Circuit board assembly and electronic equipment
By setting isolation protrusions and isolation holes in the circuit board assembly and separating pins with insulating boards, the problem of insufficient insulation distance on existing circuit boards is solved, and the insulation performance of higher voltage levels is achieved.
Patent Information
- Application Number
- CN202421577590.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-04
- Publication Date
- 2025-05-02
- Estimated Expiration
- 2034-07-04
AI Technical Summary
Multiple pins on existing circuit boards are soldered directly, and the insulation distance between adjacent pins is short, which cannot meet the insulation requirements of high voltage levels.
A first isolation protrusion is provided on the housing of the electronic device to separate adjacent pins, an isolation hole is provided on the circuit board, and an insulating plate is provided between the housing and the circuit board, and a second isolation protrusion is provided on the insulation board to further separate adjacent pins.
The insulation performance of electronic devices is improved by increasing the creepage distance between adjacent pins to meet the insulation requirements of higher voltage levels.
Smart Images
Figure CN222827423U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of electronic equipment, and in particular to a circuit board assembly and electronic equipment. Background Art
[0002] Multiple pins of existing on-board terminals are directly soldered on the circuit board, and the insulation distance between adjacent pins is short, which cannot meet the insulation requirements of high voltage levels. Utility Model Content
[0003] In view of the problems existing in the background technology, the purpose of the present application is to provide a circuit board assembly and an electronic device, which overcome the above problems or at least partially solve the above problems.
[0004] According to the first aspect of the present application, a circuit board assembly is provided, comprising an electronic device, a circuit board and an insulating board. The electronic device comprises a housing and at least two pins arranged on the housing, wherein the housing is provided with a first isolation protrusion between two adjacent pins, and the first isolation protrusion separates the two adjacent pins. The circuit board is provided with first through holes corresponding to the pins one by one, and an isolation hole is provided between the two adjacent first through holes, and the isolation hole passes through the circuit board. The insulating board is provided between the housing and the circuit board, and the insulating board is provided with second through holes corresponding to the pins one by one, and the pin is sequentially passed through the first through hole and the second through hole. The surface of the insulating board facing the housing is provided with an isolation groove corresponding to the first isolation protrusion one by one, and the first isolation protrusion is arranged in the isolation groove, and the surface of the insulating board facing the circuit board is provided with a second isolation protrusion corresponding to the isolation hole one by one, and the second isolation protrusion separates the two adjacent pins, and the second isolation protrusion is arranged in the isolation hole.
[0005] In one or more optional embodiments above, along the axial direction of the isolation hole, the depth of the isolation hole is H, the height of the portion of the second isolation protrusion located in the isolation hole is h, and H=2h.
[0006] In one or more optional embodiments above, the at least two pins are arranged in sequence along a first direction, and the first isolation protrusion is extended along a second direction, wherein the first direction is perpendicular to the second direction.
[0007] In one or more of the above optional embodiments, the isolation groove is a strip groove whose length direction is parallel to the second direction.
[0008] In one or more optional embodiments above, the at least two pins are arranged in sequence along a first direction, and the second isolation protrusion is extended along a second direction, wherein the first direction is perpendicular to the second direction.
[0009] In one or more of the above optional embodiments, the isolation hole is a strip-shaped hole whose length direction is parallel to the second direction.
[0010] In one or more optional embodiments above, the isolation grooves and the second isolation protrusions are arranged in alignment one by one along the direction from the surface of the insulating plate facing the shell to the surface of the insulating plate facing the circuit board.
[0011] In one or more of the above optional embodiments, the surface of the insulating plate facing the shell abuts against the surface of the shell facing the circuit board, and the surface of the insulating plate facing the circuit board abuts against the surface of the circuit board facing the shell.
[0012] In one or more of the above optional embodiments, the insulating plate is made of flexible material.
[0013] According to a second aspect of the present application, an electronic device is provided, comprising the circuit board assembly as described above.
[0014] The beneficial effects of the embodiments of the present application are as follows: the circuit board assembly provided in the embodiments of the present application separates adjacent pins by setting a first isolation protrusion on the shell of the electronic device, setting an isolation hole on the circuit board, and setting an insulating plate between the shell and the circuit board, the first isolation protrusion is set in the isolation groove of the insulating plate, the second isolation protrusion of the insulating plate separates adjacent pins, and the second isolation protrusion is set in the isolation hole. Through the above method, the creepage distance between adjacent pins of the electronic device can be increased to meet the use requirements of higher voltage levels. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] In order to more clearly illustrate the specific embodiments of the present application or the technical solutions in the prior art, the following is a brief introduction to the drawings required for the specific embodiments or the prior art description. In all the drawings, similar elements or parts are generally identified by similar reference numerals. In the drawings, the elements or parts are not necessarily drawn according to the actual scale.
[0016] Figure 1 It is a cross-sectional schematic diagram of an existing terminal when it is fixed on a circuit board;
[0017] Figure 2 An exploded view of a circuit board assembly provided in an embodiment of the present application;
[0018] Figure 3A schematic diagram of an electronic device of a circuit board assembly provided in an embodiment of the present application;
[0019] Figure 4 A schematic diagram of a circuit board of a circuit board assembly provided in an embodiment of the present application;
[0020] Figure 5 A schematic diagram of an insulating plate of a circuit board assembly provided in an embodiment of the present application;
[0021] Figure 6 Another schematic diagram of an insulating plate of a circuit board assembly provided in an embodiment of the present application;
[0022] Figure 7 A cross-sectional schematic diagram of a circuit board assembly provided in an embodiment of the present application;
[0023] Figure 8 for Figure 7 A partial enlarged view of
[0024] Fig. 9 A schematic diagram of an electronic device of a circuit board assembly provided by an embodiment of the present application when viewed along a direction perpendicular to both direction a and direction b;
[0025] Fig.10 This is a schematic diagram of a circuit board assembly provided in an embodiment of the present application when viewed along a direction perpendicular to both direction a and direction b. DETAILED DESCRIPTION
[0026] In order to facilitate the understanding of the present application, the present application is described in more detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that when an element is described as "fixed to" another element, it can be directly on the other element, or there can be one or more centered elements therebetween. When an element is described as "connected to" another element, it can be directly connected to the other element, or there can be one or more centered elements therebetween. The terms "vertical", "horizontal", "left", "right", "inside", "outside" and similar expressions used in this specification are for illustrative purposes only.
[0027] Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" used in this specification includes any and all combinations of one or more of the related listed items.
[0028] In the description of this specification, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this utility model can be understood according to specific circumstances.
[0029] In addition, the technical features involved in the different embodiments of the present application described below can be combined with each other as long as they do not conflict with each other.
[0030] See also Figure 1 , the existing terminal 1' passes through the through holes set in the circuit board 2' through multiple pins 12' one by one, and is then soldered on the circuit board 2'. At this time, the creepage path r between adjacent pins 12' is as follows Figure 1 As shown by the dotted line with an arrow, the length of the creepage path r is the creepage distance between adjacent pins 12′, that is, the straight-line distance between two adjacent pins 12′. However, the spacing between adjacent pins 12′ is usually short, so the creepage distance between adjacent pins 12′ cannot meet the insulation requirements of high voltage levels.
[0031] For this reason, please see Figure 2-8 The embodiment of the present application provides a circuit board assembly 1000, including an electronic device 1, a circuit board 2 and an insulating plate 3. The electronic device 1 includes a housing 11 and at least two pins 12 arranged on the housing 11, and the housing 11 is provided with a first isolation protrusion 111 between two adjacent pins 12, and the first isolation protrusion 111 separates the two adjacent pins 12. The circuit board 2 is provided with first through holes 21 corresponding to the pins 12 one by one, and an isolation hole 22 is provided between two adjacent first through holes 21, and the isolation hole 22 passes through the circuit board. The insulating plate 3 is arranged between the housing 11 and the circuit board 2, and the insulating plate 3 is provided with second through holes 31 corresponding to the pins 12 one by one, and a pin 12 is sequentially passed through a first through hole 21 and a second through hole 31. The surface 3a of the insulating plate 3 facing the shell 11 is provided with an isolation groove 32 corresponding to the first isolation protrusion 111, and a first isolation protrusion 111 is arranged in an isolation groove 32. The surface 3b of the insulating plate 3 facing the circuit board 2 is provided with a second isolation protrusion 33 corresponding to the isolation hole 22, and the second isolation protrusion 33 separates two adjacent pins 12. A second isolation protrusion 33 is arranged in an isolation hole 22.
[0032] See also Fig. 9 and Fig.10, wherein, “the first isolation protrusion 111 separates two adjacent pins 12” means that, for two adjacent pins 12, the direction from one pin 12 to the other pin 12 is called direction a, and in direction b perpendicular to direction a, the length dimension L1 of the first isolation protrusion 111 is greater than the length dimension S1 of one pin 12 and the length dimension S2 of the other pin 12, so that along direction a and in the direction opposite to direction a, the creepage path between the two adjacent pins 12 on the surface of the shell 11 needs to cross the first isolation protrusion 111; “the second isolation protrusion 33 separates the two adjacent pins 12” means that, for two adjacent pins 12, in direction b, the length dimension L2 of the second isolation protrusion 33 is greater than the length dimension S1 of one pin 12 and the length dimension S2 of the other pin 12, so that along direction a and in the direction opposite to direction a, the creepage path between the two adjacent pins 12 on the surface 3b of the insulating plate 3 facing the circuit board 2 needs to cross the second isolation protrusion 33.
[0033] See also Figure 8 The first isolation protrusion 111 cooperates with the isolation groove 32 to form a first creepage path r1 between two adjacent pins 12. The first creepage path r1 is the shortest path starting from one end on the surface of one pin 12, passing through the first isolation protrusion 111 along the surface of the shell 11 to reach the surface of the other pin 12; the second isolation protrusion 33 cooperates with the isolation hole 22 to form a second creepage path r2 and a third creepage path r3 between two adjacent pins 12. The second creepage path r2 is the shortest path starting from a point on the surface of one pin 12, passing through the second isolation protrusion 33 along the surface 3b of the insulating plate 3 facing the circuit board to reach the surface of the other pin 12; the third creepage path r3 is the shortest path starting from a point on the surface of one pin 12, passing through the second isolation protrusion 33 along the surface of the circuit board 2 facing away from the shell 11, entering the isolation hole 22 from the inner wall of the isolation hole 22, passing through the second isolation protrusion 33, extending from the other inner wall of the isolation hole 22 to the outside of the isolation hole 22, and finally reaching the surface of the other pin 12 from the surface of the circuit board 2 facing away from the shell 11. The first creepage path r1, the second creepage path r2 and the third creepage path r3 are all greater than the straight-line distance between two adjacent pins 12. That is, compared with the traditional solution of directly inserting the pins 12 into the circuit board 2, the circuit board assembly 1000 provided in the embodiment of the present application can increase the creepage distance between adjacent pins 12 to meet the use requirements of higher voltage levels.
[0034] In some embodiments, along the axial direction of the isolation hole 22, the depth of the isolation hole 22 is H, and the height of the portion of the second isolation protrusion 33 located in the isolation hole 22 is h, where H=2h. When h is larger, the total length of the second creepage path r2 increases accordingly, and the total length of the third creepage path r3 decreases accordingly, and vice versa. Therefore, the depth H of the isolation hole 22 and the height h of the portion of the second isolation protrusion 33 located in the isolation hole 22 are set to satisfy H=2h, so that both the second creepage path r2 and the third creepage path r3 can have a larger length, so that the adjacent pins 12 have a better insulation effect.
[0035] See also Figure 2-8 In some embodiments, the at least two pins 12 are arranged in sequence along the first direction X, and the first isolation protrusion 111 is extended along the second direction Y, wherein the first direction X is perpendicular to the second direction Y.
[0036] In some embodiments, a cross section of the first isolation protrusion 111 is substantially square, wherein the cross section of the first isolation protrusion 111 is a cross section perpendicular to the second direction Y.
[0037] In some embodiments, the isolation groove 32 is a strip-shaped groove whose length direction is parallel to the second direction Y.
[0038] In some embodiments, the cross-section of the isolation trench 32 is substantially square, and the cross-section of the isolation trench 32 is a cross-section perpendicular to the second direction Y.
[0039] In some embodiments, two ends of the isolation groove 32 penetrate the insulation plate 3 along the second direction Y and a direction opposite to the second direction Y, respectively.
[0040] In some embodiments, the at least two pins 12 are sequentially arranged along the first direction X, and the second isolation protrusion 33 is extended along the second direction Y.
[0041] In some embodiments, the portion of the second isolation protrusion 33 protruding from the surface 3 b of the insulating plate 3 facing the circuit board 2 has the same outer surface shape as the rectangular parallelepiped protrusion.
[0042] In some embodiments, the isolation hole 22 is a strip-shaped hole whose length direction is parallel to the second direction Y.
[0043] In some embodiments, the cross section of the isolation hole 22 is square, and the cross section of the isolation hole 22 is a cross section perpendicular to the second direction Y.
[0044] It can be understood that the shapes of the first isolation protrusion 111 , the isolation groove 32 , the second isolation protrusion 33 and the isolation hole 22 can be set to different shapes according to actual conditions.
[0045] In some embodiments, along a direction Z from the surface of the insulating plate 3 facing the housing 11 to the surface of the insulating plate 3 facing the circuit board 2 , the isolation grooves 32 and the second isolation protrusions 33 are aligned one by one.
[0046] Specifically, in some embodiments, the insulating plate 3 is recessed along the direction Z to obtain an isolation groove 32 and a second isolation protrusion 33 on two opposite sides along the direction Z, wherein the direction Z is perpendicular to the first direction X.
[0047] In some embodiments, the method of making the insulating plate 3 concave includes but is not limited to a stamping process.
[0048] In some embodiments, a surface 3 a of the insulating plate 3 facing the housing 11 abuts against a surface of the housing 11 facing the circuit board 2 , and a surface 3 b of the insulating plate 3 facing the circuit board abuts against a surface of the circuit board 2 facing the housing 11 .
[0049] In some embodiments, the insulating plate 3 is made of a flexible material. For example, the insulating plate 3 is made of silicone rubber. Compared with the insulating plate 3 made of a hard material, the insulating plate 3 made of a flexible material can provide a certain buffer between the electronic device 1 and the circuit board 2.
[0050] Based on the same inventive concept, the present application also provides an electronic device, including the circuit board assembly 1000 in any of the above embodiments.
[0051] The above are merely embodiments of the present application and are not intended to limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.
Claims
1. A circuit board assembly, characterized in that: include: An electronic device comprises a housing and at least two pins arranged on the housing, wherein the housing is provided with a first isolation protrusion between two adjacent pins, and the first isolation protrusion separates the two adjacent pins; A circuit board is provided with first through holes corresponding to the pins one by one, and an isolation hole is provided between two adjacent first through holes, and the isolation hole passes through the circuit board; An insulating plate is disposed between the housing and the circuit board, the insulating plate being provided with second through holes corresponding to the pins one by one, and the pins are sequentially passed through the first through hole and the second through hole; The surface of the insulating plate facing the shell is provided with an isolation groove corresponding to the first isolation protrusion one by one, and the first isolation protrusion is arranged in the isolation groove. The surface of the insulating plate facing the circuit board is provided with a second isolation protrusion corresponding to the isolation hole one by one, and the second isolation protrusion separates two adjacent pins, and the second isolation protrusion is arranged in the isolation hole.
2. The circuit board assembly according to claim 1, characterized in that: Along the axial direction of the isolation hole, the depth of the isolation hole is H, the height of the portion of the second isolation protrusion located in the isolation hole is h, and H=2h.
3. The circuit board assembly according to claim 1, characterized in that: The at least two pins are arranged in sequence along a first direction, and the first isolation protrusion is extended along a second direction, wherein the first direction is perpendicular to the second direction.
4. The circuit board assembly according to claim 3, characterized in that: The isolation groove is a strip-shaped groove whose length direction is parallel to the second direction.
5. The circuit board assembly according to claim 1, characterized in that: The at least two pins are arranged in sequence along a first direction, and the second isolation protrusion is extended along a second direction, wherein the first direction is perpendicular to the second direction.
6. The circuit board assembly according to claim 5, characterized in that: The isolation hole is a strip-shaped hole whose length direction is parallel to the second direction.
7. The circuit board assembly according to claim 1, characterized in that: Along the direction from the surface of the insulating plate facing the shell to the surface of the insulating plate facing the circuit board, the isolation grooves and the second isolation protrusions are arranged in alignment one by one.
8. The circuit board assembly according to claim 1, wherein: The surface of the insulating plate facing the housing abuts against the surface of the housing facing the circuit board, and the surface of the insulating plate facing the circuit board abuts against the surface of the circuit board facing the housing.
9. The circuit board assembly according to claim 1, characterized in that: The insulating plate is made of flexible material.
10. An electronic device, characterized in that: Comprising a circuit board assembly as described in any one of claims 1-9.