Electrical testing jig for circuit board
By using copper point contact and copper foil plating layer in the circuit board electrical test fixture for conduction, the problem of inaccurate probe contact in the prior art is solved, and higher testing accuracy and less material use is achieved.
Patent Information
- Application Number
- CN202421548859.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-03
- Publication Date
- 2025-05-06
- Estimated Expiration
- 2034-07-03
AI Technical Summary
The existing circuit board electrical testing fixtures are conducted through the probe for conduction testing. The probe has a large contact resistance and is prone to wear, and requires multi-layer structural support, which makes it impossible to complete the test of precision circuits.
An electrical measuring tool for circuit board is used to replace probe contact through copper point contact, and the copper foil and copper plating layer are used for conduction, and the test accuracy is ensured through fixed columns and upper support plates.
Reduce the use of materials for fixtures, improve the testing accuracy, avoid probe wear and displacement problems, and enable more precise testing of circuit boards.
Smart Images
Figure CN222838159U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of circuit boards, in particular to an electrical testing fixture for circuit boards. Background Art
[0002] Printed circuit boards are important electronic components, supporting bodies for electronic components, and carriers for electrical connections of electronic components. With the continuous miniaturization, lightness, and multifunctionality of electronic products, the size of circuit boards is getting smaller and smaller, the wiring density is getting higher and higher, and the shapes of circuit boards are also diverse. Special-shaped circuit boards are often used in various fields. Accordingly, multi-layer high-density interconnected printed circuit boards with blind drilling countersunk hole design will gradually become an important part of various high-tech electronic products.
[0003] In the prior art, a general circuit board electrical testing fixture uses a probe to perform a continuity test. The probe itself has a large contact resistance and is easily worn. At the same time, the probe fixture requires a multi-layer structure to support the probe. The probe moves up and down during the test, which will produce a certain displacement and cannot complete the test of the precision circuit.
[0004] In view of the above problems, an electrical testing fixture for circuit boards is proposed to solve the above problems. Utility Model Content
[0005] In order to make up for the above shortcomings, the utility model provides an electrical testing fixture for circuit boards, aiming to improve the problem that in the prior art, general circuit board electrical testing fixtures use probes to perform continuity tests. The probes themselves have large contact resistance and are easily worn. At the same time, the probe fixture requires a multi-layer structure to support the probes. The probes move up and down during testing, which will produce a certain displacement and cannot complete the test of precision circuits.
[0006] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: an electrical testing fixture for a circuit board, comprising a top copper foil one, a copper plating one, a top copper one, a lower fixture one and a plurality of fixed columns, an intermediate layer FR4 one is arranged at the bottom of the top copper foil one, a bottom copper foil one is arranged at the bottom of the intermediate layer FR4 one, a top copper foil two is arranged at the bottom of the copper plating one, an intermediate layer FR4 two is arranged at the bottom of the top copper foil two, a bottom copper foil two is arranged at the bottom of the intermediate layer FR4 two, a copper plating two is arranged at the bottom of the bottom copper foil two, an intermediate layer FR4 three is arranged at the bottom of the top copper one, a bottom copper two is arranged at the middle side of the bottom of the top copper one, an upper supporting plate is arranged at the top of the fixed column, an intermediate layer FR4 four is arranged at the bottom of the fixed column, a plurality of bottom copper threes are arranged at the top of the intermediate layer FR4 four, a plurality of top copper twos are arranged between the upper supporting plate and the intermediate layer FR4 four, a plurality of fixture connecting lines are arranged on the outside of the top copper two, a plurality of supporting columns are fixedly connected to the top of the lower fixture one, and a lower fixture two is fixedly connected to the top of the support column.
[0007] As a further description of the above technical solution:
[0008] A blind hole 4 is provided inside the bottom copper layer 2.
[0009] As a further description of the above technical solution:
[0010] A plug-in line row is arranged on the left side of the top of the middle layer FR4, and one end of a plurality of the fixture connecting wires is arranged on one side of the plug-in line row.
[0011] As a further description of the above technical solution:
[0012] A blind hole is opened inside the top copper foil and the middle layer FR4.
[0013] As a further description of the above technical solution:
[0014] Blind holes 2 are provided inside the second top copper foil layer and the second middle FR4 layer.
[0015] As a further description of the above technical solution:
[0016] A blind hole three is opened inside the middle layer FR4 three.
[0017] As a further description of the above technical solution:
[0018] The middle layer FR4 has a plurality of holes formed around its interior.
[0019] As a further description of the above technical solution:
[0020] A plurality of pins are arranged inside the second lower fixture, and the outer sides of the pins are arranged inside the clearance holes.
[0021] The utility model has the following beneficial effects:
[0022] In the utility model, the position of the bottom copper layer 2 is matched to the position of the test point of the product to be tested, and then the surface of the top copper layer 1 and the bottom copper layer 2 is nickel-plated and then gold-plated to prevent surface oxidation. The connecting wire is soldered to the reserved welding position of the top copper layer 1 by soldering, and the other end of the connecting wire is connected to the plug-in line, and the plug-in line is fixed to the test board by screws, and waits to be connected to the test equipment. The test circuit board is connected to the upper support plate through the fixing column, and the positioning pin is reserved on the lower fixture 2 for positioning the product and the upper and lower fixtures. It realizes the combination of the circuit board processing technology and the electrical test fixture processing method, and uses copper point contact instead of probe contact, which reduces the material used in the fixture and improves the fixture test accuracy. BRIEF DESCRIPTION OF THE DRAWINGS
[0023] Figure 1This is a schematic diagram of the structure of an upper support plate of an electrical testing fixture for a circuit board proposed by the utility model;
[0024] Figure 2 This is a cross-sectional view of a circuit board processing for testing of an electrical testing fixture for a circuit board proposed by the utility model;
[0025] Figure 3 The utility model is a structural schematic diagram of a lower fixture 2 of an electrical testing fixture for a circuit board.
[0026] Legend:
[0027] 1. Top copper foil one; 2. Middle layer FR4 one; 3. Bottom copper foil one; 4. Blind hole one; 5. Copper plating one; 6. Copper plating two; 7. Top copper one; 8. Bottom copper two; 9. Fixing column; 10. Fixture connecting wire; 11. Plug row; 12. Make way hole; 13. Upper support plate; 14. Pin; 15. Lower fixture one; 16. Top copper foil two; 17. Middle layer FR4 two; 18. Bottom copper foil two; 19. Middle layer FR4 three; 20. Blind hole two; 21. Blind hole three; 22. Middle layer FR4 three; 23. Blind hole four; 24. Top copper two; 25. Bottom copper two; 26. Lower fixture two; 27. Support column. DETAILED DESCRIPTION
[0028] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0029] Reference Figure 1 - Figure 3The utility model provides an embodiment: an electrical testing fixture for a circuit board, comprising a top copper foil 1, a copper plating 5, a top copper 7, a lower fixture 15 and a plurality of fixing columns 9, an intermediate layer FR4-2 is arranged at the bottom of the top copper foil 1, a bottom copper foil 3 is arranged at the bottom of the intermediate layer FR4-2, a top copper foil 2 16 is arranged at the bottom of the copper plating 5, an intermediate layer FR4-17 is arranged at the bottom of the top copper foil 2 16, a bottom layer FR4-17 is arranged at the bottom of the intermediate layer FR4-17, a bottom copper foil 2 18 is arranged at the bottom of the bottom copper foil 2 18, a copper plating 26 is arranged at the bottom of the top copper foil 1 An intermediate layer FR4 three 19 is arranged at the bottom of 7, a bottom copper two 8 is arranged on the middle side of the bottom of the top copper one 7, an upper support plate 13 is arranged on the top of the fixed column 9, an intermediate layer FR4 four 22 is arranged at the bottom of the fixed column 9, a plurality of bottom copper three 25 are arranged on the top of the intermediate layer FR4 four 22, a plurality of top copper two 24 are arranged between the upper support plate 13 and the intermediate layer FR4 four 22, a plurality of fixture connecting wires 10 are arranged on the outside of the top copper two 24, a plurality of support columns 27 are fixedly connected to the top of the lower fixture one 15, and a lower fixture two 26 is fixedly connected to the top of the support column 27.
[0030] Specifically, first, we started to make the circuit board for testing, and selected the double-sided copper-clad board of FR4 material, including the top copper foil 1, the middle layer FR42 and the bottom copper foil 3, whose thickness is in the range of 1.6-3mm. Next, according to the circuit board processing process, the operation is carried out: cutting-drilling, including the give-way hole 12, the blind hole 4, the blind hole 20, the blind hole 3 21 and the blind hole 4 23. Black hole treatment is performed on the walls of these holes to attach the conductive layer. Next, the top copper foil and the bottom copper foil are copper plated, copper plated 5 and copper plated 6 respectively, and the blind hole 4, blind hole 20, blind hole 3 21 and blind hole 4 23 are filled with hole filling electroplating technology. Then, the seven layers of copper foil are accurately etched through the exposure-development-etching process to obtain the required circuit pattern. At this time, the position of the bottom copper 2 8 corresponds precisely to the test point of the product to be tested. In order to protect the circuit surface, we nickel-plated and then gold-plated on the top copper 1 7 and the bottom copper 2 8 to prevent oxidation. After completing the above steps, we solder the connecting wire to the reserved welding area of the circuit board, and the other end is connected to the plug-in strip 11. The plug-in strip 11 is fixed to the test board by screws so as to be connected to the test equipment. The test circuit board is firmly connected to the upper support plate 13 through the fixing column 9 to provide stability. The lower fixture 26 is provided with a positioning pin 14 for precise product positioning and stable cooperation between the upper and lower fixtures. In actual testing, the fixture will be fixed to the test equipment, and the test can be repeated through the opening and closing action of the equipment.
[0031] Reference Figure 1 - Figure 3A blind hole 4 is opened inside the bottom copper layer 8, a plug-in wire row 11 is set on the top left side of the middle layer FR4-2, one end of a plurality of fixture connecting wires 10 is set on one side of the plug-in wire row 11, a blind hole 4 is opened inside the top copper foil 1 and the middle layer FR4-2, a blind hole 3 21 is opened inside the middle layer FR4 3 19, a plurality of clearance holes 12 are opened around the middle layer FR4 4 22, a plurality of pins 14 are set inside the lower fixture 26, and the outer side of the pins 14 is set inside the clearance hole 12.
[0032] Specifically, the plug-in row 11 is placed on the top left side of the middle layer FR4-2 to facilitate the connection of external signals or power. One end of the fixture connection line 10 is connected to the plug-in row 11 to ensure the effective connection between the circuit and the test equipment. Blind holes 4 are set on the top copper foil 1 and the middle layer FR4-2. This is a hidden hole that may be used to install components or make other internal connections. Blind holes 21 are set inside the middle layer FR4 three 19, which may be used for similar functions or to reserve space for subsequent process flows. A plurality of clearance holes 12 are set around the middle layer FR4 four 22. These holes are to facilitate the assembly and installation process of the circuit board so that the components can be accurately aligned and installed. A plurality of pins 14 are set inside the lower fixture two 26. These pins 14 play a positioning role, ensuring the precise positioning of the product on the fixture, and also making the upper and lower fixtures fit more closely.
[0033] Working principle: First, the test circuit board is made. The test board uses FR4 material double-sided copper clad board including top copper foil 1, middle layer FR4 2, bottom copper foil 3, thickness 1.6-3mm, and then it is processed according to the circuit board processing technology, cutting - drilling including give-way hole 12, blind hole 14, blind hole 20, blind hole 3 21 and bottom copper 3 25 - black hole attached with conductive layer on the wall of blind hole - filling hole electroplating, copper 15 and copper 26 are plated on the top copper foil and bottom copper foil respectively, and blind hole 14, blind hole 20, blind hole 3 21 and blind hole 4 23 are filled with copper 15 through filling hole electroplating. At this time, the top copper 7 (1+5) layers of copper foil and the bottom copper 2 8 (3+6) layers of copper foil are connected through the copper plating in blind hole 14, blind hole 20, blind hole 3 21 and blind hole 4 23. Then, the seven layers of copper are etched through the exposure-development-etching process to obtain the required pattern. At this time, the position of the bottom copper 28 corresponds to the position of the test point of the product to be tested, and then the top copper 7 and the bottom copper 28 are nickel-plated and then gold-plated to prevent surface oxidation. The connecting wire is soldered to the reserved welding place of the top copper 7 by soldering, and the other end of the connecting wire is connected to the plug-in block 11. The plug-in block 11 is fixed to the test board by screws, waiting to be connected to the test equipment. The test circuit board is connected to the upper support plate 13 through the fixing column 9. A positioning pin 14 is left on the lower fixture 26, which is used for product positioning and positioning between the upper and lower fixtures. When the fixture is used, it is fixed on the test equipment, and the test action is repeated by opening and closing the equipment up and down.
[0034] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.
Claims
1. An electrical testing jig for a circuit board, comprising a top copper foil (1), a copper plating (5), a top copper (7), a lower jig (15) and a plurality of fixing posts (9), characterized in that: The bottom of the top copper foil 1 (1) is provided with an intermediate layer FR4 1 (2), the bottom of the intermediate layer FR4 1 (2) is provided with a bottom copper foil 1 (3), the bottom of the copper plating 1 (5) is provided with a top copper foil 2 (16), the bottom of the top copper foil 2 (16) is provided with an intermediate layer FR4 2 (17), the bottom of the intermediate layer FR4 2 (17) is provided with a bottom copper foil 2 (18), the bottom of the bottom copper foil 2 (18) is provided with a copper plating 2 (6), the bottom of the top copper foil 1 (7) is provided with an intermediate layer FR4 3 (19), and the bottom of the top copper foil 1 (7) is provided with a bottom copper foil 2 (18) at the middle side of the bottom. Two (8), an upper support plate (13) is arranged on the top of the fixed column (9), an intermediate layer FR4 four (22) is arranged on the bottom of the fixed column (9), a plurality of bottom copper three (25) are arranged on the top of the intermediate layer FR4 four (22), a plurality of top copper two (24) are arranged between the upper support plate (13) and the intermediate layer FR4 four (22), a plurality of fixture connecting wires (10) are arranged on the outer side of the top copper two (24), a plurality of support columns (27) are fixedly connected to the top of the lower fixture one (15), and a lower fixture two (26) is fixedly connected to the top of the support column (27).
2. The circuit board electrical testing jig according to claim 1, characterized in that: A blind hole 4 (23) is provided inside the bottom copper layer 2 (8).
3. The circuit board electrical testing jig according to claim 1, characterized in that: A plug-in line row (11) is arranged on the left side of the top of the intermediate layer FR4-(2), and one end of a plurality of the fixture connecting wires (10) is arranged on one side of the plug-in line row (11).
4. The circuit board electrical testing jig according to claim 1, characterized in that: Blind holes (4) are provided inside the top copper foil (1) and the middle FR4 (2).
5. The circuit board electrical testing jig according to claim 1, characterized in that: Blind holes (20) are provided inside the second top copper foil (16) and the second middle FR4 layer (17).
6. The circuit board electrical testing jig according to claim 1, characterized in that: A blind hole three (21) is opened inside the middle layer FR4 three (19).
7. The circuit board electrical testing jig according to claim 1, characterized in that: The middle layer FR4 (22) is provided with a plurality of clearance holes (12) around its inner periphery.
8. The circuit board electrical testing jig according to claim 7, characterized in that: A plurality of pins (14) are arranged inside the second lower fixture (26), and the outer sides of the pins (14) are arranged inside the clearance hole (12).