Large-current test base

Abstract

The utility model discloses a heavy current test base, which relates to the technical field of current test, and comprises a device main body, a test piece group is arranged at the upper end of the device main body, the heavy current test base further comprises a radiating fin, the lower surface of the test piece group is fixedly connected with the radiating fin, and the radiating fin is fixedly connected with the test piece group. The lower surface of the cooling fin is fixedly connected with the upper surface of the device main body, the contact area is effectively increased, so that the contact resistance is reduced, the test reliability is improved, the area of a contact point is designed to be 19.625 square millimeters, the sparking phenomenon generated when a diode is tested by large current can be effectively eliminated, and the test reliability is improved. The sparking phenomenon is an electric arc generated when a large current passes due to small contact area and large contact resistance, and by increasing the contact area and reducing the contact resistance, the occurrence of the phenomenon can be effectively reduced, so that test equipment and a tested element are protected, and the test is carried out smoothly.

Description

Technical Field

[0001] The utility model relates to the technical field of current testing, in particular to a large current testing base. Background Art

[0002] The high current test base is a professional device specially designed for precise testing of electronic components such as diodes. It can provide a safe current conduction path to ensure the stability and safety of the current during the test, and ensure the stability and accuracy of the test. At the same time, the high current test base is also equipped with complete safety protection measures, such as overload protection, short circuit protection, etc., to ensure that the diode can be reliably tested and evaluated during the test, and the safety of the test equipment and operators can be effectively protected. In short, while providing professional testing services for electronic components, the high current test base also fully considers the safety of operators and equipment. It is a test equipment with high reliability and practicality.

[0003] However, during the implementation of the above technical solution, it was found that there were at least the following technical problems:

[0004] When testing a diode with high current, the diode needs a high current to pass through. At this time, the PN junction inside the diode will be subjected to a large voltage and heat. When the current density exceeds its tolerance, the electrons and holes in the PN junction will obtain enough energy under the action of the electric field, resulting in collision ionization and generating a large number of electron and hole pairs. These newly added carriers will intensify the flow of current, forming the so-called "avalanche effect", causing the current to surge instantly, thereby forming an extremely high voltage drop at both ends of the diode, the so-called "sparking" phenomenon, causing the diode to be unable to withstand and breakdown, or there are problems such as poor contact or short circuit in the test circuit. Utility Model Content

[0005] 1. Technical issues to be resolved

[0006] In view of the deficiencies in the prior art, the utility model provides a high-current test base, which solves the problem that when a diode is tested with a high current, the diode needs a high current to pass through. At this time, the PN junction inside the diode will be subjected to a large voltage and heat. When the current density exceeds its tolerance, the electrons and holes in the PN junction will obtain sufficient energy under the action of the electric field, thereby causing collision ionization and generating a large number of electron and hole pairs. These newly added carriers will intensify the flow of current, forming a so-called "avalanche effect", causing an instantaneous surge in current, thereby forming an extremely high voltage drop at both ends of the diode, the so-called "sparking" phenomenon, causing the diode to be unable to withstand and break down, or there will be technical problems such as poor contact or short circuit in the test circuit.

[0007] (II) Technical solution

[0008] In order to achieve the above objectives, the present invention is implemented through the following technical solutions:

[0009] A high current test base comprises a device body, a test piece group is arranged at the upper end of the device body, and the high current test base also comprises a heat sink, the lower surface of the test piece group is fixedly connected to the heat sink, the lower surface of the heat sink is fixedly connected to the upper surface of the device body, and the surface of the heat sink is gold-plated.

[0010] Preferably: a guide mold seat is fixedly connected to the device body, a probe is arranged in the device body, and the guide mold seat corresponds to the position of the probe.

[0011] Preferably, a notch is provided in the middle of the guide die seat, and the lower end of the probe is located inside the notch.

[0012] Preferably: a spring ring 1 is arranged at the upper end of the guide mold seat, and the lower end of the probe passes through the spring ring 1.

[0013] Preferably: the upper end of the device body is fixedly connected to a guide mold plane, and the upper end of the probe is located inside the guide mold plane.

[0014] Preferably: a groove is arranged inside the device body, a second spring ring is arranged inside the groove, and the probe passes through the second spring ring.

[0015] (III) Beneficial effects

[0016] 1. By increasing the contact points on the bottom of the heat sink and effectively increasing the contact area, the contact resistance is reduced and the reliability of the test is improved. The area of ​​this contact point is designed to be 19.625 square millimeters, which can meet the needs of most high-current tests. At the same time, in order to further improve the stability and durability of the contact, the surface of the contact point is gold-plated. Gold plating can not only improve the conductivity of the contact point, but also effectively prevent the performance of the contact point from being degraded due to oxidation and other reasons during use. Through such a design, we can effectively eliminate the sparking phenomenon caused by high-current testing of diodes. The sparking phenomenon is due to the small contact area and large contact resistance, which leads to arcs when large currents pass through. By increasing the contact area and reducing the contact resistance, our design can effectively reduce the occurrence of this phenomenon, thereby protecting the test equipment and the components being tested and improving the smooth progress of the test.

[0017] 2. In the design of the high current test base, a notch is created on the guide mold base. When the test probe needs to be replaced or repaired, this notch provides a convenient space, allowing the staff to remove or install the probe more easily. This design not only improves work efficiency, but also reduces the risk of operational errors that may occur during the test process. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The above description is only an overview of the technical solution of the utility model. In order to more clearly understand the technical means of the utility model and implement it according to the contents of the specification, the following is a detailed description of the preferred embodiments of the utility model in conjunction with the accompanying drawings.

[0019] Figure 1 It is a structural diagram of the entire utility model;

[0020] Figure 2 For this utility model Figure 1 A schematic diagram of the enlarged structure at A in the middle;

[0021] Figure 3 It is a structural diagram of the interior of the main body of the device of the utility model;

[0022] Figure 4 For this utility model Figure 3 Schematic diagram of the enlarged structure at point B in the middle.

[0023] Legend: 1. Device body; 2. Test piece group; 3. Spring coil 1; 4. Probe; 5. Heat sink; 6. Notch; 7. Guide mold plane; 8. Spring coil 2; 9. Groove; 10. Guide mold seat. DETAILED DESCRIPTION

[0024] The embodiment of the present application provides a high-current test base, which effectively solves the technical problem that when testing a diode with a high current, the diode needs a high current to pass through. At this time, the PN junction inside the diode will be subjected to a large voltage and heat. When the current density exceeds its tolerance, the electrons and holes in the PN junction will obtain sufficient energy under the action of the electric field, thereby causing collision ionization and generating a large number of electron-hole pairs. These newly added carriers will intensify the flow of current, forming a so-called "avalanche effect", causing an instantaneous surge in current, thereby forming an extremely high voltage drop at both ends of the diode, the so-called "sparking" phenomenon, causing the diode to be unable to withstand and break down, or there will be poor contact or short circuit in the test circuit. By increasing the contact points on the bottom surface of the heat sink and effectively increasing the contact area, the voltage drop is reduced. Low contact resistance improves test reliability. The area of ​​this contact point is designed to be 19.625 square millimeters, which can meet the needs of most high-current tests. At the same time, in order to further improve the stability and durability of the contact, the surface of the contact point is gold-plated. Gold plating can not only improve the conductivity of the contact point, but also effectively prevent the performance of the contact point from degrading due to oxidation and other reasons during use. Through such a design, we can effectively eliminate the sparking phenomenon caused by high-current testing of diodes. The sparking phenomenon is due to the small contact area and large contact resistance, which leads to an arc when a large current passes through. By increasing the contact area and reducing the contact resistance, our design can effectively reduce the occurrence of this phenomenon, thereby protecting the test equipment and the components being tested and improving the smooth progress of the test.

[0025] Example

[0026] like Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, the technical solution in the embodiment of the present application effectively solves the problem that when a diode is tested at a high current, the diode needs a high current to pass through. At this time, the PN junction inside the diode will be subjected to a large voltage and heat. When the current density exceeds its tolerance, the electrons and holes in the PN junction will obtain sufficient energy under the action of the electric field, thereby causing collision ionization and generating a large number of electron and hole pairs. These newly added carriers will intensify the flow of current, forming the so-called "avalanche effect", causing the current to surge instantly, thereby forming an extremely high voltage drop at both ends of the diode, the so-called "sparking" phenomenon, causing the diode to be unable to withstand and breakdown, or there are technical problems such as poor contact or short circuit in the test circuit. The overall idea is as follows:

[0027] In view of the problems existing in the prior art, the utility model provides a high-current test base, including a device body 1, a test piece group 2 is arranged at the upper end position of the device body 1, the high-current test base also includes a heat sink 5, the lower surface of the test piece group 2 is fixedly connected to the heat sink 5, the lower surface of the heat sink 5 is fixedly connected to the upper surface of the device body 1, the surface of the heat sink 5 is gold-plated, the device body 1 is fixedly connected with a guide mold seat 10, the guide mold seat uses PEEK insulating material, and a probe 4 is arranged in the device body 1 to block the conduction. At the test position of the test probe 4, there are 3 points of contact at the heat sink, which is actually 2 points of contact to form a Kelvin test. The guide mold seat 10 corresponds to the position of the probe 4, a notch 6 is arranged in the middle position of the guide mold seat 10, and the lower end position of the probe 4 is located inside the notch 6. By increasing the contact points on the bottom surface of the heat sink 5, through Effectively increase the contact area, thereby reducing contact resistance and improving test reliability. The area of ​​this contact point is designed to be 19.625 square millimeters, which can meet the needs of most high-current tests. At the same time, in order to further improve the stability and durability of the contact, the surface of the contact point is gold-plated. Gold plating can not only improve the conductivity of the contact point, but also effectively prevent the performance of the contact point from being degraded due to oxidation and other reasons during use. Through such a design, we can effectively eliminate the sparking phenomenon caused by high-current testing of diodes. The sparking phenomenon is due to the small contact area and large contact resistance, which leads to an arc when a large current passes through. By increasing the contact area and reducing the contact resistance, our design can effectively reduce the occurrence of this phenomenon, thereby protecting the test equipment and the components being tested and improving the smooth progress of the test.

[0028] A spring coil 3 is provided at the upper end of the guide mold seat 10, and the spring coil 3 is responsible for the collapse and clearance of the test probe 4. The lower end of the probe 4 passes through the spring coil 3. The upper end of the device body 1 is fixedly connected to the guide mold plane 7, and the upper end of the probe 4 is located inside the guide mold plane 7. A groove 9 is provided inside the device body 1, and a spring coil 2 8 is provided inside the groove 9. The spring coil 2 8 is responsible for the collapse and clearance of the guide mold plane 7. The probe 4 passes through the spring coil 2 8, and the test point of the probe 4 is 0.4mm higher than the guide mold plane to ensure priority contact. In the design of the high-current test base, a notch 2 is started on the guide mold seat 10. When the test probe 4 needs to be replaced or repaired, this notch 2 provides a convenient space, so that the staff can more easily remove or install the probe 4. Such a design not only improves work efficiency, but also reduces the risk of operational errors that may occur during the test process.

[0029] Working principle: By increasing the contact points on the bottom surface of the heat sink 5 and effectively increasing the contact area, the contact resistance is reduced and the reliability of the test is improved. The area of ​​this contact point is designed to be 19.625 square millimeters, which can meet the needs of most high-current tests. At the same time, in order to further improve the stability and durability of the contact, the surface of the contact point is gold-plated. Gold plating can not only improve the conductivity of the contact point, but also effectively prevent the performance degradation of the contact point due to oxidation and other reasons during use. Through such a design, we can effectively eliminate the sparking phenomenon caused by high-current testing of diodes. The sparking phenomenon is caused by the small contact area and large contact resistance, which leads to an arc when a large current passes through. By increasing the contact area and reducing the contact resistance, our design can effectively reduce the occurrence of this phenomenon, thereby protecting the test equipment and the tested components and improving the smooth progress of the test. In the design of the high-current test base, a notch 2 is started on the guide mold base 10. When the test probe 4 needs to be replaced or repaired, this notch 2 provides a convenient space, allowing the staff to more easily remove or install the probe 4. Such a design not only improves work efficiency, but also reduces the risk of operational errors that may occur during the test process.

[0030] Finally, it should be noted that: Obviously, the above embodiments are only examples for clearly explaining the present invention, and are not intended to limit the implementation methods. For ordinary technicians in the relevant field, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. The obvious changes or modifications derived from this are still within the scope of protection of the present invention.

Claims

1. A high current test base, comprising a device body (1), wherein a test piece group (2) is arranged at the upper end of the device body (1), characterized in that: The high current test base also includes a heat sink (5); The lower surface of the test piece group (2) is fixedly connected to the heat sink (5), the lower surface of the heat sink (5) is fixedly connected to the upper surface of the device body (1), and the surface of the heat sink (5) is gold-plated.

2. A high current test base as claimed in claim 1, characterized in that: The device body (1) is fixedly connected with a guide die seat (10); A probe (4) is arranged inside the device body (1).

3. A high current test base as claimed in claim 2, characterized in that: A notch (6) is provided in the middle of the guide mold base (10), and the lower end of the probe (4) is located inside the notch (6).

4. A high current test base as claimed in claim 3, characterized in that: A spring ring 1 (3) is provided at the upper end of the guide die seat (10); The lower end of the probe (4) passes through the spring coil 1 (3).

5. A high current test base as claimed in claim 1, characterized in that: The upper end of the device body (1) is fixedly connected with a guide mold plane (7); The upper end of the probe (4) is located inside the guide mold plane (7).

6. A high current test base as claimed in claim 1, characterized in that: The device body (1) is provided with a groove (9) inside, and a spring ring 2 (8) is provided inside the groove (9); The probe (4) passes through the second spring coil (8).

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