Sediment detector

Abstract

The utility model provides a sediment detector. The sediment detector comprises a detector body, an aviation plug, a bottom end conical head, a vernier, a depth gauge and a main control board, wherein the depth gauge and the main control board are arranged in the detector body; the aviation plug is mounted at the top end of the detector body; the bottom end conical head is mounted at the bottom end of the detector body, and a vibration motor is arranged in the bottom end conical head; the vernier is arranged outside the detector body in a sliding manner, and a permanent magnet is arranged in the vernier; a magnetic induction module is mounted on the depth gauge; when the sediment detector is lowered in place, a sensing signal of the magnetic sensing module is uploaded to an upper computer through the main control board, so that the upper computer obtains the thickness of sediment in the cast-in-place pile according to the sensing signal; when the sediment detector is lowered in place, the bottom end conical head makes contact with the bottom horizontal plane of the cast-in-place pile, and the vernier is located on the uppermost horizontal plane of a scum layer in the cast-in-place pile. The device has the characteristics of simple structure, convenience in operation, small size and the like.

Description

Technical Field

[0001] The utility model relates to concrete pouring, in particular to a sediment detector. Background Art

[0002] Before pouring concrete, in order to ensure the pouring quality of concrete, the sediment in the bored pile needs to be cleaned and the sediment thickness in the bored pile needs to be controlled within 50mm±10mm. Therefore, before pouring concrete, the sediment thickness in the bored pile needs to be tested to determine whether the sediment thickness in the bored pile meets the requirements and whether it needs to be cleaned. However, most of the instruments for sediment detection and cleaning on the market currently have problems such as large size and poor measurement accuracy, which may even affect the pouring quality of the bored pile. Utility Model Content

[0003] In order to overcome the deficiencies of the prior art, the purpose of the utility model is to provide a sediment detector, which can solve the problems of large equipment volume and poor measurement accuracy in the existing sediment detection in cast-in-place piles.

[0004] The purpose of the utility model is achieved by the following technical solutions:

[0005] A sediment detector comprises a detector body, an aviation plug, a bottom cone head, a vernier, a depth gauge and a main control board arranged in the detector body; wherein the aviation plug is installed at the top of the detector body, electrically connected to an external power supply and a main control board, and is used to obtain an external power supply to power the main control board; the bottom cone head is installed at the bottom end of the detector body, and a vibration motor is arranged in the bottom cone head to drive the vibration of the bottom cone head; the vibration motor is also electrically connected to the main control board; the vernier is slidably installed on the outside of the detector body, and a permanent magnet is arranged in the vernier; a magnetic induction module is installed on the depth gauge, and is electrically connected to the main control board;

[0006] When the sediment detector is lowered into place, the induction signal of the magnetic induction module is uploaded to the host computer through the main control board, so that the host computer can obtain the current position of the cursor on the detector body, that is, the sediment thickness in the cast-in-place pile, according to the induction signal and the assembly relationship between the magnetic induction module and the depth gauge; wherein, when the sediment detector is lowered into place, the bottom cone head contacts the bottom horizontal plane of the cast-in-place pile, and the cursor is located at the uppermost horizontal plane of the scum layer in the cast-in-place pile.

[0007] Furthermore, a vibration intensity sensor is also provided in the bottom cone head, which is used to obtain the vibration intensity data of the bottom cone head during the lowering of the sediment detector; wherein the vibration intensity sensor is electrically connected to the main control board and is electrically connected to the vibration intensity sensor, and is used to obtain the vibration intensity data of the bottom cone head in real time through the vibration intensity sensor during the lowering of the sediment detector.

[0008] Furthermore, the cursor includes a scum cursor and a laitance cursor; the scum cursor and the laitance cursor are slidably installed on the outside of the detector body, and the scum cursor and the laitance cursor are both provided with corresponding permanent magnets, and the scum cursor is located below the laitance cursor; when the sediment detector is in an initial state, the permanent magnet of the scum cursor corresponds horizontally to the bottom scale of the depth gauge; the gravity of the scum cursor is less than or equal to the buoyancy of the scum cursor in the laitance layer, the gravity of the laitance cursor is less than or equal to the buoyancy of the laitance cursor in the scum layer, and the gravity of the laitance cursor is greater than the buoyancy of the laitance cursor in the laitance layer.

[0009] Furthermore, the main control board includes a main control MCU; the magnetic sensing module includes a Hall sensor array composed of a plurality of three-axis linear Hall sensors installed in the depth gauge and arranged equidistantly along the depth gauge; each three-axis linear Hall sensor is electrically connected to the main control board; the main control board is used to obtain the sensing signal of the corresponding three-axis linear Hall sensor and upload the sensing signal to the host computer.

[0010] Furthermore, the main control MCU includes a chip U30 of model STM32L431CCT6;

[0011] Each of the three-axis linear Hall sensors includes a chip U1, a resistor R1, a resistor R2, a resistor R3, a resistor R4, a capacitor C1 and a resistor R22; wherein, the first end of the chip U1 is electrically connected to the main control MCU through the resistor R1, the second end is electrically connected to the main control MCU through the resistor R2, the third end is electrically connected to the chip U30 through the resistor R3, and the fourth end is electrically connected to the chip U30 through the resistor R4; the sixth and seventh ends of the chip U1 are grounded; the fifth end of the chip U1 is connected to the fourth internal power supply, and the fifth end is also grounded through the capacitor C1; one end of the resistor R22 is connected to the third internal power supply, and the other end outputs the fourth internal power supply.

[0012] Furthermore, the main control board also includes a motor drive circuit, a power conversion module, a 485 communication module and a voltage acquisition module; the input end of the power conversion module is electrically connected to the aviation plug, and is used to convert the external power supply into an internal power supply; the main control MCU is electrically connected to the vibration motor through the motor drive circuit; the vibration motor is a brushless motor; the main control MCU is communicatively connected to the 485 communication module and the host computer; the main control MCU is electrically connected to the aviation plug through the voltage acquisition module.

[0013] Further, the power conversion module includes a first power module, a second power module and a third power module; wherein the input end of the first power module is electrically connected to the aviation plug, and the output end outputs the first internal power supply; the input end of the second power module inputs the first internal power supply, and the output end outputs the second internal power supply; the input end of the third power module inputs the second internal power supply, and the output end outputs the third internal power supply;

[0014] The first power module includes a fuse F1, an ESD bidirectional diode E1, a TVS diode D6, a capacitor C40, a capacitor C26, a capacitor C27, a capacitor C42, a chip U34, an inductor L1, a Schottky diode D1, a resistor R181, a resistor R182, and a resistor R183; wherein, one end of the fuse F1 is electrically connected to the input terminal VIN, and the other end is electrically connected to the seventh end of the chip U34; an external power supply is also connected between the seventh end of the chip U34 and the fuse F1; the sixth end of the chip U34 is connected between the fuse F1 and the seventh end of the chip U34 through the capacitor C26; one end of the ESD bidirectional diode E1, the TVS diode D2, and the capacitor C40 is grounded, and the other end is connected between the other end of the fuse F1 and the seventh end of the chip U34; the eighth end of the chip U34 The first end of the chip U34 is grounded; the second end of the chip U34 is grounded through the resistor R183; the third end of the chip U34 outputs the first internal power supply; the fourth end of the chip U34 is also grounded through the Schottky diode D1; the fourth end of the chip U34 is also connected to the output end OUT_C ​​through the inductor L1; one end of the resistor R181 outputs the first internal power supply, and the other end is electrically connected to the inductor L1; one end of the capacitor C27 is grounded, and the other end is connected between the inductor L1 and the resistor R181; one end of the resistor R182 is electrically connected to the inductor L1 through the resistor R181, and the other end is connected between the second end of the chip U34 and the capacitor C42; one end of the resistor R183 is grounded, and the other end is connected between the second end of the chip U34 and the capacitor C42; the fifth end of the chip U5 is also connected between the inductor L1 and the resistor R181;

[0015] The second power supply module includes capacitor C9, capacitor C10, capacitor C11, capacitor C12 and chip U36; wherein one end of capacitor C9 is electrically connected to the third end of chip U36, and the other end is grounded; one end of capacitor C12 is electrically connected to the third end of chip U36, and the other end is grounded; one end of capacitor C9 is electrically connected to the second end and the fourth end of chip U36, and the other end is grounded; one end of capacitor C11 is electrically connected to the second end and the fourth end of chip U36, and the other end is grounded; the first end of chip U36 is connected to the first internal power supply, the second end and the fourth end output the second internal power supply, and the third end is grounded;

[0016] The third power supply module includes a resistor R21; wherein one end of the resistor R21 is connected to the second internal power supply, and the other end outputs the third internal power supply;

[0017] The motor drive circuit includes a resistor R34, a resistor R35, a resistor R36, a chip UX, a capacitor C13, a capacitor C14, a capacitor C15 and a plug connector CN5; wherein, one end of the resistor R35 is grounded, and the other end is electrically connected to the first end of the chip UX; the second end of the chip UX is grounded; the third end and the fourth end of the chip UX are electrically connected to the main control MCU; the fifth end of the chip UX is grounded through the capacitor C13, and the sixth end of the chip UX is grounded through the resistor R34; the eighth end of the chip UX is grounded through the resistor R36; the seventh end, the tenth end, the seventeenth end and the sixteenth end of the chip UX are all grounded; the fourteenth end of the chip UX is connected to the first internal power supply; the fifteenth end of the chip UX is electrically connected to the fourteenth end of the chip UX through the capacitor C14; the thirteenth end, the twelfth end and the eleventh end of the chip UX are electrically connected to the vibration motor through the plug connector CN5; one end of the capacitor C15 is grounded, and the other end is electrically connected to the fourteenth end of the chip UX;

[0018] The 485 communication module includes a resistor R184, a resistor R193, a resistor R185, a resistor R186, a capacitor C18, a resistor RT1, an anti-static diode D4, a resistor MOV1, a resistor MOV2, a voltage protector M1, a voltage protector M2 and a plug CN1; wherein one end of the resistor R184 is connected to the second internal power supply, and the other end is electrically connected to the first end of the chip U28; one end of the resistor R193 is grounded, and the other end is electrically connected to the second end of the chip U28; the first end and the fourth end of the chip U28 are electrically connected to the main control MCU; the second end and the third end of the chip U28 are electrically connected to the main control MCU; the eighth end of the chip U28 is connected to the second internal power supply, and the eighth end is also grounded through the capacitor C46; the fifth end of the chip U28 is grounded; the seventh end of the chip U28 is connected to the second internal power supply. 185 is electrically connected to the third end of the voltage protector M1; the first end of the voltage protector M1 is electrically connected to the third end of the plug CN1; the sixth end of the chip U28 is electrically connected to the third end of the voltage protector M2 through the resistor R186; the first end of the voltage protector M2 is electrically connected to the fourth end of the plug CN1; the first end of the voltage protector M1 is also grounded through the resistor MOV2, and the first end of the voltage protector M2 is also grounded through the resistor MOV1; the first end of the anti-static diode D4 is grounded, the second end is connected between the resistor R185 and the third end of the voltage protector M1, and the third end is connected between the resistor R186 and the third end of the voltage protector M2; one end of the resistor RT1 is connected between the resistor R185 and the third end of the voltage protector M1, and the other end is connected between the resistor R186 and the third end of the voltage protector M2;

[0019] The voltage acquisition module includes a resistor R191, a resistor R192, a resistor R190, a resistor R195, a TVS surge protection high voltage protection diode D5 and a capacitor C77; wherein, one end of the resistor R192 is connected to an aviation plug, and the other end is electrically connected to the first end of the TVS surge protection high voltage protection diode D5 through the resistor R191; one end of the resistor R195 is electrically connected to the first end of the TVS surge protection high voltage protection diode D5, and the other end is electrically connected to the main control MCU; one end of the capacitor C77 is grounded, and the other end is connected between the resistor R195 and the main control MCU; one end of the resistor R190 is grounded, and the other end is connected between the resistor R191 and the resistor R195.

[0020] Furthermore, the detector body is also provided with an inclination sensor for obtaining the inclination data of the sediment detector; the main control board is electrically connected to the inclination sensor;

[0021] Among them, the inclination sensor includes resistor R15, resistor R16, capacitor C55, capacitor C56 and chip U31; wherein, one end of the resistor R15 is connected to the second internal power supply, and the other end is electrically connected to the fourth end of the chip U31; one end of the resistor R16 is connected to the second internal power supply, and the other end is electrically connected to the sixth end of the chip U31; the fourth end of the chip U31 and the sixth end of the chip U31 are electrically connected to the main control MCU; the fifth end, the seventh end, the twelfth end and the tenth end of the chip U31 are grounded; the fourteenth end and the eighth end of the chip U31 are connected to the second internal power supply; the first end of the chip U31 is grounded through capacitors C55 and C56 in parallel.

[0022] Furthermore, the detector body includes a shell, and the main control board and the magnetic induction module are both arranged in the shell; a fixing plate is also provided in the shell, and the main control board and the magnetic induction module are both fixed on the fixing plate; a motor fixing block is also provided in the bottom cone head, and the vibration motor is fixed on the motor fixing block.

[0023] Furthermore, the aviation plug includes an aviation plug male head and an aviation plug female head; the aviation plug male head is fixedly connected to the top of the detector body; the aviation plug female head is matingly connected to the aviation plug male head; and the aviation plug female head is electrically connected to an external power supply.

[0024] Compared with the prior art, the beneficial effects of the present invention are:

[0025] The utility model realizes the sliding of the cursor arranged outside the detector body by using magnetic induction and a depth gauge to realize automatic detection of the thickness of the sediment in the bored pile. The device has the characteristics of simple structure, small size, convenient operation, etc., does not need manual measurement, and has higher measurement efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 A schematic diagram of the overall structure of a sediment detector provided by the utility model;

[0027] Figure 2 for Figure 1 A schematic diagram of the cross-section structure in FIG.

[0028] Figure 3 A circuit diagram of a first power supply module of the sediment detector provided by the utility model;

[0029] Figure 4 A circuit diagram of the second power module and the third power module of the sediment detector provided by the utility model;

[0030] Figure 5 A circuit diagram of the main control MCU of the sediment detector provided by the utility model;

[0031] Figure 6 A circuit diagram of a three-axis linear Hall sensor of a sediment detector provided by the utility model;

[0032] Figure 7 The circuit diagram of the 485 communication module of the sediment detector provided by the utility model;

[0033] Figure 8 A circuit diagram of a voltage acquisition module of a sediment detector provided by the utility model;

[0034] Fig. 9 A circuit diagram of a motor drive circuit of a sediment detector provided by the utility model;

[0035] Fig.10 The utility model provides a circuit diagram of the inclination sensor of the sediment detector.

[0036] In the figure: 1. Detector body; 2. Bottom cone head; 3. Aviation plug; 11. Float cursor; 12. Scum cursor; 13. Main control board; 14. Three-axis linear Hall sensor; 15. Fixing plate; 21. Motor fixing block; 22. Vibration motor; 31. Aviation plug female head; 32. Aviation plug male head. DETAILED DESCRIPTION

[0037] The present invention is further described below in conjunction with the accompanying drawings and specific implementation methods. It should be noted that, under the premise of no conflict, the various embodiments or technical features described below can be arbitrarily combined to form a new embodiment.

[0038] The utility model provides a preferred embodiment, a sediment detector, such as Figure 1 - Figure 2 As shown, it includes a detector body 1, an aviation plug 3, a bottom cone head 2, a cursor, a depth gauge and a main control board 13 arranged in the detector body 1. Among them, the aviation plug 3 is installed at the top of the detector body 1, and is electrically connected to an external power supply through the aviation plug 3 to provide power supply through the sediment detector.

[0039] The bottom cone head 2 is installed at the bottom of the detector body 1, and is used to insert into the sediment layer in the cast-in-place pile during the lowering of the sediment detector. More preferably, a vibration motor 22 is also provided in the bottom cone head 2, and the vibration motor 22 drives the vibration of the bottom cone head 2 so that the bottom cone head 2 can be inserted into the sediment layer when it contacts the sediment layer in the cast-in-place pile.

[0040] The cursor is slidably mounted on the outside of the detector body 1, and a permanent magnet is provided inside the cursor. A magnetic sensing module is installed on the depth gauge, which is electrically connected to the main control board 13. That is, when the cursor slides outside the detector body 1, due to the action of the permanent magnet, the magnetic sensing module will sense the permanent magnet, and then generate an induction signal. In this way, the sliding position or sliding distance of the cursor in the detector body 1 can be judged according to the induction signal. When the sediment detector is lowered into place, the cursor will be located at the top horizontal plane of the sediment layer in the cast-in-place pile due to the buoyancy and resistance of the sediment layer in the cast-in-place pile. At this time, the sediment thickness in the cast-in-place pile can be obtained according to the position of the cursor and the assembly of the depth gauge.

[0041] More preferably, the present embodiment further provides that when the sediment detector is in the initial state, the permanent magnet in the cursor corresponds to the bottom scale of the depth gauge horizontally, so that when the sediment detector is lowered into place, the cursor will slide to the horizontal plane at the top of the sediment layer, at which time the magnetic sensing module will sense the sensing signal and upload it to the host computer through the main control board 13, so that the host computer can obtain the position of the cursor on the detector body 1 according to the sensing signal, and then obtain the scale of the depth gauge corresponding to the cursor, so as to realize the automatic detection of the thickness of the sediment layer without manual intervention. At the same time, the sediment detector provided by the present embodiment also has the characteristics of simple structure, small size, and convenient operation.

[0042] More specifically, the maximum thickness of the sediment measured by the sediment detector provided in this embodiment can reach 500 mm, wherein the lowest scale of the depth gauge is 0 mm, and the highest scale is 500 mm.

[0043] In addition, since the bottom of the housing is equipped with a bottom cone head and a vibration motor 22, and other equipment is also provided for horizontal front design, the bottom cone head in this embodiment is provided as a cone cage type horizontal front structure. When the sediment detector is in the initial state, the front end surface of the cone cage is horizontal with the bottom end of the depth gauge, and the permanent magnet on the cursor is horizontally opposite to the scale at the bottom end of the depth gauge. Specifically, the scale at the bottom end of the depth gauge can be calibrated to 0 mm by calibration.

[0044] Preferably, the sediment in the cast-in-place pile can be divided into a scum layer and a slurry layer according to the different materials of the sediment. Therefore, similarly, the cursors in this embodiment include a scum cursor 12 and a slurry cursor 11, and the scum cursor 12 and the slurry cursor 11 are slidably installed on the outside of the detector body 1, and the scum cursor 12 is located above the slurry cursor 11. Corresponding permanent magnets are provided in the scum cursor 12 and the slurry cursor 11. This embodiment realizes the thickness of the sediment layer in the cast-in-place pile, that is, the thickness of the slurry layer and the thickness of the scum layer by sliding the scum cursor 12 and the slurry cursor 11 slidably installed on the outside of the detector body 1. Furthermore, in an actual environment, the sediment layer above the concrete layer cast in the cast-in-place pile will include a slurry layer and a scum layer. Since the density of the scum is greater than the density of the slurry, the scum layer will be located at the bottom of the slurry layer. Therefore, in this embodiment, the scum cursor 12 is also set above the slurry cursor 11, and the thickness of the slurry layer is detected by the moving position of the scum cursor 12, and the thickness of the scum layer is detected by the moving distance of the slurry cursor 11. In fact, before the test starts, due to the gravity of the slurry cursor 11 and the gravity of the scum cursor 12, both are below the detector body 1; and the permanent magnet of the scum cursor 12 is level with the scale at the bottom of the depth gauge, and the permanent magnet of the slurry cursor 11 is level with the first preset scale of the depth gauge. For example, the first preset scale is 20mm.

[0045] When the sediment detector is lowered into the bored pile, and the bottom cone head 2 contacts the bottom of the bored pile, the scum cursor 12 will be located at the top horizontal plane of the scum layer, and the slurry cursor 11 will be located at the top horizontal plane of the slurry layer. In this way, the thickness of the slurry layer and the scum layer can be detected according to the positions of the scum cursor 12 and the slurry cursor 11 on the detector body 1.

[0046] When the sediment detector is lowered into place, in order to ensure accurate measurement, the present embodiment also ensures that the gravity of the scum cursor 12 is less than or equal to the buoyancy of the scum cursor 12 in the slurry layer, so as to ensure that the scum cursor 12 is located at the topmost horizontal plane of the slurry layer; similarly, when the sediment detector is lowered into place, the gravity of the slurry cursor 11 is less than or equal to the buoyancy of the slurry cursor 11 in the scum layer.

[0047] Furthermore, the magnetic core sensing module includes a Hall sensor array composed of a plurality of three-axis linear Hall sensors 14 installed on the depth gauge and arranged equidistantly along the depth gauge. Each Hall sensor is electrically connected to the main control board 13. Once the cursor moves to the corresponding three-axis linear Hall sensor 14, the corresponding three-axis linear Hall sensor 14 will sense the permanent magnet and generate a sensing signal. The main control board 13 will upload the sensing signal to the host computer, and the host computer will detect the sediment thickness according to the sensing signal and the assembly relationship between the three-axis linear Hall sensor 14 and the depth gauge. When there are two cursor heads, the scum thickness and the slurry thickness in the cast-in-place pile can be detected at the same time.

[0048] More specifically, the main control board 13 also includes a main control MCU. Figure 5As shown, the main control MCU includes a chip U30 of model STM32L431CCT6 and its peripheral circuits, specifically including a resistor R188, a capacitor C47, a capacitor C48, a switch, a capacitor C45, a capacitor C54, a capacitor C49, a capacitor C50, a capacitor C51, a capacitor C53, a resistor R187, a capacitor C52, a resistor R189, a chip U29 and a plug connector H1. Among them, one end of the resistor R188 is grounded (GND), and the other end is electrically connected to the 44th end of the chip U30. The 48th end, the 36th end, and the 24th end of the chip U30 are connected to the second internal power supply, that is, 3.3V. The first end (VBAT end) of the chip U30 is connected to the second internal power supply and grounded through the capacitor C47. The eighth end of the chip U30 is connected to AGND, the ninth end is connected to VREF, the 35th end is grounded, and the 23rd end is grounded. One end of capacitor C48 is electrically connected to the first and third ends of the switch, and the other end is electrically connected to the second and fourth ends of the switch; the first and third ends of the switch are also electrically connected to the seventh end of chip U30, and the second and fourth ends of the switch are grounded; the switch can be used to send a reset signal to chip U30 to achieve a reset function. One end of capacitor C45, capacitor C54, capacitor C49, and capacitor C50 are all connected to the second internal power supply, that is, 3.3V, and the other end is grounded (GND). Through the parallel circuit formed by the capacitor, the second internal power supply connected to chip U30 is filtered to ensure the stability of the power supply. One end of capacitor C51 and capacitor C53 is connected to the ninth end (VREF end) of chip U30, and the other end is connected to AGND. One end of resistor R187 is connected to the second internal power supply (3.3V), and the other end is electrically connected to the ninth end (VREF end) of chip U30. The first end and the second end of the chip U29 are connected between the resistor R187 and the ninth end of the chip U30, and the third end is connected to AGND. One end of the capacitor C52 is grounded, and the other end is connected between the resistor R187 and the ninth end of the chip U30. One end of the resistor R189 is grounded (GND), and the other end is connected to AGND. The first end of the plug connector H1 is grounded, the second end is connected to the second internal power supply, the third end is electrically connected to the thirty-seventh end of the chip U30, and the fourth end is electrically connected to the thirty-fourth end of the chip U30.

[0049] like Figure 6As shown, a three-axis linear Hall sensor 14 in this embodiment includes a chip U1, a resistor R1, a resistor R2, a resistor R3, a resistor R4, a capacitor C1 and a resistor R22. Among them, the first end of the chip U1 is electrically connected to the main control MCU through the resistor R1, the second end is electrically connected to the main control MCU through the resistor R2, the third end is electrically connected to the main control MCU through the resistor R3, and the fourth end is electrically connected to the main control MCU through the resistor R4. The sixth and seventh ends of the chip U1 are grounded. The fifth end of the chip U1 is connected to the fourth internal power supply, and the fifth end is also grounded through the capacitor C1. One end of the resistor R22 is connected to the third internal power supply, and the other end outputs the fourth internal power supply. By electrically connecting each three-axis linear Hall sensor 14 to the suction cup U30 of the main control MCU, signal sensing of each three-axis linear Hall sensor 14 can be achieved. That is, when the scum cursor 12 or the slurry cursor 11 with a permanent magnet is located at the corresponding three-axis linear Hall sensor 14, the main control MCU will sense the corresponding electrical signal, and then send the electrical signal to the host computer, which can calculate the thickness of the slurry layer and the scum layer according to the installation position of the corresponding three-axis linear Hall sensor 14 and the size of the detector body 1, thereby realizing the detection of the sediment layer in the cast-in-place pile. Among them, the model of chip U1 is: TMAG5170A1QDGKR.

[0050] Preferably, the main control board 13 also includes a motor drive circuit, a power conversion module, a 485 communication module and a voltage acquisition module. Among them, the input end of the power conversion module is electrically connected to the aviation plug 3, and is used to convert the external power supply into an internal power supply. In addition, since the voltage of the power supply required by each module such as the main control MCU, the motor drive circuit, the 485 communication module, and the voltage acquisition module is different, the power conversion module in this embodiment specifically includes a first power module, a second power module and a third power module. Among them, the first power module is electrically connected to the aviation plug 3, and is used to convert the external power supply into a first internal power supply for use by the motor drive circuit.

[0051] The second power supply module is used to convert the first internal power supply into a second internal power supply for use by the main control MCU and the 485 communication module.

[0052] The third power supply module is used to convert the second internal power supply into a third internal power supply for use by the three-axis linear Hall sensor 14. By setting the power supply module, the power supply voltage is converted to adapt to different modules to ensure the normal operation of each module.

[0053] Furthermore, the main control MCU is electrically connected to the vibration motor 22 through the motor drive circuit, and the vibration motor 22 is driven to vibrate through the motor drive circuit. More specifically, the vibration motor 22 is a brushless motor. The main control MCU is also connected to the host computer through the 485 communication module to realize data interaction with the host computer, such as receiving control instructions sent by the host computer or uploading data to the host computer. The main control MCU is also electrically connected to the aviation plug 3 through the voltage acquisition module to obtain the voltage of the external power supply to determine whether the external power supply is normal.

[0054] More specifically, Figure 3 As shown, the first power module includes a fuse F1, an ESD bidirectional diode E1, a TVS diode D6, a capacitor C40, a capacitor C26, a capacitor C27, a capacitor C42, a chip U34, an inductor L1, a Schottky diode D1, a resistor R181, a resistor R182 and a resistor R183. Among them, one end of the fuse F1 is electrically connected to the input terminal VIN, and the other end is electrically connected to the seventh end of the chip U34. An external power supply is also connected between the seventh end of the chip U34 and the fuse F1. The sixth end of the chip U34 is connected between the fuse F1 and the seventh end of the chip U34 through the capacitor C26. One end of the ESD bidirectional diode E1, the TVS diode D2, and the capacitor C40 is grounded, and the other end is connected between the other end of the fuse F1 and the seventh end of the chip U34. The eighth end and the first end of the chip U34 are grounded. The second end of the chip U34 is grounded through the resistor R183. The third end of the chip U34 outputs the first internal power supply. The fourth end of the chip U34 is also grounded through the Schottky diode D1. The fourth end of the chip U34 is also connected to the output terminal OUT_C ​​through the inductor L1. One end of the resistor R181 outputs the first internal power supply, and the other end is electrically connected to the inductor L1. One end of the capacitor C27 is grounded, and the other end is connected between the inductor L1 and the resistor R181. One end of the resistor R182 is electrically connected to the inductor L1 through the resistor R181, and the other end is connected between the second end of the chip U34 and the capacitor C42. One end of the resistor R183 is grounded, and the other end is connected between the second end of the chip U34 and the capacitor C42. The fifth end of the chip U5 is also connected between the inductor L1 and the resistor R181. Among them, the model of the chip U34 is XL7056E1.

[0055] like Figure 4As shown, the second power supply module includes capacitor C9, capacitor C10, capacitor C11, capacitor C12 and chip U36. Among them, one end of capacitor C9 is electrically connected to the third end of chip U36, and the other end is grounded. One end of capacitor C12 is electrically connected to the third end of chip U36, and the other end is grounded. One end of capacitor C9 is electrically connected to the second end and the fourth end of chip U36, and the other end is grounded. One end of capacitor C11 is electrically connected to the second end and the fourth end of chip U36, and the other end is grounded. The first end of chip U36 is connected to the first internal power supply, the second end and the fourth end output the second internal power supply, and the third end is grounded.

[0056] like Figure 4 As shown, the third power supply module includes a resistor R21, wherein one end of the resistor R21 is connected to the second internal power supply, and the other end of the resistor R21 outputs the third internal power supply.

[0057] like Fig. 9 As shown, the motor drive circuit includes a resistor R34, a resistor R35, a resistor R36, a chip UX, a capacitor C13, a capacitor C14, a capacitor C15 and a plug CN5. One end of the resistor R35 is grounded, and the other end is electrically connected to the first end of the chip UX. The second end of the chip UX is grounded. The third and fourth ends of the chip UX are electrically connected to the main control MCU. The fifth end of the chip UX is grounded through the capacitor C13, and the sixth end of the chip UX is grounded through the resistor R34. The eighth end of the chip UX is grounded through the resistor R36. The seventh, tenth, seventeenth and sixteenth ends of the chip UX are all grounded. The fourteenth end of the chip UX is connected to the first internal power supply. The fifteenth end of the chip UX is electrically connected to the fourteenth end of the chip UX through the capacitor C14. The thirteenth, twelfth and eleventh ends of the chip UX are electrically connected to the vibration motor 22 through the plug CN5. One end of the capacitor C15 is grounded, and the other end is electrically connected to the fourteenth end of the chip UX. Among them, the model of chip UX is 2DRV10974PWPR.

[0058] like Figure 7As shown, the 485 communication module includes a resistor R184, a resistor R193, a resistor R185, a resistor R186, a capacitor C18, a resistor RT1, an anti-static diode D4, a resistor MOV1, a resistor MOV2, a voltage protector M1, a voltage protector M2, a chip U28 and a plug connector CN1. Among them, one end of the resistor R184 is connected to the second internal power supply, and the other end is electrically connected to the first end of the chip U28. One end of the resistor R193 is grounded, and the other end is electrically connected to the second end of the chip U28. The first end and the fourth end of the chip U28 are electrically connected to the main control MCU. The second end and the third end of the chip U28 are electrically connected to the main control MCU. The eighth end of the chip U28 is connected to the second internal power supply, and the eighth end is also grounded through the capacitor C46. The fifth end of the chip U28 is grounded; the seventh end of the chip U28 is electrically connected to the third end of the voltage protector M1 through the resistor R185; the first end of the voltage protector M1 is electrically connected to the third end of the plug connector CN1. The sixth end of the chip U28 is electrically connected to the third end of the voltage protector M2 through the resistor R186. The first end of the voltage protector M2 is electrically connected to the fourth end of the plug CN1. The first end of the voltage protector M1 is also grounded through the resistor MOV2, and the first end of the voltage protector M2 is also grounded through the resistor MOV1. The first end of the anti-static diode D4 is grounded, the second end is connected between the resistor R185 and the third end of the voltage protector M1, and the third end is connected between the resistor R186 and the third end of the voltage protector M2. One end of the resistor RT1 is connected between the resistor R185 and the third end of the voltage protector M1, and the other end is connected between the resistor R186 and the third end of the voltage protector M2.

[0059] like Figure 8 As shown, the voltage acquisition module includes a resistor R191, a resistor R192, a resistor R190, a resistor R195, a TVS surge protection high voltage protection diode D5 and a capacitor C77. Among them, one end of the resistor R192 is connected to the aviation plug 3, and the other end is electrically connected to the first end of the TVS surge protection high voltage protection diode D5 through the resistor R191. One end of the resistor R195 is electrically connected to the first end of the TVS surge protection high voltage protection diode D5, and the other end is electrically connected to the main control MCU. One end of the capacitor C77 is grounded, and the other end is connected between the resistor R195 and the main control MCU. One end of the resistor R190 is grounded, and the other end is connected between the resistor R191 and the resistor R195.

[0060] Preferably, a vibration intensity sensor is also provided in the bottom cone head 2. The main control board 13 is electrically connected to the vibration intensity sensor, and is used to obtain the vibration intensity data of the bottom cone head 2 in real time through the vibration intensity sensor during the lowering of the sediment detector. The present embodiment also collects the feedback of the vibration intensity data of the bottom cone head 2 to determine the medium in which the bottom cone head 2 is located. Normally, due to the different hardness of the slurry layer, the scum layer and the concrete layer in the cast-in-place pile, the vibration intensity of the bottom cone head 2 will be different under the drive of the same vibration motor 22. Therefore, the present embodiment also obtains the feedback of the vibration intensity data of the bottom cone head 2 in real time by providing a vibration intensity sensor in the bottom cone head 2 to determine the medium in which the bottom cone head 2 is located, so that it can be determined whether the sediment detector is lowered into place according to the medium in which the bottom cone head 2 is located.

[0061] Preferably, a tilt sensor is also provided inside the detector body 1 for obtaining tilt data of the sediment detector. The main control board 13 is electrically connected to the tilt sensor for obtaining tilt data of the sediment detector through the tilt sensor. By collecting the tilt data of the sediment detector, it is possible to determine whether the sediment detector is tilted, so as to assist in determining whether the sediment detector is lowered into place; and during the lowering process of the sediment detector, it is possible to determine whether the sediment detector is tilted.

[0062] More specifically, Fig.10 As shown, the inclination sensor includes a resistor R15, a resistor R16, a capacitor C55, a capacitor C56 and a chip U31. Among them, one end of the resistor R15 is connected to the second internal power supply, and the other end is electrically connected to the fourth end of the chip U31. One end of the resistor R16 is connected to the second internal power supply, and the other end is electrically connected to the sixth end of the chip U31. The fourth end of the chip U31 and the sixth end of the chip U31 are electrically connected to the main control MCU. The fifth end, the seventh end, the twelfth end, and the tenth end of the chip U31 are grounded. The fourteenth end and the eighth end of the chip U31 are connected to the second internal power supply. The first end of the chip U31 is grounded through the capacitors C55 and C56 connected in parallel. Among them, the model of the chip U31 is LIS3DHTR.

[0063] More preferably, the detector body 1 includes a housing. In addition, a fixing plate 15 is provided in the housing, and the main control board 13 and the magnetic induction module are fixed on the fixing plate 15 to prevent the main control board 13 and the magnetic induction module from shifting when the vibration motor 22 drives the bottom cone head 2 to vibrate.

[0064] Similarly, a motor fixing block 21 is also provided in the bottom cone head 2 , and the vibration motor 22 is located in the motor fixing block 21 to limit the vibration motor 22 .

[0065] More preferably, the aviation plug 3 includes an aviation plug male head 32 and an aviation plug female head 31; the aviation plug male head 32 is fixedly connected to the top of the detector body 1; the aviation plug female head 31 is matched and connected with the aviation plug male head 32; the aviation plug female head 31 is electrically connected to an external power supply. The main control board 13 of the sediment detector is powered by the aviation plug 3.

[0066] The above-mentioned implementation modes are only preferred implementation modes of the present invention, and cannot be used to limit the protection scope of the present invention. Any non-substantial changes and substitutions made by technicians in this field on the basis of the present invention shall fall within the scope of protection required by the present invention.

Claims

1. A sediment detector, characterized in that: It includes a detector body, an aviation plug, a bottom cone head, a vernier, a depth gauge and a main control board arranged in the detector body; wherein the aviation plug is installed at the top of the detector body, electrically connected to an external power supply and a main control board, and is used to obtain an external power supply to power the main control board; the bottom cone head is installed at the bottom end of the detector body, and a vibration motor is arranged in the bottom cone head to drive the vibration of the bottom cone head; the vibration motor is also electrically connected to the main control board; the vernier is slidably installed on the outside of the detector body, and a permanent magnet is arranged in the vernier; a magnetic induction module is installed on the depth gauge, and is electrically connected to the main control board; When the sediment detector is lowered into place, the induction signal of the magnetic induction module is uploaded to the host computer through the main control board, so that the host computer can obtain the current position of the cursor on the detector body according to the induction signal and the assembly relationship between the magnetic induction module and the depth gauge, and then obtain the sediment thickness in the cast-in-place pile; wherein, when the sediment detector is lowered into place, the bottom cone head contacts the bottom horizontal surface of the cast-in-place pile, and the cursor is located at the uppermost horizontal surface of the scum layer in the cast-in-place pile.

2. The sediment detector according to claim 1, characterized in that: A vibration intensity sensor is also provided in the bottom cone head, which is used to obtain the vibration intensity data of the bottom cone head in real time during the lowering process of the sediment detector; wherein the vibration intensity sensor is electrically connected to the main control board.

3. The sediment detector according to claim 1, characterized in that: The cursor includes a scum cursor and a laitance cursor; the scum cursor and the laitance cursor are slidably installed on the outside of the detector body, and the scum cursor and the laitance cursor are both provided with corresponding permanent magnets, and the scum cursor is located below the laitance cursor; when the sediment detector is in an initial state, the permanent magnet of the scum cursor corresponds horizontally to the bottom scale of the depth gauge; the gravity of the scum cursor is less than or equal to the buoyancy of the scum cursor in the laitance layer, the gravity of the laitance cursor is less than or equal to the buoyancy of the laitance cursor in the scum layer, and the gravity of the laitance cursor is greater than the buoyancy of the laitance cursor in the laitance layer.

4. The sediment detector according to claim 1, characterized in that: The main control board includes a main control MCU; the magnetic sensing module includes a Hall sensor array composed of a plurality of three-axis linear Hall sensors installed in the depth gauge and arranged equidistantly along the depth gauge; each three-axis linear Hall sensor is electrically connected to the main control board; the main control board is used to obtain the sensing signal of the corresponding three-axis linear Hall sensor and upload the sensing signal to the host computer.

5. The sediment detector according to claim 4, characterized in that: The main control MCU includes a chip U30 of model STM32L431CCT6; Each of the three-axis linear Hall sensors includes a chip U1, a resistor R1, a resistor R2, a resistor R3, a resistor R4, a capacitor C1 and a resistor R22; wherein, the first end of the chip U1 is electrically connected to the main control MCU through the resistor R1, the second end is electrically connected to the main control MCU through the resistor R2, the third end is electrically connected to the chip U30 through the resistor R3, and the fourth end is electrically connected to the chip U30 through the resistor R4; the sixth and seventh ends of the chip U1 are grounded; the fifth end of the chip U1 is connected to the fourth internal power supply, and the fifth end is also grounded through the capacitor C1; one end of the resistor R22 is connected to the third internal power supply, and the other end outputs the fourth internal power supply.

6. The sediment detector according to claim 4, characterized in that: The main control board also includes a motor drive circuit, a power conversion module, a 485 communication module and a voltage acquisition module; the input end of the power conversion module is electrically connected to the aviation plug, and is used to convert the external power supply into an internal power supply; the main control MCU is electrically connected to the vibration motor through the motor drive circuit; the vibration motor is a brushless motor; the main control MCU is communicatively connected to the 485 communication module and the host computer; the main control MCU is electrically connected to the aviation plug through the voltage acquisition module.

7. The sediment detector according to claim 6, characterized in that: The power conversion module includes a first power module, a second power module and a third power module; wherein the input end of the first power module is electrically connected to the aviation plug, and the output end outputs the first internal power supply; the input end of the second power module inputs the first internal power supply, and the output end outputs the second internal power supply; the input end of the third power module inputs the second internal power supply, and the output end outputs the third internal power supply; The first power module includes a fuse F1, an ESD bidirectional diode E1, a TVS diode D6, a capacitor C40, a capacitor C26, a capacitor C27, a capacitor C42, a chip U34, an inductor L1, a Schottky diode D1, a resistor R181, a resistor R182, and a resistor R183; wherein, one end of the fuse F1 is electrically connected to the input terminal VIN, and the other end is electrically connected to the seventh end of the chip U34; an external power supply is also connected between the seventh end of the chip U34 and the fuse F1; the sixth end of the chip U34 is connected between the fuse F1 and the seventh end of the chip U34 through the capacitor C26; one end of the ESD bidirectional diode E1, the TVS diode D2, and the capacitor C40 is grounded, and the other end is connected between the other end of the fuse F1 and the seventh end of the chip U34; the eighth end of the chip U34 The first end of the chip U34 is grounded; the second end of the chip U34 is grounded through the resistor R183; the third end of the chip U34 outputs the first internal power supply; the fourth end of the chip U34 is also grounded through the Schottky diode D1; the fourth end of the chip U34 is also connected to the output end OUT_C ​​through the inductor L1; one end of the resistor R181 outputs the first internal power supply, and the other end is electrically connected to the inductor L1; one end of the capacitor C27 is grounded, and the other end is connected between the inductor L1 and the resistor R181; one end of the resistor R182 is electrically connected to the inductor L1 through the resistor R181, and the other end is connected between the second end of the chip U34 and the capacitor C42; one end of the resistor R183 is grounded, and the other end is connected between the second end of the chip U34 and the capacitor C42; the fifth end of the chip U5 is also connected between the inductor L1 and the resistor R181; The second power supply module includes capacitor C9, capacitor C10, capacitor C11, capacitor C12 and chip U36; wherein one end of capacitor C9 is electrically connected to the third end of chip U36, and the other end is grounded; one end of capacitor C12 is electrically connected to the third end of chip U36, and the other end is grounded; one end of capacitor C9 is electrically connected to the second end and the fourth end of chip U36, and the other end is grounded; one end of capacitor C11 is electrically connected to the second end and the fourth end of chip U36, and the other end is grounded; the first end of chip U36 is connected to the first internal power supply, the second end and the fourth end output the second internal power supply, and the third end is grounded; The third power supply module includes a resistor R21; wherein one end of the resistor R21 is connected to the second internal power supply, and the other end outputs the third internal power supply; The motor drive circuit includes a resistor R34, a resistor R35, a resistor R36, a chip UX, a capacitor C13, a capacitor C14, a capacitor C15 and a plug connector CN5; wherein, one end of the resistor R35 is grounded, and the other end is electrically connected to the first end of the chip UX; the second end of the chip UX is grounded; the third end and the fourth end of the chip UX are electrically connected to the main control MCU; the fifth end of the chip UX is grounded through the capacitor C13, and the sixth end of the chip UX is grounded through the resistor R34; the eighth end of the chip UX is grounded through the resistor R36; the seventh end, the tenth end, the seventeenth end and the sixteenth end of the chip UX are all grounded; the fourteenth end of the chip UX is connected to the first internal power supply; the fifteenth end of the chip UX is electrically connected to the fourteenth end of the chip UX through the capacitor C14; the thirteenth end, the twelfth end and the eleventh end of the chip UX are electrically connected to the vibration motor through the plug connector CN5; one end of the capacitor C15 is grounded, and the other end is electrically connected to the fourteenth end of the chip UX; The 485 communication module includes a resistor R184, a resistor R193, a resistor R185, a resistor R186, a capacitor C18, a resistor RT1, an anti-static diode D4, a resistor MOV1, a resistor MOV2, a voltage protector M1, a voltage protector M2, a chip U28 and a plug connector CN1; wherein, one end of the resistor R184 is connected to the second internal power supply, and the other end is electrically connected to the first end of the chip U28; one end of the resistor R193 is grounded, and the other end is electrically connected to the second end of the chip U28; the first end and the fourth end of the chip U28 are electrically connected to the main control MCU; the second end and the third end of the chip U28 are electrically connected to the main control MCU; the eighth end of the chip U28 is connected to the second internal power supply, and the eighth end is also grounded through the capacitor C46; the fifth end of the chip U28 is grounded; the seventh end of the chip U28 is connected to the main control MCU through The resistor R185 is electrically connected to the third end of the voltage protector M1; the first end of the voltage protector M1 is electrically connected to the third end of the plug CN1; the sixth end of the chip U28 is electrically connected to the third end of the voltage protector M2 through the resistor R186; the first end of the voltage protector M2 is electrically connected to the fourth end of the plug CN1; the first end of the voltage protector M1 is also grounded through the resistor MOV2, and the first end of the voltage protector M2 is also grounded through the resistor MOV1; the first end of the anti-static diode D4 is grounded, the second end is connected between the resistor R185 and the third end of the voltage protector M1, and the third end is connected between the resistor R186 and the third end of the voltage protector M2; one end of the resistor RT1 is connected between the resistor R185 and the third end of the voltage protector M1, and the other end is connected between the resistor R186 and the third end of the voltage protector M2; The voltage acquisition module includes a resistor R191, a resistor R192, a resistor R190, a resistor R195, a TVS surge protection high voltage protection diode D5 and a capacitor C77; wherein, one end of the resistor R192 is connected to an aviation plug, and the other end is electrically connected to the first end of the TVS surge protection high voltage protection diode D5 through the resistor R191; one end of the resistor R195 is electrically connected to the first end of the TVS surge protection high voltage protection diode D5, and the other end is electrically connected to the main control MCU; one end of the capacitor C77 is grounded, and the other end is connected between the resistor R195 and the main control MCU; one end of the resistor R190 is grounded, and the other end is connected between the resistor R191 and the resistor R195.

8. The sediment detector according to claim 1, characterized in that: The detector body is also provided with an inclination sensor for obtaining the inclination data of the sediment detector; the main control board is electrically connected to the inclination sensor; Among them, the inclination sensor includes resistor R15, resistor R16, capacitor C55, capacitor C56 and chip U31; wherein, one end of the resistor R15 is connected to the second internal power supply, and the other end is electrically connected to the fourth end of the chip U31; one end of the resistor R16 is connected to the second internal power supply, and the other end is electrically connected to the sixth end of the chip U31; the fourth end of the chip U31 and the sixth end of the chip U31 are electrically connected to the main control MCU; the fifth end, the seventh end, the twelfth end and the tenth end of the chip U31 are grounded; the fourteenth end and the eighth end of the chip U31 are connected to the second internal power supply; the first end of the chip U31 is grounded through capacitors C55 and C56 in parallel.

9. The sediment detector according to claim 1, characterized in that: The detector body includes a shell, and the main control board and the magnetic induction module are both arranged in the shell; a fixing plate is also provided in the shell, and the main control board and the magnetic induction module are both fixed on the fixing plate; a motor fixing block is also provided in the bottom cone head, and the vibration motor is fixed on the motor fixing block.

10. The sediment detector according to claim 1, characterized in that: The aviation plug includes an aviation plug male head and an aviation plug female head; the aviation plug male head is fixedly connected to the top of the detector body; the aviation plug female head is matingly connected to the aviation plug male head; the aviation plug female head is electrically connected to an external power supply.

Images