Compact laser welding machine applying semiconductor constant temperature system

Abstract

The utility model belongs to the technical field of laser welding equipment, and relates to a compact laser welding machine applying a semiconductor constant temperature system, which comprises a cabinet, a laser welding system for welding workpieces and the semiconductor constant temperature system for adjusting the temperature of the laser welding system, the semiconductor constant temperature system comprises a cold water tank, a semiconductor chilling plate and a vertical connection heat dissipation structure arranged on the adjacent side of the cold water tank. According to the utility model, the semiconductor chilling plate is adopted to cool the cooling water, and the laser welding system is cooled through the cooling water, so that compared with the conventional water cooling system, the semiconductor chilling plate is low in material cost and manufacturing cost, and can be suitable for various severe environments and transportation conditions at any angle; and meanwhile, the semiconductor chilling plate is small in size, so that the whole laser welding machine is integrally compact, small in size and capable of being easily moved to a site where welding is needed.

Description

Technical Field

[0001] The utility model belongs to the technical field of laser welding equipment, and more specifically relates to a compact laser welding machine using a semiconductor constant temperature system. Background Art

[0002] During the operation of the laser welding machine, a large amount of heat will be generated inside the laser and welding gun, which must be cooled and dissipated, so a cooling system is needed. The cooling systems on the market include compressor water cooling and air cooling. Air cooling is easily affected by the external temperature and has certain limitations. Water cooling often uses a compressor to cool the water temperature. This method has some problems that cannot be ignored.

[0003] For example, a circulating water-cooled laser welding machine (publication number: CN208528314U, publication date: 2019-02-22) includes: a laser welding head; a welding platform, including a platform body and convex strips, and a plurality of water leakage holes are opened on the platform body; a cooling mechanism, the cooling mechanism includes a first circulation component and a second circulation component, the first circulation component includes a cooling water tank, a sealed shell, a spiral blade, a spray head, a water collection tank and a circulating water pump; the second circulation component includes a compressor, an evaporator, a filter, an expansion valve and a condenser connected in sequence to form a closed loop, and the evaporator is built into the cooling water tank.

[0004] The laser welding machine is equipped with a first circulation component to collect cooling water and circulate it into the cooling water tank, so as to recycle the cooled water resources and prevent the cooling water from flowing to the ground; the second circulation component is equipped to use air energy to cool the cooling water in the cooling water tank, which is conducive to reducing energy consumption. However, the laser welding machine uses a compressor to cool the water in the cooling water tank. The compressor is large in size, which makes the overall volume of the laser welding machine larger, which is a problem for scenes with limited space or the need for mobile equipment; if it is a fixed-frequency compressor, the high power is easy to cause energy waste, and it needs to be frequently started and stopped according to temperature control, which is troublesome to operate; if it is a variable-frequency compressor, the poor reliability leads to relatively high manufacturing and maintenance costs, and it is easy to be affected by pollutants, which can cause damage to the machine or malfunction. Utility Model Content

[0005] In view of the technical defects existing in the background technology, the utility model proposes a compact laser welding machine using a semiconductor constant temperature system, which solves the above technical problems and meets the actual needs. The specific technical solution is as follows:

[0006] A compact laser welding machine using a semiconductor constant temperature system comprises a cabinet, a laser welding system for welding workpieces, and a semiconductor constant temperature system for adjusting the temperature of the laser welding system, wherein the laser welding system and the semiconductor constant temperature system are respectively arranged in the cabinet;

[0007] The semiconductor constant temperature system includes a cold water tank, a semiconductor refrigeration sheet and a vertical heat dissipation structure arranged on an adjacent side of the cold water tank. A water outlet plate is provided at the top of the cold water tank. The semiconductor refrigeration sheet is embedded in one end of the cold water tank close to the vertical heat dissipation structure. The vertical heat dissipation structure is connected to the semiconductor refrigeration sheet through a heat pipe. The semiconductor refrigeration sheet and the vertical heat dissipation structure are arranged in a vertical direction. A radiator is provided on the inner wall of one end of the cold water tank where the semiconductor refrigeration sheet is provided. A water outlet and a water level sensor are provided at one end of the cold water tank away from the semiconductor refrigeration sheet. A water barrier is provided between the radiator and the water outlet.

[0008] As a further technical solution of the utility model, the laser welding system is arranged on a side adjacent to the semiconductor constant temperature system and a partition is provided between the laser welding system and the semiconductor constant temperature system, and an external fan is provided at one end of the partition away from the cold water tank.

[0009] As a further technical solution of the utility model, the vertical heat dissipation structure includes a fan and heat sinks arranged on opposite sides of the fan, the end of the heat sink close to the cold water tank is connected to the semiconductor refrigeration plate through a heat pipe, and a fixing part is provided on the side of the vertical heat dissipation structure away from the cold water tank, and the fan and the heat sink are fixed on the fixing part.

[0010] As a further technical solution of the utility model, the laser welding system includes a laser generating device and a welding gun assembly connected to the laser generating device.

[0011] As a further technical solution of the present invention, the longitudinal direction of the cold water tank is arranged along the vertical direction, the bottom end of the water baffle is fixed to the bottom end of the cold water tank, the top end height of the water baffle is higher than the height of the semiconductor refrigeration plate and lower than the height of the water outlet plate, and the distance between the water baffle and the semiconductor refrigeration plate is smaller than the distance between the water baffle and the water outlet hole.

[0012] As a further technical solution of the utility model, the water level sensor is arranged above the water outlet, and the water outlet is connected to a water pump.

[0013] As a further technical solution of the utility model, four semiconductor refrigeration plates and four vertical heat dissipation structures are respectively provided, and the four semiconductor refrigeration plates and four vertical heat dissipation structures are respectively arranged in the vertical direction, and each semiconductor refrigeration plate is connected to a vertical heat dissipation structure and heat transfer occurs.

[0014] As a further technical solution of the utility model, a placement groove is provided on the cold water tank, the semiconductor cooling sheet is embedded in the placement groove, and a side of the semiconductor cooling sheet away from the vertical heat dissipation structure is in close contact with the radiator.

[0015] The beneficial effects of the utility model are:

[0016] The utility model adopts a semiconductor refrigeration sheet to cool the cooling water, and uses the cooling water to cool the laser welding system. Compared with the existing water cooling system, the utility model adopts a semiconductor refrigeration sheet with low material cost and production cost, and can be applied to various harsh environments and transportation conditions at any angle. At the same time, the semiconductor refrigeration sheet is small in size, making the entire laser welding machine compact and small in size, and can be easily moved to the site where welding is required.

[0017] The utility model utilizes a vertical heat dissipation structure to dissipate heat for the hot end of a semiconductor refrigeration plate. The cold end of the semiconductor refrigeration plate contacts cooling water through a radiator. The semiconductor refrigeration plate and the vertical heat dissipation structure are arranged in a vertical direction. A water baffle is arranged in a cold water tank so that the cooling water can fully exchange heat with the radiator at one end of the cold water tank close to the semiconductor refrigeration plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a diagram of the internal structure of a compact laser welding machine that uses a semiconductor constant temperature system.

[0019] Figure 2 This is an external structural diagram of a compact laser welding machine that uses a semiconductor constant temperature system.

[0020] Figure 3 The semiconductor constant temperature system structure diagram of a compact laser welding machine using a semiconductor constant temperature system.

[0021] Figure 4 This is a structural diagram from another perspective of the semiconductor constant temperature system of a compact laser welding machine that uses a semiconductor constant temperature system.

[0022] Among them: cabinet 1, laser welding system 2, laser generating device 21, welding gun assembly 22, semiconductor constant temperature system 3, cold water tank 31, water outlet 311, placement slot 312, semiconductor refrigeration plate 32, vertical heat dissipation structure 33, fan 331, heat sink 332, fixing part 333, water outlet plate 34, heat pipe 35, radiator 36, water baffle 37, water level sensor 38, external fan 4, partition 5, water pump 6. DETAILED DESCRIPTION

[0023] The following is combined with Figures 1 to 4 The implementation methods of the present invention are described with relevant embodiments, but the implementation methods of the present invention are not limited to the following embodiments, and the present invention involves relevant necessary components in this technical field, which should be regarded as the known technology in this technical field and can be known and mastered by the technicians in this technical field.

[0024] The utility model provides a compact laser welding machine using a semiconductor constant temperature system, such as Figure 1 and Figure 2 As shown, it includes a cabinet 1, a laser welding system 2 for welding workpieces, and a semiconductor constant temperature system 3 for adjusting the temperature of the laser welding system 2. The laser welding system 2 and the semiconductor constant temperature system 3 are respectively arranged in the cabinet 1.

[0025] like Figure 3 As shown, the semiconductor constant temperature system 3 includes a cold water tank 31, a semiconductor cooling sheet 32, and a vertical heat dissipation structure 33 provided on one side adjacent to the cold water tank 31. The utility model adopts the semiconductor cooling sheet 32 ​​to cool the cooling water, and cools the laser welding system 2 by the cooling water. Compared with the existing water cooling system, the utility model adopts the semiconductor cooling sheet 32, which has low material cost and production cost, and can be applied to various harsh environments and transportation conditions at any angle. At the same time, the semiconductor cooling sheet 32 ​​is small in size, making the entire laser welding machine compact and small in size, and can be easily moved to the site where welding is required.

[0026] More specifically, during the operation of the laser welding machine, the laser will generate a lot of heat, and excessive heat will affect the welding effect of the workpiece. The cooling device can effectively reduce the temperature generated by the laser welding machine during operation, ensuring that the temperature required for laser welding is more appropriate, thereby maintaining the accuracy and stability of welding. Long-term high-temperature operation will damage the circuit and optical path components of the laser welding machine, and may even damage the equipment and cause it to fail to operate normally. The cooling device can dissipate heat in time, reduce the temperature of the equipment, and protect the equipment from high temperature damage.

[0027] There are two main types of cooling devices for laser welding machines: air cooling and water cooling. The principle of air cooling is to use a fan 331 to dissipate heat from the laser. It has the advantages of small size and low cost, but the heat dissipation effect of air cooling is not as good as that of water cooling, it is noisy, and it is easily affected by the external temperature. What's more, the air cooling temperature cannot be adjusted and controlled, and it is not suitable for handheld laser welding machines with high cooling requirements. In contrast, water cooling is more suitable for cooling laser welding machines.

[0028] Water cooling is a method of cooling the laser through water circulation. As described above, water cooling often uses a compressor to cool the water temperature. The principle is: the compressor compresses the refrigerant and sends it to the condenser. The refrigerant dissipates heat in the condenser. This heat is absorbed by the water on the cooling tower. After absorbing the heat, the water turns into steam, and the refrigerant cools and becomes liquid. Through the expansion valve, the pressure of the refrigerant is reduced, causing it to evaporate in the evaporator, thereby absorbing heat from the air and achieving a cooling effect. Using cooling water circulation to dissipate heat allows the compressor to maintain stable operation even in high temperature environments.

[0029] With the market demand, laser welding machines are also developing in the direction of miniaturization, but the compressor is large in size and heavy in weight. Laser welding machines that use compressors to achieve water cooling also require larger installation space and heavier equipment weight, which is contrary to the concept of laser welding machines developing in the direction of miniaturization. Furthermore, compressors are divided into fixed-frequency compressors and variable-frequency compressors. When a fixed-frequency compressor is running, its speed is fixed regardless of the load size, so when the load is low, it will still consume a lot of energy, resulting in relatively low energy efficiency; because the fixed-frequency compressor will stop working after reaching the set temperature, and will restart when the temperature rises again, this frequent start and stop will produce greater noise and vibration. Variable-frequency compressors are more complex in design and manufacturing.

[0030] In summary, water cooling is suitable for laser welding machines, but not for compressors. Therefore, the utility model uses a semiconductor refrigeration sheet 32 ​​for water cooling. When the current passes through the galvanic couple formed by two different semiconductor materials in series, the semiconductor refrigeration sheet 32 ​​can absorb heat and release heat at both ends of the galvanic couple to achieve a cooling effect. The thermoelectric effect of semiconductor materials can achieve very fine temperature regulation and more accurate temperature control, and semiconductor materials can be made very small, so that the volume of the entire cooling system is also reduced accordingly, making the entire laser welding machine compact and small in size, and can be easily moved to the site where welding is required.

[0031] like Figure 4 As shown, a water outlet plate 34 is provided at the top of the cold water tank 31, and a semiconductor cooling sheet 32 ​​is embedded in one end of the cold water tank 31 close to the vertical heat dissipation structure 33. The vertical heat dissipation structure 33 is connected to the semiconductor cooling sheet 32 ​​through a heat pipe 35. The utility model uses the vertical heat dissipation structure 33 to dissipate heat for the hot end of the semiconductor cooling sheet 32. A radiator 36 is provided on the inner wall of one end of the semi-cold water tank 31 where the semiconductor cooling sheet 32 ​​is provided. The cold end of the semiconductor cooling sheet 32 ​​contacts the cooling water through the radiator 36. A water outlet hole 311 and a water level sensor 38 are provided at one end of the cold water tank 31 away from the semiconductor cooling sheet 32. The conductor cooling sheet and the vertical heat dissipation structure 33 are arranged in a vertical direction, and a water barrier 37 is provided between the radiator 36 and the water outlet hole 311. This allows the cooling water to fully exchange heat with the radiator 36 at one end of the cold water tank 31 close to the semiconductor cooling sheet 32.

[0032] Although the semiconductor refrigeration sheet 32 ​​is a suitable material for cooling the cold water tank 31, there are still problems that need to be solved. The semiconductor refrigeration sheet 32 ​​has a hot end and a cold end. The cold end is used to cool the cooling water, but the hot end still needs to dissipate heat. Therefore, the utility model connects the vertical heat dissipation structure 33 through a heat pipe 35 to dissipate heat from the hot end of the semiconductor refrigeration sheet 32.

[0033] At the same time, how to achieve greater contact between the cooling water and the semiconductor cooling sheet 32 ​​and ensure that the circulating cooling water is effectively cooled. The utility model abandons the idea of ​​arranging the semiconductor cooling sheet 332 at the bottom of the cold water tank 31, and arranges the semiconductor cooling sheet 32 ​​at the side end of the cold water tank 31 in a vertical direction and contacts the cooling water through the radiator 36, which saves space in the cabinet 1 and makes the laser welding machine more compact; secondly, a water baffle 37 is set to allow the cooling water to accumulate between the water baffle 37 and the cooling sheet until it submerges the water baffle 37, during which the cooling water will fully exchange heat with the radiator 36 to achieve cooling.

[0034] The following are preferred embodiments of the present invention.

[0035] Example 1

[0036] A compact laser welding machine using a semiconductor constant temperature system, such as Figure 1 As shown, it includes a cabinet 1, a laser welding system 2 for welding workpieces, and a semiconductor constant temperature system 3 for adjusting the temperature of the laser welding system 2. The laser welding system 2 and the semiconductor constant temperature system 3 are respectively arranged in the cabinet 1. The laser welding system 2 is arranged on a side adjacent to the semiconductor constant temperature system 3, and a partition 5 is arranged between the laser welding system 2 and the semiconductor constant temperature system 3. The partition 5 is used to separate the laser welding system 2 from the semiconductor constant temperature system 3 to prevent the external temperature of the laser welding system 2 from affecting the semiconductor constant temperature system 3. An external fan 4 is arranged at one end of the partition 5 away from the cold water tank 31, and the external fan 4 is used to assist the semiconductor constant temperature system 3 and dissipate heat for the heat sink 332.

[0037] The laser welding system 2 includes a laser generating device 21 and a welding gun assembly 22 connected to the laser generating device 21. The laser generating device 21 generally includes a laser, a power supply, a cooling system, and a control system, and is responsible for generating a high-energy-density laser beam. These laser beams are focused and guided by specific optical elements to achieve the desired welding effect. The welding gun assembly 22 generally includes an optical fiber, a focusing lens, a protective lens, a nozzle, and other parts, and the welding gun assembly 22 is responsible for transmitting the laser beam to the workpiece to be welded. The laser welding system 2 of the utility model is similar in composition and principle to the laser welding system 2 on the market, and will not be described in detail here.

[0038] The semiconductor constant temperature system 3 includes a cold water tank 31, a semiconductor cooling plate 32, and a vertical heat dissipation structure 33 disposed on one side adjacent to the cold water tank 31. A water outlet plate 34 is disposed at the top of the cold water tank 31. Figure 4As shown, cooling water flows down along the inner wall of the cold water tank 31 from the surrounding of the water outlet plate 34. The semiconductor cooling sheet 32 ​​is embedded in one end of the cold water tank 31 close to the vertical heat dissipation structure 33. The inner wall of one end of the cold water tank 31 provided with the semiconductor cooling sheet 32 ​​is provided with a radiator 36. More specifically, a placement groove 312 is provided on the cold water tank 31, and the semiconductor cooling sheet 32 ​​is embedded in the placement groove 312. The side of the semiconductor cooling sheet 32 ​​away from the vertical heat dissipation structure 33 is close to the radiator 36. The cold end of the semiconductor cooling sheet 32 ​​contacts the radiator 36 and exchanges heat with the cooling water through the radiator 36.

[0039] The vertical heat dissipation structure 33 is connected to the semiconductor cooling plate 32 through the heat conduction pipe 35. The semiconductor cooling plate 32 and the vertical heat dissipation structure 33 are arranged in a vertical direction. There are four semiconductor cooling plates 32 and four vertical heat dissipation structures 33 respectively. The four semiconductor cooling plates 32 and the vertical heat dissipation structures 33 are arranged in a vertical direction respectively. Each semiconductor cooling plate 32 is connected to a vertical heat dissipation structure 33 and heat transfer occurs. Firstly, the space of the cabinet 1 is saved, making the laser welding machine more compact; secondly, a water baffle 37 is set to allow cooling water to accumulate between the water baffle 37 and the cooling plate until it submerges the water baffle 37. During this period, the cooling water will fully exchange heat with the radiator 36 to achieve cooling.

[0040] The vertical heat dissipation structure 33 includes a fan 331 and heat sinks 332 arranged on opposite sides of the fan 331. The end of the heat sink 332 close to the cold water tank 31 is connected to the semiconductor cooling sheet 32 ​​through a heat pipe 35. A fixing member 333 is provided on the side of the vertical heat dissipation structure 33 away from the cold water tank 31. The fan 331 and the heat sink 332 are fixed on the fixing member 333. The fixing member 333 is used to fix four vertically arranged vertical heat dissipation structures 33. The heat sink 332 is connected to the hot end of the semiconductor cooling sheet 32 ​​through the heat pipe 35 to dissipate heat for the semiconductor cooling sheet 32. The fan 331 assists the heat sink 332 in dissipating heat.

[0041] The end of the cold water tank 31 away from the semiconductor cooling sheet 32 ​​is provided with a water outlet 311 and a water level sensor 38. The water level sensor 38 is arranged above the water outlet 311. The water outlet 311 is connected to the water pump 6. When the water level in the cold water tank 31 exceeds the water level sensor 38, the switch of the water pump 6 is triggered to discharge the cooling water. The longitudinal direction of the cold water tank 31 is arranged along the vertical direction, which occupies a small ground area. At the same time, it is easy to control the water level in the cold water tank 31 and make it more fully contact with the radiator 36.

[0042] A water baffle 37 is provided between the radiator 36 and the water outlet 311. The bottom end of the water baffle 37 is fixed to the bottom end of the cold water tank 31. The top height of the water baffle 37 is higher than the height of the semiconductor cooling plate 32 and lower than the height of the water outlet plate 34. That is, when the water level is submerged in the water baffle 37, the radiator 36 is fully in contact with the cooling water. When the water level is submerged in the water baffle 37, part of the radiator 36 still cannot be in contact with the cooling water, resulting in a waste of the semiconductor cooling plate 32. The distance between the water baffle 37 and the semiconductor cooling plate 32 is smaller than the distance between the water baffle 37 and the water outlet 311. When the cooling water flows down from the water outlet plate 34, the cooling water level between the water baffle 37 and the semiconductor cooling plate 32 is higher than the cooling water level between the water baffle 37 and the water outlet 311. In case the cooling water level between the water baffle 37 and the water outlet 311 reaches the water level sensor 38 first, the water pump 6 discharges the uncooled water.

[0043] The working process of the entire semiconductor constant temperature system 3 is as follows: the cooling water with heat flows down from the water outlet plate 34 along the inner wall of the cold water tank 31, the cold end of the semiconductor refrigeration plate 32 contacts the radiator 36 and cools the cooling water through the radiator 36, the water level rises slowly, and the cooling water between the water baffle plate 37 and the semiconductor refrigeration plate 32 will exchange heat with the radiator 36. When the water level between the water baffle plate 37 and the semiconductor refrigeration plate 32 exceeds the height of the water baffle plate 37, the cooled cooling water will flow into the position between the water baffle plate 37 and the water outlet hole 311. When the water level between the water baffle plate 37 and the water outlet hole 311 exceeds the water level sensor 38, the switch of the water pump 6 is triggered, and the cooling water is discharged from the drain port to achieve water circulation cooling.

[0044] The above is only a preferred embodiment of the present invention. It should be pointed out that ordinary technicians in this technical field can make several improvements and modifications without departing from the principle of the present invention. These improvements and modifications should also be regarded as the protection scope of the present invention.

Claims

1. A compact laser welding machine using a semiconductor constant temperature system, characterized in that: It comprises a cabinet (1), a laser welding system (2) for welding workpieces, and a semiconductor constant temperature system (3) for adjusting the temperature of the laser welding system (2), wherein the laser welding system (2) and the semiconductor constant temperature system (3) are respectively arranged in the cabinet (1); The semiconductor constant temperature system (3) comprises a cold water tank (31), a semiconductor cooling sheet (32), and a vertical heat dissipation structure (33) arranged on one side adjacent to the cold water tank (31); a water outlet plate (34) is arranged at the top of the cold water tank (31); the semiconductor cooling sheet (32) is embedded in one end of the cold water tank (31) close to the vertical heat dissipation structure (33); the vertical heat dissipation structure (33) is connected to the semiconductor cooling sheet (32) via a heat conducting pipe (35); the semiconductor cooling sheet (32) and the vertical heat dissipation structure (33) are arranged in a vertical direction; a radiator (36) is arranged on the inner wall of one end of the cold water tank (31) where the semiconductor cooling sheet (32) is arranged; a water outlet hole (311) and a water level sensor (38) are arranged at one end of the cold water tank (31) away from the semiconductor cooling sheet (32); and a water barrier plate (37) is arranged between the radiator (36) and the water outlet hole (311).

2. The compact laser welding machine using a semiconductor constant temperature system according to claim 1, characterized in that: The laser welding system (2) is arranged on a side adjacent to the semiconductor constant temperature system (3), and a partition (5) is arranged between the laser welding system (2) and the semiconductor constant temperature system (3), and an external fan (4) is arranged at one end of the partition (5) away from the cold water tank (31).

3. The compact laser welding machine using a semiconductor constant temperature system according to claim 1, characterized in that: The vertical heat dissipation structure (33) comprises a fan (331) and heat sinks (332) arranged on opposite sides of the fan (331); one end of the heat sink (332) close to the cold water tank (31) is connected to the semiconductor cooling plate (32) via a heat conduction pipe (35); a fixing member (333) is provided on the side of the vertical heat dissipation structure (33) away from the cold water tank (31); and the fan (331) and the heat sink (332) are fixed on the fixing member (333).

4. The compact laser welding machine using a semiconductor constant temperature system according to claim 1, characterized in that: The laser welding system (2) comprises a laser generating device (21) and a welding gun assembly (22) connected to the laser generating device (21).

5. The compact laser welding machine using a semiconductor constant temperature system according to claim 1, characterized in that: The longitudinal direction of the cold water tank (31) is arranged along the vertical direction, the bottom end of the water baffle plate (37) is fixed to the bottom end of the cold water tank (31), the top end height of the water baffle plate (37) is higher than the height of the semiconductor refrigeration plate (32) and lower than the height of the water outlet plate (34), and the distance between the water baffle plate (37) and the semiconductor refrigeration plate (32) is smaller than the distance between the water baffle plate (37) and the water outlet hole (311).

6. The compact laser welding machine using a semiconductor constant temperature system according to claim 1, characterized in that: The water level sensor (38) is arranged above the water outlet hole (311), and the water outlet hole (311) is connected to the water pump (6).

7. The compact laser welding machine using a semiconductor constant temperature system according to claim 1, characterized in that: Four semiconductor refrigeration sheets (32) and four vertical heat dissipation structures (33) are provided respectively, and the four semiconductor refrigeration sheets (32) and the vertical heat dissipation structures (33) are arranged in a vertical direction respectively, and each semiconductor refrigeration sheet (32) is connected to a vertical heat dissipation structure (33) to generate heat transfer.

8. The compact laser welding machine using a semiconductor constant temperature system according to claim 1, characterized in that: The cold water tank (31) is provided with a placement groove (312), the semiconductor cooling sheet (32) is embedded in the placement groove (312), and a side of the semiconductor cooling sheet (32) away from the vertical heat dissipation structure (33) is in close contact with the radiator (36).

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