Soldering flux cleaning device

Abstract

The utility model relates to a scaling powder cleaning device which comprises a material clamping mechanism, a rotating main shaft and a coupler, and the material clamping mechanism is connected with the rotating main shaft through the coupler. The material clamping mechanism comprises a material clamping platform, material clamping buckles and a material clamping driving mechanism, the top of the material clamping platform is provided with the two opposite material clamping buckles, and the material clamping buckles are connected with the material clamping driving mechanism. The chip cleaning device has the advantages that a gap between a chip and a substrate is fully flushed by water flow by continuously rotating a workpiece, so that the cleaning effect is enhanced; and the cleaning cost is low, feeding and discharging are convenient, and the requirements of an industrial batch automatic production line are met.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor packaging, in particular to a soldering flux cleaning device. Background Art

[0002] In the semiconductor packaging industry, after large-size semiconductors are mounted, the products, especially the solder joints, need to be cleaned to remove the flux. Due to the development of product technology, the number of connection bumps between the chip and the substrate is becoming more and more dense, and the size of a single connection bump is getting smaller and smaller. For traditional flux cleaning equipment, the limitation of the incident angle between the nozzle and the substrate makes it impossible for the cleaning liquid to enter the gap between the substrate and the chip, and the cleaning is not thorough, resulting in a small amount of flux remaining in the gap, affecting the performance of the product. Utility Model Content

[0003] The utility model aims to provide a soldering flux cleaning device, which can solve the problem of incomplete soldering flux cleaning after the chip and the substrate are mounted.

[0004] In order to achieve the above-mentioned utility model object, the utility model provides a flux cleaning device, including a clamping mechanism, a rotating spindle, and a coupling, wherein the clamping mechanism is connected to the rotating spindle through the coupling;

[0005] The material clamping mechanism comprises a material clamping platform, a material clamping buckle, and a material clamping driving mechanism. Two opposite material clamping buckles are arranged on the top of the material clamping platform, and the material clamping buckles are connected to the material clamping driving mechanism.

[0006] Preferably, the material clamping driving mechanism is a cylinder, and the piston rod of the cylinder is connected to the material clamping buckle.

[0007] As a further improvement of the utility model, the clamping platform is provided with a limiting groove, a sliding block is provided in the limiting groove, and the sliding block is connected to the bottom of the clamping buckle.

[0008] Furthermore, a stop block is provided at the end of the limiting groove.

[0009] Furthermore, the coupling is externally connected to a driving assembly.

[0010] Furthermore, the rotating main shaft is externally connected to a rotating component.

[0011] As a further improvement of the utility model, the clamping platform is provided with a material placing trough.

[0012] The utility model discloses a solder flux cleaning device. Before discharging the material, the clamping platform is kept in a horizontal state, the workpiece is placed on the clamping platform, the two clamping buckles that are kept in an open state are closed by the clamping driving mechanism, the workpiece is clamped between the two clamping buckles, the coupling is externally connected to the existing driving component, so that the coupling is rotated 90 degrees, so that the clamping platform is kept in a vertical state, the workpiece clamped on the clamping platform is located below the cleaning nozzle, and the workpiece is kept in a vertical state, so that the cleaning nozzle can be aligned with the gap between the chip and the substrate, and the cleaning nozzle sprays cleaning liquid and fills the gap according to the program setting. The cleaning liquid flows downward due to gravity and wraps the solder flux in the gap between the chip and the substrate. Subsequently, the rotating spindle is controlled by an external rotating assembly, which may be a motor. The motor controls the rotating spindle to rotate, thereby driving the coupling and the clamping platform to rotate synchronously. The clamped workpiece can be rotated successively at an angle of 90° each, so that the workpiece, especially the solder flux and cleaning liquid in the gap between the chip and the substrate, can be fully washed by the water flow sprayed from the cleaning nozzle. After cleaning, the coupling drives the clamping platform to rotate back to a horizontal state to facilitate the unloading of the workpiece.

[0013] Compared with the prior art, the soldering flux cleaning device of the utility model has the following advantages:

[0014] (1) By continuously rotating the workpiece, the gap between the chip and the substrate is fully flushed by water to enhance the cleaning effect;

[0015] (2) Low cleaning cost, convenient loading and unloading, meeting the needs of industrial batch automatic production lines. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic structural diagram of a soldering flux cleaning device of the utility model;

[0017] Figure 2 It is a schematic diagram of the clamping mechanism structure;

[0018] Figure 3 It is a schematic diagram of the clamping buckle connection structure. DETAILED DESCRIPTION

[0019] The specific implementation of the utility model is further described in detail below with reference to the accompanying drawings.

[0020] like Figure 1 As shown, a solder flux cleaning device of the utility model comprises a clamping mechanism 1, a rotating spindle 2, and a coupling 3, wherein the clamping mechanism 1 is connected to the rotating spindle 2 via the coupling 3;

[0021] like Figure 2As shown, the material clamping mechanism 1 includes a material clamping platform 11 , a material clamping buckle 12 , and a material clamping driving mechanism 13 . Two opposite material clamping buckles 12 are provided on the top of the material clamping platform 11 , and the material clamping buckles 12 are connected to the material clamping driving mechanism 13 .

[0022] The utility model is a solder flux cleaning device. Before discharging the material, the clamping platform 11 is kept in a horizontal state, the workpiece 4 is placed on the clamping platform 11, and the two clamping buckles 12 that are kept in an open state are closed by the clamping driving mechanism 13, so that the workpiece 4 is clamped between the two clamping buckles 12, and the coupling 3 is externally connected to the existing driving component (not shown), so that the coupling 3 rotates 90 degrees, so that the clamping platform 11 is kept in a vertical state, the workpiece 4 clamped on the clamping platform 11 is located below the cleaning nozzle 5, and the workpiece 4 is kept in a vertical state, the cleaning nozzle 5 is aligned with the gap between the chip and the substrate, and according to the program setting, the cleaning nozzle 5 sprays cleaning The cleaning liquid is poured into the gap between the chip and the substrate below. The cleaning liquid flows downward due to gravity and wraps the flux in the gap between the chip and the substrate. Subsequently, the rotating spindle 2 is controlled by an external rotating component (not shown), which can be a motor. The motor controls the rotation of the rotating spindle 2, thereby driving the coupling 3 and the clamping platform 11 to rotate synchronously, and the clamped workpiece 4 can be rotated successively at an angle of 90° each, so that the workpiece 4, especially the flux and the cleaning liquid in the gap between the chip and the substrate, are fully washed by the water flow sprayed from the cleaning nozzle 5. After cleaning, the coupling 3 drives the clamping platform 11 to rotate back to a horizontal state, which is convenient for unloading the workpiece 4.

[0023] like Figure 2 As shown, the clamping drive mechanism 13 is preferably a cylinder, the piston rod of the cylinder is connected to the clamping buckle 12, and the cylinder automatically pushes the two clamping buckles 12 to open and close, thereby improving the clamping efficiency and ensuring that the workpiece 4 is tightly clamped between the two clamping buckles 12 to prevent the clamped material from loosening. During the cleaning process, the workpiece 4 rotates and falls off the clamping platform 11.

[0024] like Figure 3 As shown, the clamping platform 11 is provided with a material placing groove 111, and the workpiece 4 is placed in the groove. The material placing groove 111 can quickly locate the material placing position and improve the material loading speed.

[0025] The clamping platform 11 is provided with a limit groove 14, in which a slider 15 is provided, and the slider 15 is connected to the bottom of the clamping buckle 12. When the clamping buckle 12 moves back and forth, the slider 15 slides in the limit groove 14 accordingly, guiding the back and forth movement of the clamping buckle 12.

[0026] A stopper 16 is provided at the end of the limiting groove 14 , and the stopper 16 blocks the sliding block 15 , limits the limit travel of the clamping buckle 12 , and prevents the clamping buckle 12 from colliding with the workpiece 4 and causing damage to the workpiece.

[0027] The preferred embodiments of the present invention have been specifically described above, but the present invention is not limited to the described embodiments. Those skilled in the art may make various equivalent modifications or substitutions without violating the spirit of the present invention, and these equivalent modifications or substitutions are all within the scope defined by the claims of this application.

Claims

1. A flux cleaning device, characterized in that: It comprises a material clamping mechanism, a rotating spindle, and a coupling, wherein the material clamping mechanism is connected to the rotating spindle through the coupling; The material clamping mechanism comprises a material clamping platform, a material clamping buckle, and a material clamping driving mechanism. Two opposite material clamping buckles are arranged on the top of the material clamping platform, and the material clamping buckles are connected to the material clamping driving mechanism.

2. A soldering flux cleaning device as claimed in claim 1, characterized in that: The material clamping driving mechanism is a cylinder, and the piston rod of the cylinder is connected to the material clamping buckle.

3. A soldering flux cleaning device as claimed in claim 1 or 2, characterized in that: The material clamping platform is provided with a limiting groove, a sliding block is provided in the limiting groove, and the sliding block is connected to the bottom of the material clamping buckle.

4. A soldering flux cleaning device as claimed in claim 3, characterized in that: A stop block is provided at the end of the limiting groove.

5. A soldering flux cleaning device as claimed in claim 1, characterized in that: The material clamping platform is provided with a material placing trough.

6. A soldering flux cleaning device as claimed in claim 1, characterized in that: The coupling is externally connected to a driving component.

7. A soldering flux cleaning device as claimed in claim 1, characterized in that: The rotating main shaft is externally connected to a rotating component.

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