External equipment and fusing system

Abstract

The utility model discloses external equipment and a fusing system, and relates to the technical field of computers, and the external equipment comprises a multi-protocol compatible interface and a plurality of packaging resistors; each configuration pin of the multi-protocol compatible interface is connected with the first end of the corresponding packaging resistor; the second end of the packaging resistor is grounded; two ends of an electrode of the packaging resistor are connected through a fuse; and after fusing current is applied to the packaging resistor, the fuse is fused. A packaging resistor connected with a configuration pin in external equipment is directly changed into a resistor of which the two ends of an electrode are connected through a fuse, a manufacturer does not need to worry about idle materials when producing the external equipment for the first time, the packaging resistor is directly used for uniform material preparation, the unification of a bill of materials generated in the early stage is met, and after a customer purchases the material, the production efficiency is improved. And the packaging resistor of the corresponding configuration pin is fused according to the demand of the purchaser, so that the external equipment meeting the demand of the purchaser can be generated, and the production efficiency of the equipment is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of computers, in particular to an external device and a fuse system. Background Art

[0002] At present, an interface is reserved in the host design so that an SSD (Solid State Disk or Solid State Drive) or WWAN module (wireless wide area network card) can be connected to the host as an external device. However, in order to configure flexibly, it is necessary to consider compatibility with external devices from different manufacturers, and it is necessary to identify the specific type and model of the module after the external device is inserted into the host, so that the corresponding control timing can be directly called after the device is detected, and the corresponding driver can be loaded, thereby shortening the boot time. Especially for interfaces that support multi-protocol compatibility, the same interface type is easy for users to cause confusion. Therefore, the type of external device is distinguished by the state (high level or low level) of the configuration pin of the external device. In the prior art, in the production process of external devices, it is necessary to obtain customer needs, and then add patches to the resistors connected to the configuration pins according to customer needs. Adding a 0 ohm patch resistor forms a short circuit, and an empty patch (i.e., no patch resistor is added) forms an open circuit. However, this method must produce products according to customer demand. If the production volume is greater than the demand, it will cause sluggish materials, waste resources and increase costs, and the production efficiency is low. Utility Model Content

[0003] In view of this, the purpose of the utility model is to provide an external device and a fuse system. The specific scheme is as follows:

[0004] In a first aspect, the present application discloses an external device, including a multi-protocol compatible interface and a plurality of packaged resistors;

[0005] Each configuration pin of the multi-protocol compatible interface is respectively connected to the first end of the corresponding package resistor;

[0006] The second end of the package resistor is grounded;

[0007] The two ends of the electrodes of the packaged resistor are connected via a fuse; the fuse is blown after a fusing current is applied to the packaged resistor.

[0008] Optionally, the configuration pins are used to connect to a general purpose input / output port of a host, so that the host can determine the device type of the external device according to the output levels of all the configuration pins.

[0009] Optionally, the configuration pins are respectively connected to the corresponding general purpose input / output ports and the first end of the corresponding pull-up resistor;

[0010] The second end of the pull-up resistor is connected to a power supply so that the configuration pin corresponding to the package resistor outputs a low level when the fuse in the package resistor is not blown, and outputs a high level when the fuse in the package resistor is blown.

[0011] Optionally, the multi-protocol compatible interface is an M.2 interface.

[0012] Optionally, the configuration pins include pin 21, pin 69, pin 75 and pin 1.

[0013] In a second aspect, the present application discloses a fusing system, including a fusing device and the aforementioned external device;

[0014] The target configuration pin of the external device is connected to the fuse device;

[0015] The fusing device is used to apply a fusing current to the target configuration pin, so as to use the fusing current to fuse the fuse of the package resistor corresponding to the target configuration pin.

[0016] Optionally, the fuse device includes a switch and a first resistor;

[0017] The first end of the switch is connected to a power source, the second end of the switch is respectively connected to the target configuration pin and the first end of the first resistor, and the second end of the first resistor is grounded.

[0018] Optionally, the fuse device further includes an indicator light;

[0019] The second end of the first resistor is connected to the first end of the indicator light;

[0020] The second end of the indicator light is grounded.

[0021] Optionally, the indicator light is a light emitting diode;

[0022] The second end of the first resistor is connected to the positive electrode of the light emitting diode;

[0023] The cathode of the light emitting diode is grounded.

[0024] The present application provides an external device, including a multi-protocol compatible interface and a plurality of packaged resistors; each configuration pin of the multi-protocol compatible interface is respectively connected to the first end of the corresponding packaged resistor; the second end of the packaged resistor is grounded; the two ends of the electrode of the packaged resistor are connected through a fuse; the fuse is blown after the fuse current is applied to the packaged resistor. Thus, the packaged resistor connected to the configuration pin in the external device is directly changed to a resistor whose two ends of the electrode are connected through a fuse. When the manufacturer first produces the external device, there is no need to worry about the problem of idle materials. The packaged resistor is directly used for unified material preparation to meet the uniformity of the bill of materials generated in the early stage. After the customer purchases, the packaged resistor of the corresponding configuration pin is fused according to the buyer's needs, and an external device that meets the buyer's needs can be generated, thereby improving the production efficiency of the equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings in the following description are only embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying creative work.

[0026] Figure 1 A schematic diagram of the structure of an external device provided for this application;

[0027] Figure 2 A schematic diagram of a specific package resistor in the prior art;

[0028] Figure 3 A schematic diagram of a specific package resistor provided for this application;

[0029] Figure 4 for Figure 3 The schematic diagram of the structure after the package resistor is blown is shown;

[0030] Figure 5 is a specific configuration pin status table;

[0031] Figure 6 A schematic diagram of an external device application provided for this application;

[0032] Figure 7 A schematic diagram of a fuse system provided for this application;

[0033] Figure 8 A schematic diagram of a specific fuse system provided for this application. DETAILED DESCRIPTION

[0034] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0035] In the prior art, during the production process of external devices, it is necessary to obtain customer needs and then add patches to the resistors connected to the configuration pins according to customer needs. Adding a 0-ohm patch resistor forms a short circuit, and leaving an empty patch forms an open circuit. However, this method must produce products according to customer demand. If the production volume is greater than the demand, it will cause stagnant materials, waste resources and increase costs, and have low production efficiency. The core of this application is to use a resistor connected by a fuse at both ends of the electrode as a resistor connected to the configuration pin for an external device including a multi-protocol compatible interface. When the manufacturer first produces the external device, there is no need to worry about the problem of idle materials. The packaged resistors are directly used for unified material preparation to meet the uniformity of the bill of materials generated in the early stage; after the customer purchases, the packaged resistors of the corresponding configuration pins are fused according to the buyer's needs, and an external device that meets the buyer's needs can be generated, thereby improving the production efficiency of the equipment.

[0036] The utility model embodiment discloses an external device 10, such as Figure 1 As shown, it includes a multi-protocol compatible interface 11 and multiple packaged resistors 12; each configuration pin of the multi-protocol compatible interface 11 is respectively connected to the first end of the corresponding packaged resistor 12; the second end of the packaged resistor 12 is grounded; the two ends of the electrodes of the packaged resistor 12 are connected through a fuse; the fuse is blown after the fuse current is applied to the packaged resistor 12.

[0037] It can be understood that the configuration pin (CONFIG Pin) is a pin (Pin) on an external device that can characterize the device type, that is, after the external device is connected to the host, the host can determine the device type or model of the external device based on the output of the configuration pin. For a certain interface type, the configuration pin is usually a fixed number of pins. The present application designs the package resistor connected to the configuration pin in a form in which the two ends of the electrode are connected by a fuse, and the other end of the package resistor is grounded; at this time, the package resistor is in a short-circuit state, that is, if the external device is connected to the host at this time, the output level of the configuration pin connected to the package resistor is a low level; wherein, after the fuse current is applied to the package resistor, the fuse in the resistor is blown, and at this time, the package resistor is in an open circuit state, that is, if the external device is connected to the host at this time, the output level of the configuration pin connected to the package resistor is a high level. The output combination of all configuration pins forms a configuration ID, which can characterize the device type.

[0038] For example Figure 2 The figure shows the package resistor corresponding to the configuration pin in the prior art. After obtaining the customer order, it is necessary to add patches to the package resistor one by one according to the demand, that is, to add 0 ohm patch resistors to the package resistors corresponding to the configuration pins that need to output low levels, and no processing is required for those that need to output high levels. In this way, production cannot be carried out if the customer order is not obtained; and, because different customers have different configuration requirements for pin configuration, if the production volume for a certain customer is greater than the customer demand, the remaining products will become stagnant materials and cannot be used; it is not conducive to production control. The customer's configuration requirements are to distinguish different types of external devices used by the customer, that is, the customer needs to ensure that the configuration IDs output by the external devices using the same type of interface are different.

[0039] For example Figure 3 The figure shows a packaged resistor provided by the present application. The two ends of the resistor electrodes are connected by a fuse. When a fuse current is applied, the fuse blows. Figure 4 As shown. Thus, through this embodiment, when the manufacturer initially produces external devices, the package resistors corresponding to the configuration pins are all consistent, and both ends of the electrodes are connected by fuses, which meets the uniformity of the bill of materials generated in the early stage. After receiving the customer's order, according to the order quantity and the customer's demand for configuration pins, the pins corresponding to the corresponding number of external devices can be fused, so as to finally obtain an external device that meets the customer's needs.

[0040] In some embodiments, the multi-protocol compatible interface may be an M.2 interface; accordingly, the configuration pins include pin 21, pin 69, pin 75 and pin 1.

[0041] M.2 is developed by PCI-SIG and SATA-IO standard organizations, and is defined in both PCI-SIG M.2 and SATA Rev. 3.2 specifications; originally called NGFF (Next Generation Form Factor). M.2 is compatible with multiple communication protocols, such as SATA, PCIe, USB, HSIC, UART, SMBus, etc. According to the specification definition, the four signals of pin1, pin21, pin69, and pin75 of the M.2 interface module are used as CONFIG Pins (configuration pins). The host determines the type of device inserted into the module by detecting the status of these four pins.

[0042] For example Figure 5 The following table shows a specific configuration pin status table. The corresponding device type can be determined according to the status of the four pins, namely Figure 5In the add in card type and main host interface (additional card type and host interface protocol). GND means ground wire or 0 line, NC (No Connection) means no connection. In the early stage of production, the package resistors corresponding to pins 21, 69, 75 and 1, the electrodes at both ends of the package of the resistor are connected through very fine PCB traces, so under normal circumstances it is equivalent to a short circuit, which is equivalent to a 0 ohm resistance state. All configuration pins use this type of package, which is equivalent to connecting all configuration pins to GND after production. Subsequently, according to different customer needs, the pins that need to be in NC state will be selectively fused through an external power supply. The bill of materials (BOM, a technical document used to describe the composition of a company's products) of the M.2 modules with the same interface function is normalized, and after obtaining the order, the fuse is fused according to the requirements to complete the configuration of different customer needs.

[0043] In this embodiment, the configuration pins are used to connect to the general purpose input and output port (GPIO) of the host, so that the host can determine the device type of the external device according to the output levels of all the configuration pins. That is, when the external device is used, it is inserted into the multi-protocol compatible interface of the host, the host supplies power to the external device, and each configuration pin of the external device outputs a corresponding level according to the package resistance, so that the host can determine the device type after reading.

[0044] Specifically, the configuration pins are respectively connected to the corresponding universal input / output ports and the first end of the corresponding pull-up resistor; the second end of the pull-up resistor is connected to the power supply, so that when the fuse in the package resistor is not blown, the configuration pin corresponding to the package resistor outputs a low level, and when the fuse in the package resistor is blown, the configuration pin corresponding to the package resistor outputs a high level. The pull-up resistor is a kilo-ohm resistor, and the package resistor will not be blown when connected to the power supply. For example Figure 6 As shown in the figure, the host is connected to the configuration pin of the external device through GPIO and pull-up resistor.

[0045] Based on the above embodiments, the present utility model also discloses a fuse system, such as Figure 7 As shown, it includes a fuse device 20 and the external device 10 mentioned above;

[0046] The target configuration pin of the external device is connected to the fuse device; the fuse device is used to apply a fuse current to the target configuration pin, so as to use the fuse current to blow the fuse of the package resistor corresponding to the target configuration pin. That is, after receiving the user's order, the factory connects the target configuration pin of the external device to the fuse device, and the target configuration pin is the pin of the corresponding package resistor that needs to be blown. After the fuse device is connected, the fuse device is used to apply a fuse current to the target configuration pin, thereby blowing the fuse in the package resistor.

[0047] In some embodiments, the fuse device includes a switch and a first resistor; the first end of the switch is connected to a power source, the second end of the switch is respectively connected to the target configuration pin and the first end of the first resistor, and the second end of the first resistor is grounded. That is, by closing the switch, the fuse device is powered on, a large current passes through the package resistor connected to the target configuration pin, and the fuse in the package resistor is blown. Among them, the voltage value of the power source connected to the first end of the switch and the resistance value of the first resistor can be specifically set according to the thickness of the fuse, that is, to ensure that the fuse can be blown.

[0048] In some embodiments, the fuse device further includes an indicator light; the second end of the first resistor is connected to the first end of the indicator light; and the second end of the indicator light is grounded, that is, the indicator light is used to display whether the fuse is blown.

[0049] In some embodiments, the indicator light is a light emitting diode; the second end of the first resistor is connected to the positive electrode of the light emitting diode; and the negative electrode of the light emitting diode is grounded. Figure 8 As shown, the above switch is a button. When the button is turned on through an external power supply, a large current flows through the resistor package inside the module, the thin wire inside the package resistor is melted, the external light-emitting diode (LED) lights up, and the melting is completed.

[0050] As can be seen from the above, this embodiment replaces the original 0 ohm chip resistor with a specially packaged resistor to meet the unification of the early production BOM. After the production is completed in the early stage, the fuse processing can be selected according to the specific needs of different customers in the later stage, which is convenient for quickly meeting the needs of different customers and improving production efficiency.

[0051] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. An external device, characterized in that: Includes multi-protocol compatible interfaces, multiple package resistors; Each configuration pin of the multi-protocol compatible interface is respectively connected to the first end of the corresponding package resistor; The second end of the package resistor is grounded; The two ends of the electrodes of the packaged resistor are connected via a fuse; the fuse is blown after a fusing current is applied to the packaged resistor.

2. The external device according to claim 1, characterized in that: The configuration pins are used to connect to the general input and output ports of the host, so that the host can determine the device type of the external device according to the output levels of all the configuration pins.

3. The external device according to claim 1, characterized in that: The configuration pins are respectively connected to the corresponding general input and output ports and the first end of the corresponding pull-up resistor; The second end of the pull-up resistor is connected to a power supply so that the configuration pin corresponding to the package resistor outputs a low level when the fuse in the package resistor is not blown, and outputs a high level when the fuse in the package resistor is blown.

4. The external device according to claim 1, characterized in that: The multi-protocol compatible interface is an M.2 interface.

5. The external device according to claim 4, characterized in that: The configuration pins include pin 21, pin 69, pin 75 and pin 1.

6. A fusing system, characterized in that: comprising a fuse device and an external device according to any one of claims 1 to 5; The target configuration pin of the external device is connected to the fuse device; The fusing device is used to apply a fusing current to the target configuration pin, so as to use the fusing current to fuse the fuse of the package resistor corresponding to the target configuration pin.

7. The fuse system according to claim 6, characterized in that: The fuse device includes a switch and a first resistor; The first end of the switch is connected to a power source, the second end of the switch is respectively connected to the target configuration pin and the first end of the first resistor, and the second end of the first resistor is grounded.

8. The fuse system according to claim 7, characterized in that: The fuse device also includes an indicator light; The second end of the first resistor is connected to the first end of the indicator light; The second end of the indicator light is grounded.

9. The fuse system according to claim 8, characterized in that: The indicator light is a light emitting diode; The second end of the first resistor is connected to the positive electrode of the light emitting diode; The cathode of the light emitting diode is grounded.

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