Clean electroplating die

Abstract

The utility model discloses a clean electroplating mould, the clean electroplating mould comprises a cathode conductor, an anode plate, a clean gas mechanism and a uniform flow chamber, the cathode conductor is used for installing a plating piece to be electroplated, the anode plate is provided with meshes, and electroplating liquid enters the surface of the plating piece through the meshes; the clean gas mechanism is used for injecting gas into an electroplating area between the cathode conductor and the anode plate; the flow uniformizing chamber is internally provided with at least one flow uniformizing plate, uniform holes are formed in the flow uniformizing plate, and gas jetted into the flow uniformizing chamber enters the anode plate after being uniformized by the flow uniformizing plate. High-pressure inert gas (such as nitrogen and argon) is adopted, on one hand, the electroplating solution is kept not in contact with air and prevented from being aged, and on the other hand, after electroplating is finished, the air knife returns the residual precious metal solution on the surface of a plated part to an electroplating solution tank in an air shear mode, and electroplating solution waste and wastewater recycling treatment cost are reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor electroplating, in particular to a clean electroplating mold. Background Art

[0002] Electronic-grade electroplating manufactures precision nano- and micron-level semiconductor devices and wafer chip electronic materials. It is a special processing technology that forms metal-plated devices, nano- and micron-level precision manufacturing in an electrolytic cell based on the principle of electrochemical cathode deposition. Electroplating can be used to manufacture precision-structured semiconductor device electronic materials.

[0003] Existing electroplating technology usually carries out electroplating production operations in a general electroplating environment. During the electroplating process, the flowing electroplating solution is in contact with the ambient air all the time. Trace harmful substances in the air are continuously mixed into the electroplating solution, causing the performance of the electroplating solution to gradually decline, resulting in a shortened service life of the electroplating solution.

[0004] In addition, the metal coating produced by electroplating is highly active and is very susceptible to trace corrosive substances in the air. The side reaction substances produced lead to a decrease in the purity of the coating metal. Utility Model Content

[0005] In order to solve the above problems, the utility model provides a clean electroplating mold, which can reduce the aging of the electroplating solution and the corrosion of the precipitated metal.

[0006] The utility model provides a clean electroplating mold, comprising:

[0007] A cathode conductor, the cathode conductor being used to mount a plated component to be electroplated;

[0008] An anode plate, wherein mesh holes are arranged on the anode plate, and the electroplating solution enters the surface of the plated piece through the mesh holes;

[0009] a clean gas mechanism for injecting gas between the cathode conductor and the anode plate;

[0010] A uniform flow chamber is provided in which at least one uniform flow plate is arranged, and uniform holes are arranged on the uniform flow plate. The gas injected into the uniform flow chamber flows uniformly through the uniform flow plate and then enters the anode plate.

[0011] Furthermore, it also includes a carrier, the carrier, the anode plate, the cathode conductor and the plated part form an electroplating cavity, the carrier is provided with an air inlet channel, the air inlet channel is connected to the electroplating cavity, and an air knife is provided at the outlet of the gas inlet channel.

[0012] Furthermore, the carrier is also provided with a reflux hole, and the reflux hole is used for the reflux of the electroplating solution and the gas.

[0013] Furthermore, it also includes an air intake box, the air intake box is provided with an air intake interface, an air storage space is provided inside the air intake box, and the air storage space is connected to the air intake channel.

[0014] Furthermore, the cathode conductor is supported and fixed by a carrier.

[0015] Furthermore, the uniform flow chamber is arranged to include a first chamber, a second chamber and a third chamber from top to bottom, the anode plate is located at the outlet of the first chamber, a first uniform flow plate is arranged between the first chamber and the second chamber, a second uniform flow plate is arranged between the second chamber and the third chamber, and a plating liquid inlet is arranged at the bottom of the third chamber; the cross-section of the first chamber is smaller than the cross-section of the second chamber.

[0016] Beneficial effects of the utility model:

[0017] The introduction of inert gas has two functions. First, the inert gas can expel the air in the electroplating chamber, keep the electroplating solution from contacting with the air, prevent the electroplating solution from aging, and prevent the oxidation of the precipitated metal, thereby improving the purity of the electroplated metal and inhibiting the performance degradation of semiconductor devices. Second, the wind knife can form a thin, high-strength, high-flow impact wind curtain. When the electroplating of the plated part is completed, the impact wind curtain can wind-cut and recycle the residual electroplating liquid on the surface of the plated part, and return the electroplating liquid to the electroplating liquid tank through the reflux hole for recycling, thereby reducing the waste of electroplating liquid and the cost of wastewater recycling. In addition, the electroplating mold can organically combine the cleaning gas and spraying to maintain the properties of the electroplated metal unchanged. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 A cross-sectional view of a clean electroplating mold provided by an embodiment of the utility model;

[0019] Figure 2 A cross-sectional view of a carrier for cleaning an electroplating mold provided by an embodiment of the utility model;

[0020] Figure 3 A schematic diagram of the structure of an air knife for cleaning an electroplating mold provided by an embodiment of the utility model;

[0021] Figure 4 The first flow distribution plate structure of the cleaning electroplating mold provided by the embodiment of the utility model is intended;

[0022] In the figure: 1. cathode conductor; 2. plated part; 3. anode plate; 4. carrier; 41. air inlet; 42. air inlet box; 43. air storage space; 44. air inlet channel; 45. return hole; 46. wind knife; 5. uniform flow chamber; 51. first chamber; 52. second chamber; 52. third chamber; 54. first uniform flow plate; 55. second uniform flow plate. DETAILED DESCRIPTION

[0023] The technical solution of the utility model will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0024] In the description of the present invention, it should be noted that the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance. Among them, the terms "first position" and "second position" are two different positions.

[0025] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0026] Please refer to Figure 1 and Figure 2 The clean electroplating mold includes a cathode conductor 1, an anode plate 3, a carrier 4 and a uniform flow chamber 5. In addition to being electrically connected to the plated component 2, the cathode conductor 1 also serves to install and fix the plated component 2. In this embodiment, the cathode conductor 1 and the plated component 2 are fixed by screws. In this embodiment, since the plated component is in the shape of a sheet as a whole, the cathode conductor 1 is also in the shape of a plate as a whole. A mesh is provided on the anode plate 3, and the electroplating solution enters the surface of the plated component 2 through the mesh, and the anode plate 3 is arranged substantially parallel to the plated component.

[0027] The flow chamber 5 is provided with two flow equalizer plates, namely a first flow equalizer plate 54 and a second flow equalizer plate 55. The shape of the first flow equalizer plate 54 is as follows: Figure 4As shown in the figure, a plurality of holes 541 are evenly arranged in the corresponding area of the first flow equalizing plate 54 and the anode plate 3 in its projection thereon. The two flow equalizing plates divide the flow equalizing chamber 5 from top to bottom into a first chamber 51, a second chamber 52 and a third chamber 53. The anode plate 3 is located at the outlet of the first chamber. The first flow equalizing plate 54 is located between the first chamber 51 and the third chamber 53. The second flow equalizing plate 55 is located between the second chamber 52 and the third chamber 53. An electroplating solution inlet is arranged at the bottom of the third chamber 53. The cross-section of the first chamber 51 is smaller than that of the second chamber 42. After the high-pressure electroplating solution is sprayed into the third chamber 53 through the inlet at the bottom, it enters the second chamber 52 after being preliminarily equalized by the second flow equalizing plate 55, and then enters the first chamber 51 in a jet shape after being equalized by the first flow equalizing plate 54, and then reaches the anode plate 3, and then reaches the surface of the workpiece 2 through the mesh holes on the anode plate. The mesh-shaped anode plate can not only slow down the electroplating solution, but also play a role in equalizing the flow. After multiple equalizations, the electroplating solution reaching the surface of the workpiece is more evenly distributed, thus ensuring the film thickness stability of the workpiece. The flow equalizing cavity 5 can realize spraying, realize rapid deposition of thick coatings, and the coatings have high uniformity and density.

[0028] Structural reference of the carrier 4 Figure 2 , its overall shape is "square frame" shaped, the middle part is a hollow part, and the hollow part corresponds to the anode plate 3 and the cathode conductor 1. The carrier 4, the anode plate 3, the cathode conductor 1 and the workpiece 2 enclose an electroplating cavity, and the composite structure of the cathode conductor 1 and the workpiece 2 is installed on the carrier 4. In this embodiment, since the plating surface of the workpiece is rectangular, the shapes of the anode plate and the cathode conductor are generally rectangular. If the plating surface is of other shapes, it can be adjusted accordingly.

[0029] An air inlet box 42 is arranged on the periphery of the carrier 4. An air inlet 41 is arranged on each air inlet box 42. The air inlet 41 is connected to the external cleaning gas. In the present invention, the cleaning gas can be a high-pressure inert gas (such as nitrogen, argon), and a gas storage space 43 is arranged in the air inlet box 42. A plurality of air inlet channels 44 are also arranged inside the carrier 4, and the air inlet channels 44 communicate with the gas storage space 43. An air knife 46 is arranged at the outlet of the air inlet channel 44, and the structure of the air knife is as Figure 3 shown. A return hole 45 is also arranged at the bottom of the carrier 4, and the return hole 45 is connected to the electroplating solution tank through a pipeline system. The return hole not only returns the electroplating solution, but also serves as an exhaust hole to reduce the pressure in the electroplating cavity.

[0030] The introduction of inert gas here has two functions. First, the inert gas can expel the air in the electroplating chamber, maintain the electroplating solution from contact with the air, prevent the electroplating solution from aging, and prevent the precipitated metal from oxidation, thereby improving the purity of the electroplated metal and inhibiting the performance degradation of semiconductor device products. Second, the wind knife can form a thin, high-strength, large-airflow impact wind curtain. When the electroplating of the plated part is completed, the impact wind curtain can wind-cut and recover the residual plating liquid on the surface of the plated part, and return the plating liquid to the plating liquid tank through the reflux hole 45 for recycling, thereby reducing the waste of plating liquid and the cost of wastewater recycling and treatment.

[0031] The electroplating mold of the utility model can organically combine the cleaning gas and the spraying, and maintain the electroplating deposited metal performance unchanged to the greatest extent.

[0032] The above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application, and should all be included in the protection scope of the present application.

Claims

1. Cleaning electroplating mold, characterized in that, include: A cathode conductor, the cathode conductor being used to mount a plated component to be electroplated; An anode plate, wherein mesh holes are arranged on the anode plate, and the electroplating solution enters the surface of the plated piece through the mesh holes; a clean gas mechanism for injecting gas between the cathode conductor and the anode plate; A uniform flow chamber is provided in which at least one uniform flow plate is arranged, and uniform holes are arranged on the uniform flow plate. The gas injected into the uniform flow chamber flows uniformly through the uniform flow plate and then enters the anode plate.

2. The clean electroplating mold according to claim 1, characterized in that: It also includes a carrier, wherein the carrier, the anode plate, the cathode conductor and the plated part form an electroplating cavity, the carrier is provided with an air inlet channel, the air inlet channel is connected to the electroplating cavity, and an air knife is provided at the outlet of the air inlet channel.

3. The clean electroplating mold according to claim 2, characterized in that: The carrier is also provided with a reflux hole, and the reflux hole is used for the reflux of the electroplating solution and the gas.

4. The clean electroplating mold according to claim 2 or 3, characterized in that: It also includes an air intake box, which is provided with an air intake interface. An air storage space is provided inside the air intake box, and the air storage space is connected to the air intake channel.

5. The clean electroplating mold according to claim 2 or 3, characterized in that: The cathode conductor is supported and fixed by a carrier.

6. The clean electroplating mold according to claim 2, characterized in that: The uniform flow chamber is arranged from top to bottom to include a first chamber, a second chamber and a third chamber, the anode plate is located at the outlet of the first chamber, a first uniform flow plate is arranged between the first chamber and the second chamber, a second uniform flow plate is arranged between the second chamber and the third chamber, and a plating liquid inlet is arranged at the bottom of the third chamber; the cross-section of the first chamber is smaller than the cross-section of the second chamber.

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