Gluing device for electronic component

Abstract

The utility model relates to a gluing device for electronic components, which is characterized in that a support component is arranged on a base, a material conveying component and a gluing component are supported by the support component in a partitioned manner, and a plurality of adjustable clamping components are arranged on a conveying surface limited by the material conveying component at intervals along the movement direction of the conveying surface. The adjustable clamping assembly is arranged on the supporting assembly, so that the supporting assembly is matched with the gluing assembly to conduct gluing treatment on the surfaces of the electronic components placed in the material containing groove cavity limited by the gluing assembly, and the supporting assembly further supports a reciprocating lifting assembly capable of moving materials subjected to gluing treatment out of the material containing groove cavity limited by the adjustable clamping assembly. According to the utility model, the range of the placement space of the plate-shaped electronic component can be effectively and adjustably changed so as to effectively clamp and limit the plate, and meanwhile, the clamping structure and the gluing structure are matched with each other so as to limit the gluing range matched with the size specification of the electronic component, so that effective gluing treatment is realized.

Description

Technical Field

[0001] The utility model relates to the technical field of glue coating equipment for electronic components, in particular to a glue coating device for electronic components. Background Art

[0002] Electronic components are composed of several electronic parts and are the components of electronic elements, small machines, instruments and other objects; they often refer to certain parts of industries such as electrical appliances, radios, and instruments, and are the general term for electronic devices such as capacitors, transistors, hairsprings, and springs; common ones include diodes, etc. During the production process of electronic components, their surfaces need to be coated with glue by a gluing device.

[0003] During the process of surface gluing of electronic components, due to the differences in the sizes of board-shaped electronic components, the conventional array multi-point glue discharge method can apply glue to the entire surface of the board more evenly. However, when faced with electronic components of different sizes, the existing glue clamping mechanism cannot make effective adjustments with high adaptability according to the actual sizes of the electronic components, and cannot stably clamp electronic components of different sizes while simultaneously limiting the gluing range. It is very easy to fail to effectively and adaptively adjust the gluing processing range during the gluing operation, and it is very easy to have ineffective gluing in excess areas, resulting in excessive and wasteful output of glue over a large range. In addition, the clamping mechanism cannot block the sides of the electronic components, which can easily lead to excessive glue overflow and affect the gluing effect. Utility Model Content

[0004] The utility model aims to provide a gluing device for electronic components which can effectively and adjustably change the range of the placement space of plate-shaped electronic components and effectively clamp and limit the plate, and at the same time can utilize the mutual cooperation of the clamping structure and the gluing structure to limit the gluing range that matches the size specifications of the electronic components to achieve effective gluing treatment, so as to solve the problem that the existing gluing equipment is unable to perform continuous gluing treatment on electronic components and at the same time can adaptively adjust the size of batch electronic components to effectively clamp and directionally transport electronic components of different sizes, especially unable to shield the electronic components to prevent the electronic components from being over-coated with overflowing glue, and the existing gluing equipment cannot adjust the gluing range according to the actual size of the electronic components. When facing smaller electronic components, there is excessive output in too large an area, resulting in waste of glue.

[0005] The technical solution adopted by the utility model is: a gluing device for electronic components, including a base, on which a supporting assembly is arranged, the supporting assembly supports the material conveying assembly and the gluing assembly in partitions to define the relative position of the gluing assembly suspended above the transmission surface constructed by the material conveying assembly, and a plurality of adjustable clamping assemblies are also arranged at intervals along the movement direction of the transmission surface defined by the material conveying assembly, so as to cooperate with the gluing assembly to perform gluing treatment on the surface of the electronic components placed in the material placement groove cavity defined by it, and the supporting assembly also supports a reciprocating lifting assembly that can move the material that has completed the gluing treatment out of the material placement groove cavity defined by the adjustable clamping assembly.

[0006] According to a preferred embodiment, the adjustable clamping assembly includes a base, a diagonal screw, a right-angle baffle plate and a connecting bearing, wherein an accommodation groove is opened on the base, and the side wall corners of the base are penetrated by the diagonal screw rod parallel to the diagonal line of its cross-section; the insertion front end of the diagonal screw rod is rotatably connected to the right-angle baffle plate stacked on the upper surface of the base to block at least part of the notch of the accommodation groove through the connecting bearing.

[0007] According to a preferred embodiment, a diagonal through groove parallel to the axial direction of the diagonal screw is also provided on the inner bottom surface of the accommodating groove.

[0008] According to a preferred embodiment, the bottom edge of the right-angled plate body of the right-angled baffle is provided with a positioning angle block which can cooperate with the groove cavity of the placement groove which is not blocked by it to define a material placement space with adjustable size, and the bottom surface of the positioning angle block is also connected to a slider which is at least partially slidably embedded in the diagonal through groove to limit the movement direction of the right-angled plate body; the outer convex surface of the positioning angle block is also connected to the connecting bearing.

[0009] According to a preferred embodiment, the glue coating assembly includes a reciprocating lifting rod, a glue coating diverter plate, a glue discharge head, a glue delivery pipe and a glue liquid tank, wherein the reciprocating lifting rod is installed on the lower surface of the top plate of the second lifting support column of the support assembly, the axial lower end of the reciprocating lifting rod is connected to the glue coating diverter plate, the bottom surface of the glue coating diverter plate is also provided with a plurality of the glue discharge heads connected to its inner cavity in an array, and the upper surface of the glue coating diverter plate is also connected with the glue delivery pipe connected to the glue liquid tank.

[0010] According to a preferred embodiment, a guide sleeve is provided in the glue removal pipe head of the glue removal head through a positioning cross bar, an adjusting rod is passed through the guide sleeve, and a blocking block is provided at the axial upper end of the adjusting rod, and a tension spring is sleeved on the rod body of the adjusting rod located between the guide sleeve and the blocking block.

[0011] According to a preferred embodiment, the glue tank is detachably mounted on the reciprocating lifting rod, and an output port of the glue tank connected to the glue delivery pipe is provided with a driving pump.

[0012] According to a preferred embodiment, the reciprocating lifting assembly includes a reciprocating telescopic rod supported on a third support frame and a micro-negative pressure adsorption lifting mechanism arranged at the axial upper end of the reciprocating telescopic rod, wherein the adsorption head of the micro-negative pressure adsorption lifting mechanism is installed on the top of the reciprocating telescopic rod, and a micro-negative pressure exhaust pump connected to the adsorption head through an air guide hose is arranged on the side wall of the reciprocating telescopic rod.

[0013] According to a preferred embodiment, the two rotating wheels of the material conveying assembly are supported on the base through the first supporting column of the supporting assembly, and a conveyor belt is sleeved on the rotating wheels; and the base is embedded on the conveyor belt at intervals.

[0014] According to a preferred embodiment, the two first support columns of the support assembly are symmetrically arranged, and the second lifting support column and the third support frame are respectively arranged on both sides of the conveyor belt.

[0015] The beneficial effects of the utility model are:

[0016] The gluing assembly provided in the present application can cooperate with the adjustable clamping assembly to adjust the range of glue discharge, and complete the gluing of planes with different sizes in an adjustable manner. In particular, the gluing range of the gluing assembly is directly related to the size of the placement space set by the adjustable clamping assembly, so as to effectively and accurately complete the gluing process of plate-shaped electronic components of different sizes, improve the adaptability of the gluing assembly to the actual plate-shaped electronic components, reduce the waste of glue caused by excessive and excessive range of glue discharge, and improve the accuracy of gluing and the utilization rate of glue. The adjustable clamping assembly provided in the present application can adjust the cross-sectional size of the placement space defined by it according to demand, so as to effectively clamp and position plate-shaped electronic components of different sizes, and the mutual cooperation between the adjustable clamping assembly and the material conveying assembly can continuously and intermittently convey materials, so as to facilitate continuous gluing processing of electronic components of the same specification in batches. The adjustable clamping assembly provided in the present application can adaptively limit the range and size of the exposed surface of the electronic component, so as to accurately apply glue to a certain surface and avoid glue overflowing and causing other areas to be covered by glue, thereby improving the gluing effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a structural schematic diagram of a preferred electronic component gluing device proposed by the utility model;

[0018] Figure 2This is a structural schematic diagram of a preferred glue removal head of a glue coating device for electronic components proposed by the utility model;

[0019] Figure 3 The utility model is a schematic plan view of an adjustable clamping assembly of a preferred electronic component gluing device.

[0020] Reference numerals list

[0021] 1: base; 2: support assembly; 3: material conveying assembly; 4: glue coating assembly; 5: adjustable clamping assembly; 6: reciprocating lifting assembly; 21: first support column; 22: second lifting support column; 23: third support frame; 221: top plate; 31: rotating wheel; 32: conveyor belt; 41: reciprocating lifting rod; 42: glue coating diverter plate; 43: glue discharge head; 44: glue delivery hose; 45: glue liquid tank; 46: driving pump; 51: base; 52: diagonal screw; 53: Right-angle baffle; 54: connecting bearing; 61: reciprocating telescopic rod; 62: micro-negative pressure adsorption lifting mechanism; 431: rubber discharge hose head; 432: positioning cross bar; 433: guide sleeve; 434: adjustment rod; 435: blocking block; 436: tension spring; 511: placement groove; 512: diagonal through groove; 531: right-angle plate body; 532: positioning corner block; 533: slider; 621: adsorption head; 622: air guide hose; 623: micro-negative pressure exhaust pump. DETAILED DESCRIPTION

[0022] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the utility model will be briefly introduced below in combination with the drawings and the descriptions of the embodiments or the prior art. Obviously, the following descriptions of the structures of the drawings are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0023] The technical solution provided by the present invention will be described in detail below by way of embodiments with reference to the accompanying drawings. It should be noted that the description of these embodiments is used to help understand the present invention, but does not constitute a limitation of the present invention. In some examples, some implementation methods are not described or are not described in detail because they belong to existing or conventional technologies.

[0024] In addition, the technical features recorded in this article, or the steps in all methods or processes disclosed, except for mutually exclusive features and / or steps, can also be combined in any suitable manner in one or more embodiments. For those skilled in the art, it is easy to understand that the steps or operation sequence of the methods related to the embodiments provided herein can also be changed. Any order in the drawings and embodiments is only for illustrative purposes and does not imply a requirement to follow a certain order unless it is explicitly stated that a certain order is required.

[0025] The serial numbers assigned to the components herein, such as "first", "second", etc., are only used to distinguish the objects described and do not have any order or technical meaning. The "connection" and "coupling" mentioned in this application, under reasonable circumstances (not constituting a self-contradiction), include direct and indirect connections (couplings).

[0026] The following is a detailed description with reference to the accompanying drawings.

[0027] Example 1

[0028] The present application provides a glue coating device for electronic components, which includes a base 1, a support assembly 2, a material conveying assembly 3, a glue coating assembly 4, an adjustable clamping assembly 5 and a reciprocating lifting assembly 6.

[0029] according to Figure 1-3A specific embodiment is shown, in which a support assembly 2 is arranged on a base 1. The support assembly 2 supports the material conveying assembly 3 and the gluing assembly 4 in partitions above the base 1 to define the relative position of the gluing assembly 4 suspended above the transmission surface constructed by the material conveying assembly 3. A plurality of adjustable clamping assemblies 5 are also arranged at intervals along the movement direction of the transmission surface defined by the material conveying assembly 3, so as to cooperate with the gluing assembly 4 to perform gluing treatment on the surface of the electronic components placed in the material placement groove defined by it. The adjustable clamping assembly 5 can adjustably block the glue discharge port of the gluing assembly 4 in a certain non-glue-coated area according to its shielding range and the exposed material placement groove, thereby defining the range of the glue discharge area, so as to accurately and adaptively perform gluing treatment on the electronic components. The support assembly 2 also supports a reciprocating lifting assembly 6 that can move the material that has been glued out of the material placement groove defined by the adjustable clamping assembly 5. The glue coating component 4 provided in the present application can cooperate with the adjustable clamping component 5 to adjust the range of glue liquid discharge, so as to adjustably complete the flat glue coating of different sizes, especially the glue coating range of the glue coating component 4 is directly related to the size of the placement space set by the adjustable clamping component 5, so as to effectively and accurately complete the glue coating process of plate-shaped electronic components of different sizes, improve the adaptability of the glue coating component 4 to the actual plate-shaped electronic components, reduce the waste of glue liquid caused by excessive and excessive range of glue discharge, and improve the accuracy of glue coating and the utilization rate of glue liquid. The adjustable clamping component 5 provided in the present application can adjust the cross-sectional size of the placement space defined by it according to demand, so as to effectively clamp and position plate-shaped electronic components of different sizes, and the mutual cooperation between the adjustable clamping component 5 and the material conveying component 3 can continuously and intermittently convey materials, so as to facilitate continuous glue coating processing of electronic components of the same specification in batches. The adjustable clamping assembly 5 provided in the present application can adaptively limit the range and size of the exposed surface of the electronic components, so as to accurately apply glue to a certain surface and avoid glue overflow and other areas being covered by glue, thereby improving the gluing effect. The reciprocating lifting assembly 6 provided in the present application can rise periodically so that the electronic components in the placement space can be lifted and removed after the surface gluing treatment is completed, so as to facilitate the clamping and transfer of the electronic components.

[0030] Preferably, the support assembly 2 includes a first support column 21, a second lifting support column 22 and a third support frame 23. Further preferably, the two first support columns 21 supporting different rotating wheels 31 are arranged symmetrically. Further preferably, the second lifting support column 22 and the third support frame 23 are arranged on both sides of the conveyor belt 32, respectively. Specifically, the support height of the second lifting support column 22 is higher than the support height of the third support frame 23, wherein the top transverse support surface of the second lifting support column 22 is above the working surface defined by the conveyor belt 32, and the top transverse support surface of the third support frame 22 is between two parallel belt bodies of the conveyor belt 32. The support assembly 2 provided in the present application can support different components at different positions and different height planes in a partitioned manner, so that each component cooperates with each other to perform continuous gluing treatment of electronic components of different sizes in different size ranges. The third support frame 23 can support the reciprocating lifting assembly 6 so that the electronic components that have completed the gluing process can be stably ejected from the placement cavity, so that subsequent operators or manipulators can clamp and transfer the electronic components with glue applied on the upper surface without contacting the upper surface of the electronic components.

[0031] Preferably, the material conveying assembly 3 includes a rotating wheel 31 and a conveyor belt 32. Preferably, the two rotating wheels 31 are supported on the base 1 by the first support column 21 of the support assembly 2. Further preferably, a conveyor belt 32 is sleeved on the rotating wheel 31. Specifically, a base 51 is embedded on the conveyor belt 32 at intervals. Preferably, the axial upper end of the first support column 21 is also provided with a rotating drive motor coaxial with the rotating wheel and transmission-connected. Preferably, the rotating drive motor is a stepping rotary motor that periodically rotates intermittently, so that it can periodically rotate a certain angle to drive the adjustable clamping assembly 5 to complete intermittent translational motion, so that a number of adjustable clamping assemblies 5 arranged at intervals can intermittently pass through the glue coating assembly 4 and continuously complete the glue coating process with interval time, so as to facilitate the lifting and transfer operation of the electronic components in the further directional intermittent translation process. The material conveying assembly 3 provided in the present application can continuously and directionally drive the adjustable clamping assembly 5 to translate, thereby realizing the continuous directional conveying of electronic components, so as to facilitate the continuous and uninterrupted glue coating process on the upper surface of the electronic components. The base 51 of the present application is embedded in the conveyor belt 32, so that the base 51 penetrates the belt body and the diagonal through-groove 512 is penetrated, so that the micro-negative pressure adsorption lifting mechanism 62 is inserted into the diagonal through-groove 512. Further preferably, the base 51 is embedded in the conveyor belt 32 through an elastic silicone block, so that it can bend and rotate with the conveyor belt 32 while ensuring the stability of the structure. The conveyor belt 32 is provided with a through opening that matches the diagonal through-groove 512.

[0032] Preferably, the glue coating assembly 4 includes a reciprocating lifting rod 41, a glue coating diverter plate 42, a glue discharge head 43, a glue delivery pipe 44, a glue liquid tank 45 and a driving pump 46. Preferably, the reciprocating lifting rod 41 is mounted on the lower surface of the top plate 221 of the second lifting support column 22 of the support assembly 2. Preferably, the axial lower end of the reciprocating lifting rod 41 is connected with a glue coating diverter plate 42. Preferably, the bottom surface of the glue coating diverter plate 42 is also provided with a plurality of glue discharge heads 43 connected to its inner cavity in an array. Preferably, the upper surface of the glue coating diverter plate 42 is also plugged with a glue delivery pipe 44 connected to the glue liquid tank 45. Preferably, the glue liquid tank 45 is detachably mounted on the side wall of the fixed length sleeve of the reciprocating lifting rod 41. Preferably, the glue delivery pipe 44 adopts an elastic bellows with a retractable length. Preferably, a glue filling port is also provided on the top of the glue liquid tank 45, which is used to replenish the glue liquid in the tank of the glue liquid tank 45. Preferably, the output port of the glue tank 45 connected to the glue delivery pipe 44 is provided with a driving pump 46. Further preferably, the output end of the driving pump 46 is provided with a one-way valve to limit the directional discharge of the glue and to prevent the glue in the tube cavity and the plate cavity from automatically flowing downward and discharging and leaking when there is no driving force. Preferably, a heat-insulating heating layer is laid on the inner wall of the glue-coating diverter plate 42, the tube wall of the glue delivery pipe 44 and the side wall of the glue tank 45 to avoid the problem of solidification of the glue, thereby ensuring the flow state of the glue. The glue coating assembly 4 provided in the present application can form a glue plate surface and can adjustably perform surface glue coating on electronic components within a certain plane range area, thereby improving the compatibility with electronic components of different sizes, so as to reduce the waste of glue and pollution of workpieces and tooling caused by excess glue discharge in excess areas. The glue dispensing plate 42 provided in the present application can discharge the glue liquid in a uniform and dispersed manner through the glue discharge heads 43 arranged in an array, so as to achieve directional external discharge without internal airflow under the flow guide drive of the driving pump 46, thereby effectively coating the entire plane with glue. The glue discharge head 43 provided in the present application can discharge the glue liquid driven by the driving pump 46 without contact pressure blocking, so as to achieve adjustable discharge of the glue liquid. In particular, the glue discharge head 43 that is pressed can automatically block and close, and complete the adjustment of the dischargeable range of the glue liquid to adapt to plate-shaped electronic components of different sizes.

[0033] Preferably, a guide sleeve 433 is provided in the glue discharge pipe head 431 of the glue discharge head 43 through a positioning cross bar 432. Preferably, a positioning rod 434 is inserted in the guide sleeve 433. Further preferably, a blocking block 435 is provided at the axial upper end of the positioning rod 434. Preferably, the inner wall contour of the axial upper tube cavity of the glue discharge pipe head 431 is set in a manner that can match the outer contour of the blocking block 435, so as to adjustably block and isolate the glue discharge pipe head 431. Preferably, a tension spring 436 is sleeved on the rod body of the positioning rod 434 between the guide sleeve 433 and the blocking block 435, so that the tension spring 436 limits the state that the blocking block 435 is in the tube cavity of the glue discharge pipe head 431 without blocking the tube cavity at the initial length, so that the glue discharge pipe head 431 is blocked in the process that the positioning rod 434 is pressed and raised to drive the blocking block 435 to rise. The adjusting rod 434 provided in the present application can pull the elongated tension spring 436 to retract into the glue discharge pipe head 431 when it abuts against the right-angle baffle plate 53 and cannot extend into the mounting groove 511, so that the sealing block 435 at its axial upper end can seal the axial upper end pipe opening of the glue discharge pipe head 431, so that the glue discharge head 43 in the area of ​​the right-angle baffle plate 53 is blocked but the glue liquid is not discharged outside, and then the glue discharge head 43 above the mounting groove 511 that is not blocked by the right-angle baffle plate 53 is limited to be in a conductive state and the glue liquid can be discharged outside in a controllable manner, so as to realize the surface gluing treatment of the plate-shaped electronic components of a characteristic size that are limited.

[0034] Preferably, the adjustable clamping assembly 5 comprises a base 51, a diagonal screw 52, ​​a right-angle shielding plate 53 and a connecting bearing 54. Further preferably, a placement groove 511 is provided on the base 51. Preferably, a diagonal screw 52 parallel to the diagonal line of its cross section is penetrated through the side wall corner of the base 51. Preferably, the insertion front end of the diagonal screw 52 is rotatably connected to the right-angle shielding plate 53 stacked on the upper surface of the base 51 to shield at least part of the slot of the placement groove 511 through the connecting bearing 54. Preferably, a diagonal through groove 512 parallel to the axial direction of the diagonal screw 52 is also provided on the inner bottom surface of the placement groove 511. The diagonal screw 52 provided in the present application can drive the right-angle shielding plate 53 to translate along the diagonal direction of the placement groove 511 opened on the base 51, so as to adjustably shield part of the notch of the placement groove 511, and then the right-angle shielding plate 53 and the placement groove 511 cooperate with each other to define a placement groove cavity with adjustable size, which is used for the placement and positioning of plate-shaped electronic components of different sizes. The diagonal through groove 512 provided in the present application can assist in limiting the translation direction of the right-angle shielding plate 53 and can also expose at least part of the bottom surface of the plate-shaped electronic component placed in the placement groove 511, so that the micro-negative pressure adsorption lifting mechanism 62 can be adjusted to adsorb on the bottom surface of the plate-shaped electronic component and drive it to further lift and move out of the placement groove 511, so as to clamp and transfer the electronic component with surface glue coating.

[0035] Preferably, the bottom edge of the right-angle plate body 531 of the right-angle shielding plate 53 is provided with a positioning angle block 532 that can cooperate with the groove cavity of the placement groove 511 that is not blocked by it to define a material placement space with adjustable size. Preferably, the bottom surface of the positioning angle block 532 is also connected to a slider 533 that at least partially slides and embeds into the diagonal through groove 512 to limit the movement direction of the right-angle plate body 531. Preferably, the outer convex surface of the positioning angle block 532 is also connected to a connecting bearing 54, so that it can be synchronously translated along the axis of the diagonal screw 52 during the rotation and movement of the diagonal screw 52. The right-angle shielding plate 53 provided in the present application can be directional and translated according to needs and can controllably cooperate with the placement groove 511 to define a placement space with adjustable size.

[0036] Preferably, the reciprocating lifting assembly 6 includes a reciprocating telescopic rod 61 supported on the third support frame 23 and a micro-negative pressure adsorption lifting mechanism 62 arranged at the axial upper end of the reciprocating telescopic rod 61. Preferably, the adsorption head 621 of the micro-negative pressure adsorption lifting mechanism 62 is installed on the top of the reciprocating telescopic rod 61. Further preferably, a micro-negative pressure exhaust pump 623 connected to the adsorption head 621 through an air guide hose 622 is arranged on the side wall of the reciprocating telescopic rod 61. Preferably, a filling ring is arranged on the top opening surface of the adsorption head 621 to ensure the close contact of the abutment contact. Further preferably, the adsorption head 621 can be adjusted to be inserted from bottom to top into the diagonal through groove 512 to adsorb and support the bottom surface of the material, thereby further driving the material to move up and move out of the placement groove 511, so as to facilitate the operator or the mechanical clamping mechanism to grab the electronic components that have been glued. Preferably, a slide groove parallel to the diagonal through groove 512 is provided on the support surface of the third support frame 23, so that the reciprocating telescopic rod 61 is slidably engaged in the slide groove, thereby facilitating its translation and insertion into the diagonal through groove 512 from different positions to locate the center point of the electronic components and provide effective and stable support.

[0037] The present utility model is not limited to the above optional implementation modes. Anyone can derive other various forms of products under the inspiration of the present utility model. However, no matter what changes are made in the shape or structure, all technical solutions that fall within the scope of the claims of the present utility model fall within the protection scope of the present utility model. Those skilled in the art should understand that the present utility model specification and its drawings are illustrative and do not constitute limitations on the claims. The protection scope of the present utility model is defined by the claims and their equivalents. Throughout the text, the features guided by "preferably" are only an optional method and should not be understood as having to be set. Therefore, the applicant reserves the right to abandon or delete the relevant preferred features at any time.

Claims

1. A glue coating device for electronic components, comprising a base (1), on which a supporting assembly (2) is arranged, characterized in that: The support component (2) supports the material conveying component (3) and the glue coating component (4) in a partitioned manner, so as to define a relative position of the glue coating component (4) suspended above the transmission surface constructed by the material conveying component (3). A plurality of adjustable clamping components (5) are arranged at intervals along the moving direction of the transmission surface defined by the material conveying component (3), so as to cooperate with the glue coating component (4) to perform glue coating on the surface of the electronic components placed in the material placement groove defined by the material conveying component (3). The support component (2) also supports a reciprocating lifting component (6) capable of moving the material that has completed the glue coating process out of the material placement groove cavity defined by the adjustable clamping component (5).

2. The adhesive coating device for electronic components according to claim 1, characterized in that: The adjustable clamping assembly (5) comprises a base (51), a diagonal screw rod (52), a right-angle shielding plate (53) and a connecting bearing (54), wherein: A placement groove (511) is provided on the base (51), and a diagonal screw rod (52) parallel to the diagonal line of the cross section of the base (51) is passed through the corner of the side wall of the base (51); The insertion front end of the diagonal screw rod (52) is rotatably connected to the right-angle shielding plate (53) stacked on the upper surface of the base (51) to shield at least part of the slot of the placement groove (511) through the connecting bearing (54).

3. The adhesive coating device for electronic components according to claim 2, characterized in that: A diagonal through groove (512) parallel to the axial direction of the diagonal screw rod (52) is also provided on the inner bottom surface of the placement groove (511).

4. The adhesive coating device for electronic components according to claim 3, characterized in that: The bottom edge of the right-angle plate body (531) of the right-angle shielding plate (53) is provided with a positioning angle block (532) which can cooperate with the groove cavity of the placement groove (511) not blocked by it to define a material placement space with adjustable size, and the bottom surface of the positioning angle block (532) is also connected to a slider (533) which is at least partially slidably embedded in the diagonal through groove (512) to define the movement direction of the right-angle plate body (531); The outer convex surface of the positioning angle block (532) is also connected to the connecting bearing (54).

5. The adhesive coating device for electronic components according to claim 4, characterized in that: The glue coating assembly (4) comprises a reciprocating lifting rod (41), a glue coating flow dividing plate (42), a glue discharge head (43), a glue delivery pipe (44) and a glue liquid tank (45), wherein: The reciprocating lifting rod (41) is mounted on the lower surface of the top plate (221) of the second lifting support column (22) of the support assembly (2), and the axial lower end of the reciprocating lifting rod (41) is connected to the glue-spreading diverter plate (42). The bottom surface of the glue-spreading flow-dividing plate (42) is also provided with a plurality of glue discharge heads (43) in array and connected to its inner cavity, and the upper surface of the glue-spreading flow-dividing plate (42) is also connected to the glue delivery pipe (44) connected to the glue liquid tank (45).

6. The adhesive coating device for electronic components according to claim 5, characterized in that: A guide sleeve (433) is provided in the glue discharge pipe head (431) of the glue discharge head (43) via a positioning cross bar (432). A positioning rod (434) is inserted into the guide sleeve (433), and a blocking block (435) is provided at the axial upper end of the positioning rod (434). A tension spring (436) is sleeved on the rod body of the adjustment rod (434) located between the guide sleeve (433) and the blocking block (435).

7. The adhesive coating device for electronic components according to claim 6, characterized in that: The glue liquid tank (45) is detachably mounted on the reciprocating lifting rod (41). The output port of the glue liquid tank (45) connected to the glue delivery pipe (44) is provided with a driving pump (46).

8. The adhesive coating device for electronic components according to claim 7, characterized in that: The reciprocating lifting assembly (6) comprises a reciprocating telescopic rod (61) supported on a third support frame (23) and a micro-negative pressure adsorption lifting mechanism (62) arranged at the axial upper end of the reciprocating telescopic rod (61), wherein: The adsorption head (621) of the micro-negative pressure adsorption lifting mechanism (62) is installed on the top of the reciprocating telescopic rod (61), and a micro-negative pressure exhaust pump (623) connected to the adsorption head (621) through an air guide hose (622) is arranged on the side wall of the reciprocating telescopic rod (61).

9. The adhesive coating device for electronic components according to claim 8, characterized in that: The two rotating wheels (31) of the material conveying assembly (3) are supported on the base (1) via the first supporting column (21) of the supporting assembly (2), and a conveyor belt (32) is sleeved on the rotating wheels (31); The bases (51) are embedded at intervals on the conveyor belt (32).

10. The adhesive coating device for electronic components according to claim 9, characterized in that: The two first support columns (21) of the support assembly (2) are symmetrically arranged, and the second lifting support column (22) and the third support frame (23) are respectively arranged on both sides of the conveyor belt (32).

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