Chip with positioning bumps

Abstract

The utility model provides a chip with a positioning bump. The chip comprises a chip body; the plurality of convex blocks are arranged on the chip body at intervals, and the shape of at least one convex block is different from the shapes of other convex blocks. According to the utility model, the shapes of part of the bumps are changed to be separated from other bumps, so that the positioning is easy, and the bumps with different shapes are used as positioning points to be matched with corresponding pins during packaging, so that the rapid and accurate alignment is realized, and the production efficiency is improved. And the positions of other convex blocks can be quickly positioned by taking the convex block serving as the positioning point as a base point.

Description

Technical Field

[0001] The utility model relates to the technical field of chip manufacturing, in particular to a chip with a positioning bump. Background Art

[0002] Bumps are protrusions with metallic conductive properties that grow directionally on the chip surface and are directly or indirectly connected to the chip pads. During subsequent packaging, the bumps are combined with the pins on the circuit board through thermal compression or conductive adhesive.

[0003] In the prior art, the bumps on the chip are designed in a single design and have the same shape. Therefore, when there are many bumps and they are densely packed, it is difficult to locate the position of a specific bump. In particular, for a long chip, the bumps in the middle of the length are difficult to distinguish. In the subsequent packaging process, if the bumps and pins are offset due to differences in expansion and contraction coefficients, it is difficult to effectively identify and quickly locate them.

[0004] In view of this, it is necessary to provide a chip with positioning bumps to solve the above technical problems. Utility Model Content

[0005] In order to achieve the above-mentioned purpose, the utility model provides a chip with positioning bumps, which comprises a chip body; a plurality of bumps arranged at intervals on the chip body, and the shape of at least one of the bumps is different from the shapes of the other bumps.

[0006] As a further improvement of the present invention, the shape of the protrusion is two or more of a rectangle, a parallelogram, a cross, a trapezoid, a rhombus, and a hexagon.

[0007] As a further improvement of the present invention, a plurality of the bumps are arranged at intervals along the first direction, and the bumps of different shapes are located in the middle of the chip body along the first direction.

[0008] As a further improvement of the present invention, the chip body includes a first area and a second area alternately arranged in sequence along a first direction, the bump includes a first bump located in the first area and a second bump located in the second area, and the first bump and the second bump have different shapes.

[0009] As a further improvement of the present invention, any one of the second zones is located between two of the first zones.

[0010] As a further improvement of the present invention, a size of the first area along the first direction is greater than a size of the second area along the first direction.

[0011] As a further improvement of the present invention, all of the first bumps have the same shape, and all of the second bumps have the same shape.

[0012] As a further improvement of the present invention, all the first bumps have the same shape, all the second bumps in the same second zone have the same shape, and the second bumps in different second zones have different shapes.

[0013] As a further improvement of the present invention, all of the first bumps have the same shape, and the second bumps in the same second zone have different shapes.

[0014] As a further improvement of the present invention, the first convex block is a rectangle, and the second convex block is a parallelogram.

[0015] The beneficial effects of the utility model are as follows: the utility model changes the shape of some of the bumps to distinguish them from other bumps, making them easy to position, and uses the bumps with different shapes as positioning points to match them with corresponding pins during packaging, thereby achieving fast and accurate alignment, and can use the bumps that serve as positioning points as base points to quickly position the positions of other bumps. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation on the present invention. In the drawings:

[0017] Figure 1 It is a schematic diagram of an implementation mode of a chip shown in the utility model;

[0018] Figure 2 It is a schematic diagram of another embodiment of the chip shown in the utility model;

[0019] Figure 3 It is a schematic diagram of another embodiment of the chip shown in the utility model;

[0020] Figure 4 It is a schematic diagram of another embodiment of the chip shown in the utility model;

[0021] Figure 5 It is a schematic diagram of another embodiment of the chip shown in the utility model;

[0022] Figure 6 It is a schematic diagram of another embodiment of the chip shown in the present invention. DETAILED DESCRIPTION

[0023] In order to make the purpose, technical solution and advantages of the utility model clearer, the technical solution of the utility model will be clearly and completely described below in combination with the specific embodiments of the utility model and the corresponding drawings. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0024] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0025] In the description of the present invention, it should be understood that the terms "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0026] In the description of the present utility model, unless otherwise specified and limited, it should be noted that the terms "installation", "connection" and "connection" should be understood in a broad sense. For example, it can be a mechanical connection or an electrical connection, or it can be the internal connection of two components. It can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to the specific circumstances.

[0027] like Figures 1 to 6 As shown, the chip with positioning bumps provided by the utility model includes a chip body 100 and a plurality of bumps 200 spaced apart on the chip body 100 , and the shape of at least one of the bumps 200 is different from the shapes of the other bumps 200 .

[0028] The bumps 200 of different shapes can be used as positioning points corresponding to the positions on the drawing, so that the coordinates of the bumps 200 can be quickly located to match the corresponding pins, and the bumps 200 used as positioning points can be used as base points to conveniently locate the positions of other bumps 200, so that a specific bump 200 can be quickly identified and located when the bumps 200 are large in number and densely arranged.

[0029] Specifically, the shape of the protrusion 200 includes but is not limited to a rectangle, a parallelogram, a cross, a trapezoid, a rhombus, a hexagon, a circle, etc. Most of the protrusions 200 have the same shape. The shape of the protrusions 200 in this part can be a rectangle to facilitate the manufacture of the protrusions 200. Of course, other shapes that are easy to manufacture can also be selected; the shape of another part of the protrusions 200 can be any shape other than a rectangle to distinguish them from other protrusions 200. The number of the protrusions 200 in this part can be set to multiple to increase the positioning points, and when there are multiple protrusions 200 as positioning points, the shapes of the protrusions 200 in this part can remain the same or different.

[0030] In this embodiment, the chip body 100 is in a long strip shape, and the length direction of the chip body 100 is defined as a first direction.

[0031] Reference Figure 1 In one embodiment, a plurality of the bumps 200 are arranged at intervals along the first direction, and the bumps 200 of different shapes are located in the middle of the chip body 100 along the first direction.

[0032] The bump 200 serving as a positioning point is located in the middle of the first direction, which is equivalent to adding a secondary alignment check in the middle of the chip body 100 when packaging the chip body 100 on a glass substrate, a flexible circuit board or a tape, to prevent the bump 200 and the pin from being bonded offset, thereby ensuring that each of the bumps 200 on the chip corresponds to the correct drawing position, and the long chip is segmented by the bumps 200 of different shapes located in the middle of the chip body 100, thereby helping to locate a specific bump 200 away from the end of the chip body 100.

[0033] In this embodiment, the bumps 200 are arranged at intervals along the four edges of the chip body 100. Since the chip body 100 is in the shape of an elongated strip and a large number of the bumps 200 are arranged along the first direction, the shape of a bump 200 located in the middle of the first direction is changed to distinguish it from the other bumps 200, and the bump 200 is used as a central positioning point to realize a secondary alignment check with the pin and as a central base point to locate the positions of the other bumps 200.

[0034] Reference Figures 2 to 6 In another embodiment, the chip body 100 includes a first area 101 and a second area 102 arranged alternately in sequence along the first direction, and the bump 200 includes a first bump 201 located in the first area 101 and a second bump 202 located in the second area 102, and the first bump 201 and the second bump 202 have different shapes.

[0035] Further, any second area 102 is located between two first areas 101, that is, the number of the first areas 101 is N, the number of the second areas 102 is N-1, the areas located at both ends of the chip body 100 along the first direction are the first areas 101, the second areas 102 are located in the middle of the chip body 100 along the first direction, the second areas 102 serve as positioning areas, and the second bumps 202 located in the second areas 102 serve as positioning points. In this embodiment, three groups of the first areas 101 are arranged at intervals, and two groups of the second areas 102 are arranged at intervals, which can be determined depending on the length of the chip and the number of the bumps 200.

[0036] Preferably, the size of the first area 101 along the first direction is larger than the size of the second area 102 along the first direction. Since the first area 101 is used as a positioning area, the size of the positioning area can be appropriately reduced, thereby reducing the change to the original chip. In this embodiment, the size of the second area 102 along the first direction can only accommodate one second bump 202.

[0037] Reference Figure 2 and Figure 3 , all of the first bumps 201 have the same shape, and all of the second bumps 202 have the same shape.

[0038] Reference Figure 2 All of the first bumps 201 are rectangular, all of the second bumps 202 are parallelograms, two independent second areas 102 are used as positioning areas, two second bumps 202 are arranged in the second area 102 along a direction perpendicular to the first direction, and four second bumps 202 are used as positioning points. The shape design of the different bumps 200 can quickly identify and locate the second bump 202 as the positioning point, and use the second bump 202 as a secondary alignment check point with the pin and a reference point for identifying the first bump 201.

[0039] Reference Figure 3 ,and Figure 2 The difference between the chips shown is that all the second bumps 202 are cross-shaped. Of course, the shape of the second bumps 202 can also be one of the above trapezoidal, rhombus, hexagonal, and circular shapes, which will not be repeated here.

[0040] Reference Figure 4 All of the first bumps 201 have the same shape, all of the second bumps 202 in the same second zone 202 have the same shape, and the second bumps 202 in different second zones 202 have different shapes.

[0041] Specifically, all the first bumps 201 are rectangular, all the second bumps 202 in the first second zone 102 are parallelograms, and all the second bumps 202 in the second second zone 102 are hexagons, thereby distinguishing the two second zones 102 from each other.

[0042] Reference Figure 5 and Figure 6 All of the first bumps 201 have the same shape, and the second bumps 202 in the same second area 102 have different shapes.

[0043] Reference Figure 5 All of the first bumps 201 are rectangular, and one of the two second bumps 202 in the same second zone 102 is cross-shaped and the other is trapezoidal, so that the second bumps 202 in the same second zone 102 are distinguished, and the second bumps 202 in two second zones 102 are designed in this way.

[0044] Reference Figure 6 ,and Figure 5 The difference between the chips shown is that the shapes of all the second bumps 202 are different.

[0045] In summary, the utility model changes the shape of some of the bumps 200 to distinguish them from other bumps 200, which makes positioning easier, and uses the bumps 200 with different shapes as positioning points corresponding to the pins, thereby achieving fast and accurate alignment, and can use the bump 200 used as the positioning point to quickly locate the positions of other bumps 200; for chips with longer lengths, the bumps 200 with different shapes are placed in the middle of the chip body 100, which can increase secondary alignment checks, and use the bump 200 as the middle base point to locate the positions of other bumps 200.

[0046] It should be understood that although the present specification is described according to embodiments, not every embodiment contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

[0047] The series of detailed descriptions listed above are only specific descriptions of feasible embodiments of the utility model and are not intended to limit the protection scope of the utility model. Any equivalent embodiments or changes that do not deviate from the technical spirit of the utility model should be included in the protection scope of the utility model.

Claims

1. A chip with positioning bumps, characterized in that: include: Chip body (100); A plurality of bumps (200) are arranged at intervals on the chip body (100), and the shape of at least one of the bumps (200) is different from the shapes of the other bumps (200).

2. The chip with positioning bumps according to claim 1, characterized in that: The shape of the protrusion (200) is two or more of a rectangle, a parallelogram, a cross, a trapezoid, a rhombus, a hexagon, and a circle.

3. The chip with positioning bumps according to claim 1, characterized in that: A plurality of the bumps (200) are arranged at intervals along a first direction, and the bumps (200) of different shapes are located in the middle of the chip body (100) along the first direction.

4. The chip with positioning bumps according to claim 1, characterized in that: The chip body (100) comprises a first area (101) and a second area (102) arranged alternately in sequence along a first direction; the bump (200) comprises a first bump (201) located in the first area (101) and a second bump (202) located in the second area (102); the first bump (201) and the second bump (202) have different shapes.

5. The chip with positioning bumps according to claim 4, characterized in that: Any of the second regions (102) is located between two of the first regions (101).

6. The chip with positioning bumps according to claim 5, characterized in that: The size of the first region (101) along the first direction is greater than the size of the second region (102) along the first direction.

7. The chip with positioning bumps according to claim 4, characterized in that: All of the first bumps (201) have the same shape, and all of the second bumps (202) have the same shape.

8. The chip with positioning bumps according to claim 4, characterized in that: All the first convex blocks (201) have the same shape, all the second convex blocks (202) located in the same second zone (102) have the same shape, and the second convex blocks (202) located in different second zones (102) have different shapes.

9. The chip with positioning bumps according to claim 4, characterized in that: All of the first convex blocks (201) have the same shape, and the second convex blocks (202) located in the same second area (102) have different shapes.

10. The chip with positioning bumps according to claim 7, characterized in that: The first convex block (201) is a rectangle, and the second convex block (202) is a parallelogram.

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