Electronic circuit board reflow soldering furnace with automatic feeding function

Abstract

The utility model discloses an electronic circuit board reflow soldering furnace with an automatic feeding function in the technical field of reflow soldering furnaces, which comprises a reflow soldering furnace, a conveying platform is arranged in the reflow soldering furnace, openings matched with the conveying platform are arranged on the left side wall and the right side wall of the reflow soldering furnace, and a fixing plate is arranged on the right side wall of the reflow soldering furnace. A hydraulic rod is arranged at the top of the fixing plate, a placement table is arranged at one end of the hydraulic rod, electronic circuit boards are stacked at the top of the placement table, a pushing assembly is arranged at the bottom of the placement table and comprises a mounting plate arranged at the bottom of the placement table, a pushing plate is arranged in the mounting plate, and a pushing rod is arranged on the right side wall of the pushing plate; and one end of the pushing rod penetrates through the left side wall of the mounting plate to be connected with a connecting block arranged outside, and the end, provided with a first electric telescopic rod, of the right side wall of the mounting plate is connected with the left side wall of the connecting block. And manual feeding by workers is not needed, so that the production efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of reflow soldering furnaces, in particular to a reflow soldering furnace for electronic circuit boards with an automatic feeding function. Background Art

[0002] Reflow oven is a kind of equipment required for SMT process in electronic technology industry. The reflow oven process is to realize the soldering of mechanical and electrical connection between solder ends or pins of surface mounted components and pads of printed circuit boards by remelting the paste solder pre-distributed on the pads of printed circuit boards. Reflow oven is needed in the production of electronic circuit boards now, but when placing the circuit boards, they are still placed on the transmission platform manually, which is time-consuming and labor-intensive and reduces production efficiency. Therefore, we propose a reflow oven for electronic circuit boards with automatic loading function. Utility Model Content

[0003] The utility model aims to provide a reflow soldering furnace for electronic circuit boards with an automatic feeding function to solve the problems raised in the above-mentioned background technology.

[0004] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a reflow soldering furnace for electronic circuit boards with an automatic loading function, comprising a reflow soldering furnace, a conveying platform is arranged in the reflow soldering furnace, and openings matching the conveying platform are opened on the left and right side walls of the reflow soldering furnace, a fixing plate is arranged on the right side wall of the reflow soldering furnace, a hydraulic rod is arranged on the top of the fixing plate, a placing table is arranged at one end of the hydraulic rod, electronic circuit boards are stacked and placed on the top of the placing table, a pushing component is arranged at the bottom of the placing table, the pushing component comprises a mounting plate arranged at the bottom of the placing table, a pushing plate is arranged in the mounting plate, a pushing rod is arranged on the right side wall of the pushing plate, one end of the pushing rod passes through the left side wall of the mounting plate and is connected to a connecting block arranged on the outside, and a first electric telescopic rod is arranged on the right side wall of the mounting plate and one end of the first electric telescopic rod is connected to the left side wall of the connecting block.

[0005] Furthermore, two groups of sliding rods are provided on the right side wall of the pushing plate, and one end of the two groups of sliding rods penetrates the left side wall of the mounting plate and is connected to the left side wall of the connecting block.

[0006] Furthermore, the connecting block is arranged in a T shape.

[0007] Furthermore, a limiting plate is provided above the conveying platform, and a connecting rod is provided on the right side wall of the reflow oven, and one end of the connecting rod is connected to the top of the limiting plate.

[0008] Furthermore, an abutment plate is provided on the right side of the reflow oven, a second electric telescopic rod is provided on the right side wall of the reflow oven, and one end of the second electric telescopic rod is connected to the left side wall of the abutment plate.

[0009] Furthermore, the mounting plate is arranged in an L shape.

[0010] Compared with the prior art, the beneficial effect of the utility model is that the utility model can load electronic circuit boards under the action of the limit plate, the placement table, the hydraulic rod, the fixed plate, the abutment plate, the second electric telescopic rod and the pushing component, and the staff does not need to load the materials manually, thereby improving production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 It is a schematic diagram of the structure of the utility model;

[0012] Figure 2 It is a schematic diagram of the structure A of the utility model.

[0013] In the figure: 1. Reflow oven; 2. Conveying platform; 3. Connecting rod; 4. Limiting plate; 5. Pushing assembly; 50. Mounting plate; 51. Pushing plate; 52. Pushing rod; 53. Connecting block; 54. First electric telescopic rod; 55. Sliding rod; 6. Electronic circuit board; 7. Placement table; 8. Hydraulic rod; 9. Fixed plate; 10. Abutment plate; 11. Second electric telescopic rod. DETAILED DESCRIPTION

[0014] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0015] Embodiment 1:

[0016] See also Figure 1-2The utility model provides a technical solution: a reflow soldering furnace for electronic circuit boards with an automatic loading function, comprising a reflow soldering furnace 1, a conveying platform 2 is arranged in the reflow soldering furnace 1, and openings matching the conveying platform 2 are opened on the left and right side walls of the reflow soldering furnace 1, a fixing plate 9 is arranged on the right side wall of the reflow soldering furnace 1, a hydraulic rod 8 is arranged on the top of the fixing plate 9, a placing table 7 is arranged at one end of the hydraulic rod 8, electronic circuit boards 6 are stacked and placed on the top of the placing table 7, a pushing component 5 is arranged at the bottom of the placing table 7, the pushing component 5 comprises a mounting plate 50 arranged at the bottom of the placing table 7, the mounting plate 50 is arranged in an L shape, a pushing plate 51 is arranged in the mounting plate 50, a pushing rod 52 is arranged on the right side wall of the pushing plate 51, one end of the pushing rod 52 passes through the left side wall of the mounting plate 50 and is connected to a connecting block 53 arranged on the outside, the connecting block 53 is arranged in a T shape, a first electric telescopic rod 54 is arranged on the right side wall of the mounting plate 50, one end of the first electric telescopic rod 54 is connected to the connecting block 5 3 is connected to the left wall, and the right wall of the pushing plate 51 is provided with two sets of sliding bars 55. One end of the two sets of sliding bars 55 penetrates the left wall of the mounting plate 50 and is connected to the left wall of the connecting block 53. Under the action of the sliding bars 55, the movement of the pushing plate 51 is more stable. An abutment plate 10 is provided on the right side of the reflow soldering furnace 1. A second electric telescopic rod 11 is provided on the right wall of the reflow soldering furnace 1. One end of the second electric telescopic rod 11 is connected to the left wall of the abutment plate 10. The second electric telescopic rod 11 drives the abutment plate 10 to abut against the electronic circuit board 6 below (the uppermost electronic circuit board 6 is not abutted). The abutment plate 10 can block the electronic circuit board 6 below. A limiting plate 4 is provided above the conveying platform 2. A connecting rod 3 is provided on the right wall of the reflow soldering furnace 1. One end of the connecting rod 3 is connected to the top of the limiting plate 4. The hydraulic rod 8 drives the placement table 7 and the electronic circuit board 6 to move upward, and the electronic circuit board 6 can be limited under the action of the limiting plate 4.

[0017] Working principle: the electronic circuit board 6 is neatly stacked on the placement table 7, the hydraulic rod 8 drives the placement table 7 and the electronic circuit board 6 to move upward, and the electronic circuit board 6 can be limited under the action of the limit plate 4, and then the second electric telescopic rod 11 drives the abutment plate 10 to abut the electronic circuit board 6 below (the uppermost electronic circuit board 6 is not abutted), and then the first electric telescopic rod 54 drives the connecting block 53 to move, the connecting block 53 drives the pushing rod 52 to move, and the pushing rod 52 drives the pushing plate 51 to push the uppermost electronic circuit board 6, and push the electronic circuit board 6 to the conveying platform 2, so as to realize the loading of the electronic circuit board 6.

[0018] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A reflow soldering furnace for electronic circuit boards with an automatic loading function, comprising a reflow soldering furnace (1), wherein a conveying platform (2) is arranged in the reflow soldering furnace (1), and openings matching the conveying platform (2) are provided on the left and right side walls of the reflow soldering furnace (1), characterized in that: The right side wall of the reflow soldering furnace (1) is provided with a fixed plate (9), the top of the fixed plate (9) is provided with a hydraulic rod (8), one end of the hydraulic rod (8) is provided with a placement table (7), the top of the placement table (7) is stacked with electronic circuit boards (6), the bottom of the placement table (7) is provided with a pushing assembly (5), the pushing assembly (5) includes a mounting plate (50) provided at the bottom of the placement table (7), a pushing plate (51) is provided inside the mounting plate (50), a pushing rod (52) is provided on the right side wall of the pushing plate (51), one end of the pushing rod (52) passes through the left side wall of the mounting plate (50) and is connected to a connecting block (53) provided outside, and the right side wall of the mounting plate (50) is provided with a first electric telescopic rod (54) at one end which is connected to the left side wall of the connecting block (53).

2. The reflow oven for electronic circuit boards with automatic loading function according to claim 1, characterized in that: The right side wall of the pushing plate (51) is provided with two groups of sliding rods (55), and one end of the two groups of sliding rods (55) penetrates the left side wall of the mounting plate (50) and is connected to the left side wall of the connecting block (53).

3. The reflow oven for electronic circuit boards with automatic loading function according to claim 1, characterized in that: The connecting block (53) is arranged in a T shape.

4. The reflow oven for electronic circuit boards with automatic loading function according to claim 1, characterized in that: A limiting plate (4) is provided above the conveying platform (2), and a connecting rod (3) is provided on the right side wall of the reflow oven (1), and one end of the connecting rod (3) is connected to the top of the limiting plate (4).

5. The reflow oven for electronic circuit boards with automatic loading function according to claim 1, characterized in that: The right side of the reflow soldering furnace (1) is provided with an abutment plate (10), and the right side wall of the reflow soldering furnace (1) is provided with a second electric telescopic rod (11), and one end of the second electric telescopic rod (11) is connected to the left side wall of the abutment plate (10).

6. The reflow oven for electronic circuit boards with automatic loading function according to claim 1, characterized in that: The mounting plate (50) is arranged in an L shape.

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