Device for measuring tightness between central electrode of ignition electric nozzle and conical surface of semiconductor

By designing a device for measuring the adhesion degree of the central electrode of the ignition nozzle and the semiconductor cone surface, the combination of pressure test paper and linear driving mechanism is used to solve the problem of difficulty in detecting the adhesion degree in the prior art, quantitative measurement of the adhesion degree is achieved, and the stability and service life of the ignition voltage are improved.

CN222824994UActive Publication Date: 2025-05-02SICHUAN FANHUA AVIATION INSTR & ELECTRICAL CO LTD
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Patent Information

Application Number
CN202421478240.8
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-06-26
Publication Date
2025-05-02
Estimated Expiration
2034-06-26

AI Technical Summary

Technical Problem

The prior art is difficult to effectively detect the adhesion between the central electrode of the ignition nozzle and the semiconductor cone surface, which affects the stability and service life of the ignition voltage.

Method used

A device for measuring the adhesion of the central electrode of the ignition nozzle and the semiconductor cone surface is designed. By laying a pressure test paper on the cone surface of the central electrode, a linear driving mechanism is used to generate an extrusion pressure on the coordinating part of the central electrode and the semiconductor cone surface, causing the pressure test paper to discolor, and then the adhesion of the contact is determined by a color analysis instrument.

Benefits of technology

Quantitative measurement of the adhesion degree of the central electrode and the semiconductor cone surface is achieved, which has good practicality and can improve the stability and service life of the ignition voltage.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses an ignition electric nozzle center electrode and semiconductor conical surface sealing degree measuring device, which comprises a seat body and a linear driving mechanism, two ends of the top of the seat body are respectively provided with a positioning mechanism and a sliding installation seat, and the linear driving mechanism is used for driving the sliding installation seat to slide on the seat body; the middle part of the semiconductor is clamped with the semiconductor, and the opening side of the semiconductor is arranged close to the sliding mounting seat; one end of the central electrode penetrates through the semiconductor and is fixedly inserted into the sliding mounting seat, and pressure test paper is laid on the outer side of the conical end of the central electrode. According to the principle that the pressure test paper changes color under the action of pressure, the sealing degree between the central electrode and the conical surface of the semiconductor can be quantitatively tested, and good practicability is achieved.
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Description

Technical Field

[0001] The utility model belongs to the technical field of a conical surface matching tightness detection device in an ignition nozzle, and in particular relates to a conical surface tightness measurement device for a central electrode of an ignition nozzle and a semiconductor. Background Art

[0002] The ignition nozzle is a functional component for starting and igniting aircraft engines. Together with the ignition device and ignition cable, it constitutes the ignition system of aircraft engines. The working principle of the ignition system is: the ignition device converts the low-voltage DC power supply of the engine or the ground into a high-voltage electrical energy pulse, the ignition cable transmits the high-voltage electrical energy pulse to the ignition nozzle, and the ignition nozzle converts the high-voltage electrical energy pulse into an electric spark to ignite the gas mixture in the engine combustion chamber.

[0003] Ignition nozzles can be divided into semiconductor ignition nozzles and surface ignition nozzles according to the structural form of the ignition end. The semiconductor ignition nozzle has a semiconductor between the two electrodes - the center electrode and the shell. When a certain voltage is applied between the center electrode and the shell, the semiconductor component starts to pass current from the working surface layer due to the uneven material structure under the action of the external voltage. However, the distribution of current along the surface and cross-section of this layer is uneven. Most of the current is concentrated through a section of the surface with the highest conductivity, where the current density is very high, so this section quickly heats up. Since the semiconductor material has a negative temperature coefficient, the resistance of this section decreases as the heat is generated, so the current in it continues to increase, and the material heats up even more, until it causes "avalanche" thermal ionization of electrons, forming electric spark discharge.

[0004] The center electrode and the semiconductor usually use a conical surface match, that is, the outer cone surface of the center electrode matches the inner cone surface of the semiconductor. The degree of fit between the two cone surfaces, that is, the close contact (if the two cone surfaces are completely fitted, the cone surface close contact is 100%) affects the stability of the ignition voltage and service life of the semiconductor nozzle. The higher the close contact, the more stable the ignition voltage during the service life, and the longer the service life. However, since the semiconductor is made of glaze sintering, the dimensional accuracy of the inner cone surface is not easy to control, and it is mainly guaranteed by grinding with special tools. The size of the inner cone surface of the ground semiconductor is not easy to measure, and the close contact with the outer cone surface of the center electrode processed by metal machining is also difficult to detect. Utility Model Content

[0005] The utility model aims to provide a device for measuring the degree of contact between the central electrode of an ignition nozzle and the conical surface of a semiconductor, aiming to solve the above-mentioned problem.

[0006] The utility model is mainly realized through the following technical solutions:

[0007] A device for measuring the conical surface close contact between the center electrode of an ignition nozzle and a semiconductor comprises a seat body and a linear drive mechanism, wherein the top two ends of the seat body are respectively provided with a positioning mechanism and a sliding mounting seat, and the linear drive mechanism is used to drive the sliding mounting seat to slide on the seat body; the middle part of the semiconductor is clamped with the semiconductor, and the open side of the semiconductor is arranged close to the sliding mounting seat; one end of the center electrode passes through the semiconductor and is plugged and fixed with the sliding mounting seat, and the outer side of the conical end of the center electrode is laid with pressure test paper.

[0008] In order to better realize the utility model, further, the positioning mechanism includes a positioning seat and a positioning plate, a positioning plate is slidably provided at one end of the seat body, and a spring is provided between the seat body and the positioning plate, a positioning seat is provided between the positioning plate and the sliding mounting seat, the positioning seat is fixedly connected to the seat body, and a matching slot is provided at the top of the positioning seat corresponding to the middle of the semiconductor, and the two ends of the slot are respectively connected to the semiconductor through a clamping sleeve.

[0009] In order to better realize the utility model, further, a mounting hole is provided in the middle of the sliding mounting seat, a mounting inner tube is slidably provided on the side of the mounting hole close to the positioning mechanism, a plug-in hole is opened in the middle of the free end of the mounting inner tube, and the other end of the center electrode is plugged into the plug-in hole; a knob is threadedly provided on the outer side of the free end of the mounting inner tube, and the knob is rotatably connected to the sliding mounting seat.

[0010] In order to better realize the utility model, it further includes a conversion bushing and a movable threaded bushing, the mounting hole is a through structure, a limiting protrusion is circumferentially arranged on the outer side of one end of the conversion bushing, and a limiting step is correspondingly arranged inside the mounting hole, the outer sliding sleeve of the conversion bushing is provided with a movable threaded bushing, and the movable threaded bushing is threadedly connected to the mounting hole, the movable threaded bushing is screwed into the mounting hole and abuts against the limiting protrusion; the mounting inner tube sleeve is arranged inside the conversion bushing, and the mounting inner tube is slidably connected to the conversion bushing.

[0011] In order to better realize the utility model, further, one end of the movable threaded bushing extends out of the plug hole and is provided with a rotating end, and the outer side of the rotating end is provided with anti-slip grooves.

[0012] In order to better realize the utility model, further, the linear drive mechanism includes a screw and a drive motor, a sliding groove is opened on the top of the seat body, and the bottom of the sliding mounting seat is slidably connected to the sliding groove; a screw parallel to the sliding groove is arranged inside the seat body for rotation, and the drive motor is used to drive the screw to rotate, and the bottom of the sliding mounting extends into the interior of the seat body and is connected to the screw through a nut seat.

[0013] The beneficial effects of the utility model are as follows:

[0014] The utility model puts the pressure test paper on the conical surface of the center electrode, then pre-places the center electrode in the semiconductor, and then positions and installs the semiconductor in the positioning mechanism, connects the end of the center electrode to the sliding mount, and drives the sliding mount to move linearly, so that the contact part of the center electrode and the conical surface of the semiconductor generates an extrusion force, and the extrusion force causes the pressure test paper to change color. After standing for two minutes, remove the pressure test paper, and use a color analysis instrument to analyze the proportion of the color change area of ​​the pressure test paper. This proportion is the close contact between the center electrode and the conical surface of the semiconductor. Based on the principle that the pressure test paper changes color under pressure, the utility model can quantitatively test the close contact between the center electrode and the conical surface of the semiconductor, and has good practicality. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a structural schematic diagram of the cone surface close contact measuring device of the utility model;

[0016] Figure 2 It is a schematic diagram of the connection structure between the sliding mounting seat and the mounting inner tube;

[0017] Figure 3 It is a schematic diagram of the connection structure between the sliding mounting seat and the movable threaded bushing;

[0018] Figure 4 Schematic diagram of making a cone strip for pressure test paper;

[0019] Figure 5 Schematic diagram of the cone angle of the semiconductor and the central electrode;

[0020] Figure 6 Schematic diagram of the cone belt pressure test paper clamping test.

[0021] Among them: 1-semiconductor, 2-center electrode, 3-pressure test paper, 4-seat body, 5-positioning seat, 6-positioning plate, 7-sliding mounting seat, 8-mounting inner tube, 9-knob, 10-mounting hole, 11-conversion bushing, 12-movable threaded bushing. DETAILED DESCRIPTION

[0022] Embodiment 1:

[0023] A device for measuring the conical contact degree between the center electrode of an ignition nozzle and a semiconductor comprises a seat body 4 and a linear drive mechanism. The top two ends of the seat body 4 are respectively provided with a positioning mechanism and a sliding mounting seat 7. The linear drive mechanism is used to drive the sliding mounting seat 7 to slide on the seat body 4. The semiconductor 1 is clamped and positioned on the positioning mechanism, and the opening side of the semiconductor 1 is arranged close to the sliding mounting seat 7. One end of the center electrode 2 slides through the semiconductor 1 and is connected to the sliding mounting seat 7, so as to facilitate the sliding mounting seat 7 to carry the center electrode 2 to move inside the semiconductor 1. The other end of the center electrode 2 is a tapered end, and a pressure test paper 3 is laid on the outer side of the tapered end of the center electrode 2.

[0024] like Figure 5 As shown, the angle of the conical surface of the semiconductor 1 and the center electrode 2 is θ, and the lengths are L1 and L2 respectively. These two conical surfaces are also the adhesion inspection area. Figure 4 As shown, the pressure test paper 3 is made by calculating the unfolded dimensions of the conical surfaces of the semiconductor 1 and the center electrode 2:

[0025] α=πθ

[0026] R1=(L1·sinθ / 2) / 2

[0027] R2=(L2·sinθ / 2) / 2

[0028] Where: α is the expansion angle of the arc connection line of the tightness inspection pressure test paper 3;

[0029] π is the ratio of a circle to a circle;

[0030] θ is the taper angle between semiconductor 1 and center electrode 2;

[0031] R1 is the radius of the largest arc of the pressure test paper 3 for tightness inspection;

[0032] L1 is the length dimension of the large end of the taper of the semiconductor 1 and the center electrode 2;

[0033] R2 is the radius of the small arc of the pressure test paper 3 for tightness inspection;

[0034] L2 is the length dimension of the small tapered end of the semiconductor 1 and the center electrode 2.

[0035] A pressure test paper 3 is made according to the α, R1 and R2 obtained by dimensional calculation, and the pressure test paper 3 is bonded to the conical surface of the center electrode 2 to form a strip-shaped pressure test paper 3 with the same taper as the semiconductor 1 and the center electrode 2.

[0036] like Figure 6As shown, the pressure test paper 3 is sleeved on the conical surface of the central electrode 2, and then the central electrode 2 is pre-placed in the semiconductor 1, and then the semiconductor 1 is positioned and installed in the positioning mechanism, and the end of the central electrode 2 is connected to the sliding mounting seat 7. By driving the sliding mounting seat 7 to move linearly, the contact part of the conical surface of the central electrode 2 and the semiconductor 1 generates an extrusion force, and the extrusion force causes the pressure test paper 3 to change color. After standing for two minutes, remove the pressure test paper 3, and use a color analysis instrument to analyze the proportion of the color change area of ​​the pressure test paper 3, which is the close contact between the central electrode 2 and the semiconductor 1.

[0037] The utility model is based on the principle that the pressure test paper 3 changes color under the action of pressure. A circle of pressure test paper 3 is placed at the matching position of the central electrode 2 and the conical surface of the semiconductor 1. By driving the sliding mounting seat 7 to move linearly, an extrusion force is generated at the contact position of the matching position of the conical surface of the central electrode 2 and the semiconductor 1. The extrusion force causes the pressure test paper 3 to change color. Then, by observing the proportion of the color change area of ​​the pressure test paper 3, the degree of close contact between the central electrode and the conical surface of the semiconductor 1 can be obtained. The utility model has good practicality.

[0038] Embodiment 2:

[0039] A device for measuring the degree of contact between the center electrode of an ignition nozzle and the conical surface of a semiconductor, such as Figure 1 As shown, it includes a seat body 4 and a linear drive mechanism, one end of the top of the seat body 4 is provided with a positioning plate 6 and a positioning seat 5 in sequence, a slide rail is provided on the seat body 4, the bottom of the positioning plate 6 is slidably connected to the slide rail, and a spring is provided between the positioning plate 6 and the seat body 4 to facilitate the elastic positioning of the positioning plate 6 against the conical end of the semiconductor 1. The positioning seat 5 is fixedly connected to the seat body 4, and a matching card slot is provided at the top of the positioning seat 5 corresponding to the middle of the semiconductor 1, and the two ends of the card slot are respectively connected to the semiconductor 1 through a clamping bushing.

[0040] The linear drive mechanism includes a lead screw and a drive motor. A sliding groove is provided at the other end of the top of the seat body 4 along the length direction, and the bottom of the sliding mounting seat 7 is slidably connected to the sliding groove. A lead screw parallel to the sliding groove is provided for rotation inside the seat body 4, and the drive motor is used to drive the lead screw to rotate. The bottom of the sliding mounting extends into the interior of the seat body 4 and is connected to the lead screw through a nut seat.

[0041] Preferably, if Figure 2As shown, a mounting hole 10 is provided in the middle of the sliding mounting seat 7, and a mounting inner tube 8 is slidably provided on one side of the mounting hole 10 close to the positioning mechanism, and a plug hole is provided in the middle of the free end of the mounting inner tube 8, and the other end of the center electrode 2 is plugged into the plug hole; a knob 9 is provided on the outer side of the free end of the mounting inner tube 8, and the knob 9 is rotatably connected to the sliding mounting seat 7. When in use, the mounting inner tube 8 can be made to slide linearly along the mounting hole 10 inside the sliding mounting seat 7 by rotating the knob 9, so as to fine-tune the extrusion strength between the center electrode 2 and the semiconductor 1.

[0042] Furthermore, if Figure 3 As shown, it also includes a conversion bushing 11 and a movable thread bushing 12. The mounting hole 10 is a through structure. A limiting protrusion is circumferentially arranged on the outer side of one end of the conversion bushing 11. A limiting step is correspondingly arranged inside the mounting hole 10. The outer sliding sleeve of the conversion bushing 11 is provided with a movable thread bushing 12, and the movable thread bushing 12 is threadedly connected with the mounting hole 10. The movable thread bushing 12 is screwed into the mounting hole 10 and abuts against the limiting protrusion. The mounting inner tube 8 is sleeved inside the conversion bushing 11, and the mounting inner tube 8 is slidably connected with the conversion bushing 11. The conversion bushing 11 can be used to adapt to the mounting inner tube 8 of the center electrode 2 of different sizes. The conversion bushing 11 is locked inside the mounting hole 10 by the movable thread bushing 12.

[0043] The utility model is based on the principle that the pressure test paper 3 changes color under the action of pressure. A circle of pressure test paper 3 is placed at the matching position of the central electrode 2 and the conical surface of the semiconductor 1. By driving the sliding mounting seat 7 to move linearly, an extrusion force is generated at the contact position of the matching position of the conical surface of the central electrode 2 and the semiconductor 1. The extrusion force causes the pressure test paper 3 to change color. Then, by observing the proportion of the color change area of ​​the pressure test paper 3, the degree of close contact between the central electrode and the conical surface of the semiconductor 1 can be obtained. The utility model has good practicality.

[0044] The above description is only a preferred embodiment of the present invention and does not limit the present invention in any form. Any simple modification or equivalent changes made to the above embodiments based on the technical essence of the present invention shall fall within the protection scope of the present invention.

Claims

1. A device for measuring the degree of contact between the center electrode of an ignition nozzle and the conical surface of a semiconductor, characterized in that: The invention comprises a seat body (4) and a linear drive mechanism, wherein the top two ends of the seat body (4) are respectively provided with a positioning mechanism and a sliding mounting seat (7), and the linear drive mechanism is used to drive the sliding mounting seat (7) to slide on the seat body (4); the middle part of the semiconductor (1) is clamped with the semiconductor (1), and the open side of the semiconductor (1) is arranged close to the sliding mounting seat (7); one end of the central electrode (2) passes through the semiconductor (1) and is plugged and fixed with the sliding mounting seat (7), and the outer side of the conical end of the central electrode (2) is laid with a pressure test paper (3).

2. The device for measuring the degree of contact between the center electrode of an ignition nozzle and a conical surface of a semiconductor according to claim 1, characterized in that: The positioning mechanism comprises a positioning seat (5) and a positioning plate (6); a positioning plate (6) is slidably provided at one end of the seat body (4); a spring is provided between the seat body (4) and the positioning plate (6); a positioning seat (5) is provided between the positioning plate (6) and the sliding mounting seat (7); the positioning seat (5) is fixedly connected to the seat body (4); a matching card slot is provided at the top of the positioning seat (5) corresponding to the middle of the semiconductor (1); and both ends of the card slot are connected to the semiconductor (1) via card-joining bushings.

3. The device for measuring the degree of contact between the center electrode of an ignition nozzle and a semiconductor on a conical surface according to claim 1, characterized in that: A mounting hole (10) is provided in the middle of the sliding mounting seat (7); a mounting inner tube (8) is slidably provided on a side of the mounting hole (10) close to the positioning mechanism; a plug hole is provided in the middle of the free end of the mounting inner tube (8); the other end of the center electrode (2) is plugged into the plug hole; a knob (9) is provided on the outer side of the free end of the mounting inner tube (8) in a threaded manner; the knob (9) is rotatably connected to the sliding mounting seat (7).

4. The device for measuring the degree of contact between the center electrode of an ignition nozzle and a semiconductor on a conical surface according to claim 3, characterized in that: It also includes a conversion bushing (11) and a movable threaded bushing (12); the mounting hole (10) is a through structure; a limiting protrusion is circumferentially arranged on the outer side of one end of the conversion bushing (11); a limiting step is correspondingly arranged inside the mounting hole (10); a movable threaded bushing (12) is provided on the outer sliding sleeve of the conversion bushing (11); the movable threaded bushing (12) is threadedly connected to the mounting hole (10); the movable threaded bushing (12) is screwed into the mounting hole (10) and abuts against the limiting protrusion; the mounting inner tube (8) is sleeved inside the conversion bushing (11); and the mounting inner tube (8) is slidably connected to the conversion bushing (11).

5. The device for measuring the degree of contact between the center electrode of an ignition nozzle and the conical surface of a semiconductor according to claim 4, characterized in that: One end of the movable threaded bushing (12) extends out of the plug-in hole and is provided with a rotating end, and the outer side of the rotating end is provided with anti-slip grooves.

6. The device for measuring the degree of contact between the center electrode of an ignition nozzle and a semiconductor on a conical surface according to claim 1, characterized in that: The linear drive mechanism comprises a lead screw and a drive motor; a sliding groove is provided on the top of the seat body (4); the bottom of the sliding mounting seat (7) is slidably connected to the sliding groove; a lead screw parallel to the sliding groove is rotatably arranged inside the seat body (4); the drive motor is used to drive the lead screw to rotate; the bottom of the sliding mounting extends into the seat body (4) and is connected to the lead screw via a nut seat.