Wafer photoetching equipment for semiconductor manufacturing
By using the combination of screws and moving blocks and the design of flow guide grooves and filter boxes in semiconductor manufacturing wafer lithography equipment, the problem of dust contamination during processing is solved, achieving more efficient dust cleaning and lower rework rate.
Patent Information
- Application Number
- CN202421930305.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-10
- Publication Date
- 2025-05-06
- Estimated Expiration
- 2034-08-10
AI Technical Summary
During semiconductor manufacturing, wafers are easily contaminated by dust in the air when processed in lithography equipment, resulting in unclean development and need to be reworked and reprocessed.
A semiconductor-made wafer lithography device is designed, using a combination of a first screw and a first moving block to drive the moving seat back and forth through a first motor to achieve rapid loading of the ceramic disk. At the same time, a first flow channel and a filter box are provided, dust is sucked from the right side by a fan, and air is exhausted through the air pipe and the second flow channel to reduce dust residue.
Through the above design, the cleaning efficiency of dust on the ceramic disk is significantly improved, the pollution of dust on the wafer is reduced, the frequency of rework is reduced, and the efficiency and quality of processing is improved.
Smart Images
Figure CN222838348U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of wafer photolithography equipment, in particular to a semiconductor manufacturing wafer photolithography equipment. Background Art
[0002] In the semiconductor processing, a technique similar to photo printing is used to print the fine patterns on the mask onto the silicon wafer through light exposure. In the prior art, the wafer is generally glued and fixed on a ceramic plate, and then the wafer block with the ceramic plate is mounted on the photolithography table. The wafer block moves along the axis and Y axis of the semiconductor manufacturing wafer photolithography equipment driven by the transmission mechanism, thereby ensuring that the ultraviolet rays can smoothly remove the protective film on the surface of the wafer. However, during the wafer processing, dust in the air may fall onto the surface of the wafer and the ceramic plate, resulting in unclean development and rework. Utility Model Content
[0003] In order to solve the problems raised in the above background technology, the purpose of the utility model is to provide a semiconductor manufacturing wafer lithography equipment, which has the advantages of increasing the loading speed and facilitating dust removal and collection.
[0004] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a semiconductor manufacturing wafer lithography device, comprising a base, a support plate fixedly connected to the top of the base, a machine table fixedly connected to the top of the base, a first motor fixedly connected to the rear side of the base, a first groove opened on the top of the base, a first screw located in the first groove fixedly connected to the output end of the first motor, a first moving block threadedly connected to the outer side of the first screw, a moving seat fixedly connected to the top of the first moving block, a ceramic disk movably connected to the top of the moving seat, a first guide groove fixedly connected to the inner side of the support plate, a filter box fixedly connected to the right side of the support plate, the filter box is connected to the first guide groove, an exhaust fan fixedly connected to the outer side of the filter box, an air inlet of the exhaust fan is connected to the filter box, a second guide groove located on the left side of the ceramic disk fixedly connected to the inner side of the support plate, an air outlet of the exhaust fan is connected to an air pipe, and the air outlet of the air pipe is connected to the second guide groove:.
[0005] As a preferred embodiment of the utility model, the outer side of the machine is fixedly connected to an electric telescopic rod, the output end of the electric telescopic rod is fixedly connected to a brush plate located in the support plate, the outer side of the movable seat is fixedly connected to an insertion rod, the outer side of the movable seat is movably connected to a first collecting box, and the first collecting box is movably connected to the insertion rod.
[0006] As a preferred embodiment of the utility model, the interior of the filter box is movably connected to a second collecting box, the outer side of the second collecting box is fixedly connected to a baffle, the outer side of the second collecting box is fixedly connected to a filter screen, and the filter screen is movably connected to the filter box.
[0007] As a preferred embodiment of the present invention, a material box is movably connected to the top of the base, a slide groove is provided inside the material box, and a placement rack is movably connected inside the slide groove.
[0008] As a preferred embodiment of the utility model, the interior of the placement rack is movably connected with an air bag, and the inner side of the placement rack is fixedly connected with an anti-slip strip.
[0009] As a preferred embodiment of the utility model, a limiting groove is provided on the top of the base, a limiting block is fixedly connected to the bottom of the material box, and the limiting block is movably connected to the limiting groove.
[0010] Compared with the prior art, the beneficial effects of the utility model are as follows:
[0011] 1. The utility model provides a first screw rod and a first moving block, and a first motor can drive the moving seat to move forward and backward, so as to facilitate rapid loading of materials onto the ceramic disk. By providing a first guide groove and a filter box, the exhaust fan can suck dust on the ceramic disk into the filter box from the right side. By providing an air pipe and a second guide groove, the exhaust fan can blow air onto the ceramic disk from the left side, and cooperate with the first guide groove to exhaust air, so as to reduce dust generated during operation on the ceramic disk and prevent it from remaining on the wafer.
[0012] 2. The utility model provides a brush plate, an insertion rod and a first collection box. The electric telescopic rod can clean the dust on the ceramic plate. The first collection box can catch the dust brushed by the brush plate. The insertion rod can make the first collection box easy to disassemble and assemble, so that it is convenient to clean it. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] Figure 1 It is a schematic diagram of the structure of the utility model;
[0014] Figure 2 It is a side view schematic diagram of the structure of the utility model;
[0015] Figure 3 This is a schematic diagram of the material box structure of the utility model;
[0016] Figure 4 It is a rear view schematic diagram of the structure of the utility model.
[0017] In the figure: 1. base; 2. support plate; 3. machine table; 4. first motor; 5. first groove; 6. first screw; 7. first moving block; 8. moving seat; 9. ceramic plate; 10. first guide groove; 11. filter box; 12. exhaust fan; 13. second guide groove; 14. air pipe; 15. electric telescopic rod; 16. brush plate; 17. plug rod; 18. first collection box; 19. second collection box; 20. baffle; 21. filter net; 22. material box; 23. slide; 24. placement rack; 25. air bag; 26. anti-slip strip; 27. limit groove; 28. limit block. DETAILED DESCRIPTION
[0018] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0019] like Figures 1 to 4 As shown, a semiconductor manufacturing wafer lithography device includes a base 1, a support plate 2 is fixedly connected to the top of the base 1, a machine table 3 is fixedly connected to the top of the base 1, a first motor 4 is fixedly connected to the rear side of the base 1, a first groove 5 is opened on the top of the base 1, an output end of the first motor 4 is fixedly connected to a first screw 6 located in the first groove 5, a first moving block 7 is threadedly connected to the outer side of the first screw 6, a moving seat 8 is fixedly connected to the top of the first moving block 7, a ceramic disk 9 is movably connected to the top of the moving seat 8, a first guide groove 10 is fixedly connected to the inner side of the support plate 2, a filter box 11 is fixedly connected to the right side of the support plate 2, the filter box 11 is connected to the first guide groove 10, an exhaust fan 12 is fixedly connected to the outer side of the filter box 11, an air inlet of the exhaust fan 12 is connected to the filter box 11, a second guide groove 13 located on the left side of the ceramic disk 9 is fixedly connected to the inner side of the support plate 2, an air outlet of the exhaust fan 12 is connected to an air pipe 14, and an air outlet of the air pipe 14 is connected to the second guide groove 13.
[0020] refer to Figures 1 to 4 An electric telescopic rod 15 is fixedly connected to the outside of the machine 3, and the output end of the electric telescopic rod 15 is fixedly connected to a brush plate 16 located in the support plate 2. An insertion rod 17 is fixedly connected to the outside of the movable seat 8. A first collecting box 18 is movably connected to the outside of the movable seat 8, and the first collecting box 18 is movably connected to the insertion rod 17.
[0021] As a technical optimization solution of the utility model, by providing a brush plate 16, an insertion rod 17 and a first collecting box 18, the electric telescopic rod 15 can clean the dust on the ceramic plate 9, and the first collecting box 18 can catch the dust brushed by the brush plate 16. By providing the insertion rod 17, the first collecting box 18 is easy to disassemble and assemble, and is convenient for cleaning.
[0022] refer to Figures 1 to 4 The interior of the filter box 11 is movably connected to a second collecting box 19 , the outer side of the second collecting box 19 is fixedly connected to a baffle 20 , the outer side of the second collecting box 19 is fixedly connected to a filter screen 21 , and the filter screen 21 is movably connected to the filter box 11 .
[0023] As a technical optimization solution of the utility model, by setting a second collection box 19 and a filter screen 21, the filter screen 21 increases the efficiency of filtering air when the exhaust fan 12 inhales air, and the second collection box 19 can receive the dust filtered in the first guide groove 10, which is convenient for cleaning.
[0024] refer to Figures 1 to 4 A material box 22 is movably connected to the top of the base 1 , a chute 23 is provided inside the material box 22 , and a placement rack 24 is movably connected inside the chute 23 .
[0025] As a technical optimization solution of the present invention, by providing the second collection box 19 and the slide 23, the wafers can be placed in the placement rack 24 and the material box 22 can be pushed in, so as to facilitate the collection and protection of the wafers.
[0026] refer to Figures 1 to 4 The interior of the placement rack 24 is movably connected with an air bag 25 , and the inner side of the placement rack 24 is fixedly connected with an anti-slip strip 26 .
[0027] As a technical optimization solution of the utility model, by providing the airbag 25 and anti-slip adjustment, the shaking of the wafer in the placement rack 24 is reduced and protected.
[0028] refer to Figures 1 to 4 A limiting groove 27 is provided on the top of the base 1 , a limiting block 28 is fixedly connected to the bottom of the material box 22 , and the limiting block 28 is movably connected to the limiting groove 27 .
[0029] As a technical optimization solution of the present invention, by providing the limiting groove 27 and the limiting block 28, the material box 22 can be disassembled and assembled, so as to facilitate the movement of the material box 22.
[0030] The working principle and use process of the utility model are as follows: pull the placement rack 24 to take the wafer out of the placement rack 24, drive the first moving block 7 to move forward through the first moving block 7, drive the moving seat 8 to move through the moving seat 8, drive the ceramic plate 9 to move, and place the wafer on the ceramic plate 9, the first motor 4 reverses to drive the wafer to move under the machine table 3, and processes it through the machine table 3, the exhaust fan 12 exhausts air from the surface of the wafer through the filter box 11, the filter screen 21 and the first guide groove 10, and the exhaust fan 12 blows air to the surface of the wafer through the air pipe 14 and the second guide groove 13, and blows dust to the first guide groove 13. Slot 10, so that it enters the filter box 11, the dust is filtered by the filter net 21 and enters the second collection box 19. After the processing is completed, the first motor 4 drives the moving seat 8 to move out. After the wafer is removed, the first motor 4 drives the moving seat 8 to move back and forth, and the electric telescopic rod 15 drives the brush plate 16 to move back and forth on the ceramic disk 9, and the dust on the surface is scraped into the front and rear two first collection boxes 18. Pulling the first collection box 18 can separate it from the insertion rod 17, pulling the baffle 20 can separate the second collection box 19 from the filter box 11, and pulling the material box 22 to separate the limit block 28 at the bottom from the limit slot 27 can drive the material box 22 to move.
[0031] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.
[0032] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A semiconductor manufacturing wafer lithography device, comprising a base (1), characterized in that: The top of the base (1) is fixedly connected to a support plate (2), the top of the base (1) is fixedly connected to a machine platform (3), the rear side of the base (1) is fixedly connected to a first motor (4), the top of the base (1) is provided with a first groove (5), the output end of the first motor (4) is fixedly connected to a first screw rod (6) located in the first groove (5), the outer side of the first screw rod (6) is threadedly connected to a first moving block (7), the top of the first moving block (7) is fixedly connected to a moving seat (8), the top of the moving seat (8) is movably connected to a ceramic plate (9), the support A first guide groove (10) is fixedly connected to the inner side of the plate (2); a filter box (11) is fixedly connected to the right side of the support plate (2); the filter box (11) is communicated with the first guide groove (10); an exhaust fan (12) is fixedly connected to the outer side of the filter box (11); an air inlet of the exhaust fan (12) is communicated with the filter box (11); a second guide groove (13) located on the left side of the ceramic plate (9) is fixedly connected to the inner side of the support plate (2); an air outlet of the exhaust fan (12) is communicated with an air pipe (14); and an air outlet of the air pipe (14) is communicated with the second guide groove (13).
2. A semiconductor manufacturing wafer lithography device according to claim 1, characterized in that: The outer side of the machine platform (3) is fixedly connected to an electric telescopic rod (15), the output end of the electric telescopic rod (15) is fixedly connected to a brush plate (16) located inside the support plate (2), the outer side of the movable seat (8) is fixedly connected to an insertion rod (17), the outer side of the movable seat (8) is movably connected to a first collection box (18), and the first collection box (18) is movably connected to the insertion rod (17).
3. A semiconductor manufacturing wafer lithography device according to claim 1, characterized in that: The interior of the filter box (11) is movably connected to a second collection box (19), the outer side of the second collection box (19) is fixedly connected to a baffle (20), the outer side of the second collection box (19) is fixedly connected to a filter screen (21), and the filter screen (21) is movably connected to the filter box (11).
4. The semiconductor manufacturing wafer lithography equipment according to claim 1, characterized in that: A material box (22) is movably connected to the top of the base (1), a slide groove (23) is provided inside the material box (22), and a placement rack (24) is movably connected inside the slide groove (23).
5. The semiconductor manufacturing wafer lithography equipment according to claim 4, characterized in that: The interior of the placement rack (24) is movably connected to an air bag (25), and the inner side of the placement rack (24) is fixedly connected to an anti-slip strip (26).
6. A semiconductor manufacturing wafer lithography device according to claim 4, characterized in that: A limiting groove (27) is provided on the top of the base (1), a limiting block (28) is fixedly connected to the bottom of the material box (22), and the limiting block (28) is movably connected to the limiting groove (27).