High-temperature-resistant silicone-oil-free release film

Abstract

The utility model discloses a high-temperature-resistant silicone-oil-free release film. The release film sequentially comprises a first buffer layer, a second buffer layer and a release layer from top to bottom, the first buffer layer is a polybutylene terephthalate layer, the second buffer layer is a polybutylene terephthalate layer containing polyethylene or a poly (4-methylpentene-1) layer containing polyethylene, and the release layer is a poly (4-methylpentene-1) layer containing erucyl amide. The release film provided by the utility model has no silicone oil residue, is formed in one step, and can resist high temperature, expand and shrink.

Description

Technical Field

[0001] The utility model belongs to the technical field of release films, in particular to a high temperature resistant silicone oil-free release film. Background Art

[0002] Release film is also called peeling film, isolation film, separation film, etc. In order to increase the release force of plastic film, the plastic film is usually coated with fluorine or silicone release agent is applied to the surface of the film material, such as PET, PE, OPP, etc.; so that it can show extremely light and stable release force for various organic pressure-sensitive adhesives. According to the different release force required for the release film, the viscosity of the isolation product adhesive is different, and the release force is adjusted accordingly, so that it can achieve extremely light and stable release force when peeling.

[0003] Release films are widely used. Printed circuit boards are an indispensable material in electronic products. They are widely used in computers and their peripherals, communication products, consumer electronics, etc. As the demand for consumer electronics continues to grow, the demand for printed circuit boards is increasing, and the quality requirements are also increasing, while the cost is required to be lower and lower. The processing of circuit boards involves a pressing process, and release films are used to prevent material adhesion during the pressing process. However, the current release films are expensive and have high process requirements. In addition, silicone oil is required during production, so there is often silicone oil residue, which causes the circuit board surface to be contaminated or microbubbles to be generated. When used in a high temperature environment, the expansion and contraction is relatively large. Summary of the invention

[0004] In order to solve the above technical problems, a technical solution adopted by the utility model is:

[0005] A high-temperature resistant silicone oil-free release film, which comprises a first buffer layer, a second buffer layer, and a release layer from top to bottom; the first buffer layer is a polybutylene terephthalate layer, the second buffer layer is a polybutylene terephthalate layer containing polyethylene or a poly-4-methylpentene-1 layer containing polyethylene, and the release layer is a poly-4-methylpentene-1 layer containing erucamide.

[0006] Furthermore, the total thickness of the three-layer structure of the release film is 0.025 mm to 0.25 mm.

[0007] Furthermore, the thickness of the first buffer layer is 0.015 mm to 0.05 mm.

[0008] Furthermore, the second buffer layer is a poly-4-methylpentene-1 layer containing polyethylene, and has a thickness of 0.04 mm to 0.2 mm.

[0009] Furthermore, the release layer has a thickness of 0.01 mm to 0.03 mm.

[0010] Beneficial effects of the utility model:

[0011] The release film made by the utility model does not use silicone oil in the formula, so there is no silicone oil residue, and it is formed in one time, and can directly replace the conventional pressed release film, the flatness and exhaust effect are improved, and it can withstand high temperature and expand and shrink. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0013] Figure 1 Schematic diagram of the layered structure of the release film;

[0014] Description of reference numerals:

[0015] 1. First buffer layer; 2. Second buffer layer; 3. Release layer. DETAILED DESCRIPTION

[0016] The preferred embodiments of the present invention are described in detail below in conjunction with the accompanying drawings so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making a clearer and more definite definition of the protection scope of the present invention. Specific embodiment 1:

[0017] A high temperature resistant silicone oil-free release film, the release film is composed of a first buffer layer 1, a second buffer layer 2, and a release layer 3 from top to bottom; the first buffer layer 1 is a polybutylene terephthalate layer, and specifically, the thickness of the first buffer layer 1 is: 0.015mm~0.05mm. The first buffer layer plays the role of temperature resistance and exhaust. As a priority, the second buffer layer 2 is a poly-4-methylpentene-1 layer containing polyethylene, and the thickness is: 0.04mm~0.2mm. The second buffer layer 2 plays the role of buffering and resisting glue and controlling expansion and contraction. As a preference, the release layer 3 is a poly-4-methylpentene-1 layer containing erucamide, and the thickness is: 0.01mm-0.03mm. The role of the release layer 3 is temperature resistance and resisting glue and buffering. In order to increase the fit of each layer, an adhesive can be optionally added, and the adhesive is Arkema 4503. Specifically, the total thickness of the three-layer structure of the release film is: 0.025mm~0.25mm. During production, a three-layer co-extrusion casting machine is required to prepare the first layer material, the second layer material and the third layer material in sequence, and heat, extrude and press them into shape in one step.

[0018] Optionally, the first buffer layer 1 and the second buffer layer 2 further contain an antistatic agent and an antioxidant, the antistatic agent is bis(β-hydroxyethyl)stearylamine, and the antioxidant is 168 and 1076.

[0019] The following is a feasible release film production process for reference, including the following steps:

[0020] S1. Prepare the first buffer layer by selecting a polybutylene terephthalate raw material with a viscosity of 0.98-1.28 and heating it to 70-140 degrees for 3-6 hours;

[0021] S2, adding antistatic agent and antioxidant;

[0022] S3, preparing a second buffer layer by mixing polybutylene terephthalate, polyethylene, and an adhesive;

[0023] S4, adding antistatic agent and antioxidant;

[0024] S5, preparing a release layer, selecting poly 4-methylpentene-1 and heating it to 60-80 degrees;

[0025] S6, adding erucamide;

[0026] S7. Use a three-screw cast iron machine to place the three layers of material into three bins respectively, and heat and extrude them.

[0027] The above description is only an embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural transformation made using the contents of the present invention specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A high temperature resistant silicone oil-free release film, characterized in that: The release film comprises, from top to bottom, a first buffer layer (1), a second buffer layer (2), and a release layer (3); the first buffer layer (1) is a polybutylene terephthalate layer, the second buffer layer (2) is a polybutylene terephthalate layer containing polyethylene or a poly-4-methylpentene-1 layer containing polyethylene, and the release layer (3) is a poly-4-methylpentene-1 layer containing erucamide.

2. The high temperature resistant silicone oil-free release film according to claim 1, characterized in that: The total thickness of the three-layer structure of the release film is 0.025 mm to 0.25 mm.

3. The high temperature resistant silicone oil-free release film according to claim 1, characterized in that: The first buffer layer (1) has a thickness of 0.015 mm to 0.05 mm.

4. The high temperature resistant silicone oil-free release film according to claim 1, characterized in that: The second buffer layer (2) is a poly-4-methylpentene-1 layer containing polyethylene, and has a thickness of 0.04 mm to 0.2 mm.

5. The high temperature resistant silicone oil-free release film according to claim 1, characterized in that: The release layer (3) has a thickness of 0.01 mm to 0.03 mm.

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