Production equipment for integrated circuit
By designing cleaning equipment for integrated circuit production, using pressurized erosion and injection of cleaning liquid technology, the existing cleaning measures are not efficient enough, and the substrate is more thoroughly cleaned, which improves the cleaning efficiency and effect, and is suitable for substrates of different sizes and shapes.
Patent Information
- Application Number
- CN202421614632.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-09
- Publication Date
- 2025-05-02
- Estimated Expiration
- 2034-07-09
AI Technical Summary
The existing cleaning measures have insufficient water consumption and method for cleaning. The cleaning process does not have a pressure to wash the substrate, which may not be thorough enough, especially in the case of oil stains on the substrate.
A production equipment for integrated circuits is designed, including cleaning boxes, clamping components and cleaning components. The cleaning assembly consists of a mounting plate, an injector and a pipe, which can pressurize the substrate and can handle both sides at the same time to improve cleaning efficiency. The clamping assembly can adapt to different sizes of substrates through the structure of the clamping strip and fixing clips, and ensures the stability of the substrate during the cleaning process.
By pressurized erosion and spraying cleaning liquid, more thorough cleaning of the substrate surface is achieved, cleaning efficiency and effect is improved, the purity and smoothness of the substrate are ensured, and the cleaning needs of substrates of different sizes and shapes are met, the use of cleaning liquid is saved, and the consumption of water resources is reduced.
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Figure CN222817565U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of integrated circuit production, in particular to production equipment for integrated circuits. Background Art
[0002] Cleaning of conductor substrates is crucial to the semiconductor manufacturing process. The purpose of cleaning is to remove surface contaminants and impurities, ensure the purity and smoothness of the substrate surface, and improve the performance and reliability of semiconductor devices.
[0003] Before the substrate is processed, the cleaning process is to treat the surface, but the treatment method and treatment capacity as well as the speed of rapid drying in the later stage are very important for the later treatment of the substrate;
[0004] However, the existing cleaning measures are not efficient enough in terms of water consumption and methods. For example, when immersion cleaning is used, there is no flushing pressure on the substrate during the cleaning process, which may result in incomplete cleaning, especially when there are oil stains on the substrate. Based on this, improvements are needed. Utility Model Content
[0005] In view of the deficiencies of the prior art, the utility model provides a production device for integrated circuits, which solves the problem that the amount of water used and the method of cleaning in the prior art are not efficient enough for cleaning, and the cleaning process does not exert flushing pressure on the substrate, resulting in the cleaning being not thorough enough.
[0006] The utility model is a production device for integrated circuits, comprising a cleaning box for cleaning a target object, a clamping assembly arranged in the cleaning box, and a cleaning assembly adapted to the clamping assembly;
[0007] The cleaning box body comprises a water tank, and the cleaning components are arranged on both sides of the inner wall of the water tank and are symmetrically arranged;
[0008] The clamping assembly includes a clamping bar, and there are N clamping bars. A slide groove is provided at the bottom of the clamping bar, and N fixing clips are slidably connected to the inner side of the slide groove. A base plate is installed below the fixing clip.
[0009] The cleaning assembly includes two symmetrically arranged mounting plates, wherein N transverse grooves and N vertical grooves are arranged on the side of the two mounting plates away from each other, pipes are installed between the transverse grooves and the vertical grooves, and one or more injectors are arranged on the side of the two pipes close to each other for cleaning the substrate.
[0010] As a further improvement of the present invention, a telescopic member is provided on one side of the two mounting plates that are away from each other, so as to control the distance between the mounting plates.
[0011] As a further improvement of the present invention, the mounting plate comprises a plate body, a positioning bar is provided on the back of the plate body, and the positioning bar is adapted to the adjustment assembly to maintain the connection between the plate body and the adjustment assembly.
[0012] As a further improvement of the present invention, one or more guide blocks are provided at the transverse groove of the plate body, and the guide block is located between two transverse grooves and is used to limit the pipeline.
[0013] As a further improvement of the present invention, there are two clamping strips, positioning holes are provided on the sides of the two clamping strips close to each other, and an adjustment component is provided between the two groups of positioning holes for adjusting the distance between the two clamping strips.
[0014] As a further improvement of the utility model, two symmetrically arranged threaded holes are arranged on the top of one of the clamping strips, and a lifting ring is arranged between the two threaded holes.
[0015] As a further improvement of the present invention, a base is provided at the bottom of the water tank for maintaining the stability of the water tank.
[0016] Compared with the prior art, the beneficial effects of the utility model are as follows:
[0017] The utility model provides a cleaning component in combination with a clamping component, which can be combined with a substrate when in use to achieve pressurized flushing of the substrate, and can process both sides at the same time, thereby improving the cleaning efficiency. The clamping component can cooperate with substrates of different sizes to achieve a better fixing effect and meet the needs of use. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:
[0019] Figure 1 This is a schematic diagram of the front view structure of the cleaning box of the utility model;
[0020] Figure 2 This is a schematic diagram of the top view of the structure of the cleaning box, the clamping assembly and the cleaning assembly of the utility model;
[0021] Figure 3 This is a schematic diagram of the three-dimensional structure of the mounting plate of the utility model;
[0022] Figure 4 This is a schematic diagram of the front view structure of the mounting plate of the utility model;
[0023] Figure 5 This is a schematic diagram of the structure of the other side of the mounting plate of the utility model;
[0024] Figure 6 This is a schematic diagram of the front view structure of the clamping assembly of the utility model;
[0025] Figure 7 This is a schematic diagram of the three-dimensional structure of the clamping assembly of the utility model;
[0026] Figure 8 This is a schematic diagram of the structure of the clamping assembly of the utility model when viewed from above.
[0027] In the figure: 1. Cleaning box; 2. Clamping assembly; 3. Cleaning assembly; 4. Base plate;
[0028] 11. Base; 12. Water tank;
[0029] 21. Card strip; 22. Threaded hole; 23. Fixing clip; 24. Adjustment component; 25. Positioning hole; 26. Slide groove;
[0030] 31. Mounting plate; 32. Telescopic member;
[0031] 311, plate body; 312, transverse groove; 313, guide block; 314, pipeline; 315, ejector; 316, vertical groove; 317, positioning strip. DETAILED DESCRIPTION
[0032] The following will disclose multiple embodiments of the utility model with diagrams. For the purpose of clear description, many physical details will be described together in the following description. However, it should be understood that these physical details should not be used to limit the utility model. In other words, in some embodiments of the utility model, these physical details are not necessary. In addition, for the purpose of simplifying the diagram, some conventional structures and components will be depicted in a simple schematic manner in the diagram.
[0033] In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the fact that ordinary technicians in the field can implement it. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present utility model.
[0034] See also Figure 1 , Figure 2 , Figure 3 , Figure 4 as well as Figure 5 ,Before the substrate 4 is processed, the cleaning process is to process the surface, but the processing method and processing capacity as well as the speed of rapid drying in the later stage are very important for the processing of the substrate 4 in the later stage;
[0035] However, the existing cleaning measures have insufficient water consumption and methods for cleaning. For example, when the immersion cleaning method is used, there is no flushing pressure on the substrate 4 during the cleaning process, which may result in insufficient cleaning, especially when there are oil stains on the substrate 4. Based on this, the present application provides a production device for integrated circuits, including a cleaning box 1 for cleaning a target object, a clamping assembly 2 arranged in the cleaning box 1, and a cleaning assembly 3 adapted to the clamping assembly 2.
[0036] The cleaning box body 1 includes a water tank 12, and the cleaning components 3 are arranged on both sides of the inner wall of the water tank 12 and are symmetrically arranged;
[0037] The clamping assembly 2 includes a clamping strip 21, and there are N clamping strips 21. A slide groove 26 is provided at the bottom of the clamping strip 21. N fixing clips 23 are slidably connected to the inner side of the slide groove 26. A base plate 4 is installed below the fixing clip 23.
[0038] The cleaning assembly 3 includes two symmetrically arranged mounting plates 31, and N transverse grooves 312 and N vertical grooves 316 are arranged on the side of the two mounting plates 31 away from each other. A pipe 314 is installed between the transverse groove 312 and the vertical groove 316, and one or more injectors 315 are arranged on the side of the two pipes 314 close to each other for cleaning the substrate 4.
[0039] First, the substrate 4 to be cleaned is clamped onto the clamping assembly 2, and the fixation of the substrate 4 is ensured by connecting the slide groove 26 with the fixing clamp 23. Then, the clamped substrate 4 is placed into the water tank 12 in the cleaning box 1. The cleaning assembly 3 is located in the water tank 12, and the transverse groove 312 and the vertical groove 316 on the mounting plate 31 thereof match the contour of the substrate 4. The pipe 314 is connected to the ejector 315, and the ejector 315 can spray the cleaning liquid onto the surface of the substrate 4 in a directional manner. By controlling the ejector 315, the cleaning liquid can evenly cover the surface of the substrate 4 to remove dirt and impurities. After the cleaning is completed, the substrate 4 is taken out of the water tank 12, and the subsequent production process can be entered.
[0040] The design of the cleaning component 3 enables the cleaning liquid to fully cover the surface of the substrate 4. Through the action of the injector 315, the cleaning effect is more thorough, which greatly improves the cleaning efficiency. The clamping component 2 adopts a structure of multiple clips 21 and fixed clips 23, which can adapt to substrates 4 of different sizes and ensure the stability of the substrate 4 during the cleaning process, avoiding damage or incomplete cleaning caused by movement or shaking of the substrate 4. The cleaning component 3 is symmetrically arranged on the inner wall of the cleaning box 1, ensuring balanced cleaning of both sides of the substrate 4 during the cleaning process, and improving the consistency and reliability of the cleaning effect.
[0041] The design of the clamping component 2 and the cleaning component 3 enables the equipment to adapt to substrates 4 of different sizes and shapes, thereby improving the flexibility and applicability of the equipment and meeting different production needs. The equipment adopts a spray cleaning method, which saves the use of cleaning fluid and reduces the consumption of water resources in the cleaning process compared to the traditional immersion washing method, which is in line with the concept of energy conservation and environmental protection.
[0042] See also Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 as well as Figure 7 A telescopic member 32 is provided on one side of the two mounting plates 31 away from each other, for controlling the distance between the mounting plates 31. The telescopic member 32 is one of the common components used for telescopic adjustment in the mechanical field, such as a scissor lift;
[0043] The mounting plate 31 includes a plate body 311 , and a positioning bar 317 is disposed on the back of the plate body 311 . The positioning bar 317 is adapted to the adjustment component to maintain the connection between the plate body 311 and the adjustment component.
[0044] One or more guide blocks 313 are disposed at the transverse groove 312 of the plate body 311 . The guide block 313 is located between two transverse grooves 312 and is used to restrict the pipeline 314 .
[0045] A telescopic member 32 is provided on the side of the two mounting plates 31 that is away from each other, for controlling the distance between the mounting plates 31. The advantage of this design is that it can be adjusted according to substrates 4 of different sizes or shapes, ensuring that the cleaning assembly 3 can effectively adapt to different types of substrates 4, thereby improving the flexibility and versatility of the device.
[0046] Positioning bars 317 are provided on the back of the plate body 311, and these positioning bars 317 are adapted to the adjustment assembly to maintain the connection between the plate body 311 and the adjustment assembly. This design can ensure that the device maintains a stable connection during operation, avoid equipment failure or poor cleaning effect caused by loose connection, and improve the reliability and stability of the device.
[0047] One or more guide blocks 313 are provided at the transverse groove 312 of the plate body 311, and these guide blocks 313 are located between two transverse grooves 312, and are used to limit the pipe 314. Through this design, it is possible to ensure that the pipe 314 maintains a stable position during the cleaning process, avoiding the problem of inconsistent cleaning effects caused by the misalignment or movement of the pipe 314, thereby improving the cleaning accuracy and consistency.
[0048] By introducing designs such as the telescopic member 32 , the positioning bar 317 and the guide block 313 , the cleaning requirements of substrates 4 of different models and specifications can be met.
[0049] See also Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 as well as Figure 8 There are two card strips 21 , and positioning holes 25 are opened on the sides of the two card strips 21 close to each other. An adjusting component 24 is provided between the two groups of positioning holes 25 for adjusting the distance between the two card strips 21 .
[0050] Two symmetrically arranged threaded holes 22 are arranged on the top of one of the clamping strips 21 , and a lifting ring is arranged between the two threaded holes 22 .
[0051] A base 11 is provided at the bottom of the water tank 12 for maintaining the stability of the water tank 12 .
[0052] The clamping strips 21 are used to fix the position of the substrate 4 during the cleaning process. Each clamping strip 21 has two, and positioning holes 25 are provided on the sides of the two clamping strips 21 close to each other, and these positioning holes 25 are used to ensure the position of the clamping strips 21. Adjustment components 24 are provided between the two groups of positioning holes 25, and these adjustment components 24 are used to adjust the distance between the two clamping strips 21 to adapt to substrates 4 of different sizes.
[0053] In addition, two symmetrically arranged threaded holes 22 are provided on the top of one of the clamping strips 21, and a lifting ring is provided between the two threaded holes 22, so that the clamping strip 21 can be conveniently adjusted and fixed by the lifting ring, thereby ensuring the stability and safety of the substrate 4 during the clamping process.
[0054] In addition, a base 11 is provided at the bottom of the water tank 12 to maintain the stability of the water tank 12. The design of the base 11 can not only improve the overall stability of the equipment, but also effectively reduce the movement of the water tank 12 caused by vibration or external force, thereby ensuring the stability and safety of the cleaning process.
[0055] The arrangement of the adjusting component 24 and the threaded hole 22 enables the device to adapt to substrates 4 of different sizes and shapes, thereby improving the versatility and applicability of the device. Meanwhile, the design of the base 11 further enhances the stability and safety of the device.
[0056] The adjusting component 24 is one of the common supporting components in the mechanical field, such as a double-rod supporting cylinder, and considering the place of use, it is preferably a waterproof supporting cylinder.
[0057] The above description is only an embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent substitution, improvement, etc. made within the spirit and principle of the present invention shall be included in the scope of the claims of the present invention.
Claims
1. A production device for integrated circuits, comprising a cleaning box (1) for cleaning a target object, a clamping assembly (2) arranged in the cleaning box (1), and a cleaning assembly (3) adapted to the clamping assembly (2); Features: The cleaning box body (1) comprises a water tank (12), and the cleaning components (3) are arranged on both sides of the inner wall of the water tank (12) and are symmetrically arranged; The clamping assembly (2) comprises a clamping strip (21), wherein the clamping strip (21) is N in number, a slide groove (26) is provided at the bottom of the clamping strip (21), N fixing clips (23) are slidably connected to the inner side of the slide groove (26), and a base plate (4) is installed below the fixing clip (23); The cleaning assembly (3) comprises two symmetrically arranged mounting plates (31), wherein N transverse grooves (312) and N vertical grooves (316) are arranged on the sides of the two mounting plates (31) that are away from each other, a pipe (314) is installed between the transverse groove (312) and the vertical groove (316), and one or more injectors (315) are arranged on the sides of the two pipes (314) that are close to each other, for cleaning the substrate (4).
2. The integrated circuit production equipment according to claim 1, characterized in that: A telescopic member (32) is provided on one side of the two mounting plates (31) that is away from each other, and is used to control the distance between the mounting plates (31).
3. The integrated circuit production equipment according to claim 1, characterized in that: The mounting plate (31) comprises a plate body (311), and a positioning strip (317) is provided on the back of the plate body (311). The positioning strip (317) is adapted to the adjustment component and is used to maintain the connection between the plate body (311) and the adjustment component.
4. The integrated circuit production equipment according to claim 3, characterized in that: One or more guide blocks (313) are provided at the transverse groove (312) of the plate body (311), and the guide block (313) is located between two transverse grooves (312) and is used to restrict the pipeline (314).
5. The integrated circuit production equipment according to claim 1, characterized in that: There are two clamping strips (21), and positioning holes (25) are provided on the sides of the two clamping strips (21) close to each other. An adjusting component (24) is provided between the two groups of positioning holes (25) for adjusting the distance between the two clamping strips (21).
6. The production equipment for integrated circuits according to claim 1, characterized in that: The top of one of the clamping strips (21) is provided with two symmetrically arranged threaded holes (22), and a lifting ring is provided between the two threaded holes (22).
7. The integrated circuit production equipment according to claim 1, characterized in that: A base (11) is provided at the bottom of the water tank (12) for maintaining the stability of the water tank (12).