Induction cooker capable of accurately controlling temperature
By directly contacting the microcrystalline glass plate with thermocouple temperature sensor in an induction cooker, the problems of temperature measurement delay and error of traditional NTC temperature sensors are solved, precise temperature control is achieved, and the safety and efficiency of cooking are improved.
Patent Information
- Application Number
- CN202421499767.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-28
- Publication Date
- 2025-05-06
- Estimated Expiration
- 2034-06-28
AI Technical Summary
The NTC temperature sensor used in traditional induction cookers has delays and errors when measuring the temperature of the microcrystalline glass plate, which makes it difficult to accurately control the cooking temperature, which can easily lead to food burning or excessive oil smoke.
Using a thermocouple temperature sensor, the thermocouple temperature measuring probe is directly in contact with the microcrystalline glass plate, which can directly induce temperature changes, reduce intermediate thermal conductivity, and improve the temperature measurement response speed and accuracy.
Accurate control of the temperature of microcrystalline glass plates is achieved, reducing the risk of charred oil smoke and food during cooking, and improving the safety and efficiency of cooking.
Smart Images
Figure CN222836926U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of heating and cooking, in particular to an electromagnetic cooker with precise temperature control. Background Art
[0002] A thermocouple is a temperature measuring element that works based on the thermoelectric effect and can convert temperature signals into thermoelectromotive force signals, which are then converted into the temperature of the measured medium.
[0003] Based on the temperature measurement principle of thermocouples, when two conductors (thermal electrodes) of different materials come into contact, thermoelectric potential will be generated due to the difference in electron density on the contact surface. This physical phenomenon is called the thermoelectric effect. Thermocouples have a wide temperature measurement range (-200°C to +1300°C), simple structure, fast response, accurate temperature measurement, high reliability, etc. They can directly contact the object being measured, reduce the intermediate temperature transfer link, and can quickly respond to the temperature of the above-mentioned microcrystalline glass plate.
[0004] Accurate temperature control of food during the cooking process of an induction cooker has always been a technical difficulty. However, as people's living standards continue to improve, people's requirements for cooking are also getting higher and higher. The temperature sensor of a traditional induction cooker usually adopts an NTC temperature sensor, which is packaged by ceramic or glass. The NTC temperature sensor is packaged in a ceramic shell 16 or a glass shell 14. The NTC temperature sensor includes a temperature measuring chip 17, and a signal lead 15 is provided on the temperature measuring chip 17 for conductive connection with the control circuit board.
[0005] Since the microcrystalline glass plate is not directly connected to the temperature measuring chip 17 of the NTC temperature sensor, but through the NTC temperature sensor, there is a large delay and error when measuring the temperature of the microcrystalline glass plate. As the use time increases, the thermal conductive silicone grease on the NTC temperature sensor dries, resulting in a worse temperature measurement effect. As a result, when the induction cooker is heating oil for cooking, the oil temperature is usually too high, and a large amount of oil smoke evaporates; when frying food, the food is often burnt due to overheating, causing certain harm to the human body.
[0006] Therefore, there is a need for an induction cooker that can directly measure the microcrystalline glass plate. By using a thermocouple sensor and directly touching the thermocouple temperature measuring point to the microcrystalline glass plate, the temperature value of the microcrystalline glass plate can be directly sensed, the temperature measurement response speed can be accelerated, and the temperature control accuracy of the cooker can be improved. Utility Model Content
[0007] The purpose of the utility model is to provide an induction cooker with precise temperature control. The thermocouple temperature measuring probe is in direct contact with the microcrystalline glass plate and can directly sense the temperature change of the microcrystalline glass plate, avoiding the need for other sensors to measure temperature through indirect heat conduction such as a packaging shell, thereby achieving precise control of the cooking temperature.
[0008] The purpose of the utility model is achieved in this way:
[0009] A precise temperature-controlled induction cooker comprises a heater acting on a microcrystalline glass plate and a control assembly electrically connected to the heater; a thermocouple temperature sensor electrically connected to the control assembly is provided below the microcrystalline glass plate, and the thermocouple temperature sensor comprises a thermocouple temperature measuring probe for detecting the temperature value of the microcrystalline glass plate; the thermocouple temperature measuring probe is in direct or indirect contact with the microcrystalline glass plate; the thermocouple temperature sensor converts the temperature detection value of the microcrystalline glass plate through the thermocouple temperature measuring probe into an electrical signal transmitted to the control assembly; the control assembly receives the electrical signal and adjusts the heating power of the heater, thereby realizing precise temperature control of the induction cooker.
[0010] The thermocouple temperature measuring probe is abutted against the bottom of the microcrystalline glass plate; or, a accommodating cavity is provided in the microcrystalline glass plate, and the thermocouple temperature measuring probe is limitedly installed in the accommodating cavity of the microcrystalline glass plate, so as to realize the pre-embedded installation of the thermocouple temperature measuring probe in the microcrystalline glass plate, thereby increasing the contact area between the thermocouple temperature measuring probe and the microcrystalline glass plate.
[0011] The thermocouple temperature sensor includes a thermocouple signal line conductively connected to the control assembly, one end of the thermocouple signal line is fixedly connected to the thermocouple temperature probe, and a metal shielding net is provided on the outer periphery of the thermocouple signal line to avoid electromagnetic interference with the temperature measurement result of the thermocouple temperature sensor when the induction cooker is heated.
[0012] The thermocouple temperature sensor comprises a metal shielding shell for encapsulating the thermocouple temperature sensor part, and the thermocouple temperature measuring probe is located outside the metal shielding shell and directly contacts with the bottom of the microcrystalline glass plate.
[0013] Two intervally arranged first electromagnetic shielding layers and second electromagnetic shielding layers are provided on the outer peripheral side of the thermocouple signal line close to the thermocouple temperature measuring probe. The second electromagnetic shielding layer covers the outer peripheral side of the thermocouple signal line, and the first electromagnetic shielding layer covers the outer peripheral side of the second electromagnetic shielding layer. The first electromagnetic shielding layer and the second electromagnetic shielding layer form a double-layer electromagnetic shielding layer.
[0014] The heater is an electromagnetically heated heating coil disk.
[0015] The control assembly includes a computing unit and a power control part. The power control part is provided with a preset control area for presetting the heating temperature, heating power and heating time of the heater.
[0016] The operation unit and the power control part are arranged separately.
[0017] The power control part includes a power control board and a display board. The power control board is provided with an MCU chip. The operation unit is arranged on the MCU chip. The operation unit and the MCU chip are integrated on the power control board of the power control part. The operation unit, the MCU chip and the power control board are conductively connected. The display board is used to display the heating temperature, heating power and heating time of the heater; or, the display board is a touch-type control display screen, so as to preset the heating temperature, heating power and heating time of the heater on the touch-type control display screen.
[0018] An NTC temperature sensor connected to the control assembly is provided under the microcrystalline glass plate. The NTC temperature sensor cooperates with the thermocouple temperature sensor to detect the temperature value of the microcrystalline glass plate.
[0019] The beneficial effects of the utility model are as follows: BRIEF DESCRIPTION OF THE DRAWINGS
[0020] Figure 1 The temperature of the glass-ceramic plate is transferred to the NTC temperature sensor encapsulated in the glass shell.
[0021] Figure 2 The temperature of the glass-ceramic plate is transferred to the NTC temperature sensor encapsulated in the ceramic housing.
[0022] Figure 3 This is a schematic diagram of the structure in which the thermocouple temperature measuring probe is embedded in the microcrystalline glass plate in the utility model.
[0023] Figure 4 This is a schematic diagram of the structure in which the thermocouple temperature measuring probe in the utility model is directly in contact with the bottom of the microcrystalline glass plate.
[0024] Figure 5 This is a control block diagram of a precise temperature-controlled induction cooker in the first embodiment of the present utility model.
[0025] Figure 6 This is a control block diagram of a precise temperature-controlled induction cooker in the second embodiment of the present utility model.
[0026] Figure 7 This is a control block diagram of a precise temperature-controlled induction cooker in the third embodiment of the present utility model. DETAILED DESCRIPTION
[0027] The utility model is further described below in conjunction with the accompanying drawings and embodiments.
[0028] First embodiment:
[0029] A precise temperature-controlled induction cooker comprises a furnace body, on which a microcrystalline glass plate 1 for carrying a cooking utensil 13 is provided, and inside the furnace body a heating coil disk 7 for the cooking utensil 13 is provided;
[0030] A thermocouple temperature sensor 4 is provided below the microcrystalline glass plate 1. The thermocouple temperature probe 5 of the thermocouple temperature sensor 4 is in contact with the microcrystalline glass plate 1 and can directly sense the slight temperature changes of the microcrystalline glass plate 1. The temperature value is converted into an electric potential, and the signal is amplified by the operation unit 8, and is calculated with the cold end temperature of the thermocouple temperature sensor 4 to obtain the actual temperature value and transmit it to the power control part 9; the power control part 9 performs heating control according to the actual temperature value combined with the preset temperature value, so that the cooking utensil 13 can maintain the temperature range set by the program when heating, and the heating coil disk 7 keeps the heating temperature stable during the heating process of the cooking utensil 13, thereby realizing accurate control of the cooking temperature. The advantage is that the temperature control is more accurate, preventing the food in the cooking utensil 13 from being burnt due to excessive temperature, reducing the generation of oil smoke during the cooking process, and making the operation more convenient and intelligent, and not destroying the original simple appearance of the induction cooker, which is an important innovation in the induction cooker technology.
[0031] The thermocouple temperature measuring probe 5 of the thermocouple temperature sensor 4 is in direct contact with the microcrystalline glass plate 1. The thermocouple temperature sensor 4 is located below the microcrystalline glass plate 1 and is within the size range of the heating coil disk 7 projected onto the microcrystalline glass plate 1. The thermocouple temperature sensor 4 is located at the center of the projection range of the heating coil disk 7 or all positions deviating from the center. It can be understood that the thermocouple temperature sensor 4 is located at the center of the microcrystalline glass plate 1 or all positions deviating from the center.
[0032] In order to reduce the electromagnetic interference effect on the thermocouple temperature sensor 4 , it is necessary to shield the electromagnetic field on the thermocouple temperature sensor 4 to reduce the electromagnetic interference on the measurement result of the thermocouple temperature sensor 4 .
[0033] At least a part of the thermocouple temperature sensor 4 is encapsulated in the metal shielding shell 3 , and the thermocouple temperature measuring probe 5 is located outside the metal shielding shell 3 and directly contacts the microcrystalline glass plate 1 .
[0034] In order to better reduce the influence of other heat sources on the thermocouple temperature sensor 4, an ambient temperature test is set in the operation unit 8 or the power control part 9, and the cold end compensation is performed on the cold end of the thermocouple temperature sensor 4. The operation unit 8 will perform operational amplification on all measured electrical signals and perform analog or digital conversion (A / D), and transmit them to the power control part 9 for control. The amplification and analog-to-digital conversion of the operation unit 8 can be electrical components that are separated from the control board, or they can be electrical components integrated inside the MCU chip.
[0035] The power control unit 9 includes a power control board (control circuit board) 10 and a display board 11. The power control unit 9 performs heating control according to the actual temperature value combined with the preset temperature value, so that the cooking utensil 13 can maintain the temperature range set by the program when heating. The heating coil disk 7 keeps the heating temperature stable during the heating process of the cooking utensil 13, thereby realizing precise control of the cooking temperature. The advantage is that the temperature control is more precise, preventing the food in the cooking utensil 13 from being burnt due to excessive temperature, reducing the generation of oil smoke during the cooking process, and making the operation more convenient and intelligent.
[0036] The power control board 10 is provided with an MCU chip, and the MCU chip is conductively connected to the power control board 10 .
[0037] See also Figure 5 A cooking utensil 13 is placed above the microcrystalline glass plate 1, and a heating coil 7 below the microcrystalline glass plate 1 performs high-frequency electromagnetic heating on the cooking utensil 13. The heat of the cooking utensil 13 radiates to the microcrystalline glass plate 1. The thermocouple temperature measuring probe 5 of the thermocouple temperature sensor 4 is tightly attached to the microcrystalline glass plate 1, and it can sense slight changes in temperature. The thermocouple temperature sensor 4 converts the temperature signal into an electrical signal of high and low voltage; at the same time, to avoid high-frequency electromagnetic interference with the measurement value of the thermocouple temperature sensor 4, a metal shielding net 6 and a metal shielding shell 3 are provided on the periphery of the thermocouple signal line of the thermocouple temperature sensor 4, and the assembled thermocouple temperature sensor 4 passes through the opening position of the heating coil disk 7. The thermocouple temperature sensor 4 converts the detected temperature value into a high and low voltage signal, which is transmitted to the operation unit 8 for signal amplification and AD conversion. It can also be combined with the temperature sensor provided by the microcrystalline glass plate 1 to perform cold end compensation on the thermocouple temperature sensor 4. The temperature sensor provided by the microcrystalline glass plate 1 transmits the corrected temperature to the power control part 9. The power control part 9 controls the firepower and heating time of the heating coil disk 7 according to the measured precise temperature, thereby achieving precise temperature control during cooking.
[0038] The metal shielding shell 3 at least partially covers the metal shielding net 6, and the thermocouple signal line near one end of the thermocouple temperature measuring probe 5 is covered by the metal shielding net 6 and the metal shielding shell 3 to form a double-layer electromagnetic shielding layer, which effectively prevents electromagnetic interference.
[0039] To improve reliability, an NTC temperature sensor 12 may be selectively added to the bottom of the glass-ceramic plate 1 to achieve mutual failure calibration between the NTC temperature sensor 12 and the thermocouple temperature sensor 4, such as Figure 3 In the embodiment, when the temperature of the glass-ceramic plate 1 is stabilized, if the temperature value measured by the NTC temperature sensor 12 and the temperature value measured by the thermocouple temperature sensor 4 deviate by more than a certain limit, it can be determined that one of the sensors has failed, and the heating coil 7 stops heating to ensure the reliability of the whole machine.
[0040] Second embodiment:
[0041] See also Figure 6 The thermocouple temperature measuring probe 5 of the thermocouple temperature sensor 4 is pre-buried inside the microcrystalline glass plate 1 to further improve the temperature response efficiency. The other parts are the same as those in the first embodiment and will not be described in detail here.
[0042] Third embodiment:
[0043] See also Figure 7 At present, the integration of MCU chips is relatively high. The MCU chip can realize the operation amplification of electrical signals and the A / D conversion of analog or digital quantities. Therefore, the operation unit 8 can be integrated inside the control board, and the thermocouple temperature measuring probe 5 of the thermocouple temperature sensor 4 is directly in contact with the bottom of the microcrystalline glass plate 1, or the thermocouple temperature measuring probe 5 of the thermocouple temperature sensor 4 is pre-buried in the microcrystalline glass plate 1. The other parts are the same as the first embodiment and will not be described in detail here.
[0044] Fourth embodiment:
[0045] See also Figure 3 , Figure 4 , Figure 5 The microcrystalline glass plate 1 is provided with a heat conducting member 2 , and the temperature of the microcrystalline glass plate 1 is transferred to the thermocouple temperature measuring probe 5 of the thermocouple temperature sensor 4 through the heat conducting member 2 .
[0046] The above is a preferred embodiment of the utility model, which shows and describes the basic principle, main features and advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments, and the above embodiments and descriptions are only for explaining the principle of the utility model. The utility model may have various changes and improvements without departing from the spirit and scope of the utility model, and these changes and improvements fall within the scope of the utility model to be protected. The scope of protection of the utility model is defined by the attached claims and their equivalents.
Claims
1. An induction cooker with precise temperature control, comprising a heater acting on a microcrystalline glass plate (1) and a control assembly electrically connected to the heater, characterized in that: A thermocouple temperature sensor (4) electrically connected to the control assembly is provided below the microcrystalline glass plate (1). The thermocouple temperature sensor (4) comprises a thermocouple temperature measuring probe (5) for detecting the temperature value of the microcrystalline glass plate (1). The thermocouple temperature measuring probe (5) is in direct or indirect contact with the microcrystalline glass plate (1). The thermocouple temperature sensor (4) converts the temperature detection value of the microcrystalline glass plate (1) through the thermocouple temperature measuring probe (5) into an electrical signal transmitted to the control assembly. The control assembly receives the electrical signal and adjusts the heating power of the heater, thereby realizing accurate temperature control of the induction cooker.
2. The precise temperature-controlled induction cooker according to claim 1, characterized in that: The thermocouple temperature measuring probe (5) is abutted against the bottom of the microcrystalline glass plate (1); or, a housing cavity is provided in the microcrystalline glass plate (1), and the thermocouple temperature measuring probe (5) is limitedly installed in the housing cavity of the microcrystalline glass plate (1), so that the thermocouple temperature measuring probe (5) is pre-buried in the microcrystalline glass plate (1).
3. The precise temperature-controlled induction cooker according to claim 1, characterized in that: The thermocouple temperature sensor (4) comprises a thermocouple signal line conductively connected to the control assembly, one end of the thermocouple signal line is fixedly connected to the thermocouple temperature measuring probe (5), and a metal shielding net (6) is provided on the outer peripheral side of the thermocouple signal line.
4. The precise temperature-controlled induction cooker according to claim 1, characterized in that: The thermocouple temperature sensor (4) comprises a metal shielding shell (3) for encapsulating a portion of the thermocouple temperature sensor (4); the thermocouple temperature measuring probe (5) is located outside the metal shielding shell (3) and directly contacts the bottom of the microcrystalline glass plate (1).
5. The precise temperature-controlled induction cooker according to claim 1, characterized in that: Two first electromagnetic shielding layers and a second electromagnetic shielding layer are provided at intervals on the outer peripheral side of the thermocouple signal line close to the thermocouple temperature measuring probe (5); the second electromagnetic shielding layer covers the outer peripheral side of the thermocouple signal line, and the first electromagnetic shielding layer covers the outer peripheral side of the second electromagnetic shielding layer; the first electromagnetic shielding layer and the second electromagnetic shielding layer form a double-layer electromagnetic shielding layer.
6. The precise temperature-controlled induction cooker according to claim 1, characterized in that: The heater is an electromagnetically heated heating coil disk (7).
7. The precise temperature-controlled induction cooker according to claim 1, characterized in that: The control assembly comprises a calculation unit (8) and a power control part (9), wherein the power control part (9) is provided with a preset control area for presetting the heating temperature, heating power and heating time of the heater.
8. The precise temperature-controlled induction cooker according to claim 7, characterized in that: The operation unit (8) and the power control part (9) are arranged in a split type.
9. The precise temperature-controlled induction cooker according to claim 7, characterized in that: The power control part (9) comprises a power control board (10) and a display board (11); an MCU chip is arranged on the power control board (10); the operation unit (8) is arranged on the MCU chip; the operation unit (8) and the MCU chip are integrated on the power control board (10) of the power control part (9); the operation unit (8), the MCU chip and the power control board (10) are electrically connected; the display board (11) is used to display the heating temperature, heating power and heating time of the heater; or the display board (11) is a touch control display screen, so that the heating temperature, heating power and heating time of the heater can be preset on the touch control display screen.
10. The precise temperature-controlled induction cooker according to claim 1, characterized in that: An NTC temperature sensor (12) electrically connected to the control assembly is provided below the microcrystalline glass plate (1). The NTC temperature sensor (12) cooperates with the thermocouple temperature sensor (4) to jointly detect the temperature value of the microcrystalline glass plate (1).