Wafer carrying robot

Abstract

The utility model discloses a wafer carrying robot which comprises a rack, a mechanical arm and an end effector, and the end effector comprises a base connected with the mechanical arm; the executing mechanism is connected with the base, and the executing mechanism comprises a rotatable overturning shaft and a movable clamping finger; the scanning part is arranged on one side of the executing mechanism and is used for scanning the position of the wafer; and the first adsorption plate is arranged on the other side of the execution mechanism and is connected with the turnover shaft, so that the first adsorption plate moves along with the rotation of the turnover shaft, the first adsorption plate can be driven by the mechanical arm to adsorb the wafer, and the wafer is clamped on the first adsorption plate through the clamping fingers.

Description

Technical Field

[0001] The present application relates to the technical field of handling equipment, and in particular to a wafer handling robot. Background Art

[0002] With the rapid development of the semiconductor industry, the requirements for wafer handling are becoming increasingly higher. After the initial transfer of manpower to the development of wafer handling robots, how to efficiently and conveniently cope with different wafer transmission scenarios has put forward higher requirements for wafer handling robots.

[0003] Existing wafer handling robots have the following problems during the handling process: low handling accuracy, easy to damage the wafer. Lack of flexibility, difficult to adapt to the handling needs of wafers of different sizes and shapes. Therefore, during the wafer handling process, it is necessary to consider how to accurately clamp and move the wafer to avoid damage. Utility Model Content

[0004] The purpose of the embodiment of the present application is to provide a wafer handling robot, including a frame, a mechanical arm and an end effector, wherein the end effector includes:

[0005] A base connected to the robotic arm;

[0006] An actuator connected to the base, the actuator comprising a rotatable flip shaft and movable clamping fingers;

[0007] A scanning unit, which is arranged on one side of the actuator and is used to scan the position of the wafer;

[0008] The first adsorption plate is arranged on the other side of the actuator and connected to the flip shaft so that the first adsorption plate moves with the rotation of the flip shaft. The first adsorption plate can adsorb the wafer under the drive of the robotic arm and clamp the wafer on the first adsorption plate through the clamping fingers.

[0009] As an optional embodiment, the base is provided with supporting bearings arranged opposite to each other, and the supporting bearings are respectively used to support both ends of the flip shaft.

[0010] As an optional embodiment, the actuator further includes a motor for rotating the flip axis.

[0011] As an optional embodiment, a driving pulley is provided on the output shaft of the motor, a driven pulley is provided at one end of the flip shaft close to the motor, and the driving pulley is connected to the driven pulley by a belt.

[0012] As an optional embodiment, a protrusion is provided on the flip shaft, and the actuator further includes a limit switch, and the limit switch can detect the protrusion to limit the rotation range of the flip shaft.

[0013] As an optional embodiment, the first adsorption plate is provided with a plurality of evenly distributed adsorption holes, and the actuator further comprises an air path, which is communicated with the adsorption holes.

[0014] As an optional embodiment, a locking block is provided at one end of the flip shaft, a mounting plate connected to the locking block is provided on one side of the locking block, and the first adsorption plate is arranged on the mounting plate so that the rotation of the flip shaft drives the rotation of the first adsorption plate.

[0015] As an optional embodiment, a limiting protrusion is provided on one side of the first adsorption plate, and the actuator also includes a clamping cylinder, which is horizontally installed on the locking block. The output end of the clamping cylinder moves so that the clamping fingers move closer to or away from the limiting protrusion in the horizontal direction.

[0016] As an optional embodiment, the robotic arms are provided in two groups, wherein one group of the robotic arms is connected to the first adsorption plate, and the other group of the robotic arms is connected to the second adsorption plate, and adsorption holes are provided on the second adsorption plate to adsorb the wafer under the drive of the robotic arms.

[0017] As an optional embodiment, an electric box is further included, and the electric box is connected to the rack.

[0018] The beneficial effects of the embodiments of the present application are:

[0019] The application has a reasonable structural design and has precise clamping and moving capabilities. The first adsorption plate and clamping fingers on the end effector can safely transport wafers, which enhances the flexibility of the equipment and can adapt to the needs of wafer transportation of different specifications. At the same time, the robot is also equipped with a scanning unit that can accurately scan the position of the wafer, improving the efficiency and accuracy of transportation. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is a schematic diagram of the structure of an embodiment of the present application;

[0021] Figure 2 An assembly diagram of an end effector of an embodiment of the present application;

[0022] Figure 3 This is a schematic structural diagram of the first adsorption plate of an embodiment of the present application;

[0023] Figure 4 A bottom view of the end effector of an embodiment of the present application;

[0024] Figure 5 is a full cross-sectional view of the end effector of an embodiment of the present application;

[0025] Figure 6 for Figure 4 The view along the AA line in the middle;

[0026] Figure 7 An exploded view of the end effector of an embodiment of the present application.

[0027] Reference numerals:

[0028] A1, frame; A2, robot arm; A3, end effector; A4, second adsorption plate; 1, base; 2, actuator; 3, first adsorption plate; 4, scanning part; 2.1, motor; 2.2, driven pulley; 2.3, flip axis; 2.31, protrusion; 2.4, limit switch; 2.5, support bearing; 2.6, locking block; 2.7, air path; 2.8, mounting plate; 2.9, clamping cylinder; 2.10, clamping finger; 2.11, limit protrusion; 2.12 detection sensor. DETAILED DESCRIPTION

[0029] Various aspects and features of the present application are described herein with reference to the accompanying drawings.

[0030] It should be understood that various modifications may be made to the embodiments of the present application. Therefore, the above description should not be considered as limiting, but only as an example of an embodiment. Other modifications within the scope of the present application will occur to those skilled in the art.

[0031] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the present application and, together with the general description of the present application given above and the detailed description of the embodiments given below, serve to explain the principles of the present application.

[0032] These and other characteristics of the present application will become apparent from the following description of a preferred form of embodiment given as a non-limiting example with reference to the accompanying drawings.

[0033] It should also be understood that although the present application has been described with reference to some specific examples, those skilled in the art will be able to readily implement many other equivalent forms of the present application.

[0034] The above and other aspects, features and advantages of the present application will become more apparent in view of the following detailed description when taken in conjunction with the accompanying drawings.

[0035] Specific embodiments of the present application are described hereinafter with reference to the accompanying drawings; however, it should be understood that the embodiments applied for are merely examples of the present application, which may be implemented in a variety of ways. Well-known and / or repeated functions and structures are not described in detail to avoid unnecessary or redundant details that obscure the present application. Therefore, the specific structural and functional details applied for herein are not intended to be limiting, but merely serve as a basis and representative basis for the claims to teach those skilled in the art to use the present application in a variety of ways with substantially any suitable detailed structure.

[0036] This specification may use the phrases "in one embodiment," "in another embodiment," "in yet another embodiment," or "in other embodiments," all of which may refer to one or more of the same or different embodiments according to the present application.

[0037] Example 1

[0038] The present application embodiment provides a wafer handling robot, such as Figure 1 and Figure 3 As shown, it includes a frame A1, a robot arm A2 and an end effector A3, wherein the end effector A3 includes a base 12, an actuator 2, a first adsorption plate 3 and a scanning unit 4. It also includes an electric box, which is connected to the frame A1.

[0039] The rack A1 can be divided into 300mm stroke, 450mm stroke and 500mm stroke according to different Z-axis strokes; in addition, according to different loads, the rack A1 can be divided into standard load and high load. The robot arm A2 can be divided into 156mm arm length, 190mm arm length and 260mm arm length according to different arm span lengths; in addition, according to different loads, the robot arm A2 can be divided into standard load and high load; according to the number of robot arms A2, it can be divided into single arm and double arms.

[0040] In the present application, the frame A1 and the robot arm A2 are connected via a standard interface and are connected and fixed by bolts. The robot arm A2 and the end effector A3 are connected via a standard interface and are connected and fixed by bolts.

[0041] Therefore, in actual use, the frame A1 and the robot arm A2 can be quickly interchanged and freely combined. The interfaces between different components are unified, highly compatible, and easy to interchange, providing more options for actual application selection.

[0042] In addition, when a double-arm robot A2 is used, that is, two groups of the robot A2 are set, one group of the robot A2 is connected to the first adsorption plate 3, and the other group of the robot A2 is connected to the second adsorption plate A4. The second adsorption plate A4 is provided with adsorption holes to adsorb the wafer under the drive of the robot A2.

[0043] like Figure 2-Figure 5 As shown, the base 12 is connected to the robot arm A2 to ensure the stability and operating range of the robot. The actuator 2 is connected to the base 12 .

[0044] The actuator 2 includes a rotatable flip shaft 2.3 and a movable clamping finger 2.10, and also includes a support bearing 2.5, a locking block 2.6, a mounting plate 2.8, a motor, a driving pulley, a driven pulley 2.2, a belt, a protrusion 2.31, a limit switch 2.4, a limit protrusion 2.11 and a clamping cylinder 2.9.

[0045] Specifically, Figure 4 As shown, the base 12 is provided with supporting bearings 2.5 arranged opposite to each other, and the supporting bearings 2.5 are respectively used to support the two ends of the flip shaft 2.3 to ensure the stability of the flip shaft 2.3.

[0046] A locking block 2.6 is provided at one end of the flip shaft 2.3, and a mounting plate 2.8 connected thereto is provided on one side of the locking block 2.6. The first adsorption plate 3 is arranged on the mounting plate 2.8 so that the rotation of the flip shaft 2.3 drives the rotation of the first adsorption plate 3, thereby realizing the rotation of the first adsorption plate 3.

[0047] like Figure 5 As shown, the actuator 2 also includes a motor for rotating the flip shaft 2.3. A driving pulley is provided on the output shaft of the motor, and a driven pulley 2.2 is provided at one end of the flip shaft 2.3 close to the motor. The driving pulley and the driven pulley 2.2 are connected by a belt to achieve precise control of the flip shaft 2.3. The driven pulley 2.2 is connected to the flip shaft 2.3 by a locking screw.

[0048] like Figure 4 As shown, the flip shaft 2.3 is provided with a protrusion 2.31, and the actuator 2 further comprises a limit switch 2.4. The limit switch 2.4 can detect the protrusion 2.31 and is used to limit the rotation range of the flip shaft 2.3 to prevent damage.

[0049] like Figure 2 As shown, a limiting protrusion 2.11 is provided on one side of the first adsorption plate 3, and the actuator 2 also includes a clamping cylinder 2.9, which is horizontally mounted on the locking block 2.6. The output end of the clamping cylinder 2.9 moves so that the clamping fingers 2.10 move closer to or away from the limiting protrusion 2.11 in the horizontal direction to adapt to wafers of different sizes.

[0050] like Figure 2As shown, the scanning unit 4 is arranged on one side of the actuator 2, and is used to scan the wafer position and provide accurate positioning information for handling. Determining the wafer position by the scanning unit 4 is a technical means known to those skilled in the art, so it is briefly described in this application.

[0051] Specifically, the scanning unit 4 includes various sensors, and the robot uses various sensors (such as visual sensors, laser scanners, infrared sensors, etc.) to sense its working environment and the position of the wafer. The sensors collect information about the wafer, including but not limited to characteristic data such as position, size, shape, etc. The robot processes the data to build an internal map or model, which represents the layout of the working area, including the accurate position of the wafer.

[0052] Mapping the physical location of the wafer onto the robot's internal map ensures that the robot can identify and understand the spatial distribution of the wafer. The robot uses the mapped information to navigate and plan the optimal path from the current location to the target wafer location. Once the wafer's location is accurately mapped and located, the robot can perform handling tasks such as adsorption, handling, and placement of wafers.

[0053] like Figure 2 and Figure 4 As shown, the first adsorption plate 3 is arranged on the other side of the actuator 2 and is connected to the flip shaft 2.3 so that the first adsorption plate 3 moves with the rotation of the flip shaft 2.3. The first adsorption plate 3 can adsorb the wafer under the drive of the robot arm A2 and clamp the wafer on the first adsorption plate 3 through the clamping fingers 2.10.

[0054] The first adsorption plate 3 is provided with a plurality of evenly distributed adsorption holes, and the actuator 2 further comprises an air path 2.7, which is communicated with the adsorption holes to achieve effective adsorption of the wafer.

[0055] The first adsorption plate 3 is also provided with a detection sensor 2.12, which is used to detect whether the wafer is adsorbed. The detection sensor 2.12 can be a pressure sensor or a photoelectric sensor.

[0056] Working process of end effector A3: The scanning unit 4 moves to the top of the wafer through the robot A2 and determines the precise position of the wafer by scanning. This step ensures that the robot can accurately identify and locate the wafer to avoid errors during handling. Once the position of the wafer is determined, the scanning unit 4 will return to its initial position along a predetermined path to make room for the operation of the first adsorption plate 3 or the second adsorption plate A4.

[0057] Subsequently, the end effector A3 is moved to the wafer position by the robot A2, and the first adsorption plate 3 adsorbs the wafer by controlling the on and off of the gas path 2.7. At the same time, the clamping cylinder 2.9 is actuated to clamp the side of the wafer by the clamping fingers 2.10, so as to limit the wafer between the limiting protrusion 2.11 and the clamping fingers 2.10, that is, to fix the wafer in the horizontal direction. The robot A2 then drives the end effector A3 to move the wafer out, completing the wafer removal action.

[0058] When the wafer needs to be flipped, the output shaft of the motor rotates to drive the active pulley to rotate, and the active pulley rotates to drive the driven pulley 2.2 to rotate through the belt, and the driven pulley 2.2 drives the flip shaft 2.3 to rotate. The flip shaft 2.3 drives the mounting plate 2.8 and the first adsorption plate 3 to rotate through the locking block 2.6. When it rotates to a certain position, the limit switch 2.4 detects the protrusion 2.31 on the flip shaft 2.3, and the rotation stops, completing the flipping action of the wafer.

[0059] At this time, the first adsorption plate 3 cancels the adsorption of the wafer by controlling the on and off of the gas path 2.7, and at the same time, the clamping cylinder 2.9 is actuated to make the clamping fingers 2.10 release the side of the wafer, thus completing the placement of the wafer.

[0060] The above embodiments are only exemplary embodiments of the present application and are not intended to limit the present application. The protection scope of the present application is defined by the claims. Those skilled in the art may make various modifications or equivalent substitutions to the present application within the essence and protection scope of the present application, and such modifications or equivalent substitutions shall also be deemed to fall within the protection scope of the present application.

Claims

1. A wafer handling robot, comprising a frame, a robotic arm and an end effector, characterized in that: The end effector comprises: A base connected to the robotic arm; An actuator connected to the base, the actuator comprising a rotatable flip shaft and movable clamping fingers; A scanning unit, which is arranged on one side of the actuator and is used to scan the position of the wafer; The first adsorption plate is arranged on the other side of the actuator and connected to the flip shaft so that the first adsorption plate moves with the rotation of the flip shaft. The first adsorption plate can adsorb the wafer under the drive of the robotic arm and clamp the wafer on the first adsorption plate through the clamping fingers.

2. A wafer handling robot as claimed in claim 1, characterized in that: The base is provided with supporting bearings which are arranged opposite to each other, and the supporting bearings are respectively used to support the two ends of the flip shaft.

3. A wafer handling robot as claimed in claim 1, characterized in that: The actuator also includes a motor for rotating the flip shaft.

4. A wafer handling robot as claimed in claim 3, characterized in that: A driving pulley is arranged on the output shaft of the motor, and a driven pulley is arranged on one end of the flip shaft close to the motor. The driving pulley and the driven pulley are connected by a belt.

5. The wafer handling robot according to claim 1, characterized in that: The flip shaft is provided with a protrusion, and the actuator further comprises a limit switch, and the limit switch can detect the protrusion and is used to limit the rotation range of the flip shaft.

6. A wafer handling robot as claimed in claim 1, characterized in that: The first adsorption plate is provided with a plurality of evenly distributed adsorption holes, and the actuator further comprises an air path, which is communicated with the adsorption holes.

7. The wafer handling robot according to claim 1, characterized in that: A locking block is provided at one end of the flip shaft, a mounting plate connected to the locking block is provided at one side of the locking block, and the first adsorption plate is arranged on the mounting plate so that the rotation of the flip shaft drives the rotation of the first adsorption plate.

8. A wafer handling robot as claimed in claim 7, characterized in that: A limiting protrusion is provided on one side of the first adsorption plate, and the actuator also includes a clamping cylinder, which is horizontally installed on the locking block. The output end of the clamping cylinder moves so that the clamping fingers move closer to or away from the limiting protrusion in the horizontal direction.

9. The wafer handling robot according to claim 1, characterized in that: The robotic arms are arranged in two groups, wherein one group of the robotic arms is connected to the first adsorption plate, and the other group of the robotic arms is connected to the second adsorption plate. The second adsorption plate is provided with adsorption holes to adsorb the wafer under the drive of the robotic arms.

10. The wafer handling robot according to claim 1, characterized in that: It also includes an electric box, which is connected to the rack.

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