LED ceramic lamp filament

Abstract

The LED ceramic lamp filament comprises a ceramic substrate, a first light-transmitting glue layer and a plurality of LED chips which are arranged along the length direction of the front surface of the ceramic substrate, conductive pins are respectively arranged at two ends of the ceramic substrate, and a negative electrode end and a positive electrode end of each LED chip respectively vertically face or obliquely face two sides of the length direction of the ceramic substrate. Two or more LED chips are connected in parallel through a first guide wire to form a light source module, a plurality of light source modules are sequentially connected in series through a second guide wire to form a light source access, and the head end and the tail end of the light source access are electrically connected to conductive pins at the two ends of the ceramic substrate through a third guide wire respectively. The first light-transmitting glue layer covers and wraps the light source path and one end of the inner side of each conductive pin to the front face of the ceramic substrate. According to the utility model, the problem that the voltage is not stable due to the fact that the circuit is oxidized after the conventional circuit with the silver layer is subjected to die bonding and high-temperature baking, bonding wire combination is not easy, and pseudo soldering of the silver wire on the ceramic substrate is easy to occur can be effectively solved.

Description

Technical Field

[0001] The utility model relates to the technical field of filaments, in particular to an LED ceramic filament. Background Art

[0002] As a new energy source, LED has been widely used in the field of lighting due to its advantages such as good energy saving effect and long life. LED lights have changed the principle of tungsten filament light emission of incandescent lamps, and use electric field to emit light. They have the advantages of high light efficiency, no radiation, long life, low power consumption, and environmental protection and energy saving. The LED filament currently used in LED lights, the LED light-emitting components used in it, such as the attached Figure 1 As shown, silver wires are generally welded on both sides of the ceramic substrate in the length direction, and the LED chips are evenly distributed along the width direction of the front side of the ceramic substrate; however, the existing LED filament has some disadvantages. After the silver layer circuit is solidified and baked at high temperature, the circuit is oxidized, which makes it difficult to weld the wire, and it is easy to cause the silver wire to be cold-welded on the ceramic substrate, thereby causing voltage instability. In addition, the silver circuit on the ceramic substrate will block the luminous efficiency of the LED chip, so it needs to be improved. Utility Model Content

[0003] The purpose of the utility model is to provide an LED ceramic filament to solve the problems raised in the above background technology.

[0004] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0005] An LED ceramic filament comprises a ceramic substrate, a first light-transmitting adhesive layer and a plurality of LED chips arranged along the length direction of the front side of the ceramic substrate, conductive pins are respectively arranged at both ends of the ceramic substrate, the negative terminal and the positive terminal of each LED chip are respectively vertically or obliquely oriented towards the two sides of the length direction of the ceramic substrate, two or more LED chips are connected in parallel through a first conductive wire to form a light source module, a plurality of light source modules are sequentially connected in series through a second conductive wire to form a light source path, the first and last ends of the light source path are respectively electrically connected to the conductive pins at both ends of the ceramic substrate through a third conductive wire, and the first light-transmitting adhesive layer covers and encases the light source path and the inner end of each conductive pin to the front side of the ceramic substrate.

[0006] Preferably, the positive terminal of the first LED chip of the first group of light source modules is electrically connected to the conductive pin at the front end of the ceramic substrate, the negative terminal of the last LED chip of the first group of light source modules is electrically connected to the positive terminal of the first LED chip of the second group of light source modules through a second conductive wire, and so on; the negative terminal of the last LED chip of the last group of light source modules is electrically connected to the conductive pin at the end of the ceramic substrate.

[0007] Preferably, each LED chip is bonded to the ceramic substrate by a die-bonding adhesive.

[0008] Preferably, the distance H between two adjacent LED chips is 0.5 mm-2 mm.

[0009] Preferably, the width T of the ceramic substrate is 0.7 mm-1.7 mm.

[0010] Preferably, two or more groups of light source paths are provided on the ceramic substrate, and the first and second ends of each light source path are electrically connected to the conductive pins at the two ends of the ceramic substrate through guide wires, and the first light-transmitting adhesive layer covers and envelops each light source path and the inner end of each conductive pin to the front side of the ceramic substrate.

[0011] Preferably, the back side of the ceramic substrate is coated with a second light-transmitting adhesive layer;

[0012] The first light-transmitting adhesive layer and the second light-transmitting adhesive layer are transparent silicone layers or fluorescent silicone layers.

[0013] A lamp using an LED ceramic filament comprises a light-transmitting carrier. The LED ceramic filament is arranged in the light-transmitting carrier and draws electricity from a power source outside the light-transmitting carrier.

[0014] Preferably, the light-transmitting carrier is a glass bulb, a lamp holder is provided at one end of the glass bulb, a power driver is provided in the lamp holder, the positive and negative ends of the LED ceramic filament are electrically connected to the power driver, and the power driver is electrically connected to the lamp holder.

[0015] Compared with the prior art, the beneficial effects of the utility model are:

[0016] The LED ceramic filament is designed to change the traditional ceramic substrate with silver wire into a ceramic substrate without silver wire, and then two or more LED chips are connected in parallel through the guide wire to form a light source module, and a plurality of light source modules are connected in series through the guide wire to form a light source path, which can effectively solve the problem that the existing silver layer circuit is oxidized after high-temperature baking of the solid crystal, which will lead to the difficulty of welding wire bonding, and the silver wire is easy to be cold-welded on the ceramic substrate, thereby causing the voltage to be unstable;

[0017] In addition, the ceramic substrate designed without silver wires can effectively prevent the lines from blocking the light-emitting effect of the LED chip, and the brightness can be increased after removing the lines. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 The figure is a schematic diagram of the chip layout and electrical connection of the ceramic filament in the prior art.

[0019] Figure 2 The figure is a schematic diagram of the chip arrangement and electrical connection of the ceramic filament of the utility model.

[0020] Figure 3 It is a cross-sectional structural schematic diagram of the overall structure of the utility model.

[0021] Figure 4 Schematic diagram of a lamp using LED ceramic filament.

[0022] The meanings of the numbers in the figure are: 10, ceramic substrate; 11, LED chip; 121, first conductor wire; 122, second conductor wire; 123, third conductor wire; 13, conductive pin; 140, silver layer circuit; 14, first light-transmitting adhesive layer; 15, second light-transmitting adhesive layer; 16, glass bulb; 17, lamp holder; 18, power driver. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0024] Embodiment 1: First, the arrangement of the filament in the prior art is introduced. Figure 1 As shown, it includes a ceramic substrate, a plurality of LED chips evenly distributed along the width direction of the front side of the ceramic substrate, conductive pins are respectively arranged at both ends of the ceramic substrate, and silver layer circuits are printed on both sides of the front side of the ceramic substrate in the length direction, such as Figure 1 A plurality of LED chips are arranged in the longitudinal direction of the front side of the ceramic substrate, and two or more LED chips are connected in series through a guide wire to form a light source module, and the two ends of each light source module are respectively connected in parallel between the two sides of which are printed with a silver layer circuit 140. In the existing filament arrangement method, the circuit oxidation after the high-temperature baking of the silver layer circuit will make it difficult to bond the wire, and it is easy to cause the silver layer circuit 140 to have a cold solder joint on the ceramic substrate, thereby causing the voltage to be unstable. In addition, the silver layer circuit 140 on the ceramic substrate will also block the luminous efficiency of the LED chip.

[0025] In order to solve the existing deficiencies, the utility model provides a technical solution:

[0026] A LED ceramic filament, see Figure 2 , including a ceramic substrate 10, a first light-transmitting adhesive layer and a plurality of LED chips 11 evenly distributed along the length direction of the front side of the ceramic substrate 10. The arrangement of the ceramic substrate 10 without a silver layer circuit in the utility model can effectively prevent the silver wire from blocking the LED chip 11, thereby improving the luminous effect of the LED chip 11.

[0027] Conductive pins 13 are respectively provided at both ends of the ceramic substrate 10. Figure 2As shown, the negative terminal and the positive terminal of each LED chip 11 are respectively oriented to the two sides of the length direction of the ceramic substrate 10, and two or more LED chips 11 are connected in parallel through the first conductive wire 121 to form a light source module 1. In the utility model, two LED chips 11 are connected in parallel through the first conductive wire 121 to form a light source module 1; a plurality of light source modules 1 are connected in series in sequence through the second conductive wire 122 to form a light source path, and the first and last ends of the light source path are electrically connected to the conductive pins 13 at both ends of the ceramic substrate 10 through the third conductive wire 123.

[0028] The positive terminal of the first LED chip 11 of the first group of light source modules 1 is electrically connected to the conductive pin 13 at the front end of the ceramic substrate 10, the negative terminal of the last LED chip 11 of the first group of light source modules 1 is electrically connected to the positive terminal of the first LED chip 11 of the second group of light source modules 1 through the second conductive wire 122, and so on; the negative terminal of the last LED chip 11 of the last group of light source modules 1 is electrically connected to the conductive pin 13 at the end of the ceramic substrate 10.

[0029] The same light source module 1 in the present invention comprises at least two LED chips 11 , the cathode terminals of the two LED chips 11 are connected to the cathode terminals, and the anode terminals are connected to the anode terminals, so that the two LED chips 11 in the same light source module 1 are connected in parallel.

[0030] In the present invention, each LED chip 11 is bonded to the ceramic substrate 10 by a die-bonding adhesive; the width T of the ceramic substrate 10 is 0.7 mm-1.7 mm, and the width T of the ceramic substrate 10 can be 0.7 mm, 1.1 mm, or 1.7 mm. The width T of the ceramic substrate 10 of the present invention is preferably 1.1 mm.

[0031] The distance H between two adjacent LED chips 11 is 0.5 mm-2 mm. The distance H between two adjacent LED chips 11 can be 0.5 mm, 1.3 mm, or 2 mm. In the present invention, the distance H between two adjacent LED chips 11 is preferably 1.3 mm.

[0032] Two or more light source paths may be provided on the ceramic substrate 10, and the first and second ends of each light source path are electrically connected to the conductive pins 13 at both ends of the ceramic substrate through the third conductive wire 123. Providing multiple light source paths can improve the overall lighting effect of the lamp.

[0033] In the utility model, the traditional ceramic substrate with silver wire is designed as a ceramic substrate without silver wire, which can effectively solve the problem that the circuit oxidation after high-temperature baking of the existing silver layer circuit solid crystal will make it difficult to weld the wire, and it is easy to cause the silver wire to have a cold solder joint on the ceramic substrate, thereby causing the voltage to be unstable, and the practicality is better.

[0034] like Figure 3As shown, the first light-transmitting adhesive layer 14 covers and envelops each light source passage and the inner end of each conductive pin 13 to the front side of the ceramic substrate 10. A second light-transmitting adhesive layer 15 is coated on the back side of the ceramic substrate 10;

[0035] The first light-transmitting adhesive layer 14 and the second light-transmitting adhesive layer 15 may be transparent silicone layers or fluorescent silicone layers.

[0036] Example 2: Reference Figure 4 A lamp using an LED ceramic filament includes a light-transmitting carrier, wherein the LED ceramic filament 100 is arranged in the light-transmitting carrier and draws power from a power source outside the light-transmitting carrier.

[0037] Preferably, the light-transmitting carrier is a glass bulb 16 , a lamp holder 17 is provided at one end of the glass bulb 16 , a power driver 18 is provided inside the lamp holder 17 , the positive and negative ends of the LED ceramic filament 100 are electrically connected to the power driver 18 , and the power driver 18 is electrically connected to the lamp holder 17 .

[0038] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. An LED ceramic filament, characterized in that: It includes a ceramic substrate, a first light-transmitting adhesive layer and a plurality of LED chips arranged along the length direction of the front side of the ceramic substrate. Conductive pins are respectively arranged at both ends of the ceramic substrate. The negative terminal and the positive terminal of each LED chip are respectively vertically or obliquely oriented toward the two sides of the length direction of the ceramic substrate. Two or more LED chips are connected in parallel through a first conductive wire to form a light source module. A plurality of light source modules are sequentially connected in series through a second conductive wire to form a light source path. The first and last ends of the light source path are respectively electrically connected to the conductive pins at both ends of the ceramic substrate through a third conductive wire. The first light-transmitting adhesive layer covers and encases the light source path and the inner end of each conductive pin to the front side of the ceramic substrate.

2. The LED ceramic filament according to claim 1, characterized in that: The positive terminal of the first LED chip of the first group of light source modules is electrically connected to the conductive pin at the front end of the ceramic substrate, the negative terminal of the last LED chip of the first group of light source modules is electrically connected to the positive terminal of the first LED chip of the second group of light source modules through the second conductive wire, and so on; the negative terminal of the last LED chip of the last group of light source modules is electrically connected to the conductive pin at the end of the ceramic substrate.

3. The LED ceramic filament according to claim 1, characterized in that: Each LED chip is bonded to the ceramic substrate by a die-bonding adhesive.

4. The LED ceramic filament according to claim 1, characterized in that: The distance H between two adjacent LED chips is 0.5mm-2mm.

5. The LED ceramic filament according to claim 1, characterized in that: The width T of the ceramic substrate is 0.7 mm-1.7 mm.

6. The LED ceramic filament according to claim 1, characterized in that: Two or more light source paths are arranged on the ceramic substrate, and the first and second ends of each light source path are electrically connected to the conductive pins at the two ends of the ceramic substrate through guide wires, and the first light-transmitting adhesive layer covers and envelops each light source path and the inner end of each conductive pin to the front side of the ceramic substrate.

7. The LED ceramic filament according to claim 1 or 6, characterized in that: The back side of the ceramic substrate is coated with a second light-transmitting adhesive layer; The first light-transmitting adhesive layer and the second light-transmitting adhesive layer are transparent silicone layers or fluorescent silicone layers.

8. A lamp using the LED ceramic filament as claimed in any one of claims 1 to 7, characterized in that It comprises a light-transmitting carrier, wherein the LED ceramic filament is arranged in the light-transmitting carrier and draws power from a power source outside the light-transmitting carrier.

9. The lamp according to claim 8, characterized in that: The light-transmitting carrier is a glass bulb shell, a lamp holder is arranged at one end of the glass bulb shell, a power driver is arranged in the lamp holder, the positive terminal and the negative terminal of the LED ceramic filament are electrically connected to the power driver, and the power driver is electrically connected to the lamp holder.

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