Micro differential pressure sensor integrating multiple functions
By designing micro-differential pressure sensors that integrate multiple functions, the problems of large space occupation and high assembly costs caused by independent packaging of airflow sensors and processing chips in traditional electronic cigarettes are solved, and the product is miniaturized, cost reduction and anti-interference ability are improved.
Patent Information
- Application Number
- CN202421499162.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-28
- Publication Date
- 2025-05-06
- Estimated Expiration
- 2034-06-28
AI Technical Summary
In traditional electronic cigarettes that detect airflow start, the airflow sensor and the back-end processing chip are both independently packaged, resulting in large space consumption and high assembly costs.
A micro-differential pressure sensor with integrated multiple functions is designed, including a packaging substrate, a main control chip, an air-fluid sensing chip and a metal protective case. The main control chip and an air-fluid sensing chip are fixedly installed on one side of the packaging substrate, and the metal protective case is fixedly installed on the side where the main control chip and an air-fluid sensing chip are installed on the side where the package substrate is installed, forming a metal shielding cavity. The main control chip and an air-fluid sensing chip are located in the metal shielding cavity.
It achieves miniaturization of product volume, reduces overall cost, reduces packaging volume, has strong anti-interference ability, and provides good heat dissipation effect through the use of high thermal conductivity silver paste.
Smart Images
Figure CN222837717U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of electronic cigarette electronic control, and in particular to a micro differential pressure sensor integrating multiple functions. Background Art
[0002] Electronic cigarettes are electronic products that imitate cigarettes. There are many ways to start them. The most commonly used methods are button switch and airflow detection. Because of the convenience of airflow detection, it is widely used.
[0003] Traditional electronic cigarettes that detect airflow to start use a circular airflow sensor to detect airflow changes in the airway, which generates capacitance changes and transmits them to the back-end processing chip. After receiving the signal, the processing chip outputs a voltage to start the atomizer and form smoke.
[0004] Currently, airflow sensors and back-end processing chips are packaged independently, which takes up a lot of space and has high assembly costs. Utility Model Content
[0005] The purpose of the utility model is to overcome the shortcomings of the above-mentioned traditional technology and provide a micro differential pressure sensor integrating multiple functions that can solve the above-mentioned problems.
[0006] The purpose of the utility model is achieved through the following technical measures: a micro-differential pressure sensor integrating multiple functions, characterized in that: it includes a packaging substrate, a main control chip, an airflow sensing chip and a metal protective shell, the main control chip and the airflow sensing chip are fixedly installed on one side of the packaging substrate, the metal protective shell is fixedly installed on the side of the packaging substrate where the main control chip and the airflow sensing chip are installed, a metal shielding cavity is formed between the metal protective shell and the packaging substrate, the main control chip and the airflow sensing chip are fixedly installed on the packaging substrate and are located in the metal shielding cavity, a first through hole is opened on the packaging substrate, a second through hole is opened on the metal protective shell, and the metal protective shell has the functions of structural protection and electromagnetic shielding.
[0007] As a preferred solution: the main control chip and the airflow sensing chip are electrically connected, the packaging substrate adopts an FR4 epoxy resin board, and the packaging substrate adopts a surface copper-clad design and a via design.
[0008] As a preferred solution: the main control chip and the airflow sensing chip are mounted on the packaging substrate through thermal conductive silver paste.
[0009] As a preferred solution: the metal protective shell provides structural protection and electromagnetic shielding for the main control chip and the airflow sensing chip.
[0010] As a preferred solution: the first through holes and the second through holes are arranged alternately.
[0011] As a preferred solution: the airflow sensing chip is arranged corresponding to the first through hole, and the main control chip is arranged away from the first through hole.
[0012] As a preferred solution: the first through hole is opened on a side of the metal protective shell away from the packaging substrate.
[0013] As a preferred solution: the metal protective shell includes a shell and a connecting seat, and the shell and the connecting seat are integrated.
[0014] As a preferred solution: the first through hole is opened on the shell, and the connecting seat is fixedly connected to the packaging substrate.
[0015] As a preferred solution: the distance between the cross sections of the packaging substrate and the metal protective shell that are away from each other is L , L The value is 1.1±0.2mm.
[0016] Due to the adoption of the above technical solution, compared with the prior art, the advantages of the utility model are:
[0017] The utility model discloses a micro differential pressure sensor integrating multiple functions, comprising a packaging substrate, a main control chip, an airflow sensing chip and a metal protective shell, wherein the main control chip and the airflow sensing chip are fixedly mounted on one side of the packaging substrate, the metal protective shell is fixedly mounted on the side of the packaging substrate where the main control chip and the airflow sensing chip are mounted, the main control chip and the airflow sensing chip are fixedly mounted on a portion of the packaging substrate located within the metal protective shell, a first through hole is provided on the packaging substrate, a second through hole is provided on the metal protective shell, the metal protective shell has the functions of structural protection and electromagnetic shielding, and the chip mounting in the present application uses high thermal conductivity silver paste to provide favorable conditions for the heat dissipation of the product.
[0018] The utility model is further described below in conjunction with the accompanying drawings and specific implementation methods. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] Attached Figure 1 It is a structural schematic diagram of a micro differential pressure sensor integrating multiple functions of the utility model.
[0020] Attached Figure 2 It is a structural schematic diagram of the metal protective shell and the second through hole of the utility model.
[0021] Attached Figure 3 It is a highly schematic diagram of the utility model. DETAILED DESCRIPTION
[0022] Example: As attached Figure 1 To Attachment Figure 3As shown, a micro differential pressure sensor integrating multiple functions includes a packaging substrate 1, a main control chip 2, an airflow sensing chip 3 and a metal protective shell 4, wherein the main control chip 2 and the airflow sensing chip 3 are fixedly mounted on one side of the packaging substrate 1, and the metal protective shell 4 is fixedly mounted on the side of the packaging substrate 1 where the main control chip 2 and the airflow sensing chip 3 are mounted, a metal shielding cavity is formed between the metal protective shell 4 and the packaging substrate 1, the main control chip 2 and the airflow sensing chip 3 are fixedly mounted on the packaging substrate 1 and are located in the metal shielding cavity, and have strong anti-interference ability, a first through hole 5 is opened on the packaging substrate 1, and a second through hole 6 is opened on the metal protective shell 4, and the metal protective shell 4 has the functions of structural protection and electromagnetic shielding, while some circuits of the same type of products are made outside the metal shielding cavity, and have weak anti-interference ability.
[0023] The main control chip 2 is electrically connected to the airflow sensing chip 3 , the packaging substrate 1 is made of FR4 epoxy resin board, and the packaging substrate 1 is designed with surface copper cladding and vias.
[0024] The main control chip 2 and the airflow sensing chip 3 are mounted on the packaging substrate 1 by means of thermally conductive silver paste. The chip mounting uses a high thermally conductive silver paste, which provides favorable conditions for the heat dissipation of the product.
[0025] The metal protective shell 4 provides structural protection and electromagnetic shielding for the main control chip 2 and the airflow sensing chip 3 .
[0026] The first through holes 5 and the second through holes 6 are arranged alternately, and the functions of the first through holes 5 and the second through holes 6 can be limited according to actual needs. When the first through hole 5 is an air inlet hole, the second through hole 6 is an air suction hole, and vice versa.
[0027] The airflow sensing chip 3 is disposed corresponding to the first through hole 5 , and the main control chip 2 is disposed away from the first through hole 5 .
[0028] The first through hole 5 is opened on a side of the metal protection shell 4 away from the packaging substrate 1 .
[0029] The metal protective shell 4 includes a shell 41 and a connecting seat 42 , and the shell 41 and the connecting seat 42 are integrated.
[0030] The first through hole 5 is formed on the housing 41 , and the connecting base 42 is fixedly connected to the packaging substrate 1 .
[0031] The distance between the cross sections of the package substrate 1 and the metal protective shell 4 that are away from each other is L , L The value is 1.1±0.2mm.
[0032] The advantages of this application are as follows:
[0033] 1. The product is small in size. The height of similar products is about 1.5mm, while the height of the sensor in this application is between 1.1±0.2mm;
[0034] 2. The main control chip 2 and airflow sensing chip 3 of the present application adopt a full electromagnetic shielding design, and all circuits are made in the metal shielding cavity, with strong anti-interference ability. Some circuits of the same type of products are made outside the metal shielding cavity, and the anti-interference ability is not strong.
[0035] 3. The sensor of the present application integrates the main control chip 2 and the airflow sensing chip 3 into one package, which reduces the overall cost and the package volume, is beneficial to the design and assembly of finished products, has a smaller volume, lower cost, shorter circuits, and also reduces power consumption.
[0036] 4. This application has a special heat dissipation structure and material design, so that the heat generated during operation can be dissipated quickly and maintain normal working state.
[0037] It should be noted that the packaging substrate 1, the main control chip 2, the airflow sensing chip 3 and the metal protective shell 4 can be connected by glue, solder paste and thermal conductive silver paste, and the specific connection method can be selected according to actual conditions.
Claims
1. A micro differential pressure sensor integrating multiple functions, characterized in that: The invention comprises a packaging substrate (1), a main control chip (2), an airflow sensing chip (3) and a metal protective shell (4), wherein the main control chip (2) and the airflow sensing chip (3) are fixedly mounted on one side of the packaging substrate (1), and the metal protective shell (4) is fixedly mounted on the side of the packaging substrate (1) on which the main control chip (2) and the airflow sensing chip (3) are mounted, a metal shielding cavity is formed between the metal protective shell (4) and the packaging substrate (1), the main control chip (2) and the airflow sensing chip (3) are fixedly mounted on the packaging substrate (1) and are located in the metal shielding cavity, a first through hole (5) is provided on the packaging substrate (1), and a second through hole (6) is provided on the metal protective shell (4), and the metal protective shell (4) has the functions of structural protection and electromagnetic shielding.
2. The micro differential pressure sensor integrating multiple functions according to claim 1, characterized in that: The main control chip (2) and the airflow sensing chip (3) are electrically connected, the packaging substrate (1) adopts an FR4 epoxy resin board, and the packaging substrate (1) adopts a surface copper-clad design and a via design.
3. The micro differential pressure sensor integrating multiple functions according to claim 2, characterized in that: The main control chip (2) and the airflow sensing chip (3) are mounted on the packaging substrate (1) via heat-conductive silver paste.
4. The micro differential pressure sensor integrating multiple functions according to claim 2, characterized in that: The metal protective shell (4) provides structural protection and electromagnetic shielding for the main control chip (2) and the airflow sensing chip (3).
5. A micro differential pressure sensor integrating multiple functions according to any one of claims 1 to 4, characterized in that: The first through holes (5) and the second through holes (6) are arranged alternately.
6. A micro differential pressure sensor with integrated multiple functions according to any one of claims 1 to 4, characterized in that: The airflow sensing chip (3) and the first through hole (5) are arranged correspondingly, and the main control chip (2) is arranged away from the first through hole (5).
7. The micro differential pressure sensor integrating multiple functions according to claim 6, characterized in that: The first through hole (5) is opened on a side of the metal protective shell (4) away from the packaging substrate (1).
8. The micro differential pressure sensor integrating multiple functions according to claim 7, characterized in that: The metal protective shell (4) comprises a shell (41) and a connecting seat (42), and the shell (41) and the connecting seat (42) are integrally arranged.
9. The micro differential pressure sensor integrating multiple functions according to claim 8, characterized in that: The first through hole (5) is formed on the housing (41), and the connecting seat (42) is fixedly connected to the packaging substrate (1).
10. A micro differential pressure sensor integrating multiple functions according to any one of claims 7 to 9, characterized in that: The distance between the cross-sections of the packaging substrate (1) and the metal protective shell (4) that are away from each other is L , L The value is 1.1±0.2mm.