Efficient heat dissipation metal compensator

Abstract

The utility model discloses an efficient heat dissipation metal compensator which is characterized in that the efficient heat dissipation metal compensator belongs to the field of metal compensators, a cooling box and an annular cooling pipe are arranged, the annular cooling pipe conducts heat dissipation and cooling outside a compensator body in a surrounding mode, and the annular cooling pipe is of an adjustable structure. According to the metal compensator, the compensator body can achieve rapid heat dissipation and cooling, operation stability of the compensator body is achieved, the service life of internal components of the metal compensator is prolonged, and the problem that the heat dissipation and cooling effect of the metal compensator is poor is solved. The cooling fins are arranged, the semiconductor chilling plate can stably operate for refrigeration through the multiple cooling fins, a sealing ring forms a sealing structure, and when the device stably refrigerates, leakage of cooling liquid in the cooling box is avoided; and the positioning rods are arranged, the positions of the positioning rods are adjusted, the heat conduction plate can be conveniently clamped and adsorbed to the exterior of the compensator body, the heat conduction plate is more convenient to mount and dismount, and the using effect of the heat conduction plate is improved.

Description

Technical Field

[0001] The utility model relates to the field of metal compensators, in particular to a metal compensator with high-efficiency heat dissipation. Background Art

[0002] Metal compensator is a compensating element, also called expansion joint. Metal compensator mainly utilizes the effective expansion and contraction deformation of its working body bellows, mainly on the infusion pipeline with temperature changes;

[0003] Chinese patent authorization application number: CN202220955227.1 provides a leakage-proof metal compensator. The solution symmetrically arranges installation positioning mechanisms on both sides of the outer wall of the compensator body, which can support and install the rubber protective sleeve and the elastic limiting mechanism, and is also convenient for quick installation and disassembly.

[0004] The existing metal compensators have certain drawbacks when used. First, when the metal compensators are used for a long time, a certain amount of heat energy is generated. The metal compensators cannot easily cool down the heat energy, which leads to reduced stability in the operation of the metal compensators and affects the service life of the internal components of the metal compensators. For this reason, we propose a metal compensator with efficient heat dissipation. Utility Model Content

[0005] In order to overcome the shortcomings of the prior art, the purpose of the utility model is to provide a metal compensator with efficient heat dissipation, by arranging a cooling box and an annular cooling tube, the annular cooling tube dissipates heat and cools the outside of the compensator body in a circumferential manner, and the annular cooling tube is an adjustable structure, so that the compensator body can achieve rapid heat dissipation and cooling, so that the compensator body can operate stably, and the service life of the internal components of the metal compensator is increased, which is used to solve the problem of poor heat dissipation and cooling effect of the metal compensator; by arranging heat sinks, multiple heat sinks allow the semiconductor refrigeration plate to operate stably for cooling, and the sealing ring forms a sealing structure, so that the device can avoid leakage of coolant inside the cooling box when the cooling is stable; a positioning rod is provided, and the position of the positioning rod is adjusted, so that the heat conduction plate can be conveniently snapped and adsorbed on the outside of the compensator body, making the installation and disassembly of the heat conduction plate more convenient, thereby improving the use effect of the heat conduction plate.

[0006] The above technical objectives of the utility model are achieved through the following technical solutions:

[0007] A metal compensator with high efficiency in heat dissipation comprises a main body mechanism, the inner end of the main body mechanism is movably connected with a connection mechanism which is evenly distributed, and the outer end of the connection mechanism is sleeved with a heat dissipation mechanism;

[0008] The heat dissipation mechanism includes a cooling box, which is located at the rear end of the main body mechanism. A semiconductor refrigeration plate is installed at the inner end of the cooling box. A circulating pump is fixedly connected to the outer end of the cooling box. A connecting pipe is fixedly connected to the outer end of the circulating pump. The other end of the connecting pipe away from the circulating pump is fixedly connected to an annular cooling pipe.

[0009] By installing a cooling box and an annular cooling pipe, the service life of the internal components of the metal compensator can be increased, and the efficient heat dissipation effect of the metal compensator is improved.

[0010] Furthermore, the other end of the annular cooling pipe away from the connecting pipe is connected to a circulation pipe, and the circulation pipe is connected to the cooling box.

[0011] By installing a circulation pipe, the heat dissipation and cooling effect of the metal compensator can be increased.

[0012] Furthermore, the inner end of the cooling box is movably connected with a plurality of evenly distributed heat sinks, the heat sinks are located at the outer end of the semiconductor cooling sheet, and both ends of the semiconductor cooling sheet are movably connected with sealing rings, the sealing rings are located at the inner end of the cooling box.

[0013] By installing the heat sink, the device can provide stable cooling while preventing coolant leakage inside the cooling box.

[0014] Furthermore, the main body mechanism comprises an external protective sleeve, the interior of the external protective sleeve is movably connected with a compensator body, and the outer end of the compensator body is fixedly connected with a symmetrically distributed flange.

[0015] By installing an external protective sleeve, the protective sleeve outside the compensator body can play a role in preventing leakage.

[0016] Furthermore, flange plate 2 is installed on the outer side of flange plate 1, and a plurality of evenly distributed connecting frames are fixedly connected to the outer end of flange plate 1, and an elastic rod is hingedly connected to the inner end of the connecting frame.

[0017] By installing the connecting frame, a plurality of elastic rods can be stably connected to the outer end of the compensator body.

[0018] Furthermore, a heat conducting plate is sleeved on the outer end of the compensator body, a plurality of evenly distributed heat conducting holes are opened on the outer end of the heat conducting plate, and an evenly distributed assembly frame is fixedly connected to the outer end of the heat conducting plate.

[0019] By installing the heat conducting plate, the heat dissipation and heat conduction effect of the compensator body can be improved.

[0020] Furthermore, a positioning frame is installed at the outer end of the assembly frame, a positioning rod is slidably connected to the inner end of the positioning frame, and a clamping block is installed at the front end of the positioning rod.

[0021] By installing the positioning rod, the use effect of the heat conducting plate can be improved.

[0022] Furthermore, a spring ring is sleeved on the outer end of the positioning rod, a guide ring is slidably connected to the front side of the spring ring, the guide ring is located at the outer end of the positioning rod, an adjustment groove is opened at the outer end of the guide ring, and the adjustment groove is located at the inner end of the positioning frame.

[0023] By installing the guide ring, the guide ring can slide on the inner end of the adjustment groove as the positioning rod moves, so that the positioning, disassembly and adjustment of the positioning rod are more stable and will not cause deviation.

[0024] In summary, the utility model has the following beneficial effects:

[0025] 1. By setting a cooling box and an annular cooling pipe, when the metal compensator needs to dissipate heat and cool, the coolant inside the cooling box is conducted to the inside of the annular cooling pipe, and the annular cooling pipe is circumferentially arranged outside the compensator body for heat dissipation and cooling. The annular cooling pipe is an adjustable structure, so that the compensator body can achieve rapid heat dissipation and cooling, making the operation stability of the compensator body, increasing the service life of the internal components of the metal compensator, and improving the efficient heat dissipation effect of the metal compensator;

[0026] 2. By setting a heat sink, a plurality of heat sinks form a heat dissipation structure at the outer end of the semiconductor refrigeration chip, so that the semiconductor refrigeration chip can stably operate the refrigeration, and the sealing ring installed at the inner end of the cooling box forms a sealing structure outside the semiconductor refrigeration chip, so that the device can stably refrigerate and prevent the coolant inside the cooling box from leaking;

[0027] 3. By setting a positioning rod, the positioning rod can be adjusted or easily reset under the force of the spring coil, so that the heat conducting plate can be easily snapped and adsorbed on the outside of the compensator body, making the installation and removal of the heat conducting plate more convenient and improving the use effect of the heat conducting plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 Schematic diagram of the overall structure of this embodiment;

[0029] Figure 2 is a schematic structural diagram of the plane of the connecting mechanism in this embodiment;

[0030] Figure 3 In this embodiment Figure 2 A schematic diagram of the structure with an enlarged plane at point A;

[0031] Figure 4 is a schematic structural diagram of the plane of the heat dissipation mechanism in this embodiment;

[0032] Figure 5 It is a schematic structural diagram of the cross section of the cooling box in this embodiment.

[0033] In the figure, 1. main body mechanism; 101. external protective sleeve; 102. compensator body; 103. flange one; 104. flange two; 105. connecting frame; 106. elastic rod; 2. connecting mechanism; 201. heat conducting plate; 202. heat conducting hole; 203. assembly frame; 204. positioning frame; 205. positioning rod; 206. block; 207. spring ring; 208. guide ring; 209. adjustment groove; 3. heat dissipation mechanism; 301. cooling box; 302. semiconductor refrigeration plate; 303. circulation pump; 304. connecting pipe; 305. annular cooling pipe; 306. circulation pipe; 307. heat sink; 308. sealing ring. DETAILED DESCRIPTION

[0034] The utility model is further described in detail below in conjunction with the accompanying drawings.

[0035] The same parts are denoted by the same reference numerals. It should be noted that the words "front", "rear", "left", "right", "upper" and "lower" used in the following description refer to directions in the drawings, and the words "bottom" and "top", "inner" and "outer" refer to directions toward or away from the geometric center of a specific component, respectively.

[0036] Reference Figure 1-5 As shown, a metal compensator with high efficiency in heat dissipation in a preferred embodiment of the utility model is provided, comprising a main body mechanism 1, the inner end of the main body mechanism 1 is movably connected with a connection mechanism 2 which is evenly distributed, and the outer end of the connection mechanism 2 is sleeved with a heat dissipation mechanism 3;

[0037] The heat dissipation mechanism 3 includes a cooling box 301, which is located at the rear end of the main body mechanism 1. A semiconductor refrigeration plate 302 is installed at the inner end of the cooling box 301. A circulating pump 303 is fixedly connected to the outer end of the cooling box 301. A connecting pipe 304 is fixedly connected to the outer end of the circulating pump 303. The other end of the connecting pipe 304 away from the circulating pump 303 is fixedly connected to a ring-shaped cooling pipe 305.

[0038] Reference Figure 4-5 As shown, further, the other end of the annular cooling pipe 305 away from the connecting pipe 304 is connected to a circulation pipe 306 , and the circulation pipe 306 is connected to the cooling box 301 .

[0039] Reference Figure 5 As shown, further, the inner end of the cooling box 301 is movably connected with a plurality of evenly distributed heat sinks 307, and the heat sinks 307 are located at the outer end of the semiconductor cooling sheet 302. The two ends of the semiconductor cooling sheet 302 are movably connected with sealing rings 308, and the sealing rings 308 are located at the inner end of the cooling box 301.

[0040] The cooling liquid inside the cooling box 301 is conducted to the inside of the annular cooling tube 305, and the annular cooling tube 305 dissipates heat and cools the outside of the compensator body 102 in a circumferential manner. The annular cooling tube 305 is an adjustable structure, and the circulation tube 306 can conduct the cooling liquid cooled by the annular cooling tube 305, and the cooling liquid is again conducted to the inside of the cooling box 301 for circulation cooling, so that the compensator body 102 can achieve rapid heat dissipation and cooling. When the device is running, multiple heat sinks 307 form a heat dissipation structure at the outer end of the semiconductor refrigeration sheet 302, so that the semiconductor refrigeration sheet 302 can operate stably for cooling, and the sealing ring 308 installed at the inner end of the cooling box 301 forms a sealing structure on the outside of the semiconductor refrigeration sheet 302, so that the cooling liquid inside the cooling box 301 can be prevented from leaking when the device is stably cooling.

[0041] Reference Figure 1 As shown, further, the main body mechanism 1 includes an external protective sleeve 101, the interior of the external protective sleeve 101 is movably connected with a compensator body 102, and the outer end of the compensator body 102 is fixedly connected with a symmetrically distributed flange 103.

[0042] Reference Figure 1 As shown, further, flange plate two 104 is installed on the outer side of flange plate one 103, and the outer end of flange plate one 103 is fixedly connected with a plurality of evenly distributed connecting frames 105, and the inner end of the connecting frame 105 is hingedly connected with an elastic rod 106.

[0043] The outer protective sleeve 101 is made of rubber material, and when leakage or burst occurs at the telescopic part of the metal compensator, the outer protective sleeve 101 plays a role in preventing leakage, and a plurality of symmetrically distributed connecting frames 105 can stably connect the elastic rods 106.

[0044] Reference Figure 2-3 As shown, further, a heat conducting plate 201 is sleeved on the outer end of the compensator body 102 , a plurality of evenly distributed heat conducting holes 202 are opened on the outer end of the heat conducting plate 201 , and an evenly distributed assembly frame 203 is fixedly connected to the outer end of the heat conducting plate 201 .

[0045] Reference Figure 5 As shown, further, a positioning frame 204 is installed at the outer end of the assembly frame 203, and a positioning rod 205 is slidably connected to the inner end of the positioning frame 204, and a clamping block 206 is installed at the front end of the positioning rod 205.

[0046] Reference Figure 4-5As shown, further, the outer end of the positioning rod 205 is sleeved with a spring ring 207, and the front side of the spring ring 207 is slidably connected with a guide ring 208, which is located at the outer end of the positioning rod 205. The outer end of the guide ring 208 is provided with an adjustment groove 209, and the adjustment groove 209 is located at the inner end of the positioning frame 204.

[0047] By installing a heat-conducting plate 201 made of a heat-conducting material and cooperating with a plurality of heat-conducting holes 202, the heat dissipation effect of the compensator body 102 is increased, and the positioning rod 205 can be adjusted or easily reset under the action of the spring coil 207, so that the heat-conducting plate 201 can be easily snapped and adsorbed on the outside of the compensator body 102, making the installation and removal of the heat-conducting plate 201 more convenient, thereby improving the use effect of the heat-conducting plate 201.

[0048] Specific implementation process: When the device needs to dissipate heat during operation, the coolant inside the cooling box 301 is conducted to the inside of the annular cooling tube 305. The annular cooling tube 305 dissipates heat and cools the outside of the compensator body 102 in a circumferential manner, and the circulation tube 306 can conduct the coolant cooled by the annular cooling tube 305. The coolant is again conducted to the inside of the cooling box 301 for circulation cooling, so that the compensator body 102 can achieve rapid heat dissipation and cooling, and the compensator body 102 has stable operation and increases the service life of the components inside the metal compensator. A plurality of heat sinks 307 form a heat dissipation structure at the outer end of the semiconductor refrigeration sheet 302, so that the semiconductor refrigeration sheet 302 can stably operate and cool, and the sealing ring 308 installed at the inner end of the cooling box 301 forms a sealing structure on the outside of the semiconductor refrigeration sheet 302, so that the device can stably cool and avoid leakage of the coolant inside the cooling box 301.

[0049] In addition, the heat conducting plate 201 is made of a heat conducting material and is equipped with a plurality of heat conducting holes 202, so that the heat dissipation effect of the compensator body 102 is increased. The positioning rod 205 can be adjusted or easily reset under the action of the spring coil 207, so that the heat conducting plate 201 can be easily snapped and adsorbed on the outside of the compensator body 102, making the installation and removal of the heat conducting plate 201 more convenient, thereby improving the use effect of the heat conducting plate 201.

[0050] The above shows and describes the basic principle and main features of the utility model and the advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions are only for explaining the principle of the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, which fall within the scope of the utility model to be protected. The scope of protection claimed by the utility model is defined by the attached claims and their equivalents.

Claims

1. A metal compensator with high heat dissipation efficiency, characterized by: It comprises a main body mechanism (1), the inner end of the main body mechanism (1) is movably connected to a connection mechanism (2) that is evenly distributed, and the outer end of the connection mechanism (2) is sleeved with a heat dissipation mechanism (3); The heat dissipation mechanism (3) comprises a cooling box (301), the cooling box (301) is located at the rear end of the main body mechanism (1), a semiconductor cooling plate (302) is installed at the inner end of the cooling box (301), a circulating pump (303) is fixedly connected to the outer end of the cooling box (301), a connecting pipe (304) is fixedly connected to the outer end of the circulating pump (303), and the other end of the connecting pipe (304) away from the circulating pump (303) is fixedly connected to an annular cooling pipe (305).

2. The metal compensator with high heat dissipation efficiency according to claim 1, characterized in that: The other end of the annular cooling pipe (305) away from the connecting pipe (304) is connected to a circulation pipe (306), and the circulation pipe (306) is connected to the cooling box (301).

3. The metal compensator with high heat dissipation efficiency according to claim 2, characterized in that: The inner end of the cooling box (301) is movably connected to a plurality of evenly distributed heat sinks (307), the heat sinks (307) are located at the outer end of the semiconductor cooling sheet (302), and both ends of the semiconductor cooling sheet (302) are movably connected to sealing rings (308), the sealing rings (308) are located at the inner end of the cooling box (301).

4. The metal compensator with high heat dissipation efficiency according to claim 1, characterized in that: The main body mechanism (1) comprises an external protective sleeve (101), the interior of the external protective sleeve (101) is movably connected to a compensator body (102), and the outer end of the compensator body (102) is fixedly connected to a symmetrically distributed flange (103).

5. The metal compensator with high heat dissipation efficiency according to claim 4, characterized in that: Flange plate 2 (104) is installed on the outer side of flange plate 1 (103), and the outer end of flange plate 1 (103) is fixedly connected to a plurality of evenly distributed connecting frames (105), and the inner end of the connecting frame (105) is hingedly connected to an elastic rod (106).

6. The metal compensator with high heat dissipation efficiency according to claim 4, characterized in that: The outer end of the compensator body (102) is sleeved with a heat conducting plate (201), the outer end of the heat conducting plate (201) is provided with a plurality of evenly distributed heat conducting holes (202), and the outer end of the heat conducting plate (201) is fixedly connected with an evenly distributed assembly frame (203).

7. The metal compensator with high heat dissipation efficiency according to claim 6, characterized in that: The outer ends of the assembly frames (203) are all equipped with positioning frames (204), the inner ends of the positioning frames (204) are slidably connected with positioning rods (205), and the front ends of the positioning rods (205) are equipped with clamping blocks (206).

8. The metal compensator with high heat dissipation efficiency according to claim 7, characterized in that: The outer end of the positioning rod (205) is sleeved with a spring ring (207), the front side of the spring ring (207) is slidably connected with a guide ring (208), the guide ring (208) is located at the outer end of the positioning rod (205), the outer end of the guide ring (208) is provided with an adjustment groove (209), and the adjustment groove (209) is located at the inner end of the positioning frame (204).

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