Desktop computer liquid cooling device
By designing locking components and adjustment components in desktop computer liquid cooling devices, the water-cooled radiator is installed on the outside of the chassis, solving the problems of large space occupation and complex maintenance, and achieving efficient heat dissipation and convenient maintenance.
Patent Information
- Application Number
- CN202421586906.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-05
- Publication Date
- 2025-05-02
- Estimated Expiration
- 2034-07-05
AI Technical Summary
The existing desktop computer liquid cooling device takes up a lot of space during installation and maintenance, and requires regular liquid replacement and pipe cleaning. Disassembly of the chassis will affect the normal operation of other components.
A desktop computer liquid cooling device is designed. By setting up locking components and adjustment components, the water-cooled radiator can be installed on the outside of the chassis, reducing internal installation pressure and facilitating later removal and washing. At the same time, the adjustment components can be adapted to different specifications of liquid cooling devices.
It realizes efficient heat dissipation within limited chassis space, while reducing the complexity of installation and maintenance and space occupation, avoiding the impact on other components.
Smart Images

Figure CN222825862U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of computer heat dissipation, in particular to a liquid cooling device for a desktop computer. Background Art
[0002] A desktop computer liquid cooling device is a device used to reduce the temperature of a computer by circulating liquid to absorb and dissipate the heat generated by the computer, thereby improving the stability and performance of the computer.
[0003] The available space inside the existing desktop computer case is usually limited, and the liquid cooling system needs to occupy a certain amount of space to install pipes, radiators and other components. On the other hand, the liquid cooling system requires regular maintenance work such as replacing the liquid and cleaning the pipes. Disassembling the case will affect the normal operation of other components. Therefore, it is necessary to provide a desktop computer liquid cooling device to ensure the normal heat dissipation of the desktop computer without affecting the operation of other components. Utility Model Content
[0004] The purpose of the utility model is to provide a desktop computer liquid cooling device to solve the problem raised in the above background technology that the available space inside the existing desktop computer case is usually limited, and the liquid cooling system needs to occupy a certain space to install pipes, radiators and other components. On the other hand, the liquid cooling system needs regular maintenance work such as replacing liquid and cleaning pipes, and disassembling the case will affect the normal operation of other components.
[0005] In order to solve the above technical problems, the utility model is realized by the following technical solutions:
[0006] The utility model is a desktop computer liquid cooling device, comprising:
[0007] A main body component, the main body component comprising a chassis and a cover plate;
[0008] The sealing plate is fixed to the side of the chassis by screws;
[0009] A locking assembly, the locking assembly comprising an opening, a connecting plate, a through hole, an adjustment rod, a pressing plate and an anti-slip pad;
[0010] The opening is opened in the middle of the sealing plate, the connecting plate is fixed on the outside of the sealing plate, the through hole is opened at one end of the connecting plate, the adjusting rod is screwed in the through hole, the pressing plate is rotatably connected to one end of the adjusting rod, and the anti-slip pad is fixed on the side of the pressing plate away from the adjusting rod.
[0011] Furthermore, there are two connecting plates, which are located in the middle of both sides of the opening, and the pressure plate and the anti-slip pad are located between the connecting plates and the opening.
[0012] Furthermore, the main body assembly also includes heat dissipation holes and semiconductor cooling fins;
[0013] The heat dissipation holes are opened on the sealing plate and are located at the upper and lower ends. The semiconductor cooling sheet is fixed on the inner side of the sealing plate and is located at the opening.
[0014] Furthermore, the main body assembly also includes a cooling fan and a fin-type heat sink;
[0015] The fin-type heat sink is fixed on the side of the semiconductor cooling plate, and the heat dissipation fan is fixed on the side of the fin-type heat sink away from the semiconductor cooling plate.
[0016] Furthermore, the main body assembly also includes a water-cooled radiator, a circulating water pipe and a circulating water pump;
[0017] The water-cooled radiator is inserted into the opening and fits on the side of the semiconductor refrigeration sheet away from the fin-type radiator. The circulating water pump is fixed on the side of the water-cooled radiator away from the semiconductor refrigeration sheet, and the water-cooled radiator and the circulating water pump are connected through a circulating water pipe.
[0018] Further, it also includes an adjustment component;
[0019] The adjustment assembly includes a card slot and a movable plate;
[0020] The card slot is fixed on the inner side of the sealing plate and is located on both sides of the opening, and the movable plate is inserted into the card slot.
[0021] Compared with the prior art, the advantages of the present invention are:
[0022] 1. The utility model, through the locking assembly provided, the semiconductor refrigeration sheet is installed at the opening on the inner side of the sealing plate, the water-cooled radiator is inserted from above or below the pressure plate and stuck into the opening, the adjusting rod on the connecting plate is twisted, the adjusting rod is driven to move along the through hole, and then the pressure plate and the anti-skid pad are driven to move toward the water-cooled radiator, driving the water-cooled radiator and the semiconductor refrigeration sheet to fit tightly. This arrangement can set the water-cooled radiator on the outside of the chassis, reduce the installation pressure inside the chassis, and facilitate the disassembly and cleaning of the water-cooled radiator at a later time.
[0023] 2. The utility model, through the setting of the adjustment component, if the liquid cooling device is smaller than the opening, the movable plate in the slot can be moved to bring the two movable plates closer together, and then the semiconductor refrigeration plate is fixed on the movable plate, and then the water-cooled radiator is installed. This setting can make the sealing plate on the chassis adapt to liquid cooling devices of different specifications. BRIEF DESCRIPTION OF THE DRAWINGS
[0024] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for describing the embodiments are briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.
[0025] Figure 1 It is a schematic diagram of the overall structure of the utility model;
[0026] Figure 2 This is a schematic diagram of the inner side of the sealing plate of the utility model;
[0027] Figure 3 This is a top view of the sealing plate of the utility model;
[0028] Figure 4 This is a schematic diagram of the locking assembly structure of the utility model;
[0029] Figure 5 It is a schematic diagram of the structure of the regulating component of the utility model.
[0030] In the accompanying drawings, the components represented by the reference numerals are listed as follows:
[0031] 10. Chassis; 11. Cover plate; 12. Heat dissipation holes; 13. Cooling fan; 14. Fin-type radiator; 15. Semiconductor refrigeration plate; 16. Water-cooled radiator; 17. Circulating water pipe; 18. Circulating water pump; 20. Opening; 21. Connecting plate; 22. Through hole; 23. Adjustment rod; 24. Press plate; 25. Anti-skid pad; 30. Card slot; 31. Movable plate. DETAILED DESCRIPTION
[0032] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are described in detail below with reference to the accompanying drawings.
[0033] In the following description, many specific details are set forth to facilitate a full understanding of the present invention, but the present invention may also be implemented in other ways different from those described herein, and those skilled in the art may make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific implementation methods disclosed below.
[0034] In order to make the purpose, technical solution and advantages of the present invention more clear, the implementation mode of the present invention will be further described in detail below with reference to the accompanying drawings.
[0035] See also Figure 1-5 As shown, this embodiment is a desktop computer liquid cooling device, comprising:
[0036] The main body assembly includes a chassis 10 and a cover plate 11;
[0037] The sealing plate 11 is fixed to the side of the chassis 10 by screws;
[0038] The chassis 10 and the sealing plate 11 form a closed space;
[0039] A locking assembly, the locking assembly comprising an opening 20, a connecting plate 21, a through hole 22, an adjusting rod 23, a pressing plate 24 and an anti-slip pad 25;
[0040] The opening 20 is formed in the middle of the sealing plate 11, the connecting plate 21 is fixed on the outside of the sealing plate 11, the through hole 22 is formed at one end of the connecting plate 21, the adjusting rod 23 is screwed in the through hole 22, the pressing plate 24 is rotatably connected to one end of the adjusting rod 23, and the anti-slip pad 25 is fixed on the side of the pressing plate 24 away from the adjusting rod 23;
[0041] The opening 20 facilitates installation of the liquid cooling device, the connecting plate 21 plays a supporting role, the through hole 22 and the adjusting rod 23 play an adjusting role, the pressing plate 24 plays a pressing role, and the anti-skid pad 25 has an anti-skid function and can prevent the pressing plate 24 from abrading the water-cooled radiator 16;
[0042] There are two connecting plates 21, which are located in the middle of both sides of the opening 20, and the pressing plate 24 and the anti-slip pad 25 are located between the connecting plates 21 and the opening 20;
[0043] The main body assembly also includes heat dissipation holes 12 and semiconductor cooling sheets 15;
[0044] The heat dissipation holes 12 are formed on the sealing plate 11 and are located at the upper and lower ends. The semiconductor cooling sheet 15 is fixed on the inner side of the sealing plate 11 and is located at the opening 20.
[0045] The heat dissipation holes 12 are convenient for discharging the heat inside the chassis 10, and the semiconductor cooling sheet 15 can generate cold air;
[0046] The main assembly also includes a cooling fan 13 and a fin-type heat sink 14;
[0047] The fin type heat sink 14 is fixed on the side of the semiconductor cooling sheet 15, and the cooling fan 13 is fixed on the side of the fin type heat sink 14 away from the semiconductor cooling sheet 15;
[0048] The fin-type heat sink 14 can conduct the cold air out, and the cooling fan 13 blows the cold air into the inside of the chassis 10;
[0049] The main assembly also includes a water-cooled radiator 16, a circulating water pipe 17 and a circulating water pump 18;
[0050] The water-cooled radiator 16 is inserted into the opening 20 and attached to the side of the semiconductor cooling sheet 15 away from the fin-type radiator 14. The circulating water pump 18 is fixed to the side of the water-cooled radiator 16 away from the semiconductor cooling sheet 15, and the water-cooled radiator 16 and the circulating water pump 18 are connected through a circulating water pipe 17.
[0051] The water-cooled radiator 16 is internally provided with a circulating pipe, into which coolant is passed, so as to absorb the heat generated by the hot end of the semiconductor refrigeration plate 15 . The circulating water pipe 17 provides a flow channel for the coolant, and the circulating water pump 18 provides the power for the liquid flow.
[0052] Working principle:
[0053] The semiconductor cooling sheet 15 is installed at the inner opening 20 of the sealing plate 11, connected to the internal power interface of the chassis 10, and the sealing plate 11 is fixed on the chassis 10;
[0054] Insert the water-cooled radiator 16 from above or below the pressing plate 24 and insert it into the opening 20, twist the adjusting rod 23 on the connecting plate 21, drive the adjusting rod 23 to move along the through hole 22, and then drive the pressing plate 24 and the anti-skid pad 25 to move toward the water-cooled radiator 16, drive the water-cooled radiator 16 to fit tightly with the semiconductor cooling sheet 15;
[0055] When the chassis 10 is started, the liquid cooling device is started, and the cold end of the semiconductor refrigeration plate 15 generates cold air, which is blown to the inside of the chassis 10 through the fin-type radiator 14 and the cooling fan 13. The heat generated by the hot end on the other side of the cold end of the semiconductor refrigeration plate 15 is absorbed by the water-cooled radiator 16, and the heat is exchanged through the operation of the circulating water pump 18 and the circulating water pipe 17.
[0056] In this step, the water-cooled radiator 16 can be arranged outside the chassis 10 to reduce the installation pressure inside the chassis 10 and facilitate the disassembly and cleaning of the water-cooled radiator 16 at a later time.
[0057] See also Figure 5 This embodiment is based on the above embodiment 1 and further includes:
[0058] An adjustment component, the adjustment component includes a slot 30 and a movable plate 31;
[0059] The card slot 30 is fixed inside the sealing plate 11 and is located on both sides of the opening 20 , and the movable plate 31 is inserted into the card slot 30 ;
[0060] The card slot 30 and the movable plate 31 play a connecting role.
[0061] Working principle:
[0062] If the liquid cooling device is smaller than the opening 20 , the movable plate 31 in the slot 30 can be moved to bring the two movable plates 31 closer together, and then the semiconductor cooling sheet 15 can be fixed on the movable plate 31 , and then the water-cooled radiator 16 can be installed.
[0063] This step can make the cover plate 11 on the chassis 10 adapt to liquid cooling devices of different specifications.
[0064] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0065] Finally, it should be noted that the above description is only a preferred embodiment of the utility model and is not intended to limit the utility model. Although the utility model is described in detail with reference to the above embodiments, those skilled in the art can still modify the technical solutions recorded in the above embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.
Claims
1. A desktop computer liquid cooling device, characterized in that: include: A main body component, the main body component comprising a chassis (10) and a cover plate (11); The sealing plate (11) is fixed to the side of the chassis (10) by screws; A locking assembly, the locking assembly comprising an opening (20), a connecting plate (21), a through hole (22), an adjusting rod (23), a pressing plate (24) and an anti-slip pad (25); The opening (20) is formed in the middle of the sealing plate (11), the connecting plate (21) is fixed on the outside of the sealing plate (11), the through hole (22) is formed at one end of the connecting plate (21), the adjusting rod (23) is screwed into the through hole (22), the pressing plate (24) is rotatably connected to one end of the adjusting rod (23), and the anti-slip pad (25) is fixed on a side of the pressing plate (24) away from the adjusting rod (23).
2. A desktop computer liquid cooling device according to claim 1, characterized in that: There are two connecting plates (21) located in the middle of both sides of the opening (20), and the pressing plate (24) and the anti-slip pad (25) are located between the connecting plates (21) and the opening (20).
3. The desktop computer liquid cooling device according to claim 1, characterized in that: The main body component also includes a heat dissipation hole (12) and a semiconductor cooling sheet (15); The heat dissipation holes (12) are opened on the sealing plate (11) and are located at the upper and lower ends. The semiconductor cooling plate (15) is fixed on the inner side of the sealing plate (11) and is located at the opening (20).
4. A desktop computer liquid cooling device according to claim 3, characterized in that: The main body assembly also includes a cooling fan (13) and a fin-type heat sink (14); The fin-type heat sink (14) is fixed on the side of the semiconductor cooling sheet (15), and the heat dissipation fan (13) is fixed on the side of the fin-type heat sink (14) away from the semiconductor cooling sheet (15).
5. The desktop computer liquid cooling device according to claim 1, characterized in that: The main body assembly also includes a water-cooled radiator (16), a circulating water pipe (17) and a circulating water pump (18); The water-cooled radiator (16) is inserted into the opening (20) and is attached to a side of the semiconductor cooling sheet (15) away from the fin-type radiator (14). The circulating water pump (18) is fixed to a side of the water-cooled radiator (16) away from the semiconductor cooling sheet (15), and the water-cooled radiator (16) and the circulating water pump (18) are connected via a circulating water pipe (17).
6. The desktop computer liquid cooling device according to claim 1, characterized in that: Also included are adjustment components; The adjustment assembly comprises a clamping slot (30) and a movable plate (31); The card slot (30) is fixed on the inner side of the sealing plate (11) and is located on both sides of the opening (20), and the movable plate (31) is inserted into the card slot (30).