Integrated COF display module
By directly designing electronic components and connectors on COF and removing FPC, the problems of complex design and high cost in the existing technology are solved, and the effect of reducing material and process costs and enhancing product competitiveness is achieved.
Patent Information
- Application Number
- CN202421643174.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-11
- Publication Date
- 2025-05-02
- Estimated Expiration
- 2034-07-11
AI Technical Summary
In the display module design of existing wearable electronic products, electronic components and connectors need to be bound through FPC, resulting in complex design, high cost, increased material costs and process costs, affecting the competitiveness of the product.
Design a display module with integrated COF. By directly designing electronic components and connectors on the COF, the FPC in the original design is removed, the binding process is reduced, and the material and process costs are reduced.
It achieves the reduction of material costs and process, reduces costs, and improves the competitiveness of the product. At the same time, the structure is simpler and compact, and the area between components and driver IC can be bent for easy storage.
Smart Images
Figure CN222826036U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of display module COF, in particular to an integrated COF display module. Background Art
[0002] At present, the integration of various functions of wearable electronic products is getting higher and higher, and the cost competitiveness in the industry is getting greater and greater. Therefore, major manufacturers are trying their best to optimize product design and reduce the loss of manpower and material resources. Therefore, an integrated COF display module is designed. By making the electronic components and connectors required on the original FPC directly on the COF, a binding process is reduced, material costs and processes are reduced, and costs are reduced to enhance the competitiveness of the product. Utility Model Content
[0003] The purpose of the utility model is to overcome the deficiencies in the prior art and provide an integrated COF display module.
[0004] The purpose of this utility model is achieved through the following technical solutions:
[0005] An integrated COF display module, characterized in that it includes: a display module and a COF; the center of the bottom of the display module is connected to the top of the COF; a COF display screen binding position is provided at the top of the COF, a reinforcing plate is provided at the center of the bottom of the front side of the COF display screen binding position, a connector is provided at the bottom of the back of the COF, and a high-voltage driving chip is provided at the center of the back of the COF.
[0006] In one embodiment, a bending area is provided in the center of the COF, and the bending area is a flexible circuit board.
[0007] In one of the embodiments, the top of the COF is a COF display screen binding position, and the COF display screen binding position is connected to a metal pin at the center of the bottom of the display module.
[0008] In one of the embodiments, a high-voltage driver chip is disposed at a position near the top of the back center of the COF, and the high-voltage driver chip is located in the top area of the bending area.
[0009] In one embodiment, an electronic component area is disposed at the bottom of the center of the back of the COF, and the electronic component area is located on the top of the connector.
[0010] In one embodiment, the width of the COF at the top and bottom is smaller than the width at the center.
[0011] In one embodiment, the length and width of the front side of the COF are smaller than the length and width of the front side of the display module.
[0012] In one embodiment, the back of the electronic component area is bonded to the metal heat sink on the display module housing.
[0013] In one embodiment, the reinforcing plate at the bottom of the front side of the COF and the connector at the bottom of the back side are arranged in a mirror image.
[0014] In one embodiment, the length of the front side of the reinforcing plate is the same as the length of the bottom block of the front side of the COF, and the length of the front side of the connector matches the length of the front side of the reinforcing plate.
[0015] Compared with the prior art, the utility model has at least the following advantages:
[0016] The integrated COF display module of the utility model removes the FPC connected to the COF in the original design and designs the electronic components and connectors thereon directly on the COF, thereby saving the space of a FOF binding position and reducing the cost and process of an FPC. The area between the components and the driver IC can also be bent, and the structure is more compact, thereby achieving the purpose of reducing material costs and processes, reducing costs and improving the competitiveness of the product. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the utility model and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying creative work.
[0018] Figure 1 This is a schematic diagram of the overall structure of the front side of the display module of the integrated COF of the utility model;
[0019] Figure 2 It is a schematic diagram of the overall structure of the back of the display module of the integrated COF of the utility model.
[0020] In the figure: 1. Display module; 2. COF; 21. COF display screen binding position; 22. Bending area; 23. Reinforcement plate; 24. High-voltage driver chip; 25. Connector; 26. Electronic component area. DETAILED DESCRIPTION
[0021] In order to facilitate the understanding of the present invention, the present invention will be described more comprehensively with reference to the relevant drawings. The drawings provide preferred embodiments of the present invention. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thoroughly and comprehensively understood.
[0022] In the description of the present application, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.
[0023] Unless otherwise clearly stipulated and limited, terms such as "installed", "connected", "connected", "fixed", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium; it can be the internal connection of two elements or the interaction relationship between two elements.
[0024] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art in the technical field of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.
[0025] like Figure 1-2 As shown, an integrated COF display module includes: a display module 1 and a COF2; the center of the bottom of the display module 1 is connected to the top of the COF2; a COF display screen binding position 21 is provided at the top of the COF2, a reinforcing plate 23 is provided at the center of the bottom of the front of the COF display screen binding position 21, a connector 25 is provided at the bottom of the back of the COF2, and a high-voltage driver chip 24 is provided at the center of the back of the COF2. It should be noted that the size of the COF2 is enlarged to a certain extent on the original design to set the electronic component area 16 and the connector 15 placed on the FPC, so that the COF2 can replace the role of the FPC.
[0026] like Figure 1-2As shown, in one embodiment, a bending area 22 is provided in the center of COF1, and the bending area 22 is a flexible circuit board. It should be noted that the bending area 22 is located in the center of COF1, so that COF1 can be bent as needed, so that it can be easily stored.
[0027] like Figure 1-2 As shown, in one embodiment, the top of COF 21 is a COF display screen binding position 21, and the COF display screen binding position 21 is connected to the metal pin at the bottom center of the display module 1. It should be noted that the length of the gold finger of the COF display screen binding position 21 is the same as the length of the metal pin at the bottom center of the display module 1.
[0028] like Figure 1-2 As shown, in one embodiment, a high-voltage driver chip 24 is disposed at a position near the top of the back center of the COF2, and the high-voltage driver chip 24 is located at the top area of the bending area 22. It should be noted that the high-voltage driver chip 24 and the bending area 22 are staggered to prevent the high-voltage driver chip 24 from being damaged during bending.
[0029] like Figure 1-2 As shown, in one embodiment, an electronic component area 26 is provided at the bottom of the center of the back of the COF 2, and the electronic component area 26 is located on the top of the connector 25. The back of the electronic component area 26 is bonded to the metal heat sink on the housing of the display module 1. It should be noted that this design can enhance the thermal conductivity of the electronic component area 26, thereby improving its heat dissipation capacity.
[0030] like Figure 1-2 As shown, in one embodiment, the width of the top and bottom sides of COF2 is smaller than the width of the center. The length and width of the front of COF2 are smaller than the length and width of the front of the display module 1. It should be noted that this design allows COF2 to be bent to the back of the display module 1, so that it can be hidden and protected.
[0031] like Figure 1-2 As shown, in one embodiment, the reinforcing plate 23 at the bottom of the front of COF2 and the connector 25 at the bottom of the back are arranged in a mirror image. The length of the front of the reinforcing plate 23 is the same as the length of the block at the bottom of the front of COF2, and the length of the front of the connector 25 matches the length of the front of the reinforcing plate 23. It should be noted that this design can facilitate the staff to operate the connector 25 to connect with the main board in the display module 1.
[0032] The above-mentioned embodiments only express several implementation methods of the utility model, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, and these all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.
Claims
1. An integrated COF display module, characterized in that: include: Display module (1) and COF (2); The center of the bottom of the display module (1) is connected to the top of the COF (2); A COF display screen binding position (21) is arranged at the top of the COF (2), a reinforcing plate (23) is arranged at the center of the bottom of the front side of the COF display screen binding position (21), a connector (25) is arranged at the bottom of the back of the COF (2), and a high-voltage driving chip (24) is arranged at the center of the back of the COF (2).
2. The integrated COF display module according to claim 1, characterized in that: A bending area (22) is provided at the center of the COF (1), and the bending area (22) is a flexible circuit board.
3. The integrated COF display module according to claim 1, characterized in that: The top of the COF (21) is a COF display screen binding position (21), and the COF display screen binding position (21) is connected to a metal pin at the center of the bottom of the display module (1).
4. The integrated COF display module according to claim 2, characterized in that: A high-voltage driving chip (24) is arranged at a position close to the top in the center of the back of the COF (2), and the high-voltage driving chip (24) is located in the top area of the bending area (22).
5. The integrated COF display module according to claim 1, characterized in that: An electronic component area (26) is provided at the bottom of the center of the back of the COF (2), and the electronic component area (26) is located on the top of the connector (25).
6. The integrated COF display module according to claim 1, characterized in that: The width of the COF (2) at the top and bottom sides is smaller than the width at the center.
7. The integrated COF display module according to claim 1, characterized in that: The length and width of the front side of the COF (2) are smaller than the length and width of the front side of the display module (1).
8. The integrated COF display module according to claim 5, characterized in that: The back of the electronic component area (26) and the metal heat sink on the outer shell of the display module (1) are bonded together.
9. The integrated COF display module according to claim 1, characterized in that: The reinforcing plate (23) at the bottom of the front side of the COF (2) and the connector (25) at the bottom of the back side are arranged in a mirror image.
10. The integrated COF display module according to claim 1, characterized in that: The length of the front side of the reinforcing plate (23) is the same as the length of the bottom block of the front side of the COF (2), and the length of the front side of the connector (25) matches the length of the front side of the reinforcing plate (23).