill the small gaps between the thermally conductive structures 4, so that the heat can be evenly conducted to the surface of the heat dissipation area 33 of the shell 3, thereby improving the heat dissipation efficiency;

[0074] It can be understood that the combination of the heat-conducting structures 4 such as the graphene heat sink 41, the aluminum alloy heat sink 42, and the heat-conducting silicone member 43 can be determined according to actual use requirements, and has strong flexibility and versatility;

[0075] Illustratively, in some embodiments of the present application, a DC circuit board 22 is also provided, and the DC circuit board 22 is connected to the circuit main board 2 via a thermally conductive silicone member 43 to achieve uniform and stable heat conduction, thereby helping to improve heat dissipation efficiency and reduce the temperature of the circuit main board 2.

[0076] Further, in some other embodiments of the present application, such as Figure 6 As shown, the heat dissipation area 33 is distributed with first heat dissipation holes 51 for air entry and second heat dissipation holes 52 for air exhaust; the first heat dissipation holes 51 are located on one side of the shell 3, and the second heat dissipation holes 52 are located on the other side of the shell 3 corresponding to the first heat dissipation holes 51, so as to form a heat dissipation duct from the first heat dissipation holes 51 to the second heat dissipation holes 52.

[0077] The first heat dissipation hole 51 helps air to enter the interior of the battery module, and the second heat dissipation hole 52 helps air to be discharged from the interior of the battery module, thereby forming air flow to prevent the device from overheating, improve performance and stability, prevent internal components from being damaged by high temperature, and extend the service life of the device.

[0078] Furthermore, the aperture of the first heat dissipation hole 51 is not smaller than the aperture of the second heat dissipation hole 52 .

[0079] The first heat dissipation hole 51 introduces fresh air, and the second heat dissipation hole 52 discharges hot air, so that the air flows more smoothly in the heat dissipation duct, the air circulation speed is accelerated, and the heat dissipation efficiency is improved; the aperture of the first heat dissipation hole 51 is not smaller than that of the second heat dissipation hole 52, and sufficient fresh air can be quickly introduced, and the air that helps to complete the heat exchange can be quickly discharged, avoiding heat retention and accumulation in the heat dissipation duct, so as to effectively reduce the temperature of the battery module, and then help to balance the temperature distribution in the entire heat dissipation duct, thereby improving the heat dissipation stability and the heat dissipation efficiency.

[0080] Furthermore, in some embodiments of the present application, a side of the circuit main board 2 close to the heat dissipation duct is further provided with wavy heat dissipation fins (not shown in the figure), and all the heat dissipation fins are distributed at equal intervals;

[0081] The extension direction of all the heat dissipation fins is parallel or approximately parallel to the air flow direction of the heat dissipation air duct.

[0082] By designing the heat dissipation fins with equal spacing, the surface area of ​​the circuit board 2 can be further effectively increased, thereby increasing the heat dissipation efficiency; specifically, in some embodiments of the present application, the extension direction of the heat dissipation fins is arranged parallel to the direction of the heat dissipation air duct, which helps to reduce the obstruction of the heat dissipation fins when the gas flows in the heat dissipation air duct, reduces the friction, and allows the gas to pass more smoothly, thereby increasing the heat dissipation speed;

[0083] On the other hand, when the gas passes through the heat dissipation duct, it can fully contact the outer surface of the heat dissipation fins, thereby improving the heat dissipation efficiency and optimizing the heat dissipation effect;

[0084] On the other hand, it is also beneficial to maintain the consistency of gas flow direction when the air in the heat dissipation duct area flows through the heat dissipation fins, thereby optimizing the heat dissipation performance.

[0085] The cooling fins are wavy in shape, which can improve air flow, increase heat dissipation efficiency and reduce noise generation.

[0086] Furthermore, if Figure 1 and Figure 5 As shown, an electrical connector 61 and a connecting member 60 are also provided. The electrical connector 61 is used to electrically connect to an external device. One end of the connecting member 60 is connected to the circuit main board 2, and the other end of the connecting member 60 is connected to the electrical connector 61. The electrical connector 61 is connected to the circuit main board 2 through the connecting member 60, so that the electrical connector 61 is mounted on the circuit main board 2, forming a spatial gap between the electrical connector 61 and the circuit main board 2.

[0087] The electrical connector 61 can be used to connect external devices such as photographic lights to provide power to the photographic lights, but the metal contacts of the electrical connector 61 are prone to heat up because they need to transmit current. The connection through the connector 60 makes the electrical connector 61 not in direct contact with the circuit main board 2, but there is a certain space gap. On the one hand, the space gap avoids the accumulation of heat between the electrical connector 61 and the circuit main board 2, and on the other hand, it allows air to flow, which helps the electrical connector 61 to dissipate heat, so as to further optimize the heat dissipation effect of the battery module.

[0088] Furthermore, a support member 62 is provided on either or both of the circuit main board 2 and the housing 3 , so as to mount the circuit main board 2 on the housing 3 and form a heat dissipation space between the circuit main board 2 and the housing 3 .

[0089] Under the action of the support member 62, the circuit main board 2 is suspended relative to the inner bottom wall of the bottom shell 32, which effectively increases the space between the circuit main board 2 and the shell 3, helps to promote heat exchange between the air and the heat source 21, and improves the heat dissipation efficiency; it also improves the spatial layout inside the shell 3, thereby improving the internal air circulation conditions, optimizing the air flow in the heat dissipation space, and promoting the rapid dissipation of heat.

[0090] Furthermore, the heat dissipation area 33 of the shell 3 includes a shell 3 at least partially made of aluminum or a shell 3 at least partially made of aluminum alloy material, and / or the outer surface of the heat dissipation area 33 is also provided with a heat dissipation coating (not shown in the figure).

[0091] The aluminum shell or aluminum alloy shell has good thermal conductivity and heat dissipation, which is convenient for dissipating heat, reducing the surface temperature of the battery module, avoiding overheating of the battery 1, and protecting the normal operation of the battery 1;

[0092] Aluminum alloy has a low density, and using aluminum alloy can reduce the overall weight of the battery module, making it easier to carry and install.

[0093] The heat dissipation coating generally has a high thermal conductivity, which can improve the thermal conductivity of the surface of the heat dissipation area 33. Heat can be conducted more quickly from the inside of the battery 1 to the surface of the heat dissipation area 33, and quickly dissipated to the surrounding environment, thereby improving the heat dissipation efficiency.

[0094] Optionally, the heat dissipation coating may use metal coatings such as copper and aluminum, or ceramic coatings with high thermal conductivity; a heat-resistant polymer coating; or a thermal conductive paste.

[0095] It is understandable that there is no limitation on the specific selection of the heat dissipation coating material.

[0096] Furthermore, if Figure 7 As shown, the outer surface of the housing 3 is also provided with a concave-convex structure 7 to increase the heat dissipation area.

[0097] The concave-convex structure 7 can change the direction and speed of air flow on the surface of the shell 3, effectively increase the heat dissipation surface area, accelerate the conduction and dissipation of heat, and improve the heat dissipation efficiency; the design of the concave-convex structure 7 helps heat to be dissipated from the surface of the shell 3 faster, thereby reducing the operating temperature of the battery module.

[0098] The concave-convex structure 7 can not only improve the heat dissipation effect, but also increase the friction force to prevent the battery module from slipping during use; in addition, the concave-convex structure 7 can also enhance the structural strength of the entire battery module.

[0099] Furthermore, the housing 3 includes an upper housing 31 and a bottom housing 32, and the battery 1, the circuit board 2 and the heat-conducting structure 4 are all located in the internal space formed by the housing 3;

[0100] One of the upper shell 31 and the bottom shell 32 is provided with a buckle 81 , and the other of the two is provided with a slot 82 . The buckle 81 is engaged with the slot 82 to achieve a detachable connection between the upper shell 31 and the bottom shell 32 .

[0101] Optionally, the buckle 81 can be provided on the upper shell 31 or on the bottom shell 32; the slot 82 can be provided on the bottom shell 32 or on the upper shell 31;

[0102] Specifically, in some embodiments of the present application, the buckle 81 is arranged on the upper shell 31 and the slot 82 is arranged on the bottom shell 32. The detachable connection between the buckle 81 and the slot 82 facilitates the installation and maintenance of the battery module.

[0103] Of course, there is no limitation on the design of the specific positions of the buckle 81 and the slot 82 .

[0104] The embodiments of the present application have at least the following beneficial effects:

[0105] The present application provides a battery module with enhanced heat dissipation, optimizes the internal structure layout of the battery module, optimizes the heat dissipation effect, does not cause noise during the heat dissipation process, and is lightweight; specifically, through the connection setting of the heat-conducting structure 4, different heat-conducting paths 44 are formed, the heat dissipation area is increased, the heat dissipation structure layout is improved, and the heat dissipation capacity is improved, which can accelerate the heat dissipation of the battery module;

[0106] A support member 62 is provided to form a heat dissipation space, which is beneficial for the circuit main board 2 to fully contact with the air and complete the heat exchange; a first heat dissipation hole 51 and a second heat dissipation hole 52 are provided to form a heat dissipation air duct, which improves the air circulation speed inside the battery 1 and accelerates the heat exchange. The aperture of the first heat dissipation hole 51 is not less than the aperture of the second heat dissipation hole 52, so that hot air is not easy to gather in the heat dissipation air duct, further optimizing the heat dissipation effect.

[0107] Example 2

[0108] A battery module with enhanced heat dissipation includes: a battery 1, a circuit main board 2, a housing 3 and a heat-conducting structure 4; the battery 1 and the circuit main board 2 are both located in the housing 3;

[0109] The side of the circuit board 2 facing the battery 1 is a first side 24; an accommodation space 9 for accommodating the heat-conducting structure 4 is formed between the first side 24, the battery 1 and the housing 3;

[0110] There are one or more heat sources 21 on the circuit main board 2, and there is a heat dissipation area 33 with heat dissipation capability on at least a portion of the shell 3 facing the first surface 24. There is at least one heat conduction path 44 from the heat source 21 to the heat dissipation area 33 formed by connecting one or more heat conduction structures 4 in sequence, and the heat conduction path 44 runs through the accommodating space.

[0111] Specifically, in some embodiments of the present application, the heat dissipation area 33 is located on the top wall and the side wall of the housing 3 . Of course, there is no limitation on the arrangement of the heat dissipation area 33 .

[0112] It can be understood that the above structural design makes full use of the remaining storage space 9 between the circuit main board 2, the battery 1 and the shell 3, optimizes the layout of various components in the limited space, and makes the overall structure of the battery 1 module more compact, thereby improving the space utilization rate and allowing the battery module to develop in the direction of miniaturization; at the same time, arranging the heat conduction path 44 in the storage space 9 can also facilitate installation, and the outer wall shape restriction of the storage space 9 also helps to enhance the stability of the connection of the heat conduction path 44.

[0113] Furthermore, a DC circuit board 22 is also provided on the first surface 24, and the DC circuit board 22 is horizontally placed in the accommodation space 9;

[0114] The heat conduction path 44 includes a first section 441 and a second section 442 . The first section 441 is respectively connected to the circuit main board 2 and the DC circuit board 22 , and the second section 442 is respectively connected to the DC circuit board 22 and the housing 3 , so as to realize a compact layout of the battery module.

[0115] It can be understood that the above structural design also indirectly utilizes the DC circuit board 22 to connect with the heat conduction path 44. On the one hand, there is no need to change the positional relationship between the DC circuit board 22 and the circuit main board 2; on the other hand, the DC circuit board 22 together constitutes a part of the heat conduction path 44, saving the material cost of the heat conduction structure 4; finally, the heat conduction path 44 does not need to bypass the DC circuit board 22, and there is no need to change the specific setting position of the heat conduction path 44, so that the heat conduction route is more direct, which facilitates the heat to be conducted to the shell 3 more quickly, thereby optimizing the heat dissipation effect.

[0116] Furthermore, if Figure 3 As shown, the thermal conductive structure 4 includes: any one or more of a graphene heat sink 41, an aluminum alloy heat sink 42 or a thermal conductive silicone member 43; the thermal conductive structures 4 respectively connected to the circuit main board 2 in the first section 441 and the second section 442 both include a thermal conductive silicone member 43.

[0117] Since the thermal conductivity of the DC circuit board 22 itself is not excellent, the thermal conductive structure 4 in direct contact with the DC circuit board 22 needs to have good thermal conductivity to achieve effective heat conduction;

[0118] The thermally conductive silicone component 43 is made of a polymer silicone material, which has relatively good thermal conductivity and can effectively transfer heat from the heat source 21 to the heat dissipation area 33, so that the temperature of the DC circuit board 22 and the electronic components 23 is stable; the thermally conductive silicone component 43 also has excellent plasticity and adaptability, and can be directly coated or sprayed where heat conduction is required, conforming to various complex geometric shapes. The DC circuit board 22 has a relatively irregular shape and surface, and the thermally conductive silicone component 43 is just suitable for connection with the DC circuit board 22; the thermally conductive silicone component 43 also has special high temperature tolerance and good electrical insulation, and can work in different high temperature environments, so that the circuit main board 2, the DC circuit board 22 and the electronic components 23 will not have safety problems such as electrical short circuit or leakage during the heat conduction process.

[0119] Furthermore, if Figure 2 , Figure 4 as well as Figure 5 As shown, the circuit board 2 includes a first area corresponding to the position of the accommodation space 9 and a second area corresponding to other positions;

[0120] The side of the circuit board 2 facing away from the first side 24 is the second side 25. There are one or more heat sources 21 on the second side 25. There is at least a portion of a heat dissipation area 33 with heat dissipation capability on the housing 3 facing the second side 25. There is at least one heat conduction path 44 formed by connecting one or more heat conduction structures 4 in sequence. One end of the heat conduction path 44 is connected to the heat source 21 on the second side 25, and the other end of the heat conduction path 44 is connected to the heat dissipation area 33 on the housing 3 facing the second side 25.

[0121] The heat conduction path 44 connected to the first surface 24 is used to conduct the heat of the heat source 21 in the first area, and the heat conduction path 44 connected to the second surface 25 is used to conduct the heat of the heat source 21 in the second area.

[0122] By dividing the heat sources 21 on the circuit main board 2 into the heat sources 21 in the first area and the heat sources 21 in the second area according to the positional relationship, and designing the heat conduction paths 44 respectively, the heat in different areas can be conducted separately, and the position design of the heat conduction paths 44 is optimized, so that the heat on the entire circuit main board 2 can be effectively conducted through different heat conduction paths 44, reducing the risk of local overheating of the circuit main board 2; it also avoids heat cross interference and improves the heat dissipation efficiency.

[0123] Further, the housing 3 facing the first surface 24 includes a metal housing, and the housing 3 facing the second surface 25 includes a non-conductive housing.

[0124] The metal shell has good thermal conductivity and can more effectively conduct and dissipate the heat of the heat source 21 in the first area, while the non-conductive shell can prevent accidental conduction of current in the second area, while providing electrical insulation protection and improving safety.

[0125] Specifically, in some embodiments of the present application, the shell 3 facing the first surface 24 is an aluminum alloy shell, and the shell 3 facing the second surface 25 is a plastic shell.

[0126] Furthermore, if Figure 3 As shown, the DC circuit board 22 is further provided with electronic components 23 on one side away from the circuit main board 2;

[0127] The sum of the thickness of any electronic component 23 on the DC circuit board 22 and the heat-conducting structure 4 in direct contact therewith is not greater than the height of the highest electronic component 231 .

[0128] Regarding the related design of the thickness and height between the electronic components 23 and the thermal conductive structure 4, the volume and thickness of the thermal conductive structure 4 are restricted, so that the connection with the thermal conductive structure 4 can be achieved without changing the original size of the DC circuit board 22, so that the contact between the thermal conductive structure 4 and the DC circuit board 22 is relatively close, and the heat dissipation function of the thermal conductive structure 4 can be maximized to prevent the occurrence of overheating; in addition, the space on the DC circuit board 22 is limited. Through the compact design of the electronic components 23 and the thermal conductive structure 4, the space on the DC circuit board 22 can be more effectively utilized, the space utilization rate can be improved, and the compact design can be further realized.

[0129] The embodiments of the present application have at least the following beneficial effects:

[0130] By optimizing the position setting of the heat conduction path 44, the height limit of the heat conduction structure 4 and the electronic components 23, the spatial layout inside the battery 1 module is optimized, and while achieving good thermal conductivity and heat dissipation effects, a compact structural layout is also achieved, which helps to reduce the overall volume of the battery module.

[0131] The rest of the contents that are the same as those in Example 1 are not repeated here.

[0132] Example 3

[0133] A battery module with enhanced heat dissipation, comprising:

[0134] Insulating housing;

[0135] The heat dissipation housing is connected to the insulating housing and encloses an installation space;

[0136] Optionally, the heat dissipation housing is usually made of metal materials, such as aluminum alloy or copper, which has good thermal conductivity and can quickly conduct heat to the external environment, thereby improving the heat dissipation performance of the battery module.

[0137] A circuit main board is arranged in the insulating housing;

[0138] Optionally, the insulating shell is usually made of insulating materials, such as plastic, rubber, ceramics, etc., and has good insulation properties. Placing the circuit board in the insulating shell can effectively isolate the circuit, achieve safe operation of the battery module, and improve the safety performance of the battery module.

[0139] The battery is arranged in the installation space, and the battery is electrically connected to the circuit main board; the circuit main board is located between the battery and the insulating shell;

[0140] The first heat-conducting component is connected to the circuit mainboard and the heat-dissipating housing; the first heat-conducting component and the battery are both located on the same side of the circuit mainboard.

[0141] Understandably, on the one hand, the side of the circuit board electrically connected to the battery is usually connected to the positive and negative electrodes of the battery, which often generates a lot of heat during the charging and discharging process, and is one of the main sources of heat generated by the circuit board. This side is also usually provided with electronic components, which often generate a certain amount of heat when the electronic components are working. The first heat-conducting component and the battery are both located on the same side of the circuit board, which gives priority to strengthening the heat dissipation function of this side, so that the heat dissipation function matches the heat generation. At the same time, the distance to the heat source is relatively close, and the heat generated by the circuit board can also be effectively conducted to the heat dissipation housing, which promotes the dissipation of heat and plays a timely cooling effect, so that the battery is kept in a relatively low temperature environment, reducing safety hazards;

[0142] On the other hand, the first heat-conducting component and the battery being located on the same side also help to make full use of the installation space and improve the space utilization inside the battery module. Placing the first heat-conducting component and the battery together in the installation space realizes a compact setting, which can avoid the overlapping of the battery module in thickness and width directions and enhance the portability of the battery module.

[0143] Furthermore, the first heat-conducting component includes an input connector, which is electrically connected to the circuit board or the battery, and the insulating housing is provided with a socket for an external power source to be inserted and connected to the input connector.

[0144] It can be understood that the provision of the access plug enhances the scalability of the battery module, and the insulating shell is provided with a socket for plugging in an external power source. Due to the insulating properties of the insulating shell, the safety performance of the external power source during charging is enhanced.

[0145] The input plug will also generate a certain amount of heat during the current transmission process. Using the input plug as a component of the first heat-conducting component can directly and effectively conduct the heat generated by the input plug away, thereby cooling the input plug and further facilitating the heat dissipation inside the battery module. At the same time, the position characteristics of the input plug in the internal space of the battery module are also utilized, and it is used as a part of the first heat-conducting component, rather than avoiding the input plug to achieve the position setting of the first heat-conducting component, which helps to further achieve a compact layout of the internal space.

[0146] Specifically, in some embodiments of the present application, the first heat conducting component further includes:

[0147] A first flexible heat conductive member connects the input connector and the circuit board; and / or a second flexible heat conductive member, a heat conductive plate and a heat conductive sheet, wherein the second flexible heat conductive member connects the input connector and the heat conductive plate, and the heat conductive sheet at least partially fits the heat conductive plate and the heat dissipation housing.

[0148] The shapes of the input plug and the circuit main board are relatively irregular, and to achieve a good thermal conductivity effect, the thermal conductive component must be in full contact with the input plug and / or the circuit main board. The connecting parts of the first thermal conductive component and the input connector and / or the circuit main board are the first flexible thermal conductive part and the second flexible thermal conductive part, which have stronger flexibility and adaptability, and can make the first thermal conductive component fully contact with the input connector and the circuit main board, effectively increasing the contact area, facilitating the full and effective conduction of heat, and realizing the cooling of the battery module; it also helps to reduce the mechanical stress of the connection part, plays a role in buffering and shock absorption, reduces the pressure on the input connector and the circuit main board, avoids connection problems caused by thermal expansion and contraction, and thus improves the reliability of the connection.

[0149] Optionally, the first flexible heat-conducting member and the second flexible heat-conducting member are usually made of silicone, polyester film or polyimide film, etc. Of course, there is no limitation on the selection of specific materials.

[0150] Preferably, the heat conducting sheet fully fits the heat conducting plate and the heat dissipation housing, which helps the heat conducting sheet to fully contact the heat conducting plate and the heat dissipation housing, increase the contact area, and then increase the heat conduction area and heat dissipation area, thereby improving the heat dissipation efficiency and heat dissipation performance.

[0151] Furthermore, the first heat-conducting component is arranged on one side of the battery, and in the direction where the circuit main board faces the battery, the first flexible heat-conducting member, the input connector, the second flexible heat-conducting member, the heat-conducting plate and the heat-conducting sheet are arranged in sequence.

[0152] Through the above arrangement, the first heat-conducting component can receive heat from the circuit main board more directly, and then conduct it to the heat-conducting plate and the heat-conducting sheet through the first flexible heat-conducting part, the input connector, the second flexible heat-conducting part and other components, so as to conduct and dissipate heat step by step in sequence, thereby improving the overall heat dissipation effect.

[0153] In addition, the combined arrangement of the first flexible heat conductive member, the input connector, the second flexible heat conductive member, the heat conductive plate and the heat conductive sheet adapts to the complex and irregular space inside the battery module, thereby achieving effective heat conduction to the heat dissipation housing.

[0154] Furthermore, the heat dissipation enhanced battery module further includes a second heat conducting component, the second heat conducting component is located on a side of the circuit main board facing away from the battery, and the second heat conducting component is connected to the circuit main board and the insulating shell;

[0155] Specifically, in some embodiments of the present application, the battery module with enhanced heat dissipation is a V-mount battery module.

[0156] By differently setting the heat conduction direction, heat conduction area, and heat dissipation area of ​​the first heat-conducting component and the second heat-conducting component, heat can be more evenly conducted and dissipated in different areas and directions, thereby improving the overall heat dissipation effect of the battery module and avoiding local overheating problems caused by the relatively single setting position of the heat-conducting component; the heat conduction direction and conduction area can be adjusted in a targeted manner, thereby improving the heat conduction efficiency, avoiding cross-interference between different heat sources, and optimizing the heat conduction and heat dissipation effects.

[0157] The embodiments of the present application have at least the following beneficial effects:

[0158] By arranging the positions of the insulating shell, the heat dissipation shell, the circuit main board, the battery, and the first heat-conducting component, the first heat-conducting component can be closer to the main area where heat is generated and fully contact it, so as to conduct heat away in a timely and effective manner, improve the heat dissipation efficiency, reduce the safety hazards of the battery module, optimize the space layout inside the battery module, and improve the space utilization rate.

[0159] Those skilled in the art will appreciate that the accompanying drawings are merely schematic diagrams of a preferred implementation scenario, and the modules or processes in the accompanying drawings are not necessarily required for implementing the present application.

[0160] Those skilled in the art will appreciate that the modules in the device in the implementation scenario can be distributed in the device in the implementation scenario according to the implementation scenario description, or can be changed accordingly and located in one or more devices different from the implementation scenario. The modules in the above implementation scenario can be combined into one module, or can be further split into multiple sub-modules.

[0161] The above application serial numbers are for description only and do not represent the advantages or disadvantages of the implementation scenarios.

[0162] The above disclosure only discloses several specific implementation scenarios of the present application. However, the present application is not limited thereto, and any changes that can be conceived by technicians in this field should fall within the scope of protection of the present application.

Claims

1. A battery module with enhanced heat dissipation, characterized in that: include: Battery, circuit board, housing and heat conduction structure; The battery is electrically connected to the circuit mainboard, one or more heat sources are present on the circuit mainboard, and a heat dissipation area with heat dissipation capability is at least partially present on the housing; One or more of the heat-conducting structures are connected in sequence to form a heat-conducting path from the heat source to the heat-dissipating area, the starting point of the heat-conducting path is connected to one or more of the heat sources, and the end point of the heat-conducting path is connected to one or more of the heat-dissipating areas; There are at least two heat conduction paths respectively connected to different heat dissipation areas to enhance heat dissipation.

2. A battery module with enhanced heat dissipation according to claim 1, characterized in that: The heat-conducting structure includes: any one or more of a graphene heat sink, an aluminum alloy heat sink or a heat-conducting silicone member.

3. A battery module with enhanced heat dissipation according to claim 1, characterized in that: The heat dissipation area is provided with first heat dissipation holes for air to enter and second heat dissipation holes for air to be discharged; The first heat dissipation hole is located on one side of the shell, and the second heat dissipation hole is located on the other side of the shell, so as to form a heat dissipation duct from the first heat dissipation hole to the second heat dissipation hole.

4. A battery module with enhanced heat dissipation according to claim 3, characterized in that: The aperture of the first heat dissipation hole is not smaller than the aperture of the second heat dissipation hole, so as to speed up the air circulation speed inside the housing.

5. A battery module with enhanced heat dissipation according to claim 1, characterized in that: A support member is provided on either or both of the circuit main board and the shell, so as to mount the circuit main board on the shell and form a heat dissipation space between the circuit main board and the shell.

6. A battery module with enhanced heat dissipation according to claim 1, characterized in that: An electrical connector and a connecting piece are also provided. The electrical connector is used to electrically connect to an external device. One end of the connecting piece is connected to the circuit main board, and the other end of the connecting piece is connected to the electrical connector, so that the electrical connector is mounted on the circuit main board to form a space gap between the electrical connector and the circuit main board.

7. A battery module with enhanced heat dissipation according to claim 1, characterized in that: The outer surface of the shell is also evenly distributed with concave and convex structures to increase the heat dissipation area.

8. A battery module with enhanced heat dissipation, characterized in that: include: A battery, a circuit board, a housing and a heat-conducting structure; the battery and the circuit board are both located in the housing; The side of the circuit board facing the battery is the first side; An accommodation space for accommodating the heat-conducting structure is formed between the first surface, the battery and the shell; There are one or more heat sources on the circuit main board, and there is a heat dissipation area with heat dissipation capability on at least a portion of the shell facing the first surface. There is at least one heat conduction path from the heat source to the heat dissipation area formed by connecting one or more heat conduction structures in sequence, and the heat conduction path runs through the accommodating space.

9. A battery module with enhanced heat dissipation according to claim 8, characterized in that: A DC circuit board is also provided on the first surface, and the DC circuit board is horizontally placed in the accommodation space; The heat conduction path includes a first section and a second section, the first section respectively connects the circuit main board and the DC circuit board, and the second section respectively connects the DC circuit board and the shell, so as to achieve a compact layout of the battery module.

10. A battery module with enhanced heat dissipation according to claim 9, characterized in that: The heat-conducting structure includes: any one or more of a graphene heat sink, an aluminum alloy heat sink or a heat-conducting silicone member; the heat-conducting structures in the first section and the second section respectively connected to the circuit main board both include a heat-conducting silicone member.

11. A battery module with enhanced heat dissipation according to claim 8, characterized in that: The circuit main board includes a first area and a second area corresponding to the position of the accommodation space; The side of the circuit main board facing away from the first side is the second side, one or more heat sources are present on the second side, at least a portion of the housing facing the second side has a heat dissipation area with heat dissipation capability, and at least one heat conduction path formed by sequentially connecting one or more heat conduction structures is present; One end of the heat conduction path is connected to the heat source on the second surface, and the other end of the heat conduction path is connected to the heat dissipation area on the housing facing the second surface; The heat conduction path connected to the first surface is used to conduct the heat of the heat source in the first area, and the heat conduction path connected to the second surface is used to conduct the heat of the heat source in the second area.

12. A battery module with enhanced heat dissipation according to claim 11, characterized in that: The shell facing the first surface includes a metal shell, and the shell facing the second surface includes a non-conductive shell.

13. A battery module with enhanced heat dissipation, characterized in that: include: Insulating housing; A heat dissipation housing connected to the insulating housing and enclosing an installation space; A circuit main board is arranged in the insulating housing; A battery is arranged in the installation space, the battery is electrically connected to the circuit main board; the circuit main board is located between the battery and the insulating shell; The first heat-conducting component is connected to the circuit main board and the heat-dissipating housing; the first heat-conducting component and the battery are both located on the same side of the circuit main board.

14. A battery module with enhanced heat dissipation according to claim 13, characterized in that: The first heat-conducting component includes an input connector, which is electrically connected to the circuit board or the battery. The insulating housing is provided with a socket for an external power source to be inserted and connected to the input connector.

15. A battery module with enhanced heat dissipation according to claim 14, characterized in that: The first heat conducting component also includes: A first flexible heat-conducting member connects the input connector and the circuit main board; and / or, A second flexible heat-conducting member, a heat-conducting plate and a heat-conducting sheet, wherein the second flexible heat-conducting member is connected to the input connector and the heat-conducting plate, and the heat-conducting sheet at least partially adheres to the heat-conducting plate and the heat dissipation housing.

16. A battery module with enhanced heat dissipation according to claim 15, characterized in that: The first heat-conducting component is arranged at one side of the battery. In the direction in which the circuit main board faces the battery, the first flexible heat-conducting member, the input connector, the second flexible heat-conducting member, the heat-conducting plate and the heat-conducting sheet are arranged in sequence.

17. A battery module with enhanced heat dissipation according to any one of claims 13 to 16, characterized in that: The battery module with enhanced heat dissipation also includes a second heat-conducting component, which is located on the side of the circuit main board facing away from the battery, and the second heat-conducting component connects the circuit main board and the insulating shell; and / or, the battery module with enhanced heat dissipation is a V-mouth battery module.

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