Gluing device for computer mainboard processing

Abstract

The utility model discloses a gluing device for computer mainboard processing, and relates to the technical field of gluing devices, the gluing device comprises a placing mechanism, a gluing mechanism and other parts, the placing mechanism comprises a base, two groups of rectangular plates are correspondingly installed on the upper surface of the base, a sliding rod is installed between the two rectangular plates in each group, a sliding block is arranged on each sliding rod in a sliding mode, and the gluing mechanism is arranged on the base. According to the placing mechanism of the device, the computer mainboard placed on the placing table can be clamped and fixed through the two clamping plates close to each other, so that the stability of the computer mainboard is enhanced, dislocation of the computer mainboard caused by operation vibration of the device during gluing is avoided, the gluing accuracy of the computer mainboard is enhanced, and the working efficiency of the computer mainboard is improved. According to the gluing mechanism, the clamping piece is clamped into the clamping groove of the glue bottle to limit the glue bottle, the glue bottle can be fixed only by pulling the pull rod outwards to drive the clamping piece to move out of the clamping groove during disassembly, operation is easy, and therefore the glue bottle is easy to replace, and operation of workers is facilitated.

Description

Technical Field

[0001] The utility model relates to the technical field of glue coating devices, in particular to a glue coating device for processing computer mainboards. Background Art

[0002] Computer is a modern electronic computing machine used for high-speed calculation. It can perform numerical calculation and logical calculation. In the process of computer production, in order to reduce the failure rate of components due to factors such as temperature changes, falling, vibration, etc. during the use of products and extend the service life of products, it is usually necessary to use a dispensing machine to reinforce surface components on the motherboard. Dispensing machine is also called glue coating machine, glue dripping machine, glue spraying machine, glue filling machine, etc. It is an automated machine that controls fluids and drips and applies fluids to the surface or inside of products. It can realize three-dimensional and four-dimensional path dispensing, precise positioning, precise glue control, no drawing, no glue leakage, no glue dripping. Dispensing machine is mainly used for glue, paint and other liquids in product processes to accurately point, inject, apply and drip to each product's precise position, which can be used to achieve dotting, drawing lines, circles or arcs;

[0003] For example, the patent website discloses a gluing device for processing computer motherboards (publication number: CN220258536U). This device directly places the computer motherboard on a carrier and applies glue to it, but there is no fixing mechanism for the computer motherboard, so that the vibration during the operation of the device may cause the computer motherboard to move slightly, thereby causing the gluing position to be misplaced, resulting in gluing failure. Therefore, a person skilled in the art has proposed a gluing device for processing computer motherboards. Utility Model Content

[0004] In view of the deficiencies of the prior art, the utility model provides a gluing device for processing a computer mainboard. The placement mechanism of the device can fix the computer mainboard, solving the problem that the mainboard is easily dislocated if it is not fixed in the above background.

[0005] To achieve the above purpose, the utility model is implemented through the following technical solutions: a glue coating device for processing a computer motherboard, comprising:

[0006] A placement mechanism, the placement mechanism is used to fix the computer mainboard;

[0007] The placing mechanism comprises a base, the upper surface of the base is correspondingly mounted with two groups of rectangular plates, a sliding rod is mounted between each group of two rectangular plates, each sliding rod is slidably mounted with a slider, a placing platform is mounted on the upper surface of the two sliders, the upper surface of the placing platform is correspondingly provided with two moving grooves, two bidirectional screws are mounted in the two moving grooves for common rotation, each thread of the bidirectional screw is provided with a thread seat in the moving groove, an L-shaped rod is mounted on the upper surface of each thread seat, a clamping plate is mounted on the end of each L-shaped rod, a rubber pad is mounted on the side of each clamping plate, and one end of the bidirectional screw extends to the outside of the placing platform and is mounted with a knob;

[0008] A gluing mechanism is used for gluing a computer mainboard.

[0009] As a further technical solution of the utility model, the glue coating mechanism includes a U-shaped frame installed on the upper surface of the base, a motor is installed at the center of the upper surface of the U-shaped frame, the driving end of the motor passes through the U-shaped frame and is installed with a disc, and the upper surface of the disc is rectangular and has four bottle grooves.

[0010] As a further technical solution of the utility model, a fixed cylinder is installed on one side of each bottle groove on the side of the disc, a limit plate is slidably arranged inside each fixed cylinder, a pull rod extending to the outside of the fixed cylinder is installed at the center of the side of each limit plate, a spring is sleeved on the surface of the pull rod in each fixed cylinder, and a clamp extending to the adjacent bottle groove is installed at the center of the other side of each limit plate.

[0011] As a further technical solution of the utility model, each bottle groove is provided with a glue bottle adapted thereto, a limiting ring is installed on the side of each glue bottle above the disc, and a card slot adapted to the card piece is opened on the side of each glue bottle.

[0012] As a further technical solution of the utility model, two electric push rods are installed on the upper surface of the base corresponding to one side of the U-shaped frame, and a horizontal plate is installed on the upper ends of the two electric push rods. A glue coating head structure connected to the glue bottle directly above is provided on the horizontal plate.

[0013] Beneficial Effects

[0014] The utility model provides a glue coating device for processing a computer mainboard. Compared with the prior art, it has the following beneficial effects:

[0015] 1. A gluing device for processing a computer motherboard. The placement mechanism of the device uses two clamping plates close to each other to clamp and fix the computer motherboard placed on the placement table, thereby enhancing the stability of the computer motherboard, avoiding the vibration of the operation of the device during gluing that causes the computer motherboard to be out of position, and enhancing the accuracy of gluing the computer motherboard.

[0016] 2. A gluing device for processing computer motherboards. The gluing mechanism of the device uses a card to be inserted into a card slot of the glue bottle to limit the glue bottle. When disassembling, it is only necessary to pull the pull rod outward to drive the card to move out of the card slot to release the fixation of the glue bottle. The operation is simple, so that the replacement of the glue bottle becomes simple and convenient for the staff to operate. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a structural schematic diagram of a glue coating device for processing a computer mainboard;

[0018] Figure 2 A side view of a glue coating device for processing a computer mainboard;

[0019] Figure 3 A cross-sectional view of a placement mechanism of a glue coating device for processing a computer mainboard;

[0020] Figure 4 This is a schematic diagram of the structure of a glue coating mechanism of a glue coating device for processing a computer mainboard;

[0021] Figure 5 The present invention is a cross-sectional view of a disc of a glue coating device used for processing a computer mainboard.

[0022] In the figure: 1. base; 2. rectangular plate; 3. sliding rod; 4. slider; 5. placing table; 6. moving groove; 7. bidirectional screw; 8. threaded seat; 9. L-shaped rod; 10. clamping plate; 11. knob; 12. U-shaped frame; 13. motor; 14. disc; 15. bottle groove; 16. fixing cylinder; 17. limiting plate; 18. pull rod; 19. spring; 20. clamp; 21. glue bottle; 22. limiting ring; 23. clamping groove; 24. electric push rod; 25. horizontal plate; 26. glue coating head structure. DETAILED DESCRIPTION

[0023] The present disclosure is further described in detail below in conjunction with the accompanying drawings and implementations. It is understood that the specific implementations described herein are only used to explain the relevant content, rather than to limit the present disclosure. It should also be noted that, for ease of description, only the parts related to the present disclosure are shown in the accompanying drawings.

[0024] It should be noted that, in the absence of conflict, the embodiments and features of the embodiments in the present disclosure can be combined with each other. The technical solution of the present disclosure will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0025] Unless otherwise specified, the exemplary embodiments / embodiments shown will be understood as providing exemplary features of various details of some ways in which the technical concept of the present disclosure can be implemented in practice. Therefore, unless otherwise specified, the features of the various embodiments / embodiments can be combined, separated, interchanged and / or rearranged without departing from the technical concept of the present disclosure.

[0026] The use of cross-hatching and / or shading in the accompanying drawings is generally used to make the boundaries between adjacent components clear. As such, unless otherwise specified, the presence or absence of cross-hatching or shading does not convey or indicate any preference or requirement for the specific materials, material properties, dimensions, proportions, commonalities between the components shown, and / or any other characteristics, attributes, properties, etc. of the components. In addition, in the accompanying drawings, the sizes and relative sizes of the components may be exaggerated for clarity and / or descriptive purposes. When the exemplary embodiments can be implemented differently, the specific process sequence can be performed in a different order than described. For example, two successively described processes can be performed substantially simultaneously or in an order opposite to the described order. In addition, the same figure numbers represent the same components.

[0027] When a component is referred to as being "on" or "over," "connected to," or "coupled to" another component, the component may be directly on, directly connected to, or directly coupled to the other component, or intervening components may be present. However, when a component is referred to as being "directly on," "directly connected to," or "directly coupled to" another component, there are no intervening components. For this purpose, the term "connected" may refer to a physical connection, an electrical connection, etc., with or without intervening components.

[0028] For descriptive purposes, the present disclosure may use spatially relative terms such as "under," "beneath," "under," "down," "over," "upper," "above," "higher," and "side (e.g., as in "sidewall")," to describe the relationship of one component to another (other) component as shown in the accompanying drawings. The spatially relative terms are intended to encompass different orientations of the device in use, operation, and / or manufacture in addition to the orientation depicted in the accompanying drawings. For example, if the device in the accompanying drawings is turned over, components described as "under" or "beneath" other components or features would subsequently be positioned "over" the other components or features. Thus, the exemplary term "under" can encompass both the "above" and "below" orientations. Furthermore, the device may be otherwise oriented (e.g., rotated 90 degrees or at other orientations), and the spatially relative descriptors used herein should be interpreted accordingly.

[0029] The terms used here are for the purpose of describing specific embodiments, and are not intended to be restrictive. As used here, unless the context clearly indicates otherwise, the singular forms "one (kind, person)" and "said (the)" are also intended to include plural forms. In addition, when the terms "comprise" and / or "include" and their variations are used in this specification, it is explained that there are stated features, integral bodies, steps, operations, parts, assemblies and / or their groups, but it is not excluded that there are or add one or more other features, integral bodies, steps, operations, parts, assemblies and / or their groups. It should also be noted that, as used here, the terms "substantially", "approximately" and other similar terms are used as approximate terms and not as degree terms, so that they are used to explain the inherent deviations of the measured values, calculated values ​​and / or the values ​​provided that will be recognized by those of ordinary skill in the art.

[0030] Figure 1 It is a structural schematic diagram of a glue coating device for processing a computer mainboard;

[0031] Figure 2 A side view of a glue coating device for processing a computer mainboard;

[0032] Figure 3 A cross-sectional view of a placement mechanism of a glue coating device for processing a computer mainboard;

[0033] like Figure 1-3 As shown, a gluing device for processing a computer mainboard disclosed in the present invention may include: a placing mechanism, a gluing mechanism and other components;

[0034] like Figure 1-3 As shown, the placement mechanism includes a base 1, a rectangular plate 2, a slide bar 3, a slider 4, a placement table 5, a moving groove 6, a bidirectional screw 7, a threaded seat 8, an L-shaped rod 9, a clamping plate 10, and a knob 11;

[0035] The two groups of rectangular plates 2 are installed on the upper surface of the base 1, each of the slide bars 3 is installed between the corresponding group of two rectangular plates 2, each of the sliders 4 is slidably arranged on the corresponding slide bars 3, the placement table 5 is installed on the upper surfaces of the two sliders 4, the two moving grooves 6 are opened on the upper surface of the placement table 5, the bidirectional screw 7 is rotatably installed in the two moving grooves 6, the two threaded seats 8 are respectively arranged on the two threads of the bidirectional screw 7, the two L-shaped rods 9 are respectively installed on the upper surfaces of the two threaded seats 8, the two clamps 10 are respectively installed on the ends of the two L-shaped rods 9, and the knob 11 is installed on the end of the bidirectional screw 7 extending to the outside of the placement table 5;

[0036] When in use, place the computer motherboard right on the center of the upper surface of the placement table 5, then rotate the knob 11 to drive the bidirectional screw 7 to rotate and drive the two threaded seats 8 to approach each other, thereby driving the two clamping plates 10 to approach each other to clamp the computer motherboard, and then the glue coating mechanism can be used to apply glue to the computer motherboard, and at the same time, the slider 4 of the placement table 5 can slide on the slide bar 3, so that the position of the placement table 5 can be adjusted, the position of the computer motherboard can be changed, and glue can be applied to multiple positions of the computer motherboard. After the gluing is completed, the reverse knob 11 drives the two clamping plates 10 to move away from each other through the above operation to release the clamping of the computer motherboard, and then the glued computer motherboard can be removed;

[0037] Figure 4 This is a schematic diagram of the structure of a glue coating mechanism of a glue coating device for processing a computer mainboard;

[0038] Figure 5 It is a cross-sectional view of a disc of a glue coating device for processing a computer mainboard;

[0039] like Figure 4-5 As shown, the glue coating mechanism includes a U-shaped frame 12, a motor 13, a disc 14, a bottle groove 15, a fixing cylinder 16, a limiting plate 17, a pull rod 18, a spring 19, a clamp 20, a glue bottle 21, a limiting ring 22, a clamping groove 23, an electric push rod 24, a horizontal plate 25, and a glue coating head structure 26;

[0040] The U-shaped frame 12 is installed on the upper surface of the base 1, the motor 13 is installed on the center of the upper surface of the U-shaped frame 12, the disc 14 is installed on the driving end of the motor 13 that passes through the U-shaped frame 12, the four bottle grooves 15 are rectangularly opened on the upper surface of the disc 14, the side of the disc 14 is opened on one side of each bottle groove 15 with a fixed cylinder 16, each of the limit plates 17 is slidably set in the corresponding fixed cylinder 16, each of the pull rods 18 is installed at the center of the side of the corresponding limit plate 17 and extends to the outside of the fixed cylinder 16, each of the springs 19 is sleeved on the surface of the corresponding pull rod 18, and each of the clamps 20 is installed on the other side of the corresponding limit plate 17 The center of one side surface extends to the nearest bottle groove 15, the four glue bottles 21 are respectively arranged in the four bottle grooves 15, each of the limiting rings 22 is respectively installed on the side of the glue bottle 21 and is located above the disc 14, each of the card slots 23 is opened on the side of the corresponding glue bottle 21 and is adapted to the card 20, the two electric push rods 24 are installed on the upper surface of the base 1 and are located on one side of the U-shaped frame 12, the horizontal plate 25 is installed on the upper ends of the two electric push rods 24, the glue head structure 26 is installed on the horizontal plate 25 and is connected to the glue bottle 21 directly above, it should be noted that the glue head structure 26 is the same as the glue component structure of the reference document;

[0041] When in use, the glue in the glue bottle 21 connected to the glue head structure 26 is used to glue the computer motherboard through the glue head structure 26. When the glue in the glue bottle 21 is used up, the electric push rod 24 is shortened to drive the cross plate 25 and the glue head structure 26 to descend and drive the glue head structure 26 to separate from the corresponding glue bottle 21. Then, the motor 13 is operated to drive the disc 14 to rotate so that another glue bottle 21 rotates to the top of the glue head structure 26. Then, the electric push rod 24 is extended to drive the glue head structure 26 to rise so that the lower end of the glue bottle 21 above is inserted into the glue head structure 26, and glue coating can continue.

[0042] When the glue in the four glue bottles 21 is all used up, the pull rod 18 is pulled outward to drive the limit plate 17 to move. The moving limit plate 17 compresses the spring 19 and also drives the clamp 20 to move out of the slot 23, so that the limit on the empty glue bottle 21 can be released, and the glue bottle 21 is taken out of the bottle slot 15. Then, the glue bottle 21 filled with glue is put back into the bottle slot 15, and the slot 23 is aligned with the clamp 20. The pull rod 18 is released to let the spring 19 rebound and drive the clamp 20 to be reinserted into the slot 23 to fix the glue bottle 21. Then, the above operation is repeated to replace other empty glue bottles 21.

[0043] In the description of this specification, the description with reference to the terms "one embodiment / method", "some embodiments / methods", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment / method or example are included in at least one embodiment / method or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment / method or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments / methods or examples in a suitable manner. In addition, those skilled in the art may combine and combine different embodiments / methods or examples described in this specification and the features of different embodiments / methods or examples, unless they are contradictory.

[0044] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0045] Those skilled in the art should understand that the above embodiments are only for the purpose of clearly illustrating the present disclosure, and are not intended to limit the scope of the present disclosure. For those skilled in the art, other changes or modifications may be made based on the above disclosure, and these changes or modifications are still within the scope of the present disclosure.

Claims

1. A glue coating device for processing a computer motherboard, characterized in that: include: A placement mechanism, the placement mechanism is used to fix the computer mainboard; The placement mechanism comprises a base (1), the upper surface of the base (1) is correspondingly mounted with two groups of rectangular plates (2), a sliding rod (3) is mounted between each group of two rectangular plates (2), each sliding rod (3) is slidably mounted with a slider (4), a placement platform (5) is mounted on the upper surface of the two sliders (4), the upper surface of the placement platform (5) is correspondingly provided with two movable grooves (6), a bidirectional screw (7) is mounted in the two movable grooves (6) for co-rotation, each thread of the bidirectional screw (7) is provided with a thread seat (8) in the movable groove (6), an L-shaped rod (9) is mounted on the upper surface of each thread seat (8), a clamping plate (10) is mounted at the end of each L-shaped rod (9), a rubber pad is mounted on the side of each clamping plate (10), one end of the bidirectional screw (7) extends to the outside of the placement platform (5) and is mounted with a knob (11); A gluing mechanism is used for gluing a computer mainboard.

2. A glue coating device for processing a computer mainboard according to claim 1, characterized in that: The glue coating mechanism comprises a U-shaped frame (12) mounted on the upper surface of a base (1); a motor (13) is mounted at the center of the upper surface of the U-shaped frame (12); a driving end of the motor (13) passes through the U-shaped frame (12) and is mounted with a disc (14); the upper surface of the disc (14) is rectangular and has four bottle grooves (15).

3. A glue coating device for processing a computer mainboard according to claim 2, characterized in that: A fixing cylinder (16) is installed on the side of each bottle groove (15) of the disc (14), a limiting plate (17) is slidably arranged inside each fixing cylinder (16), a pull rod (18) extending to the outside of the fixing cylinder (16) is installed at the center of the side of each limiting plate (17), a spring (19) is sleeved on the surface of the pull rod (18) in each fixing cylinder (16), and a clamping member (20) extending to the adjacent bottle groove (15) is installed at the center of the other side of each limiting plate (17).

4. A glue coating device for processing a computer mainboard according to claim 3, characterized in that: Each of the bottle grooves (15) is provided with a glue bottle (21) adapted thereto, a limiting ring (22) is installed on the side of each of the glue bottles (21) above the disc (14), and a clamping groove (23) adapted to the clamping member (20) is opened on the side of each of the glue bottles (21).

5. A glue coating device for processing a computer mainboard according to claim 4, characterized in that: Two electric push rods (24) are mounted on the upper surface of the base (1) at one side of the U-shaped frame (12), and a horizontal plate (25) is mounted on the upper ends of the two electric push rods (24). A glue coating head structure (26) connected to the glue bottle (21) directly above is arranged on the horizontal plate (25).

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