FPC (Flexible Printed Circuit) structure for improving anti-static capability of display module

By setting up a freely bent grounding part on the FPC and connecting it with the copper area of ​​the ground drain of the customer motherboard, the problem of the display module being unable to achieve grounding connection when the FPC is deployed and shipped is improved, and the anti-static ability is improved.

CN222827405UActive Publication Date: 2025-05-02TRULY SEMICON
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Patent Information

Application Number
CN202421484704.6
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-06-26
Publication Date
2025-05-02
Estimated Expiration
2034-06-26

AI Technical Summary

Technical Problem

When the existing display module needs to be unfolded and shipped and the backlight is in a plastic structure, the ground connection between the FPC and the backlight cannot be achieved, resulting in the failure to meet the anti-static requirements of the display module.

Method used

A freely bent grounding part is provided on the FPC. The grounding part can be bent to one side of the customer motherboard and connected to the copper area of ​​the grounding drain of the customer motherboard through conductive double-sided adhesives to realize the grounding connection between the FPC and the customer motherboard.

Benefits of technology

Without affecting the FPC roll-out and shipment, the anti-static ability of the display module body is improved to ensure effective conduction of static electricity.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses an FPC (Flexible Printed Circuit) structure for improving the anti-static capability of a display module, which comprises a display module body, the display module body comprises a display screen and a backlight, the backlight is made of a plastic material, an FPC is bound on the display screen and is in an unfolded state, a client mainboard is arranged on one side of the display module body, and the client mainboard is arranged on the other side of the display module body. One side of the FPC is provided with a grounding part which can be freely bent, and the grounding part can be independently bent to one side of the client mainboard and is in grounding connection with the client mainboard. The FPC structure has the advantages that the display module body is connected with the ground while spreading delivery is not affected, and the anti-static capacity of the display module body is improved.
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Description

Technical Field

[0001] The utility model relates to the technical field of display modules, in particular to an FPC structure for improving the anti-static capability of a display module. Background Art

[0002] The display module usually includes a cover plate, a display screen and a backlight. The display screen is usually bound with an FPC, which is used to connect to the customer's motherboard to ensure the normal use of the display module. One end of the FPC is bound to the display screen, and the other end of the FPC is bent to the iron frame on the back of the backlight and grounded to the iron frame to meet the anti-static requirements of the display module.

[0003] However, the display modules of some projects need to be shipped with the FPC unfolded, which means that the FPC does not need to be bent to the back of the backlight, and some backlights are plastic structures without iron frames. The FPC cannot be grounded to the backlight, thus failing to meet the anti-static requirements of the display module. Utility Model Content

[0004] The purpose of the utility model is to overcome the deficiencies in the prior art and provide an FPC structure that improves the anti-static capability of a display module.

[0005] The purpose of this utility model is achieved through the following technical solutions:

[0006] An FPC structure for improving the anti-static ability of a display module comprises: a display module body, the display module body comprises a display screen and a backlight, the backlight is made of plastic, an FPC is bound to the display screen, the FPC is in an unfolded state, a customer mainboard is arranged on one side of the display module body, a freely bendable grounding portion is arranged on one side of the FPC, the grounding portion can be bent independently to one side of the customer mainboard and is grounded to the customer mainboard.

[0007] In one embodiment, the grounding portion is integrally formed with the FPC, one end of the FPC is bound to the display screen, and the other end of the FPC is used to plug into a customer mainboard, and the grounding portion is formed by extending outward from the end of the FPC away from the end bound to the display screen.

[0008] In one embodiment, one end of the FPC away from the display screen is a plug-in end, the grounding portion is formed by extending outward from a side of the plug-in end, and the grounding portion is arranged in parallel with the plug-in end.

[0009] In one embodiment, a gold finger for plugging into the client mainboard is provided at the plug-in end.

[0010] In one embodiment, a U-shaped groove for separation is provided between the FPC and the grounding portion, the FPC and the grounding portion are provided at a certain distance, and the FPC is connected to one end of the grounding portion.

[0011] In one embodiment, a grounding PAD is disposed on the grounding portion. The grounding PAD is located on the front side of the grounding portion. The grounding PAD is used to be grounded to the customer mainboard.

[0012] In one embodiment, a conductive double-sided adhesive is disposed on the ground PAD, and the size of the conductive double-sided adhesive is adapted to the size of the ground PAD.

[0013] In one embodiment, the conductive double-sided adhesive is located on the front side of the grounding PAD, one side of the conductive double-sided adhesive is adhered to the grounding PAD, and after the grounding portion is bent to one side of the customer mainboard, the side of the conductive double-sided adhesive away from the grounding PAD is adhered to the customer mainboard.

[0014] In one embodiment, the thickness of the conductive double-sided adhesive is 0.05 mm.

[0015] In one embodiment, a grounding copper leakage area is provided at a position of the customer mainboard relative to the grounding PAD, and after the grounding portion is bent, the grounding PAD is adhered to the grounding copper leakage area by means of the conductive double-sided adhesive.

[0016] Compared with the prior art, the utility model has at least the following advantages:

[0017] The utility model discloses an FPC structure for improving the anti-static ability of a display module by arranging a freely bendable grounding portion on the FPC. When the grounding portion is bent to one side of a customer's mainboard, a grounding PAD is correspondingly adhered to a grounding copper leakage area of ​​the customer's mainboard through a conductive double-sided adhesive, thereby enabling the FPC to be grounded and connected to the customer's mainboard, thereby improving the anti-static ability of the display module body without affecting the rolling out and shipment of the FPC. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for use in the embodiments are briefly introduced below.

[0019] Figure 1 A schematic diagram of the structure of an FPC structure for improving the anti-static ability of a display module provided by the utility model;

[0020] Figure 2 A schematic diagram of a structure of an FPC structure with a conductive double-sided adhesive attached to a grounding portion in order to improve the anti-static capability of a display module provided by the utility model;

[0021] Figure 3 The utility model provides a side structural schematic diagram of an FPC structure for improving the anti-static capability of a display module.

[0022] Description of the drawings: 10. Display module body; 11. Display screen; 12. Backlight; 20. FPC; 21. Plug terminal; 211. Gold finger; 30. Customer mainboard; 31. Ground leakage copper area; 40. Grounding part; 41. Grounding PAD; 50. U-shaped groove; 60. Conductive double-sided adhesive. DETAILED DESCRIPTION

[0023] In order to facilitate the understanding of the present invention, the present invention will be described more comprehensively below with reference to the relevant drawings.

[0024] An FPC structure for improving the anti-static ability of a display module, referring to Figure 1 , including a display module body 10, the display module body 10 includes a display screen 11 and a backlight 12, the backlight 12 is made of plastic, an FPC 20 is bound to the display screen 11, one end of the FPC 20 is bound to the display screen 11, and the other end of the FPC 20 is used to connect to a client mainboard 30, and a client mainboard 30 is provided on one side of the display module body 10. In this embodiment, the FPC 20 is in an unfolded state.

[0025] Reference Figure 1 , because the FPC20 in the display screen 11 of some projects needs to be rolled out for shipment, and when the backlight 12 is made of plastic, the FPC20 cannot be bent to the back of the backlight 12 to achieve grounding connection, and thus cannot meet the anti-static requirements of the display module body 10. Therefore, a grounding portion 40 for grounding connection is provided on one side of the FPC20, and the grounding portion 40 can be bent to the client motherboard 30 on one side of the display module body 10, and is grounded to the client motherboard 30. The grounding portion 40 is integrally formed with the FPC20, and the grounding portion 40 extends outward from one end of the FPC20 away from the binding to the display screen 11.

[0026] Reference Figure 1 The end of the FPC 20 away from the display screen 11 is a plug end 21, which is used to connect to the customer mainboard 30. The grounding portion 40 is formed by extending outward from the side of the plug end 21, and the grounding portion 40 is arranged parallel to the plug end 21. The grounding portion 40 can be bent freely and can be bent alone to the customer mainboard 30 to achieve grounding connection.

[0027] Further, refer to Figure 1 A gold finger 211 for plugging with the customer's mainboard 30 is provided at the plug-in end 21 .

[0028] Reference Figure 1A U-shaped groove 50 for separation is provided between the FPC 20 and the grounding portion 40, one end of the U-shaped groove 50 is connected to the outside, the U-shaped groove 50 allows the FPC 20 and the grounding portion 40 to be arranged at a certain distance, and the FPC 20 is connected to one end of the grounding portion 40, so that the grounding portion 40 can be freely bent alone, and the unfolded state of the FPC 20 will not be affected when the grounding portion 40 is bent.

[0029] Reference Figure 1 A grounding PAD41 is provided on the grounding portion 40 , and the grounding PAD41 is located on the front side of the grounding portion 40 . The grounding PAD41 is used to ground the grounding portion 40 and the customer mainboard 30 . When the grounding portion 40 is bent to one side of the customer mainboard 30 , the grounding PAD41 contacts the customer mainboard 30 .

[0030] Reference Figure 2 A conductive double-sided adhesive 60 for conducting electricity is provided on the grounding PAD41. The size of the conductive double-sided adhesive 60 is adapted to the size of the grounding PAD41. One side of the conductive double-sided adhesive 60 is adhered to the grounding PAD41, and the other side of the conductive double-sided adhesive 60 is used to be adhered to the customer's mainboard 30.

[0031] Reference Figure 2 The conductive double-sided adhesive 60 is located on the front side of the grounding PAD 41. After the grounding portion 40 is bent to one side of the customer mainboard 30, the side of the conductive double-sided adhesive 60 away from the grounding PAD 41 is adhered to the customer mainboard 30, thereby realizing the grounding connection between the grounding portion 40 and the customer mainboard 30.

[0032] Further, refer to Figure 2 The thickness of the conductive double-sided adhesive 60 is 0.05mm.

[0033] Reference Figure 3 A grounding copper leakage area 31 is provided on the customer mainboard 30 at a position relative to the grounding PAD41, and the size of the grounding copper leakage area 31 is adapted to the size of the grounding PAD41. When the grounding portion 40 is bent to one side of the customer mainboard 30, the grounding PAD41 is correspondingly adhered to the grounding copper leakage area 31 of the customer mainboard 30 through the conductive double-sided adhesive 60, so that the FPC 20 and the customer mainboard 30 are grounded, so that the static electricity of the display module can be quickly conducted to the customer mainboard 30 for release, thereby improving the anti-static ability of the display module body 10.

[0034] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. An FPC structure for improving the anti-static ability of a display module, characterized in that: include: A display module body (10), the display module body (10) comprising a display screen (11) and a backlight (12), the backlight (12) being made of plastic material, an FPC (20) being bound to the display screen (11), the FPC (20) being in an unfolded state, a client motherboard (30) being arranged on one side of the display module body (10), a freely bendable grounding portion (40) being arranged on one side of the FPC (20), the grounding portion (40) being independently bendable to one side of the client motherboard (30) and being grounded to the client motherboard (30).

2. The FPC structure for improving the anti-static ability of a display module according to claim 1, characterized in that: The grounding portion (40) and the FPC (20) are integrally formed, one end of the FPC (20) is bound to the display screen (11), the other end of the FPC (20) is used for plugging with a customer mainboard (30), and the grounding portion (40) is formed by extending outward from the end of the FPC (20) away from the end bound to the display screen (11).

3. The FPC structure for improving the anti-static ability of a display module according to claim 2, characterized in that: One end of the FPC (20) away from the display screen (11) is a plug-in end (21), the grounding portion (40) is formed by extending outward from a side of the plug-in end (21), and the grounding portion (40) is arranged in parallel with the plug-in end (21).

4. The FPC structure for improving the anti-static ability of a display module according to claim 3, characterized in that: The plug-in end (21) is provided with a gold finger (211) for plugging with the client mainboard (30).

5. The FPC structure for improving the anti-static ability of a display module according to claim 3, characterized in that: A U-shaped groove (50) for separation is provided between the FPC (20) and the grounding portion (40); the FPC (20) and the grounding portion (40) are arranged at a certain distance from each other; and one end of the FPC (20) is connected to the grounding portion (40).

6. The FPC structure for improving the anti-static capability of a display module according to claim 5, characterized in that: A grounding PAD (41) is provided on the grounding portion (40). The grounding PAD (41) is located on the front side of the grounding portion (40). The grounding PAD (41) is used for grounding connection with the client mainboard (30).

7. The FPC structure for improving the anti-static capability of a display module according to claim 6, characterized in that: A conductive double-sided adhesive (60) is provided on the grounding PAD (41), and the size of the conductive double-sided adhesive (60) is adapted to the size of the grounding PAD (41).

8. The FPC structure for improving the anti-static capability of a display module according to claim 7, characterized in that: The conductive double-sided adhesive (60) is located on the front side of the grounding PAD (41), and one side of the conductive double-sided adhesive (60) is adhered to the grounding PAD (41). After the grounding portion (40) is bent to one side of the client mainboard (30), the side of the conductive double-sided adhesive (60) away from the grounding PAD (41) is adhered to the client mainboard (30).

9. The FPC structure for improving the anti-static ability of a display module according to claim 8, characterized in that: The thickness of the conductive double-sided adhesive (60) is 0.05 mm.

10. The FPC structure for improving the anti-static capability of a display module according to claim 9, characterized in that: A grounding copper leakage area (31) is arranged at a position of the customer mainboard (30) relative to the grounding PAD (41); after the grounding portion (40) is bent, the grounding PAD (41) is adhered to the grounding copper leakage area (31) via the conductive double-sided adhesive (60).