Splash-proof cutting device for diode module

Abstract

The utility model discloses a diode module splash-proof cutting device which comprises a base, a guide column, a fixing plate, a blade, a blade fixing plate, a platform plate, a pressing block, a splash-proof pressing plate, a first lifting plate and a second lifting plate. The blade fixing plate is vertically arranged at the front end of the first lifting plate, the blade is arranged on the back face of the blade fixing plate and extends downwards, the platform plate is arranged at the front end of the second lifting plate and located below the blade, and a slag discharging plate obliquely extending downwards to the outer side of the second lifting plate is arranged at the bottom of the second lifting plate. The pressing block is arranged below the blade fixing plate, and the splash-proof pressing plate is arranged at the bottom of the first lifting plate and located behind the blade. By means of the mode, the splash-proof cutting device for the diode module can achieve cutting of tails of a plurality of hardware pieces, is high in machining efficiency, and avoids splashing of cut stub bars.

Description

Technical Field

[0001] The utility model relates to the field of diode module processing equipment, in particular to a diode module splash-proof cutting device. Background Art

[0002] During the processing of the diode module, it is necessary to cut off the tail of the hardware at one end. The tail of the hardware can be cut off by using a cutting device. The diode module is placed in the mold of the cutting device to position the hardware, and the tail of the hardware is cut off by pressing down the blade. Then the mold is opened, the diode module is taken out, and the mold is cleaned before continuing the subsequent processing of the diode module. The production efficiency is relatively low.

[0003] In order to improve the production efficiency of diode modules, it is necessary to use automated equipment to transport and cut diode modules. However, the mold of the existing cutting equipment is fixed, which is not conducive to the transportation and entry of diode modules, and the cut-off material heads are also prone to splashing, affecting the entry of subsequent diode modules, which needs to be improved. Utility Model Content

[0004] The main technical problem solved by the utility model is to provide a splash-proof cutting device for a diode module, which is convenient for entering the diode module and cutting off the tail of the hardware, and avoids splashing of the material head.

[0005] In order to solve the above technical problems, a technical solution adopted by the utility model is: to provide a diode module splash-proof cutting device, including: a base, a guide column, a fixed plate, a blade, a blade fixing plate, a platform plate, a pressure block, a splash-proof pressure plate, a first lifting plate and a second lifting plate, wherein the guide column is vertically arranged on the base, the fixed plate is arranged on the top of the guide column, the first lifting plate can be movably arranged below the fixed plate up and down, the fixed plate is provided with a first lifting drive mechanism connected to the first lifting plate, the second lifting plate can be movably arranged below the first lifting plate up and down, and the base is provided with A second lifting drive mechanism connected to the second lifting plate, the blade fixing plate is vertically arranged at the front end of the first lifting plate, the blade is arranged on the back side of the blade fixing plate and extends downward, the platform plate is arranged at the front end of the second lifting plate and is located below the blade, a slag discharge plate is arranged at the bottom of the second lifting plate and extends obliquely downward to the outside of the second lifting plate, the pressure block is arranged below the blade fixing plate, a first spring is arranged between the pressure block and the blade fixing plate, the anti-splash pressure plate is arranged at the bottom of the first lifting plate and is located behind the blade, and a second spring is arranged between the anti-splash pressure plate and the first lifting plate.

[0006] In a preferred embodiment of the present invention, the guide pillars are symmetrically distributed on the base.

[0007] In a preferred embodiment of the present invention, linear bearings corresponding to the guide columns are arranged on the first lifting plate and the second lifting plate.

[0008] In a preferred embodiment of the present invention, the first lifting drive mechanism and the second lifting drive mechanism respectively use cylinders.

[0009] In a preferred embodiment of the present invention, a cutting groove corresponding to the blade is concavely arranged on the top of the back side of the platform plate.

[0010] In a preferred embodiment of the present invention, the splash-proof pressure plate is an L-shaped bent plate.

[0011] In a preferred embodiment of the present invention, the second lifting plate is provided with a material drop opening located at the top of the slag discharge plate.

[0012] In a preferred embodiment of the present invention, the anti-splash pressure plate is located above the drop opening.

[0013] The beneficial effects of the utility model are as follows: the utility model points out a diode module splash-proof cutting device, the platform plate can move down with the second lifting plate, so as to facilitate the entry of hardware at one end of multiple diode modules, and then the second lifting plate moves up to drive the platform plate to reset, and the blade fixing plate and the splash-proof pressure plate are driven down by the first lifting plate, and the pressure block and the splash-proof pressure plate are used to elastically press the two ends of the hardware, and finally the blade is used to achieve the removal of the tails of multiple hardware, with high processing efficiency, and the splash-proof pressure plate avoids splashing of the cut-off material head, and after the first lifting plate moves up and resets, the splash-proof pressure plate moves up accordingly, and the end of the material head loses the pressing of the splash-proof pressure plate and automatically falls into the slag discharge plate, so as to avoid affecting the cutting of subsequent diode modules, thereby improving the smoothness and automation level of cutting. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative work, among which:

[0015] Figure 1 It is a structural schematic diagram of a preferred embodiment of a diode module splash-proof cutting device of the utility model;

[0016] Figure 2 yes Figure 1 Schematic diagram of the structure after the blade in FIG. moves downward. DETAILED DESCRIPTION

[0017] The technical solutions in the embodiments of the present invention are described clearly and completely below. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0018] See also Figure 1~Figure 2 , the utility model embodiment includes:

[0019] like Figure 1 and Figure 2 The diode module splash-proof cutting device shown includes: a base 1, a guide column 3, a fixed plate 11, a blade 15, a blade fixing plate 8, a platform plate 5, a pressure block 9, a splash-proof pressure plate 12, a first lifting plate 13 and a second lifting plate 4. The guide column 3 is vertically arranged on the base 1, and the fixed plate 11 is arranged on the top of the guide column 3. In this embodiment, the guide column 3 is symmetrically distributed on the base 1 to provide stable support for the fixed plate 11. The fixed plate 11 can be connected and fixed to the top of the guide column 3 by screws, and the structure is stable.

[0020] The first lifting plate 13 is arranged below the fixed plate 11 so as to be movable up and down, and the fixed plate 11 is provided with a first lifting drive mechanism 10 connected to the first lifting plate 13, and the second lifting plate 4 is arranged below the first lifting plate 13 so as to be movable up and down, and the base 1 is provided with a second lifting drive mechanism 2 connected to the second lifting plate 4. In this embodiment, the first lifting plate 13 and the second lifting plate 4 are provided with linear bearings 14 corresponding to the guide pillars 3, which improves the lifting stability of the first lifting plate 13 and the second lifting plate 4. In addition, the first lifting drive mechanism 10 and the second lifting drive mechanism 2 respectively use cylinders, and the telescopic control of the first lifting drive mechanism 10 and the second lifting drive mechanism 2 can be performed through the PLC to realize the lifting and lowering drive of the first lifting plate 13 and the second lifting plate 4.

[0021] The blade fixing plate 8 is vertically arranged at the front end of the first lifting plate 13, and the blade 15 is arranged on the back of the blade fixing plate 8 and extends downward. It can be fixed with screws. The structure is stable, so that the blade fixing plate 8 and the blade 15 can be lifted and lowered with the first lifting plate 13.

[0022] The platform plate 5 is arranged at the front end of the second lifting plate 4 and below the blade 15, so that the platform plate 5 can be avoided as the second lifting plate 4 descends, which facilitates the hardware at one end of the diode module 6 to enter the top of the platform plate 5. In this embodiment, a cutting groove 18 corresponding to the blade 15 is concavely arranged on the top of the back of the platform plate 5. During the descent of the blade 1, the tail of the hardware at one end of the diode module 6 is cut by cooperating with the cutting groove 18.

[0023] A slag discharge plate 16 is provided at the bottom of the second lifting plate 4 and extends obliquely downward to the outside of the second lifting plate 4. A material drop opening is provided in the second lifting plate 4 and is located at the top of the slag discharge plate, which is conducive to the material head cut off from the tail of the hardware falling into the slag discharge plate 16 for directional outflow, which is convenient for centralized processing.

[0024] The pressing block 9 is arranged below the blade fixing plate 8, and a first spring 7 is arranged between the pressing block 9 and the blade fixing plate 8. The pressing block 9 first performs elastic compression of the hardware to improve the stability of the diode module 6 during the subsequent cutting process. The pressing block 9 is long, and the hardware at one end of multiple diode modules 6 can be compressed at the same time.

[0025] like Figure 1 As shown, the splash plate 12 is arranged at the bottom of the first lifting plate 13 and behind the blade 15, and a second spring 17 is arranged between the splash plate 12 and the first lifting plate 13. Figure 2 As shown, the blade fixing plate 8 and the splash-proof pressure plate 12 are moved downward by the first lifting plate 13, and the pressure block 9 and the splash-proof pressure plate 12 are used to elastically press the two ends of the hardware. Finally, the blade 15 is used to cut off the tails of multiple hardware parts. The processing efficiency is high, and the splash-proof pressure plate 12 avoids the splashing of the cut material head.

[0026] In this embodiment, the splash-proof pressure plate 12 is an L-shaped curved plate. Figure 1 As shown, the opening of the L-shaped bent plate points downward, and the splash-proof pressure plate 12 is located above the blanking port. The bottom of the L-shaped bent plate cooperates with the edge of the blanking port to press and fix the end of the material head. After cutting, the splash-proof pressure plate 12 moves up with the first lifting plate 13, and the end of the material head loses the pressure of the splash-proof pressure plate 12 and automatically falls into the slag discharge plate 16 to avoid affecting the cutting of subsequent diode modules.

[0027] In summary, the splash-proof cutting device for diode modules pointed out in the utility model can simultaneously cut off the tail of the hardware at one end of multiple diode modules, which is beneficial to the transportation and pressing of the diode modules, avoids the splashing of the material heads, ensures that the material heads can be discharged smoothly through the slag discharge plate, and improves the processing efficiency.

[0028] The above are only embodiments of the present invention, and are not intended to limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the present invention specification, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A diode module splash-proof cutting device, characterized in that: include: A base, a guide column, a fixed plate, a blade, a blade fixing plate, a platform plate, a pressure block, a splash-proof pressure plate, a first lifting plate and a second lifting plate, wherein the guide column is vertically arranged on the base, the fixed plate is arranged on the top of the guide column, the first lifting plate can be movably arranged below the fixed plate up and down, a first lifting drive mechanism connected to the first lifting plate is arranged on the fixed plate, the second lifting plate can be movably arranged below the first lifting plate up and down, a second lifting drive mechanism connected to the second lifting plate is arranged on the base, the blade fixing plate is vertically arranged at the front end of the first lifting plate, the blade is arranged on the back of the blade fixing plate and extends downward, the platform plate is arranged at the front end of the second lifting plate and is located below the blade, a slag discharge plate obliquely extending downward to the outside of the second lifting plate is arranged at the bottom of the second lifting plate, the pressure block is arranged below the blade fixing plate, a first spring is arranged between the pressure block and the blade fixing plate, the splash-proof pressure plate is arranged at the bottom of the first lifting plate and is located behind the blade, and a second spring is arranged between the splash-proof pressure plate and the first lifting plate.

2. The diode module splash-proof cutting device according to claim 1, characterized in that: The guide pillars are symmetrically distributed on the base.

3. The diode module splash-proof cutting device according to claim 1, characterized in that: The first lifting plate and the second lifting plate are provided with linear bearings corresponding to the guide pillars.

4. The diode module splash-proof cutting device according to claim 1, characterized in that: The first lifting drive mechanism and the second lifting drive mechanism respectively use cylinders.

5. The diode module splash-proof cutting device according to claim 1, characterized in that: The top of the back side of the platform plate is concavely provided with a cutting groove corresponding to the blade.

6. The diode module splash-proof cutting device according to claim 1, characterized in that: The anti-splash plate is an L-shaped bent plate.

7. The diode module splash-proof cutting device according to claim 1, characterized in that: The second lifting plate is provided with a material drop opening located at the top of the slag discharge plate.

8. The diode module splash-proof cutting device according to claim 7, characterized in that: The anti-splash pressure plate is located above the material drop opening.

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