Turnover clamp for automobile semiconductor detection

Abstract

The utility model discloses a turnover fixture for automobile semiconductor detection, which comprises a turnover clamping assembly and a semiconductor clamping and fixing assembly, the semiconductor clamping and fixing assembly comprises a fixed clamping tool and a movable clamping tool, the fixed clamping tool and the movable clamping tool comprise clamping groove plates, and the clamping groove plates are arranged on the turnover clamping assembly. The device can reduce the manual tightening of a bolt to clamp and fix a semiconductor plate, reduces the time and labor intensity of manual operation, can accurately control the clamping force, avoids the quality problem of the semiconductor plate caused by improper manual operation, and improves the working efficiency. And then the rubber pads on the fixed clamping plate and the movable clamping plate are contacted and clamped on the surface of the semiconductor plate, so that the semiconductor plate can be prevented from being damaged or damaged in the clamping and fixing process.

Description

Technical Field

[0001] The utility model relates to the technical field of packaging equipment, in particular to a flippable clamp for automobile semiconductor detection. Background Art

[0002] In the inspection of automotive-grade semiconductors, this fixture can provide stable support and flexible angle adjustment, making it convenient for inspectors to conduct comprehensive tests on semiconductor devices. With the development of automotive electrification and intelligence, the demand and inspection needs for automotive-grade semiconductors have also increased significantly, and this fixture has broad application prospects.

[0003] In the current automotive semiconductor testing process, the semiconductor board is clamped and fixed by a clamping device, and the clamping plate is further tightened and fixed using multiple bolts. The automotive semiconductor is clamped and fixed by the clamping plate, which may make the installation and removal of the semiconductor board very troublesome, inconvenient for the inspectors to operate, and the process requires a lot of time. Utility Model Content

[0004] The purpose of the utility model is to provide a flippable automobile semiconductor testing fixture to solve the problems raised in the above background technology.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a flippable automotive semiconductor detection fixture, comprising a flip clamping assembly and a semiconductor clamping and fixing assembly, the semiconductor clamping and fixing assembly includes a fixed clamp and a movable clamp, the fixed clamp and the movable clamp include a clamping slot plate, the upper end of the clamping slot plate is connected and fixed to a clamping hydraulic cylinder by bolts, a rectangular groove is provided inside the clamping slot plate, the inner bottom end of the rectangular groove is connected and fixed to a fixed clamping plate by bolts, a movable clamping plate is provided above the fixed clamping plate, the upper end of the movable clamping plate is connected and fixed to a clamping guide column by bolts, and a clamping hydraulic cylinder is fixedly installed on the upper end of the clamping guide column.

[0006] As a further preferred embodiment of the technical solution, one end of the fixed clamping plate and the movable clamping plate is adhered with a rubber pad, and the fixed clamping plate and the movable clamping plate are clamped to fix the semiconductor board.

[0007] As a further preferred embodiment of the present technical solution, movable guide rail plates are installed on both side ends of the fixed clamp, and movable grooves are provided inside the movable guide rail plates.

[0008] As a further preferred embodiment of the present technical solution, the moving groove of the moving guide plate is slidably connected to a first sliding block and a second sliding block, and the first sliding block and the second sliding block are connected to both side ends of the clamping groove plate of the moving clamp by welding.

[0009] As a further preferred embodiment of the technical solution, the interior of the second sliding block is connected with a threaded screw by rotation, and a servo motor is installed at one end of the threaded screw.

[0010] As a further preferred embodiment of the present technical solution, one end of the servo motor is connected to one end of the second mounting plate by bolts, the second mounting plate is connected to one end of the movable guide plate by bolts, and one end of the movable guide plate is connected and fixed to the first mounting plate by bolts.

[0011] As a further preferred embodiment of the present technical solution, one end of the first mounting plate is connected and fixed to the second connecting shaft by bolts, one end of the second connecting shaft is fixedly mounted with a rotating motor, one end of the second mounting plate is connected and fixed to the first connecting shaft by bolts, the first connecting shaft is connected to the inside of the bearing by rotation, the rotating motor and the bearing are connected to one end of the fixing plate by bolts, the fixing plate is connected to both side ends of the detection workbench by bolts, and a whetstone is installed at the lower end of the detection workbench.

[0012] The utility model provides a reversible automobile semiconductor testing fixture, which has the following beneficial effects:

[0013] (1) The utility model drives the clamping hydraulic cylinder to move the clamping guide column downward. During the downward movement of the clamping guide column, the movable clamping plate is further moved. The semiconductor board is clamped and fixed by the movement of the movable clamping plate, and the movable clamping plate is clamped on the upper surface of the semiconductor board, which can reduce the manual tightening of bolts to clamp the semiconductor board, reduce the time and labor intensity of manual operation, and can accurately control the clamping force to avoid quality problems of the semiconductor board caused by improper manual operation. Afterwards, the clamping plate and the rubber pad on the movable clamping plate are contacted and clamped on the surface of the semiconductor board, which can avoid damage or breakage of the semiconductor board during the clamping and fixing process.

[0014] (2) The utility model adjusts the moving distance of the clamping groove plate of the mobile clamp on the movable guide plate through the second sliding block and the first sliding block. The clamping groove plate of the mobile clamp can be adjusted according to different sizes of automobile semiconductor boards, which can effectively adapt to clamping and fixing automobile semiconductor boards of different sizes, thereby improving the application range and flexibility of the equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0016] Figure 2 It is a schematic diagram of the semiconductor clamping and fixing assembly structure of the utility model;

[0017] Figure 3It is a schematic diagram of the internal structure of the movable groove of the utility model;

[0018] Figure 4 It is a schematic diagram of the structure of the sliding block and the clamping slot plate of the utility model;

[0019] Figure 5 It is a schematic diagram of the structure of the fixed clamping plate and the movable clamping plate of the utility model;

[0020] Figure 6 It is a schematic diagram of the structure of the connecting shaft and the rotating motor of the utility model;

[0021] In the figure: 100, flip clamping assembly; 101, pillar; 102, fixed plate; 103, rotating motor; 104, detection workbench; 105, bearing; 106, first connecting shaft; 107, second connecting shaft; 200, semiconductor clamping and fixing assembly; 201, movable guide plate; 202, first mounting plate; 203, second mounting plate; 204, threaded screw; 205, servo motor; 206, movable clamp; 207, fixed clamp; 208, semiconductor board; 209, movable groove; 210, clamping groove plate; 211, rectangular groove; 213, first sliding block; 214, second sliding block; 215, clamping hydraulic cylinder; 216, clamping guide column; 217, movable clamping plate; 218, fixed clamping plate; 219, rubber pad. DETAILED DESCRIPTION

[0022] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the accompanying drawings in the embodiments of the present invention.

[0023] The utility model provides a technical solution: Figure 1-5 As shown, in this embodiment, a flippable automotive semiconductor testing fixture includes a flip clamping assembly 100 and a semiconductor clamping and fixing assembly 200, the semiconductor clamping and fixing assembly 200 includes a fixed clamp 207 and a movable clamp 206, the fixed clamp 207 and the movable clamp 206 include a clamping slot plate 210, the upper end of the clamping slot plate 210 is connected and fixed to a clamping hydraulic cylinder 215 by bolts, a rectangular groove 211 is provided inside the clamping slot plate 210, the inner bottom end of the rectangular groove 211 is connected and fixed to a fixed clamping plate 218 by bolts, a movable clamping plate 217 is provided above the fixed clamping plate 218, the upper end of the movable clamping plate 217 is connected and fixed to a clamping guide column 216 by bolts, and a clamping hydraulic cylinder 215 is fixedly installed on the upper end of the clamping guide column 216.

[0024] like Figure 5As shown, a rubber pad 219 is pasted to one end of the fixed clamping plate 218 and the movable clamping plate 217 , and the fixed clamping plate 218 and the movable clamping plate 217 are clamped to fix the semiconductor board 208 .

[0025] By placing the automobile semiconductor board 208 on the fixed clamp 207 and the movable clamp 206, and by the clamping slot 210 of the fixed clamp 207 and the movable clamp 206, the semiconductor board 208 is placed on the upper surface of the fixed clamping plate 218 at the bottom end of the clamping slot 210, and the clamping hydraulic cylinder 215 is driven to drive the clamping guide column 216 to move downward, and the movable clamping plate 217 is further moved during the downward movement of the clamping guide column 216, and the semiconductor board 208 is moved forward by the movement of the movable clamping plate 217. The semiconductor board 208 is clamped and fixed in place, and the movable clamping plate 217 is clamped on the upper surface of the semiconductor board 208, which can reduce the manual tightening of bolts to clamp and fix the semiconductor board 208, reduce the time and labor intensity of manual operation, and can accurately control the clamping force to avoid quality problems of the semiconductor board 208 caused by improper manual operation. After that, the clamping plate 218 and the rubber pad 219 on the movable clamping plate 217 are contacted and clamped on the surface of the semiconductor board 208, which can avoid damage or breakage of the semiconductor board 208 during the clamping and fixing process.

[0026] like Figure 1-4 As shown, movable guide plates 201 are installed on both side ends of the fixed clamp 207, and a movable groove 209 is opened inside the movable guide plate 201. The movable groove 209 of the movable guide plate 201 is connected with a first sliding block 213 and a second sliding block 214 through sliding connection. The first sliding block 213 and the second sliding block 214 are connected to both side ends of the clamping groove plate 210 of the movable clamp 206 by welding. The inside of the second sliding block 214 is connected with a threaded screw 204 through rotation. A servo motor 205 is installed at one end of the threaded screw 204. One end of the servo motor 205 is connected to one end of the second mounting plate 203 by bolts. The second mounting plate 203 is connected to one end of the movable guide plate 201 by bolts. One end of the movable guide plate 201 is connected and fixed to the first mounting plate 202 by bolts.

[0027] The servo motor 205 is driven to drive the threaded screw 204 to rotate inside the second sliding block 214, and further drive the second sliding block 214 to adjust the moving distance inside the moving groove 209. During the process of adjusting the moving distance on the moving guide plate 201 by the second sliding block 214, the clamping groove plate 210 of the mobile clamp 206 will be further driven to move. The second sliding block 214 and the first sliding block 213 and the clamping groove plate 210 of the mobile clamp 206 are used to adjust the moving distance on the moving guide plate 201. The clamping groove plate 210 of the mobile clamp 206 can be adjusted according to different sizes of automobile semiconductor boards 208, and can effectively adapt to clamping and fixing automobile semiconductor boards 208 of different sizes, thereby improving the application range and flexibility of the equipment.

[0028] like Figure 1 , Figure 6 As shown, one end of the first mounting plate 202 is connected and fixed to the second connecting shaft 107 by bolts, one end of the second connecting shaft 107 is fixedly installed with a rotating motor 103, one end of the second mounting plate 203 is connected and fixed to the first connecting shaft 106 by bolts, the first connecting shaft 106 is connected to the inside of the bearing 105 by rotation, the rotating motor 103 and the bearing 105 are connected to one end of the fixing plate 102 by bolts, the fixing plate 102 is connected to the two side ends of the detection workbench 104 by bolts, and the lower end of the detection workbench 104 is installed with a pillar 101, the second connecting shaft 107 is driven to rotate by the rotating motor 103, and the semiconductor clamping and fixing assembly 200 is further driven to rotate, and the first connecting shaft 106 is further driven to rotate inside the bearing 105. During the rotation of the semiconductor clamping and fixing assembly 200, it is convenient for the inspector to inspect the automotive semiconductor board 208.

[0029] The utility model provides a reversible fixture for automobile semiconductor testing, and the specific working principle is as follows: the second connecting shaft 107 is driven to rotate by the rotating motor 103, which further drives the semiconductor clamping and fixing component 200 to rotate, and further drives the first connecting shaft 106 to rotate inside the bearing 105. During the rotation of the semiconductor clamping and fixing component 200, it is convenient for the testing personnel to test the automobile semiconductor board 208, place the automobile semiconductor board 208 on the fixed clamp 207 and the mobile clamp 206, and When the semiconductor board 208 is placed on the upper surface of the fixed clamping plate 218 at the bottom end of the clamping slot plate 210 of the clamping device 206, the clamping guide column 216 is driven downward by driving the clamping hydraulic cylinder 215. During the downward movement of the clamping guide column 216, the movable clamping plate 217 is further moved. The semiconductor board 208 is clamped and fixed by the movement of the movable clamping plate 217, and the movable clamping plate 217 is clamped on the upper surface of the semiconductor board 208, which can reduce the manual tightening of bolts to clamp and fix the semiconductor board 208. The time and labor intensity of manual operation are reduced, the clamping force can be accurately controlled, and the quality problems of the semiconductor board 208 caused by improper manual operation can be avoided. Then, the rubber pad 219 on the fixed clamping plate 218 and the movable clamping plate 217 is contacted and clamped on the surface of the semiconductor board 208, so that the semiconductor board 208 can be prevented from being damaged or broken during the clamping and fixing process. The servo motor 205 is driven to drive the threaded screw 204 to rotate inside the second sliding block 214, and further drive the second sliding block 214 to move the distance adjustment inside the moving groove 209. During the process of adjusting the moving distance on the movable guide plate 201 through the second sliding block 214, the clamping slot plate 210 of the movable clamp 206 will be further driven to move. The moving distance is adjusted on the movable guide plate 201 through the second sliding block 214 and the first sliding block 213 and the clamping slot plate 210 of the movable clamp 206. The clamping slot plate 210 of the movable clamp 206 can be adjusted according to different sizes of automobile semiconductor boards 208, and can effectively adapt to clamping and fixing automobile semiconductor boards 208 of different sizes, thereby improving the application range and flexibility of the equipment.

[0030] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A reversible automobile semiconductor testing fixture, comprising a reversible clamping assembly (100) and a semiconductor clamping and fixing assembly (200), characterized in that: The semiconductor clamping and fixing assembly (200) includes a fixed clamp (207) and a movable clamp (206), wherein the fixed clamp (207) and the movable clamp (206) include a clamping slot plate (210), wherein the upper end of the clamping slot plate (210) is connected and fixed to a clamping hydraulic cylinder (215) by bolts, wherein a rectangular groove (211) is provided inside the clamping slot plate (210), wherein the inner bottom end of the rectangular groove (211) is connected and fixed to a fixed clamping plate (218) by bolts, wherein a movable clamping plate (217) is provided above the fixed clamping plate (218), wherein the upper end of the movable clamping plate (217) is connected and fixed to a clamping guide column (216) by bolts, wherein the upper end of the clamping guide column (216) is fixedly mounted with a clamping hydraulic cylinder (215).

2. The reversible automobile semiconductor testing fixture according to claim 1, characterized in that: One end of the fixed clamping plate (218) and the movable clamping plate (217) are bonded with a rubber pad (219), and the fixed clamping plate (218) and the movable clamping plate (217) are clamped to fix the semiconductor plate (208).

3. The reversible automobile semiconductor testing fixture according to claim 1, characterized in that: The two side ends of the fixed clamp (207) are mounted with movable guide rail plates (201), and the movable guide rail plates (201) are provided with movable grooves (209) inside.

4. The reversible automobile semiconductor testing fixture according to claim 3, characterized in that: The moving groove (209) of the moving guide plate (201) is slidably connected to a first sliding block (213) and a second sliding block (214); the first sliding block (213) and the second sliding block (214) are connected to both side ends of the clamping groove plate (210) of the moving clamp (206) by welding.

5. The reversible automobile semiconductor testing fixture according to claim 4, characterized in that: The interior of the second sliding block (214) is connected to a threaded screw (204) by rotation, and a servo motor (205) is installed at one end of the threaded screw (204).

6. The reversible automobile semiconductor testing fixture according to claim 5, characterized in that: One end of the servo motor (205) is connected to one end of the second mounting plate (203) by bolts, the second mounting plate (203) is connected to one end of the movable guide plate (201) by bolts, and one end of the movable guide plate (201) is connected and fixed to the first mounting plate (202) by bolts.

7. The reversible automobile semiconductor testing fixture according to claim 6, characterized in that: One end of the first mounting plate (202) is connected and fixed to the second connecting shaft (107) by bolts, one end of the second connecting shaft (107) is fixedly mounted with a rotating motor (103), one end of the second mounting plate (203) is connected and fixed to the first connecting shaft (106) by bolts, the first connecting shaft (106) is connected to the inside of the bearing (105) by rotation, the rotating motor (103) and the bearing (105) are connected to one end of the fixing plate (102) by bolts, the fixing plate (102) is connected to both side ends of the detection workbench (104) by bolts, and a whetstone (101) is installed at the lower end of the detection workbench (104).

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