Display substrate
By using a deformable layer during the production process of the LED display substrate, the problem of poor bonding caused by uneven pressure of the light emitting diode chip is solved, and uniform pressure distribution and bond yield are improved.
Patent Information
- Application Number
- CN202420626615.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-28
- Publication Date
- 2025-05-02
- Estimated Expiration
- 2034-03-28
AI Technical Summary
During the production process of the LED display substrate, the multiple light emitting diode chips have poor bonding with the driving back plate due to uneven pressure on the bearing plate.
A deformable layer is adopted, disposed on the side of the light emitting device away from the driving backplane, and overlaps with the orthoprojection of each light emitting device. The deformable layer material is an elastic material with a thickness of between 2 and 50 μm, which can provide buffering in the bonding process to ensure uniform pressure distribution.
Through the buffering effect of the deformable layer, the bonding yield between the light emitting device and the driving backplate is improved, and the uniformity of the pressure applied to each light emitting device is ensured, thereby improving the overall performance of the display substrate.
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Figure CN222827615U_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to the field of display technology, and in particular to a display substrate. Background Art
[0002] With the development of display technology, LED display substrates have the advantages of pure chromaticity, wide dynamic range, high brightness, high definition, low operating voltage, low power consumption, long life, impact resistance, wide viewing angle, stable and reliable operation, etc. LED display substrates will become the most advantageous new generation display media. Among them, LED display substrates include multiple LED light-emitting chips arranged in an array. The research and development of LED light-emitting chips, especially mini-LED and micro-LED light-emitting chips, has become an important topic in the display field. Utility Model Content
[0003] The present disclosure provides a display substrate, comprising:
[0004] Driver backplane;
[0005] A plurality of light emitting devices are arranged on the driving backplane;
[0006] The deformable layer is arranged on a side of the plurality of light emitting devices away from the driving backplane, and the deformable layer overlaps with an orthographic projection of each of the light emitting devices on the driving backplane.
[0007] In some embodiments, the material of the deformable layer is an elastic material.
[0008] In some embodiments, the material of the deformable layer includes acrylic system resin or silicone system resin.
[0009] In some embodiments, the thickness of the deformable layer is between 2 μm and 50 μm.
[0010] In some embodiments, the orthographic projection of the deformable layer on the driving backplane covers the orthographic projection of the light-emitting device on the driving backplane.
[0011] In some embodiments, the deformable layer includes a plurality of elastic portions that are spaced apart from each other, and the elastic portions correspond to the light emitting devices one by one.
[0012] In some embodiments, an orthographic projection of the deformable layer on the driving backplane and an orthographic projection of the light-emitting device on the driving backplane have a first overlapping region, and the first overlapping region is only located at an edge of the light-emitting device.
[0013] In some embodiments, the first overlapping region is annular in shape;
[0014] The first overlapping region extends along an edge of the light emitting device.
[0015] In some embodiments, the minimum width of the ring is greater than or equal to 3 μm.
[0016] In some embodiments, the deformable layer is a first dark film layer, and the first dark film layer is configured to transmit a portion of the light emitted by the light-emitting device and absorb a portion of the light emitted by the light-emitting device; the color of the light transmitted through the light-emitting device is the same as the color of the light emitted by the light-emitting device;
[0017] Wherein, the transmittance of the first dark film layer to the light emitted by the light-emitting device is between 20% and 75%.
[0018] In some embodiments, the display substrate further comprises a second dark film layer, the second dark film layer being located on a side of the deformable layer away from the plurality of light emitting devices; the second dark film layer being configured to transmit a portion of the light emitted by the light emitting devices and absorb a portion of the light emitted by the light emitting devices; the color of the light transmitted through the light emitting devices is the same as the color of the light emitted by the light emitting devices;
[0019] Wherein, the transmittance of the second dark film layer to the light emitted by the light emitting device is between 20% and 75%.
[0020] In some embodiments, the second dark film layer is a continuously distributed film layer;
[0021] At least part of the orthographic projection of the light-emitting device on the driving backplane is located inside the orthographic projection of the second dark film layer on the driving backplane.
[0022] In some embodiments, there is a second overlapping area between the orthographic projection of the second dark film layer on the driving backplane and the orthographic projection of the light-emitting device on the driving backplane, and the second overlapping area is only located at the edge of the light-emitting device.
[0023] In some embodiments, the orthographic projection of the deformable layer on the driving backplane is located inside the orthographic projection of the second dark film layer on the driving backplane.
[0024] In some embodiments, the display substrate further comprises a third dark film layer located on a side of the light emitting device away from the driving backplane, the third dark film layer being configured to transmit a portion of the light emitted by the light emitting device and absorb a portion of the light emitted by the light emitting device, and the color of the light transmitted through the light emitting device is the same as the color of the light emitted by the light emitting device;
[0025] The transmittance of the third dark film layer to the light emitted by the light emitting device is between 20% and 75%; the third dark film layer has openings corresponding to the light emitting devices one by one, and the orthographic projection of the openings on the driving backplane overlaps with the orthographic projection of the light emitting device on the driving backplane;
[0026] At least a portion of the deformable layer is located inside the opening.
[0027] In some embodiments, the deformable layer includes a plurality of elastic portions that are spaced apart from each other, and the elastic portions are located in the opening portions.
[0028] In some embodiments, the display substrate further includes an adhesive layer located between the deformable layer and the light-emitting device, and the adhesive layer is fixedly connected to the deformable layer and the light-emitting device respectively.
[0029] In some embodiments, the adhesive layer is a flexible adhesive layer.
[0030] In some embodiments, the material of the deformable layer is a viscous material.
[0031] In some embodiments, the deformable layer is a fourth dark film layer, and the fourth dark film layer is configured to transmit a portion of the light emitted by the light-emitting device and absorb a portion of the light emitted by the light-emitting device; the color of the light transmitted through the light-emitting device is the same as the color of the light emitted by the light-emitting device;
[0032] Wherein, the transmittance of the fourth dark film layer to the light emitted by the light-emitting device is between 20% and 75%.
[0033] In some embodiments, the display substrate further includes a cover plate located on a side of the deformable layer away from the light emitting device.
[0034] In some embodiments, the display substrate further comprises a cover plate located on a side of the deformable layer away from the light emitting device, the cover plate being a dark cover plate, and the dark cover plate being configured to transmit a portion of the light emitted by the light emitting device and absorb a portion of the light emitted by the light emitting device; the color of the light transmitted through the dark cover plate is the same as the color of the light emitted by the light emitting device;
[0035] The transmittance of the dark cover plate to the light emitted by the light emitting device is between 20% and 75%.
[0036] In some embodiments, the display substrate further includes: a cover plate located on a side of the deformable layer away from the light-emitting device; a fifth dark film layer located on a side of the cover plate away from the light-emitting device, the fifth dark film layer being configured to transmit a portion of the light emitted by the light-emitting device and absorb a portion of the light emitted by the light-emitting device; the color of the light transmitted through the light-emitting device is the same as the color of the light emitted by the light-emitting device; wherein the transmittance of the fifth dark film layer to the light emitted by the light-emitting device is between 20% and 75%. BRIEF DESCRIPTION OF THE DRAWINGS
[0037] The accompanying drawings are used to provide a further understanding of the present disclosure and constitute a part of the specification. Together with the following specific embodiments, they are used to explain the present disclosure but do not constitute a limitation of the present disclosure. In the accompanying drawings:
[0038] Figure 1 This is a schematic diagram of the first structure of a display substrate provided in some embodiments of the present disclosure.
[0039] Figure 2 A second structural schematic diagram of a display substrate provided in some embodiments of the present disclosure.
[0040] Figure 3 This is a third structural schematic diagram of a display substrate provided in some embodiments of the present disclosure.
[0041] Figure 4 This is a fourth structural schematic diagram of a display substrate provided in some embodiments of the present disclosure.
[0042] Figure 5 This is a fifth structural schematic diagram of a display substrate provided in some embodiments of the present disclosure.
[0043] Figure 6 This is a sixth structural schematic diagram of a display substrate provided in some embodiments of the present disclosure.
[0044] Figure 7 This is a seventh structural schematic diagram of a display substrate provided in some embodiments of the present disclosure.
[0045] Figure 8 It is a schematic top view of a deformable layer and a plurality of light-emitting devices provided in some embodiments of the present disclosure.
[0046] Fig. 9 This is an eighth structural schematic diagram of a display substrate provided in some embodiments of the present disclosure.
[0047] Fig. 10A This is a ninth structural schematic diagram of a display substrate provided in some embodiments of the present disclosure.
[0048] Fig. 10BThis is a tenth structural schematic diagram of a display substrate provided in some embodiments of the present disclosure.
[0049] Fig.11A This is an eleventh structural schematic diagram of a display substrate provided in some embodiments of the present disclosure.
[0050] Fig. 11B This is a twelfth structural schematic diagram of a display substrate provided in some embodiments of the present disclosure.
[0051] Fig.12 This is a thirteenth structural schematic diagram of a display substrate provided in some embodiments of the present disclosure.
[0052] Fig.13 This is the fourteenth structural schematic diagram of the display substrate provided in some embodiments of the present disclosure.
[0053] Fig.14 This is a fifteenth structural schematic diagram of a display substrate provided in some embodiments of the present disclosure.
[0054] Fig.15 This is a sixteenth structural schematic diagram of a display substrate provided in some embodiments of the present disclosure.
[0055] Fig.16 This is a seventeenth structural schematic diagram of a display substrate provided in some embodiments of the present disclosure.
[0056] Fig.17 This is a schematic diagram of the eighteenth structure of the display substrate provided in some embodiments of the present disclosure.
[0057] Fig.18 This is a nineteenth structural schematic diagram of a display substrate provided in some embodiments of the present disclosure.
[0058] Fig.19 This is a twentieth structural schematic diagram of a display substrate provided in some embodiments of the present disclosure.
[0059] Fig. 20 This is a twenty-first structural schematic diagram of a display substrate provided in some embodiments of the present disclosure.
[0060] Fig.21 This is a twenty-second structural schematic diagram of a display substrate provided in some embodiments of the present disclosure.
[0061] Fig. 22 A schematic diagram of a method for manufacturing a display substrate provided in some embodiments of the present disclosure.
[0062] Fig.23 Schematic diagram of a method for manufacturing a display substrate provided in some other embodiments of the present disclosure. DETAILED DESCRIPTION
[0063] The specific implementation of the present disclosure is described in detail below in conjunction with the accompanying drawings. It should be understood that the specific implementation described herein is only used to illustrate and explain the present disclosure, and is not used to limit the present disclosure.
[0064] In order to make the purpose, technical solution and advantages of the embodiments of the present disclosure clearer, the technical solution of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings of the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, not all of the embodiments. Based on the described embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.
[0065] Unless otherwise defined, the technical terms or scientific terms used in the embodiments of the present disclosure should be understood by people with ordinary skills in the field to which the present disclosure belongs. The "first", "second" and similar words used in the present disclosure do not represent any order, quantity or importance, but are only used to distinguish different components. Similarly, "including" or "comprising" and similar words mean that the elements or objects appearing in front of the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connect" or "connected" and similar words are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.
[0066] As used herein, "parallel" and "perpendicular" include the described situation and the situation similar to the described situation, and the range of the similar situation is within the acceptable deviation range, wherein the acceptable deviation range is determined by a person of ordinary skill in the art taking into account the measurement in question and the error associated with the measurement of a specific quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, wherein the acceptable deviation range of approximate parallelism can be, for example, a deviation within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, wherein the acceptable deviation range of approximate perpendicularity can also be, for example, a deviation within 5°.
[0067] It will be understood that when a layer or an element is referred to as being on another layer or substrate, it can be directly on the other layer or substrate, or intervening layers may be present between the layer or element and the other layer or substrate.
[0068] Exemplary embodiments are described herein with reference to cross-sectional views and / or plan views that are idealized exemplary drawings. In the drawings, the thickness of layers and regions are exaggerated for clarity. Therefore, variations in shape relative to the drawings due to, for example, manufacturing techniques and / or tolerances are conceivable. Therefore, the exemplary embodiments should not be interpreted as being limited to the shapes of the regions shown herein, but include deviations in shape due to, for example, manufacturing. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to illustrate the actual shapes of regions of the device, and are not intended to limit the scope of the exemplary embodiments.
[0069] The conventional method for manufacturing a light emitting diode (LED) display substrate includes: first forming a light emitting diode chip on a carrier board, then transferring a plurality of light emitting diode chips on the carrier board to a driving backplane by mass transfer technology, and bonding the plurality of light emitting diode chips to the driving substrate. In the bonding process, a high voltage needs to be applied to the carrier board. However, when there are a large number of light emitting diode chips on the carrier board, it is easy to cause different pressures on light emitting diode chips at different positions, resulting in poor bonding between some light emitting diode chips and the driving backplane.
[0070] Figures 1 to 13 Schematic diagrams of various structures of display substrates provided in some embodiments of the present disclosure are shown, such as Figures 1 to 13 As shown, the display substrate includes: a driving backplane 10 , a plurality of light emitting devices 20 and a deformable layer 30 .
[0071] In some examples, the light emitting device 20 may be a light emitting diode chip. The light emitting device 20 includes a light emitting body 23 and an electrode structure electrically connected to the light emitting body 23, the electrode structure includes a first electrode 21 and a second electrode 22, and the light emitting body 23 may include a first semiconductor layer, a second semiconductor layer and a light emitting layer located therebetween. A plurality of light emitting devices 20 are arranged on the driving backplane 10, and are used to emit light under the driving action of the driving backplane 10. For example, the driving backplane 10 includes a base substrate 11 and a plurality of driving circuits 12 located on the base substrate 11, and each driving circuit 12 is electrically connected to the light emitting device 20 through a gasket, so as to drive the light emitting device 20 to emit light. For example, a flat layer is arranged on the side of the driving circuit 12 away from the base substrate 11, the first electrode 21 is bonded to the first gasket 15, and the first gasket 15 is electrically connected to the driving circuit 12 through a via hole on the flattening layer 13; the second electrode 22 is bonded to the second gasket 14, and the second gasket 14 is electrically connected to the driving circuit 12 through a via hole on the flattening layer 13.
[0072] The deformable layer 30 is disposed on a side of the plurality of light emitting devices 20 away from the driving backplane 10, and the deformable layer 30 overlaps with the orthographic projection of each light emitting device 20 on the driving backplane 10. The deformable layer 30 refers to a film layer that can be deformed when subjected to pressure.
[0073] In the embodiment of the present disclosure, since a deformable layer 30 is provided on the side of the plurality of light-emitting devices 20 away from the driving backplane 10, and the deformable layer 30 overlaps with the orthographic projection of the light-emitting device 20, the deformable layer 30 can provide a certain buffering effect in the bonding process between the light-emitting device 20 and the driving backplane 10, so that the pressure received by the light-emitting devices 20 at different positions is more uniform, thereby improving the bonding yield of each light-emitting device 20 and the driving backplane 10.
[0074] In some embodiments, the material of the deformable layer 30 is an elastic material, wherein the elastic material refers to a material that can generate elastic restoring force when subjected to stress, that is, the deformation of the deformable layer 30 is reversible.
[0075] In some embodiments, the elastic recovery rate of the elastic material is above 85%, so that the deformable layer 30 has a higher deformation recovery ability, thereby improving the pressure buffering effect of the deformable layer 30. For example, the elastic recovery rate of the elastic material is above 90%, or above 95%.
[0076] For example, the material of the deformable layer 30 includes acrylic system resin or silicone system resin.
[0077] In some embodiments, the thickness of the deformable layer 30 is between 2 and 50 μm. The greater the thickness of the deformable layer 30, the better the buffering effect of the pressure during bonding, so that the bonding yield of the light-emitting device 20 and the driving backplane 10 at each position is higher; the smaller the thickness of the deformable layer 30, the smaller the overall thickness of the display substrate, which is more conducive to the thinning of the display product. In the embodiment of the present disclosure, the thickness of the deformable layer 30 is set between 2 and 50 μm, which can ensure that the deformable layer 30 has a good buffering effect, while making the display substrate as a whole reach a smaller thickness. Further, the thickness of the deformable layer 30 is between 5 and 30 μm, so that while ensuring the bonding yield of the light-emitting device 20 and the driving backplane 10, the display substrate is further thinned. Further, the thickness of the deformable layer 30 is between 10 and 20 μm, so that while ensuring the bonding yield of the light-emitting device 20 and the driving backplane 10, the display substrate reaches the minimum thickness. For example, the thickness of the deformable layer 30 is between 10 and 12 μm, or between 12 and 15 μm, or between 15 and 20 μm.
[0078] In some embodiments, the orthographic projection of the deformable layer 30 on the driving backplane 10 covers the orthographic projection of the light emitting device 20 on the driving backplane 10 , so that the pressure at each position of the single light emitting device 20 is evenly distributed.
[0079] For example, Figure 1 and Figure 2 As shown, the deformable layer 30 may be a continuous whole film layer, that is, there are no openings or gaps on the deformable layer 30 .
[0080] For example, Figures 3 to 5 As shown, the deformable layer 30 includes a plurality of elastic parts arranged at intervals, the elastic parts correspond to the light emitting devices 20 one by one, and the orthographic projection of each elastic part on the driving backplane 10 covers the orthographic projection of the corresponding light emitting device 20 on the driving backplane 10 .
[0081] In other embodiments, Figure 6 , Figure 7 and Fig. 9 As shown, the orthographic projection of the deformable layer 30 on the driving backplane 10 only covers a portion of the orthographic projection of the light emitting device 20 on the driving backplane 10. Specifically, Figure 8 FIG. 1 is a top view schematic diagram of a deformable layer 30 and a plurality of light emitting devices 20 provided in some embodiments of the present disclosure, such as Figure 8 As shown, the orthographic projection of the deformable layer 30 on the driving backplane 10 and the orthographic projection of the light emitting device 20 on the driving backplane 10 have a first overlapping area, and the first overlapping area is only located at the edge of the light emitting device 20. In other words, the deformable layer 30 is provided with a plurality of holes, and the orthographic projection of each hole on the driving backplane 10 is located within the orthographic projection range of a light emitting device 20 on the driving backplane 10, and there is a gap with the edge of the orthographic projection of the light emitting device 20. In this case, the deformable layer 30 can also make each light emitting device 20 subject to a uniformly distributed pressure, and because the orthographic projection of the deformable layer 30 only covers the edge portion of the orthographic projection of the light emitting device 20, the shielding of the light emitting device 20 by the deformable layer 30 can be reduced, thereby improving the light extraction efficiency of the light emitting device 20.
[0082] In some embodiments, the first overlapping region is annular. The first overlapping region extends along the edge of the light emitting device 20. The annular shape here depends on the shape of the surface of the light emitting device 20 away from the driving back plate 10. For example, if the surface of the light emitting device 20 away from the driving back plate 10 is circular, the first overlapping region may be annular; for another example, if the surface of the light emitting device 20 away from the driving back plate 10 is rectangular, the first overlapping region may be a rectangular ring (i.e., a U-shaped).
[0083] In one example, the minimum width of different positions in the ring is greater than or equal to 3 μm, so as to ensure that the deformable layer 30 can cover the edge of the light-emitting device 20 even if there is a process error. When the ring is a rectangular ring, that is, the distance between the straight edge of the outer edge of the ring and the straight edge of the inner edge is greater than or equal to 3 μm. The upper limit of the minimum width can be set according to actual needs, but it should be ensured that the deformable layer 30 does not completely cover the light-emitting device 20. For example, the minimum width of different positions in the ring is 3 μm, or 4 μm, or 5 μm.
[0084] In some embodiments, Figures 2 to 10B As shown, the deformable layer 30 is a film layer with a high visible light transmittance (for example, more than 90%) and is visually transparent. In this case, the display substrate may further include a second dark film layer 50, for example, Figures 2 to 9 As shown, the second dark film layer 50 is located on the side of the deformable layer 30 away from the plurality of light emitting devices 20, or, as shown in FIG. Fig. 10A and Fig. 10B As shown, the second dark film layer 50 is located on one side of the deformable layer 30 close to the plurality of light emitting devices 20. The second dark film layer 50 is configured to transmit a portion of the light emitted by the light emitting device 20 and absorb a portion of the light emitted by the light emitting device 20; the color of the light transmitted through the light emitting device 20 is the same as the color of the light emitted by the light emitting device 20. By setting the second dark film layer 50, the surface of the display substrate can be dark when not displaying.
[0085] Specifically, the second dark film layer 50 may be a film having a low transmittance (for example, a transmittance between 20% and 75%) to the light emitted by the light emitting device 20 and visually presenting a dark color such as black or dark gray.
[0086] In one example, if Figures 2 to 7 , Fig. 10A and Fig. 10B As shown, the second dark film layer 50 may be a continuously distributed film layer, and at least part of the orthographic projection of the light-emitting device 20 on the driving backplane 10 is located inside the orthographic projection of the second dark film layer 50 on the driving backplane 10. The "continuously distributed film layer" here means that there are no openings or gaps on the film layer.
[0087] In another example, Fig. 9 As shown, the second dark film layer 50 is a discontinuously distributed film layer. Specifically, there is a second overlapping area between the orthographic projection of the second dark film layer 50 on the driving backplane 10 and the orthographic projection of the light-emitting device 20 on the driving backplane 10, and the second overlapping area is only located at the edge of the light-emitting device 20, thereby reducing the shielding of the second dark film layer 50 on the light emitted by the light-emitting device 20 and improving the light extraction efficiency of the light-emitting device 20.
[0088] For example, the second overlapping area is annular. The second overlapping area extends along the edge of the light emitting device 20. The annular shape here depends on the shape of the surface of the light emitting device 20 away from the driving backplane 10. For example, if the surface of the light emitting device 20 away from the driving backplane 10 is circular, the second overlapping area can be annular; for another example, if the surface of the light emitting device 20 away from the driving backplane 10 is rectangular, the second overlapping area can be a rectangular ring (i.e., a U-shaped). The minimum width of the annular second overlapping area can be greater than or equal to 3μm.
[0089] For example, Fig. 9 As shown, when the second dark film layer 50 is a discontinuously distributed film layer, the orthographic projection of the second dark film layer 50 on the driving backplane 10 can overlap with the orthographic projection of the spacing area between adjacent light-emitting devices 20 on the driving backplane 10, thereby reducing light crosstalk between adjacent light-emitting devices 20.
[0090] For example, when the second dark film layer 50 is a continuously distributed film layer or a discontinuously distributed film layer, the orthographic projection of the deformable layer 30 on the driving backplane 10 is located inside the orthographic projection of the second dark film layer 50 on the driving backplane 10. Of course, when the second dark film layer 50 is a discontinuously distributed film layer, the orthographic projection of the deformable layer 30 on the driving backplane 10 may also exceed the orthographic projection of the second dark film layer 50 on the driving backplane 10. For example, Fig. 9 As shown, the orthographic projections of the deformable layer 30 and the second dark film layer 50 on the driving backplane 10 overlap, so that the deformable layer 30 and the second dark film layer 50 can be patterned using the same patterning process during the manufacturing process, thereby simplifying the process.
[0091] Figures 1 to 10B The embodiment shown in the figure shows that the deformable layer 30 is a transparent film layer, while in other embodiments, such as Fig.11A and Fig. 11B As shown, the deformable layer 30 is a first dark film layer 301, which is configured to transmit a portion of the light emitted by the light-emitting device 20 and absorb a portion of the light emitted by the light-emitting device 20; the color of the light transmitted through the light-emitting device 20 is the same as the color of the light emitted by the light-emitting device 20, that is, the deformable layer 30 does not change the color of the light when transmitting a portion of the light from the light-emitting device 20. In this case, the second dark film layer 50 is not required.
[0092] Specifically, the first dark film layer 301 may be a film with low visible light transmittance (eg, less than 75%) and visually presents a dark color such as black or dark gray. The first dark film layer 301 may include a matrix of elastic material and black pigment doped in the matrix.
[0093] For example, Fig.11AAs shown, the first dark film layer 301 may be a continuously distributed film layer, so that the surface of the display substrate is dark when not displaying. Fig. 11B As shown, the first dark film layer 301 is a discontinuously distributed film layer, and the orthographic projection of the first dark film layer 301 on the driving backplane 10 can overlap with the orthographic projection of the interval area between adjacent light-emitting devices 20 on the driving backplane 10 to reduce the crosstalk of the light emitted by adjacent light-emitting devices 20. In addition, Fig. 11B The orthographic projection of the first dark film layer 301 on the driving backplane 10 may have a first overlapping area with the orthographic projection of the light emitting device 20 on the driving backplane 10. For details, please refer to the above description of Figure 7 Description.
[0094] In some further embodiments, Fig.12 As shown, the display substrate may include a third dark film layer 51 in addition to a plurality of light-emitting devices 20 and a deformable layer 30. The third dark film layer 51 is located on a side of the plurality of light-emitting devices 20 away from the driving backplane 10. The third dark film layer 51 is configured to transmit a portion of the light emitted by the light-emitting device 20 and absorb a portion of the light emitted by the light-emitting device 20. The color of the light transmitted through the light-emitting device 20 is the same as the color of the light emitted by the light-emitting device 20, that is, the third dark film layer 51 does not change the color of the light when transmitting part of the light from the light-emitting device 20.
[0095] exist Fig.12 In the embodiment, the third dark film layer 51 has openings corresponding to the light emitting devices 20, and the orthographic projection of the openings on the driving backplane 10 overlaps with the orthographic projection of the light emitting devices 20 on the driving backplane 10. At least part of the deformable layer 30 is located inside the openings.
[0096] For example, a portion of the deformable portion is located inside the opening, and another portion is located on a side of the third dark film layer 51 facing the driving backplane 10 .
[0097] For example, Fig.12 As shown, the deformable layer 30 includes a plurality of elastic portions 31 arranged at intervals, and the elastic portions 31 are located in the opening. Fig.12 In the example, the thickness of the deformable layer 30 is equal to the thickness of the third dark film layer 51 . Of course, in other examples, the thickness of the elastic portion 31 may also be less than or greater than the thickness of the third dark film layer 51 .
[0098] Optionally, in the above embodiments, Figures 1 to 7 , Figures 8 to 12As shown, the display substrate may further include an adhesive layer 40 located between the deformable layer 30 and the light-emitting device 20. The adhesive layer 40 is fixedly connected to the deformable layer 30 and the light-emitting device 20, respectively, to ensure the connection stability between the light-emitting device 20 and the deformable layer 30, so that when the deformable layer 30 is subjected to pressure, the pressure can be evenly dispersed.
[0099] It should be noted that the "fixed connection" here can be a direct fixed connection or an indirect fixed connection. Figures 1 to 7 , Fig. 9 As shown, the adhesive layer 40 can be fixedly connected to the deformable layer 30 and the light emitting device 20 respectively. Fig. 10A and Fig. 10B As shown, the second dark film layer 50 is located on one side of the deformable layer 50 close to the plurality of light emitting devices 20, and the adhesive layer 40 is directly connected to the light emitting devices 20 and the second dark film layer 50, respectively, thereby being indirectly connected to the deformable layer 30. In one example, as Figure 1 , Figure 2 As shown, the deformable layer 30 is a continuously distributed film layer. In this case, the adhesive layer 40 can be a continuously distributed film layer to facilitate the formation of the adhesive layer 40 .
[0100] In another example, in Figures 4 to 5 In the embodiment, the deformable layer 30 includes a plurality of elastic portions 31 arranged at intervals, and the adhesive layer 40 may be a continuously distributed film layer to facilitate the formation of the adhesive layer 40; for example, Figure 4 As shown, a portion of the adhesive layer 40 is located on the surface of the elastic portion 31 facing the driving back plate 10, and another portion is located in the interval area between adjacent elastic portions 31, and the surface of the adhesive layer 40 facing the driving back plate 10 forms a flat surface. Figure 5 As shown, the thickness of the bonding layer is relatively thin, so that the first portion of the bonding layer 40 is located on the surface of the elastic portion 31 facing the drive back plate 10, the second portion is located in the spacing area between adjacent elastic portions 31, and the second portion is a curved structure that bends away from the drive back plate 10.
[0101] In another example, Figure 3 and Fig.13 As shown, the deformable layer 30 includes a plurality of elastic parts 31 arranged at intervals, the adhesive layer 40 includes adhesive parts 41 corresponding to the elastic parts 31 one by one, and the orthographic projection of the adhesive part 41 on the driving backplane 10 is located within the orthographic projection range of the elastic part 31 on the driving backplane 10, so as to reduce the blocking of the light output of the light-emitting device 20 by the adhesive layer 40, and ensure the light output efficiency of the light-emitting device 20. For example, the orthographic projections of the adhesive part 41 and the corresponding elastic part 31 on the driving backplane 10 coincide or substantially coincide, thereby ensuring the connection stability between the elastic part 31 and the light-emitting device 20, and reducing the influence of the adhesive layer 40 on the light output of the light-emitting device 20.
[0102] In another example, Figure 6 As shown, there is a first overlapping area between the orthographic projection of the deformable layer 30 on the driving backplane 10 and the orthographic projection of the light-emitting device 20 on the driving backplane 10, and the first overlapping area is only located at the edge of the light-emitting device 20. At this time, the orthographic projection of the adhesive layer 40 on the driving backplane 10 can be located within the range of the orthographic projection of the deformable layer 30 on the driving backplane 10. For example, the orthographic projections of the adhesive layer 40 and the deformable layer 30 on the driving backplane 10 coincide or substantially coincide.
[0103] Optionally, the thickness of the adhesive layer 40 located on the side of the forming layer 30 facing the light emitting device 20 is between 0.5 and 20 microns, thereby ensuring the bonding effect while reducing the influence of the adhesive layer 40 on the light emitted by the light emitting device 20. Further, the thickness of the adhesive layer 40 located on the side of the forming layer 30 facing the light emitting device 20 is between 2 and 5 microns, thereby ensuring the bonding effect while further reducing the influence of the adhesive layer 40 on the light emitted by the light emitting device 20.
[0104] Specifically, the adhesive layer 40 may be at least one of a flexible material, a deformable material that does not rebound, and a material with an elastic recovery rate less than 85%.
[0105] Fig.14 Shown with Figures 1 to 13 In different situations, specifically, in Fig.14 In the display substrate shown, the deformable layer 30 is made of a viscous material. The composition and thickness of the viscous material can be set so that the viscous material can be deformed under pressure. In this case, the above-mentioned adhesive layer 40 is not required.
[0106] In one example, when the deformable layer 30 is made of a viscous material, it also has a certain elasticity. For example, the elastic recovery rate of the deformable layer 30 is above 85%.
[0107] In one example, if Fig.14 and Fig.15 As shown, when the deformable layer 30 is made of a viscous material, the deformable layer 30 may be a continuously distributed film layer; or Fig.16 As shown, the deformable layer 30 may include a plurality of adhesive portions 32 corresponding to the plurality of light emitting devices 20, and the orthographic projection of each adhesive portion 32 on the driving backplane 10 covers the orthographic projection of the corresponding light emitting device 20 on the driving backplane 10; or, as shown in FIG. Fig.17 As shown, there is a third overlapping area between the orthographic projection of the deformable layer 30 on the driving backplane 10 and the orthographic projection of the light-emitting device 20 on the driving backplane 10 , and the third overlapping area is only located at the edge of the light-emitting device 20 , for example, the third overlapping area extends along the edge of the light-emitting device 20 .
[0108] For example, the third overlapping area is annular, and the minimum width of different positions in the annular is greater than or equal to 3μm, so as to ensure that even if there is a process error, the deformable layer 30 can cover the edge of the light-emitting device 20. When the annular is a rectangular ring, that is, the distance between the straight edge of the outer edge of the annular ring and the straight edge of the inner edge is greater than or equal to 3μm. The upper limit of the minimum width can be set according to actual needs, but it should be ensured that the deformable layer 30 does not completely cover the light-emitting device 20. For example, the minimum width of different positions in the annular is 3μm, or 4μm, or 5μm.
[0109] In one example, when the deformable layer 30 is made of a viscous material, such as Fig.14 As shown, the viscous material can be a dark viscous material, in which case the deformable layer 30 is a fourth dark film layer 304, which is configured to transmit a portion of the light emitted by the light-emitting device 20 and absorb a portion of the light emitted by the light-emitting device 20; the color of the light transmitted through the light-emitting device 20 is the same as the color of the light emitted by the light-emitting device 20. For example, the transmittance of the fourth dark film layer 304 to the light emitted by the light-emitting device 20 is between 20% and 75%.
[0110] Of course, the deformable layer 30 may also be made of a transparent viscous material. In this case, the display substrate may further include the second dark film layer 50, which is located on a side of the deformable layer 30 away from the plurality of light emitting devices 20. The second dark film layer 50 is configured to transmit a portion of the light emitted by the light emitting device 20 and absorb a portion of the light emitted by the light emitting device 20. The color of the light of the light emitting device 20 transmitted by the second dark film layer 50 is the same as the color of the light emitted by the light emitting device 20. For example, the transmittance of the second dark film layer 50 to the light emitted by the light emitting device 20 is between 20% and 75%.
[0111] The second dark film layer 50 may be a continuously distributed film layer or may not be a continuously distributed film layer, please refer to the above description for details.
[0112] In addition, when the deformable layer 30 is made of a transparent viscous material, the display substrate may further include the third dark film layer 51, which is configured to transmit a portion of the light emitted by the light emitting device 20 and absorb a portion of the light emitted by the light emitting device 20, and the color of the light transmitted through the light emitting device 20 is the same as the color of the light emitted by the light emitting device 20. The transmittance of the third dark film layer 51 to the light emitted by the light emitting device 20 is between 20% and 75%; the third dark film layer 51 has an opening portion corresponding to the light emitting device 20 one by one, and the orthographic projection of the opening portion on the driving backplane 10 overlaps with the orthographic projection of the light emitting device 20 on the driving backplane 10; at least a portion of the deformable layer 30 is located inside the opening portion.
[0113] For example, the deformable layer 30 includes a plurality of adhesive portions 32 disposed at intervals, and the plurality of adhesive portions 32 are located in the opening.
[0114] Figures 19 to 21 1 shows various structures of display panels provided in some embodiments of the present disclosure, such as Fig.19 and Fig.21 As shown, the display substrate further includes a cover plate 60 , which is located on a side of the deformable layer 30 away from the plurality of light emitting devices 20 .
[0115] The cover plate 60 may be a transparent cover plate 60, so as to transmit the light emitted by the light emitting device 20. For example, the material of the cover plate 60 is glass.
[0116] It should be noted that in Fig.19 and Fig. 20 In the display substrate shown in FIG. 1 , the deformable layer 30 is a continuously distributed film layer. Of course, the deformable layer 30 may also be in other distribution forms. Figures 1 to 18 In each embodiment of the present invention, a cover plate 60 may be provided. When the display substrate includes, for example, a second dark film layer 50 or a third dark film layer 51, the dark film layer may be located on a side of the cover plate 60 facing the light emitting device 20 (eg, Fig.19 shown).
[0117] like Fig. 20 As shown, when the display substrate includes a cover plate 60, and the cover plate 60 is a transparent cover plate 60, the side of the cover plate 60 facing the driving back plate 10 is not provided with a dark film layer, but a fifth dark film layer 65 is provided on the side of the cover plate 60 away from the driving back plate 10, and the fifth dark film layer 65 is configured to transmit a part of the light emitted by the light-emitting device 20 and absorb a part of the light emitted by the light-emitting device 20; the color of the light transmitted through the light-emitting device 20 is the same as the color of the light emitted by the light-emitting device 20. For example, the transmittance of the fifth dark film layer 65 to the light emitted by the light-emitting device 20 is between 20% and 75%.
[0118] like Fig.21 As shown, the display substrate also includes a cover plate 60, Fig.19 The difference is that in Fig.21 In the embodiment, the cover plate 60 may be a dark cover plate, which is configured to transmit a portion of the light emitted by the light emitting device 20 and absorb a portion of the light emitted by the light emitting device 20; the color of the light transmitted through the dark cover plate 60 is the same as the color of the light emitted by the light emitting device 20. For example, the transmittance of the light emitted by the light emitting device 20 by the dark cover plate is between 20% and 75%, so that the surface of the display substrate is dark when not displaying.
[0119] In this case, the cover plate 60 and the plurality of light emitting devices 20 may no longer be provided with a dark film layer, that is, the deformable layer 30 may be a transparent film layer, and the second dark film layer 50 and the third dark film layer 51 are no longer provided between the deformable layer 30 and the cover plate 60. When an adhesive layer 40 is provided between the deformable layer 30 and the plurality of light emitting devices 20, the adhesive layer 40 is a transparent film layer, wherein the deformable layer 30 may be Figure 1 , Figure 2 The continuous distribution film layer shown may also include Figures 3 to 5 The multiple elastic parts 31 shown in FIG. 3 may also be as follows Figure 6 and Figure 7 As shown in FIG. 1 , the orthographic projection of the deformable layer 30 on the driving backplane 10 and the orthographic projection of the light emitting device 20 on the driving backplane 10 have a first overlapping area. The adhesive layer 40 may be Figure 1 and Figure 2 , Figures 4 to 6 The continuous distribution film layer shown may also include Figure 3 The multiple bonding portions 41 shown may also be Figure 7 As shown, the orthographic projection of the adhesive layer 40 on the driving backplane 10 and the orthographic projection of the light emitting device 20 on the driving backplane 10 have an overlapping area, and the overlapping area is only located at the edge of the light emitting device 20. When the cover plate 60 adopts a dark cover plate, the deformable layer 30 can also adopt a transparent adhesive material, so as to play a role of buffering and bonding at the same time. In this case, the deformable layer 30 can also be Fig.15 The continuous distribution film layer shown may also include Fig.16 The multiple bonding parts 41 shown in FIG. 4 may also be as follows Fig.17 As shown in , there is a third overlapping area between the orthographic projection of the deformable layer 30 on the driving backplane 10 and the orthographic projection of the light emitting device 20 on the driving backplane 10 .
[0120] Fig. 22 Schematic diagram of a method for manufacturing a display substrate provided in some embodiments of the present disclosure. The present disclosure also provides a method for manufacturing a display substrate, such as Fig. 22 As shown, including:
[0121] S1 . Forming a deformable layer 30 on a carrying plate 70 .
[0122] S2. Form a plurality of light emitting devices 20 on a side of the deformable layer 30 away from the carrier board 70 .
[0123] S3 . Arrange the carrier plate 70 and the driving back plate 10 opposite to each other, and apply pressure to the carrier plate 70 to bond the plurality of light emitting devices 20 to the driving back plate 10 .
[0124] Since a deformable layer 30 is arranged between the carrier plate 70 and the multiple light-emitting chips, when pressure is applied to the carrier plate 70, the deformable layer 30 buffers the pressure, so that the pressure exerted on the light-emitting devices 20 at different positions is more uniform, thereby improving the bonding yield between the light-emitting devices 20 and the driving backplane 10.
[0125] In some embodiments, the carrier plate 70 is a middle carrier substrate, and step S2 specifically includes the following steps S21 and S22:
[0126] S21 . Form a plurality of light emitting devices 20 on each of a plurality of substrates.
[0127] For example, step S21 may specifically include: forming an epitaxial layer group of a plurality of light-emitting devices 20 on each of a plurality of substrates; then, forming an electrode structure corresponding to the light-emitting devices 20 on a side of the epitaxial layer group away from the substrate; and then dividing the epitaxial layer group and the plurality of electrode structures to form a plurality of light-emitting devices 20. When dividing, the epitaxial layer group and the plurality of electrode structures may be divided by an etching process.
[0128] For example, the substrate may be a sapphire substrate. Of course, the embodiments of the present disclosure include but are not limited to this, and the substrate may also be other suitable substrates such as a silicon carbide substrate.
[0129] S22 , transferring the plurality of light-emitting devices 20 on the plurality of substrates to the carrier plate 70 .
[0130] For example, step S22 may include: transferring the substrate formed with the light-emitting device 20 to a transfer substrate, and then peeling the substrate from the transfer substrate; and then transferring the light-emitting devices 20 on the plurality of transfer substrates to the carrier plate 70 .
[0131] For example, the area of the transfer substrate may be substantially equal to the area of the substrate; the area of the carrier plate 70 may be greater than or equal to the sum of the areas of the plurality of substrates.
[0132] In some embodiments, the deformable layer 30 formed in step S1 may be a continuous distribution film layer or a discontinuous distribution film layer. When the display substrate to be prepared further includes an adhesive layer 40, the steps S1 and S2 may further include: S15, forming an adhesive layer 40 on a side of the deformable layer 30 away from the carrier plate 70, and the adhesive layer 40 may be a continuous distribution film layer or a discontinuous distribution film layer.
[0133] In some embodiments, the carrier plate 70 may not be removed, thereby forming the cover plate 60 in the above embodiments.
[0134] In the case where the carrier plate 70 is not removed, in some embodiments, before step S1, the second dark film layer 50 or the third dark film layer 51 may be formed. Alternatively, after step S3, the fifth dark film layer 65 may be formed on the side of the carrier plate 70 away from the light emitting device 20.
[0135] Fig.23 Schematic diagram of a method for manufacturing a display substrate provided in some other embodiments of the present disclosure, such as Fig.23 As shown, in other embodiments, the manufacturing method includes a step of removing the carrier plate 70. Specifically, in addition to the above steps S1 to S3, the manufacturing method may also include a step S0 before step S1: forming a sacrificial layer 80 on the carrier plate 70; and a step S4 after step S3: removing the sacrificial layer 80 to remove the carrier plate 70.
[0136] For example, the material of the sacrificial layer 80 may include ultraviolet viscosity-reducing glue, and the viscosity of the sacrificial layer 80 may be reduced by irradiating ultraviolet light to remove the carrier plate 70; for another example, the material of the sacrificial layer 80 includes laser dissociation glue, and the viscosity of the sacrificial layer 80 may be reduced by irradiating laser; for another example, the material of the sacrificial layer 80 includes thermal decomposition glue, so that the viscosity of the sacrificial layer 80 may be reduced by heating. Of course, the sacrificial layer 80 may also be made of other materials, such as materials that can reduce viscosity or be decomposed in an acid pickling process.
[0137] In the case of removing the carrier plate 70, in some embodiments, between step S0 and step S1, the following may be included: forming the second dark film layer 50 or the third dark film layer 51. Alternatively, after step S4, the second dark film layer 50 or the third dark film layer 51 is formed, so that the finally formed display substrate includes the second dark film layer 50 or the third dark film layer 51 located on the side of the deformable layer 30 away from the base substrate 11. Alternatively, the second dark film layer 50 may be formed before steps S1 and S15, and the second dark film layer 50 is located on the side of the deformable layer 30 away from the middle carrier substrate 70, and then the adhesive layer 40 is formed, so that in the finally formed display substrate, the second dark film layer 50 is located on the side of the deformable layer 30 close to the base substrate 11.
[0138] The present disclosure also provides a display device, including the display substrate in the above embodiment. The display device may include any device or product with a display function. For example, the display device may be a smart phone, a mobile phone, an e-book reader, a desktop computer (PC), a laptop PC, a netbook PC, a personal digital assistant (PDA), a portable multimedia player (PMP), a digital audio player, a mobile medical device, etc.
[0139] It is to be understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of the present disclosure, but the present disclosure is not limited thereto. For those of ordinary skill in the art, various modifications and improvements can be made without departing from the spirit and substance of the present disclosure, and these modifications and improvements are also considered to be within the scope of protection of the present disclosure.
Claims
1. A display substrate, comprising: Driver backplane; A plurality of light emitting devices are arranged on the driving backplane; It is characterized by further comprising: The deformable layer is arranged on a side of the plurality of light emitting devices away from the driving backplane, and the deformable layer overlaps with an orthographic projection of each of the light emitting devices on the driving backplane.
2. The display substrate according to claim 1, characterized in that: The material of the deformable layer is elastic material.
3. The display substrate according to claim 2, characterized in that: The material of the deformable layer includes acrylic system resin or silicone system resin.
4. The display substrate according to claim 2, characterized in that: The thickness of the deformable layer is between 2 μm and 50 μm.
5. The display substrate according to claim 2, characterized in that: The orthographic projection of the deformable layer on the driving backplane covers the orthographic projection of the light-emitting device on the driving backplane.
6. The display substrate according to claim 5, characterized in that: The deformable layer includes a plurality of elastic parts arranged at intervals, and the elastic parts correspond to the light emitting devices one by one.
7. The display substrate according to claim 2, characterized in that: An orthographic projection of the deformable layer on the driving backplane and an orthographic projection of the light-emitting device on the driving backplane have a first overlapping region, and the first overlapping region is only located at an edge of the light-emitting device.
8. The display substrate according to claim 7, characterized in that: The shape of the first overlapping area is annular; The first overlapping region extends along an edge of the light emitting device.
9. The display substrate according to claim 8, characterized in that: The minimum width of the ring is greater than or equal to 3 μm.
10. The display substrate according to any one of claims 2 to 9, characterized in that: The deformable layer is a first dark film layer, and the first dark film layer is configured to transmit a portion of the light emitted by the light-emitting device and absorb a portion of the light emitted by the light-emitting device; the color of the light transmitted through the light-emitting device is the same as the color of the light emitted by the light-emitting device; Wherein, the transmittance of the first dark film layer to the light emitted by the light-emitting device is between 20% and 75%.
11. The display substrate according to any one of claims 1 to 9, characterized in that: The display substrate further comprises a second dark film layer, which is located on a side of the deformable layer away from the plurality of light-emitting devices, or on a side of the deformable layer close to the plurality of light-emitting devices; the second dark film layer is configured to transmit a portion of the light emitted by the light-emitting devices and absorb a portion of the light emitted by the light-emitting devices; the color of the light transmitted through the light-emitting devices is the same as the color of the light emitted by the light-emitting devices; Wherein, the transmittance of the second dark film layer to the light emitted by the light emitting device is between 20% and 75%.
12. The display substrate according to claim 11, characterized in that: The second dark film layer is a continuously distributed film layer; At least part of the orthographic projection of the light-emitting device on the driving backplane is located inside the orthographic projection of the second dark film layer on the driving backplane.
13. The display substrate according to claim 11, characterized in that: There is a second overlapping area between the orthographic projection of the second dark film layer on the driving backplane and the orthographic projection of the light-emitting device on the driving backplane, and the second overlapping area is only located at the edge of the light-emitting device.
14. The display substrate according to claim 13, characterized in that: The orthographic projection of the deformable layer on the driving backplane is located inside the orthographic projection of the second dark film layer on the driving backplane.
15. The display substrate according to any one of claims 1 to 9, characterized in that: The display substrate further comprises a third dark film layer located on a side of the light emitting device away from the driving backplane, wherein the third dark film layer is configured to transmit a portion of the light emitted by the light emitting device and absorb a portion of the light emitted by the light emitting device, and the color of the light transmitted through the light emitting device is the same as the color of the light emitted by the light emitting device; The transmittance of the third dark film layer to the light emitted by the light emitting device is between 20% and 75%; the third dark film layer has openings corresponding to the light emitting devices one by one, and the orthographic projection of the openings on the driving backplane overlaps with the orthographic projection of the light emitting device on the driving backplane; At least a portion of the deformable layer is located inside the opening.
16. The display substrate according to claim 15, characterized in that: The deformable layer includes a plurality of elastic portions which are arranged at intervals, and the elastic portions are located in the opening portions.
17. The display substrate according to any one of claims 1 to 9, characterized in that: The display substrate further includes an adhesive layer located between the deformable layer and the light emitting device, and the adhesive layer is fixedly connected to the deformable layer and the light emitting device respectively.
18. The display substrate according to claim 17, characterized in that: The adhesive layer is a flexible adhesive layer.
19. The display substrate according to claim 1, characterized in that: The material of the deformable layer is a viscous material.
20. The display substrate according to claim 19, characterized in that: The deformable layer is a fourth dark film layer, and the fourth dark film layer is configured to transmit a portion of the light emitted by the light-emitting device and absorb a portion of the light emitted by the light-emitting device; the color of the light transmitted through the light-emitting device is the same as the color of the light emitted by the light-emitting device; Wherein, the transmittance of the fourth dark film layer to the light emitted by the light-emitting device is between 20% and 75%.
21. The display substrate according to any one of claims 1 to 9, characterized in that: The display substrate further comprises a cover plate located on a side of the deformable layer away from the light emitting device.
22. The display substrate according to any one of claims 1 to 9, characterized in that: The display substrate further comprises a cover plate located on a side of the deformable layer away from the light emitting device, wherein the cover plate is a dark cover plate, and the dark cover plate is configured to transmit a portion of the light emitted by the light emitting device and absorb a portion of the light emitted by the light emitting device; the color of the light transmitted through the dark cover plate is the same as the color of the light emitted by the light emitting device; The transmittance of the dark cover plate to the light emitted by the light emitting device is between 20% and 75%.
23. The display substrate according to any one of claims 1 to 9, characterized in that: The display substrate further comprises: A cover plate located on a side of the deformable layer away from the light emitting device; a fifth dark film layer located on a side of the cover plate away from the light emitting device, the fifth dark film layer being configured to transmit a portion of the light emitted by the light emitting device and absorb a portion of the light emitted by the light emitting device; the color of the light transmitted through the light emitting device is the same as the color of the light emitted by the light emitting device; Wherein, the transmittance of the fifth dark film layer to the light emitted by the light-emitting device is between 20% and 75%.