Laminated structure, electronic equipment and display module

Abstract

The embodiment of the utility model provides a laminated structure, electronic equipment and a display module, the laminated structure comprises an anti-glare layer, a base film, a buffer layer, a stress barrier layer and a light uniformizing layer which are arranged in a laminated mode, the anti-glare layer is formed on the upper surface of the base film, the modulus of the stress barrier layer is larger than that of the buffer layer, the haze of the anti-glare layer is smaller than or equal to 35%, and the light uniformizing layer is formed on the upper surface of the base film. The haze of the light uniformizing layer is greater than or equal to 70%, and the light uniformizing layer is used for mixing light emitted by the display panel. Therefore, the light homogenizing layer is used for uniformly mixing the light emitted by the display panel and then enabling the light to enter the anti-glare layer, the anti-glare layer can enable the incident ambient light to generate diffuse reflection, and glare on a screen is avoided. When the light which is uniformly mixed by the light homogenizing layer is scattered by the anti-glare layer, screen flash points caused by crosstalk of different light can be avoided. In addition, a small haze parameter is set, the definition can be considered, and the buffer layer can improve the buffer performance of the lamination.

Description

Technical Field

[0001] Embodiments of the present application relate to the field of display technology, and in particular, to a stacked structure, an electronic device, and a display module. Background Art

[0002] With the continuous development of display technology, foldable display terminals are gradually becoming a development trend of future mobile electronic products. When unfolded, foldable display terminals can obtain a larger display area to improve the viewing effect. When folded, foldable display terminals can obtain a smaller volume, which is convenient for users to carry.

[0003] The large-size folding screen of the folding display terminal brings users a better experience of reading, video and games, but it also brings great challenges to the readability requirements under strong light. The coating that reduces reflection is prone to the risk of coating fracture under the increasingly smaller bending radius of the folding display terminal. For this reason, an anti-glare layer with an uneven surface is provided, but the display screen using this anti-glare layer is prone to flash points, affecting the user experience. Utility Model Content

[0004] The embodiments of the present application provide a stacked structure, an electronic device and a display module, which solve the problem of flash points on display screens.

[0005] In order to achieve the above purpose, the embodiment of the present application adopts the following technical solution:

[0006] In the first aspect of the embodiment of the present application, a laminated structure is provided, which includes: an anti-glare layer, a base film, a buffer layer, a stress barrier layer and a light-distributing layer which are stacked, wherein the anti-glare layer is formed on the upper surface of the base film, the modulus of the stress barrier layer is greater than the modulus of the buffer layer, the haze of the anti-glare layer is less than or equal to 35%, the haze of the light-distributing layer is greater than or equal to 70%, and the light-distributing layer is used to mix the light emitted by the display panel. Thus, the light-distributing layer is used to evenly mix the light emitted by the display panel and then enter the anti-glare layer, and the anti-glare layer can diffusely reflect the incident ambient light to avoid glare on the screen. Among them, when the light evenly mixed by the light-distributing layer is scattered by the anti-glare layer, crosstalk between different light rays can be avoided to cause screen flash points; the optical module suppresses the generation of glare and screen flash points through the combined effect of the light-distributing layer and the anti-glare layer, and the anti-glare layer is set with a smaller haze parameter, so that the display device can ensure a higher definition of imaging, taking into account the requirements of low flash point and high definition. In addition, by arranging a buffer layer and a stress barrier layer between the base film and the homogenizing layer, a laminated structure of a low modulus buffer layer and a high modulus buffer layer can be formed. The low modulus buffer layer is used to produce large deformation to absorb energy and achieve buffering, and the high modulus buffer layer improves the impact resistance of the buffer layer, thereby improving the buffering performance and impact resistance of the laminated structure.

[0007] In an optional implementation, the buffer layer is formed on the lower surface of the base film by coating, thereby the buffer layer can be formed on the lower surface of the base film, and the process is simple.

[0008] In an optional implementation, the light-homogenizing layer includes a plurality of columnar structures arranged in an array, and the spacing P between adjacent columnar structures satisfies: 3D≥P>D, where D is the characteristic size of the columnar structure. As a result, the light-homogenizing layer has a small attenuation of the light intensity of the light emitted in each direction or angle, and the light type distribution after the light is homogenized is more uniform. The light-homogenizing layer has a light intensity attenuation of less than or equal to 30% for vertically incident collimated light.

[0009] In an optional implementation, the molding process of the anti-glare layer includes: coating molding, particle dispersion molding, phase separation molding, chemical etching molding, and nanoimprint molding.

[0010] In an optional implementation, the laminate structure further includes: an anti-reflection film, which is arranged above the anti-glare layer. Thus, by arranging the anti-reflection film, the reflective performance of the laminate structure can be reduced, further improving the reading experience of the screen under strong light.

[0011] In an optional implementation, the anti-reflection film forming process includes: at least one of a wet etching process and a dry etching process. Thus, the anti-reflection film can be formed in a variety of ways.

[0012] In an optional implementation, the material of the base film includes: at least one of polyethylene terephthalate PET, thermoplastic polyurethane elastomer rubber TPU, and polyimide PI; the material of the buffer layer includes: non-Newtonian fluid.

[0013] In an optional implementation, the stress barrier layer is connected to the light-distributing layer by thermal compression.

[0014] In an optional implementation, the stacked structure further includes: a first connecting layer, and the stress barrier layer is connected to the light-homogenizing layer through the first connecting layer.

[0015] In an optional implementation, the material of the first connection layer includes: optically transparent adhesive OCA.

[0016] In an optional implementation, the stacked structure further includes: a substrate, which is disposed between the light-homogenizing layer and the stress barrier layer.

[0017] In an optional implementation, the substrate is disposed below the light-homogenizing layer.

[0018] In an optional implementation, the light-homogenizing layer is connected to the substrate by thermal compression.

[0019] In an optional implementation, the stacked structure further includes: a second connecting layer, and the substrate is connected to the light-homogenizing layer via the second connecting layer.

[0020] According to a second aspect of the embodiments of the present application, an electronic device is provided, comprising a display module and the stacked structure as described above, wherein the stacked structure is arranged on a light emitting side of the display module.

[0021] According to a third aspect of an embodiment of the present application, a display module is provided, comprising: an anti-glare layer, a base film, a buffer layer, a stress barrier layer and a display panel which are stacked together, wherein the anti-glare layer is formed on the base film, the modulus of the stress barrier layer is greater than the modulus of the buffer layer, and the haze of the anti-glare layer is less than or equal to 35%; the display module also comprises: a light-homogenizing layer, which is arranged between the stress barrier layer and the display panel, and the haze of the light-homogenizing layer is greater than or equal to 70%.

[0022] The display module also includes a cover plate, which is arranged between the stress barrier layer and the display panel. The embodiment of the present application does not limit the position of the light-distributing layer on the cover plate. In an optional implementation, the light-distributing layer is arranged in the cover plate. In an optional implementation, the light-distributing layer is arranged between the cover plate and the stress barrier layer. In an optional implementation, the light-distributing layer is arranged between the cover plate and the display panel.

[0023] According to a fourth aspect of an embodiment of the present application, a display module is provided, which includes: a cover plate and a display panel arranged in a stacked manner, and the display module also includes: a light-homogenizing layer, which is arranged on the cover plate, or the light-homogenizing layer is arranged in the cover plate, or the light-homogenizing layer is arranged between the cover plate and the display panel, and the haze of the light-homogenizing layer is greater than or equal to 70%.

[0024] According to a fifth aspect of the embodiments of the present application, an electronic device is provided. The electronic device includes: a housing, and the display module as described above, wherein the display module is disposed in the housing.

[0025] The embodiment of the present application provides a laminated structure, an electronic device and a display module. In some implementations, the laminated structure is arranged on the display module. The laminated structure includes: an anti-glare layer, a base film, a buffer layer, a stress barrier layer and a light-distributing layer which are stacked. The anti-glare layer is formed on the base film. The modulus of the stress barrier layer is greater than the modulus of the buffer layer. The haze of the anti-glare layer is less than or equal to 35%. The haze of the light-distributing layer is greater than or equal to 70%. The light-distributing layer is used to mix the light emitted by the display panel. Thus, the light-distributing layer is used to evenly mix the light emitted by the display panel and then enter the anti-glare layer. The anti-glare layer can diffusely reflect the incident ambient light to avoid glare on the screen. Among them, when the light evenly mixed by the light-distributing layer is scattered by the anti-glare layer, crosstalk between different light rays can be avoided to cause screen flash points. The optical module suppresses the generation of glare and screen flash points through the combined effect of the light-distributing layer and the anti-glare layer. The anti-glare layer is set with a smaller haze parameter, so that the display device can ensure a higher definition of imaging, taking into account the requirements of low flash point and high definition. Moreover, by arranging a buffer layer and a stress barrier layer between the base film and the light-distributing layer, a laminated structure of a low modulus buffer layer and a high modulus buffer layer can be formed. The low modulus buffer layer is used to produce large deformation to absorb energy and achieve buffering, and the high modulus buffer layer improves the impact resistance of the buffer layer, thereby improving the buffering performance and impact resistance of the laminated structure.

[0026] In some other embodiments, the display module includes: a cover plate, a display panel and a light-distributing layer, the haze of the light-distributing layer is greater than or equal to 70%. The light-distributing layer can be arranged in the cover plate, above the cover plate and below the cover plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 A schematic diagram of the disassembled structure of an electronic device provided in an embodiment of the present application;

[0028] Figure 2 A schematic diagram of the structure of an electronic device provided in an embodiment of the present application;

[0029] Figure 3 A schematic diagram of the structure of another electronic device provided in an embodiment of the present application;

[0030] Figure 4 A schematic diagram of a laminated structure;

[0031] Figure 5 A flow chart of a method for forming an anti-reflection film by a magnetron sputtering coating process provided in an embodiment of the present application;

[0032] Figure 6 A schematic diagram of the working principle of a magnetron sputtering coating process provided in an embodiment of the present application;

[0033] Figure 7A flow chart of a method for forming an anti-reflection film by a coating process provided in an embodiment of the present application;

[0034] Figure 8 A schematic diagram of the principle of a slit coating process provided in an embodiment of the present application;

[0035] Fig. 9 A schematic diagram of the principle of a micro-dimpled coating process provided in an embodiment of the present application;

[0036] Fig.10 is a schematic diagram of the structure of another laminated structure;

[0037] Fig.11 for Fig.10 A schematic diagram of the working state of the stacked structure shown;

[0038] Fig.12 A schematic diagram of a working state of a stacked structure provided in an embodiment of the present application;

[0039] Fig.13 A schematic diagram of the structure of a light-homogenizing layer provided in an embodiment of the present application;

[0040] Fig.14 for Fig.11 The stacked structure and Fig.12 A schematic diagram of a pixel unit of the stacked structure shown;

[0041] Fig.15 A flow chart of a method for preparing a light-homogenizing layer provided in an embodiment of the present application;

[0042] Fig.16 A schematic diagram of the preparation process of the light-homogenizing layer provided in the embodiment of the present application;

[0043] Fig.17 A schematic diagram of the structure of the first laminated structure provided in an embodiment of the present application;

[0044] Fig.18 A schematic diagram of the structure of a second laminated structure provided in an embodiment of the present application;

[0045] Fig.19 A schematic diagram of the structure of a third laminated structure provided in an embodiment of the present application;

[0046] Fig. 20 A schematic structural diagram of a fourth laminated structure provided in an embodiment of the present application;

[0047] Fig.21 A schematic structural diagram of a fifth laminated structure provided in an embodiment of the present application;

[0048] Fig. 22 , Fig.23 , Fig.24 , Fig.25 , Fig.26 For preparation Fig.21 A schematic diagram of the structure of an intermediate product of the laminated structure shown;

[0049] Fig. 27 A schematic structural diagram of a sixth laminated structure provided in an embodiment of the present application;

[0050] Fig.28 , Fig.29 , Fig.30 For preparation Fig. 27 Schematic diagram of the intermediate product structure when the stacked structure is shown;

[0051] Fig.31 A schematic diagram of the structure of a display module provided in an embodiment of the present application;

[0052] Fig.32 A schematic diagram of the structure of another display module provided in an embodiment of the present application;

[0053] Fig.33 A schematic diagram of the structure of another display module provided in an embodiment of the present application;

[0054] Fig.34 A schematic diagram of the structure of another display module provided in an embodiment of the present application;

[0055] Fig.35 A schematic diagram of the structure of another display module provided in an embodiment of the present application;

[0056] Fig.36 A schematic diagram of the structure of another display module provided in an embodiment of the present application. DETAILED DESCRIPTION

[0057] In order to make the objectives, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings.

[0058] In the following, the terms "first", "second", etc. are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise specified, "plurality" means two or more.

[0059] In addition, in the present application, directional terms such as "upper" and "lower" are defined relative to the orientation of the components in the drawings. It should be understood that these directional terms are relative concepts. They are used for relative description and clarification, and they can change accordingly according to the changes in the orientation of the components in the drawings.

[0060] The embodiment of the present application provides an electronic device. The electronic device can be a tablet computer, a mobile phone, an e-reader, a remote control, a personal computer (PC), a laptop, a personal digital assistant (PDA), a vehicle-mounted device, an Internet TV, a wearable device, a TV, and other products with a display interface, as well as smart display wearable products such as smart watches and smart bracelets. The embodiment of the present application does not impose any special restrictions on the form of the above-mentioned electronic devices. For the convenience of explanation, the following embodiments are all exemplified by taking the electronic device as a mobile phone as an example.

[0061] like Figure 1 As shown, the electronic device 1 includes a display module 13, a middle frame 11 and a housing (or rear housing) 12. The middle frame 11 is located between the display module 13 and the housing 12.

[0062] The display module 13 is used to display images.

[0063] The display module 13, the middle frame 11 and the housing 12 can be arranged in different layers in the thickness direction of the electronic device, and these layers can be parallel to each other. The plane where each layer is located can be called the XY plane, and the direction perpendicular to the XY plane can be called the Z direction. In other words, the display module 13, the middle frame 11 and the housing 12 can be distributed in layers in the Z direction.

[0064] The display module 13 can be Figure 1 The flexible printed circuit (FPC) shown passes through the middle frame 11 and is electrically connected to the PCB disposed on the middle frame 11. Thus, the PCB can transmit display data to the display module 13 to control the display module 13 to display images.

[0065] The middle frame 11 is located between the display module 13 and the housing 12. The surface of the middle frame 11 away from the display module 13 is used to install internal components such as batteries, printed circuit boards (PCB), cameras, antennas, etc. After the housing 12 and the middle frame 11 are covered, the above internal components are located between the housing 12 and the middle frame 11.

[0066] The housing 12 is connected to the middle frame 11 to form a receiving cavity for receiving the above-mentioned PCB, camera, battery and other electronic components, thereby preventing external moisture and dust from invading the receiving cavity and affecting the performance of the above-mentioned electronic components.

[0067] The embodiments of the present application do not limit the structure of the mobile phone. In some embodiments of the present application, such as Figure 2As shown, the mobile phone may be a straight-screen phone, and its display module 13 is not foldable.

[0068] Or, if Figure 3 As shown, the mobile phone can also be a foldable screen mobile phone, and the display module 13 of the foldable screen is foldable.

[0069] The display module 13 may be an active matrix organic light-emitting diode (AMOLED) display screen.

[0070] As a self-luminous display, the AMOLED display screen does not need a backlight module (BLM). Therefore, when the base substrate in the AMOLED display screen is made of a flexible resin material, such as polyimide (PI) or polyethylene terephthalate (PET), the AMOLED display screen can have a bendable property.

[0071] In some embodiments, in order to improve the reading experience of the screen under sunlight or strong light, Figure 2 The display module 13 of the straight-screen machine shown in FIG. Figure 3 The light-emitting surface of the display module 13 of the folding screen mobile phone shown is provided with an anti-reflection (AR) film.

[0072] For example, Figure 4 As shown, an anti-reflection film 101 is disposed on the light-emitting surface of the display module 13. The anti-reflection film 101 can improve the readability of the display module under strong light.

[0073] In some embodiments, the anti-reflection film includes: a substrate, a hardening layer, a high-refractive layer, a low-refractive layer, and an anti-fingerprint coating layer that are stacked.

[0074] The embodiment of the present application does not limit the number of layers of the low-refractive layer and the high-refractive layer, and only requires that the low-refractive layer and the high-refractive layer be arranged alternately. In some embodiments, the anti-reflection film includes two low-refractive layers and two high-refractive layers, and the low-refractive layers and the high-refractive layers are arranged alternately. The high-refractive material includes metal oxides such as niobium pentoxide and zirconium oxide, and the low-refractive material includes materials such as silicon oxide.

[0075] The present application embodiment does not limit the preparation process of the anti-reflection film. In some embodiments, the anti-reflection film is deposited by a magnetron sputtering coating process (also known as a "dry AR film").

[0076] Figure 5A flow chart of a method for forming an anti-reflection film by a magnetron sputtering coating process provided in an embodiment of the present application. Figure 5 As shown, the method for preparing the anti-reflection film includes:

[0077] S1: Substrate surface treatment.

[0078] S2: Hardening layer coating.

[0079] Here, a hardening layer may be coated on the surface of the substrate.

[0080] S3: Surface treatment of hardened layer.

[0081] The hardened layer may be surface treated after being cured.

[0082] S4: First high refractive layer coating.

[0083] Wherein, a first high refractive layer may be formed on the surface of the hardened layer.

[0084] S5: First low refractive layer coating.

[0085] Wherein, a first low-refractive layer may be formed on the surface of the first high-refractive layer.

[0086] S6: Second high refractive layer coating.

[0087] Wherein, a second high refractive layer may be formed on the surface of the first low refractive layer.

[0088] S7: Second low refractive layer coating.

[0089] Wherein, a second low refractive layer may be formed on the surface of the second high refractive layer, forming a stacked structure design of the low refractive layer and the high refractive layer.

[0090] S8: Anti-fingerprint coating.

[0091] Wherein, an anti-fingerprint coating can be formed on the surface of the low-refractive layer. The anti-fingerprint coating can be formed by coating or evaporation. In some embodiments, the low-refractive layer resin contains the anti-fingerprint coating.

[0092] In this embodiment, the first high refractive layer, the first low refractive layer, the second high refractive layer, and the second low refractive layer are all formed by, for example, a magnetron sputtering coating process.

[0093] The magnetron sputtering coating process refers to applying a DC voltage between the coating target and the substrate under vacuum conditions. The voltage decomposes the gas into Ar+ ions and electrons, causing the positively charged ions to be accelerated and collide with the coating target, sputtering the coating target atoms through momentum transfer.

[0094] Figure 6A schematic diagram of the working principle of a magnetron sputtering coating process provided in an embodiment of the present application is shown in FIG. Figure 6 As shown, the surface of the coating target 200 is vaporized into gaseous atoms, molecules or partially ionized into ions and electrons through the electrode 300, and a magnetic field is introduced on the surface of the coating target 200. Under the action of the electric field, the electrons collide with argon atoms in the process of flying toward the substrate 100, causing them to be ionized to produce Ar+ and new electrons. The new electrons fly toward the substrate 100, and the Ar+ is accelerated to fly toward the cathode coating target 200 under the action of the electric field, and bombards the surface of the coating target 200 with high energy, causing the coating target 200 to be sputtered. Among the sputtered particles, neutral target atoms or molecules are deposited on the substrate 100 to form a thin film.

[0095] In other embodiments, the anti-reflection film may be formed by a coating process (also known as a "wet AR film").

[0096] The coating process refers to coating the resin material containing high refractive index and low refractive index particles on the surface of the substrate by slit coating or micro-concave coating, respectively, to form a high refractive index material film layer and a low refractive index material film layer. The filling particles in the high refractive index material film layer include: metal oxide nanoparticles such as aluminum oxide, zirconium oxide, and tin oxide, and the filling particles in the low refractive index layer include: hollow silica nanoparticles.

[0097] Figure 7 A flow chart of a method for forming an anti-reflection film by a coating process provided in an embodiment of the present application. Figure 7 As shown, the method includes:

[0098] S11: Substrate surface treatment.

[0099] Among them, the substrate may be surface treated.

[0100] S12: Hardening layer coating.

[0101] Here, a hardening layer may be coated on the surface of the substrate.

[0102] S13: High refractive layer coating.

[0103] Wherein, a high refractive layer may be coated on the surface of the hardened layer, and the high refractive layer may be cured.

[0104] S14: low refractive layer coating.

[0105] Wherein, a low-refractive layer may be formed on the surface of the cured high-refractive layer, and the low-refractive layer may be cured.

[0106] Figure 8 A schematic diagram of the principle of a slit coating process provided in an embodiment of the present application. Figure 8As shown, the substrate 100 is disposed on a roller. When the roller rotates, the substrate 100 rotates accordingly, and the coating liquid 400 can be coated on the substrate 100 .

[0107] Fig. 9 A schematic diagram of the principle of a micro-dimpled coating process provided in the embodiment of the present application. Fig. 9 As shown, part of the roller is immersed in the coating liquid 400, and part of the roller is in contact with the surface of the substrate 100. When the roller rotates, the coating liquid 400 can be coated on the substrate 100, and the excess coating liquid on the roller surface can be scraped off by the scraper 500.

[0108] However, display screens using anti-reflection film have limited anti-reflection effects on strong light. If the strong light or outdoor reflection effect is maximized, long-term use will cause visual fatigue to users.

[0109] In some embodiments, Fig.10 As shown, an anti-glare (AG) layer 102 may be further provided on the light emitting surface of the display module 13 , and the anti-glare layer 102 may be provided between the anti-reflection film 101 and the light emitting surface of the display module.

[0110] The anti-glare layer 102 can be formed by coating process, which can refer to the wet process of the anti-reflection film 101, and a medium can be added in the hardened layer to increase the haze (5%-80%), thereby increasing diffuse reflection and reducing reflectivity. The medium can be a plurality of solid silicon dioxide spheres of different particle sizes.

[0111] In some embodiments, Fig.11 As shown, the display module 13 can be a micro (micro or mini) LED display screen. The display module 13 includes a display panel 20. The display panel 20 includes: a substrate 21, and a plurality of LED devices 22 arranged on the substrate, each LED device 22 is located in a sub-pixel of the display module 13. Among them, in a micro LED display screen, the size of the LED device is usually less than 50μm. In a mini LED display screen, the size of the LED device is usually between 50μm and 200μm. In order to enable the above-mentioned display module 13 to achieve color display, for example, three adjacent LED devices can be used to emit red light, green light and blue light respectively.

[0112] A first protective film 30 is provided between the anti-glare layer 102 and the display panel 20. The first protective film 30 is provided, for example, on the light-emitting side of the display panel 20. A display module using the anti-glare layer 102 has a large random distribution of characteristic dimensions and density of the anti-glare layer 102, which causes disordered convergence and divergence of screen light. Fig.11As shown, the light intensity of the screen becomes disorderly distributed in space, so that the display module using the anti-glare layer 102 tends to turn white under strong light and have "flash points" of light and dark, which greatly reduces the screen brightness and display clarity.

[0113] To this end, the present application provides a laminated structure in which a light-homogenizing layer is provided, which can reduce the reflectivity while ensuring the display clarity, providing users with the best readability in strong light or outdoors.

[0114] The present application does not limit the position of the laminated structure in the display module. In some embodiments, the laminated structure can be arranged on the light-emitting side of the display module. In other embodiments, the laminated structure can be arranged in the display module.

[0115] like Fig.12 As shown, the laminated structure includes: an anti-glare layer 102, a first protective film 30 and a light-homogenizing layer 103 stacked in sequence from top to bottom, the haze of the anti-glare layer 102 is less than or equal to 35%, the haze of the light-homogenizing layer is greater than or equal to 70%, and the light-homogenizing layer 103 is used to mix the light emitted by the display panel.

[0116] The anti-glare layer 102 includes an anti-glare structure, which refers to the uneven microstructure morphology on the surface of the anti-glare layer 102. These microstructure morphologies can diffusely reflect the incident ambient light to avoid glare on the screen. In some embodiments, the roughness of the anti-glare layer 102 is 0.2 μm to 0.35 μm, and the haze of the anti-glare layer 102 is less than or equal to 35%, which can achieve higher clarity.

[0117] The molding process of the anti-glare layer 102 includes: particle dispersion molding, phase separation molding, and chemical etching molding.

[0118] The display module includes, for example, a display panel 20. Fig.12 As shown, the light-homogenizing layer 103 can evenly mix the light emitted by the display panel 20 and then enter the anti-glare layer 102. For example, the light emitted by the light-emitting sub-pixels of different colors can be evenly mixed, so that the light emitted by the irregular small light-emitting sub-pixels is evenly mixed, and regular large light-emitting sub-pixels are visually presented. When the light after the even mixing is scattered by the anti-glare layer 102, crosstalk between different light rays can be avoided to cause screen flash points.

[0119] For example, when the light emitted by the LED device 22 enters the light-homogenizing layer 103, the light-homogenizing layer 103 scatters the light beam incident to the light-homogenizing layer 103, so that the light emitted by each LED device 22 is mixed in the light-homogenizing layer 103 and then emitted from the light-homogenizing layer 103, so as to evenly mix the light emitted by the display panel 20. When the evenly mixed light enters the anti-glare layer 102 and is scattered by the anti-glare layer 102, crosstalk between different light beams can be avoided to cause screen flashes.

[0120] In some embodiments, the first protective film 30 includes: a base film 1001, a buffer layer 1002 and a stress barrier layer 1003 stacked from top to bottom. Fig.17 As shown, the base film 1001 is disposed close to the anti-reflection film 101, the stress barrier layer 1003 is disposed close to the light-distributing layer 103, and the buffer layer 1002 is disposed between the base film 1001 and the stress barrier layer 1003. The anti-glare layer 102 is formed on the upper surface of the base film 1001, and the base film 1001 can be used as Figure 8 , Fig. 9 The substrate 100 of the anti-glare layer 102 is shown. The modulus of the stress barrier layer 103 is greater than the modulus of the buffer layer 1002. The upper surface of the base film 1001 is the surface of the base film 1001 away from the buffer layer 1002.

[0121] The laminated structure provided in the embodiment of the present application can evenly mix the light emitted by the display panel and then incident on the anti-glare layer 102 through the light-homogenizing layer 103. The anti-glare layer 102 can diffusely reflect the incident ambient light to prevent the screen from generating glare. Among them, when the light evenly mixed by the light-homogenizing layer 103 is scattered by the anti-glare layer, crosstalk between different light rays can be avoided to cause screen flash points. The optical module suppresses the generation of glare and screen flash points through the combined effect of the light-homogenizing layer 103 and the anti-glare layer 102. The anti-glare layer 102 sets a smaller haze parameter, so that the display device can be guaranteed to have a higher definition of imaging, taking into account the requirements of low flash point and high definition. In addition, by arranging a buffer layer and a stress barrier layer between the base film and the light-homogenizing layer, a laminated structure of a low modulus buffer layer-a high modulus buffer layer can be formed. The low modulus buffer layer is used to generate large deformation to absorb energy and achieve buffering. The high modulus buffer layer improves the impact resistance of the buffer layer, thereby improving the buffering performance and impact resistance of the laminated structure. The laminated structure can be set on the display module as a protective film.

[0122] The present application embodiment does not limit the structure of the light-homogenizing layer 103. Fig.13 , Fig.13 is a cross-sectional view of the homogenizing layer in the direction perpendicular to the normal line, such as Fig.13 As shown in Figure a, Fig.13 Figure a shows a schematic diagram of a light-homogenizing layer 103. Fig.13As shown, the light homogenizing layer 103 includes: a grating 1031 and a substrate 1032 , and the grating 1031 is disposed on the substrate 1032 .

[0123] In some embodiments, see Fig.13 As shown in Figure b, the grating 1031 includes a plurality of columnar structures (1031a and 1031A) arranged in an array.

[0124] In other embodiments, see Fig.16 The grating 1031 further includes: a strip structure 1031b, and the columnar structure 1031a is, for example, arranged on the strip structure 1031b.

[0125] For example, Fig.13 In the light-homogenizing layer 103 shown in Figure a, the columnar structures of the grating 1031 are arranged in a regular hexagon, and the characteristic dimensions of the columnar structures are the same (the characteristic dimension of the columnar structure 1031a is Da). The characteristic dimension refers to the minimum dimension in a semiconductor device. In this embodiment, the characteristic dimension may be the width of the grating. In this embodiment, the characteristic dimension of the columnar structure 1031a may be the diameter of the columnar structure.

[0126] exist Fig.13 Based on Figure a, Fig.13 Figure b shows another schematic diagram of the light-homogenizing layer 103. Fig.13 In the light-homogenizing layer 103 shown in Figure b, the characteristic sizes of the columnar structures of the grating 1031 are different, and they are still arranged in a regular hexagon. Among them, the characteristic size of the columnar structure 1031a is Da, and the characteristic size of the columnar structure 1031A is DA. Multiple columnar structures 1031a are arranged around the columnar structure 1031A, and at least one columnar structure 1031a can be arranged at equal intervals between any two columnar structures 1031A. The arrangement period P between the columnar structures 1031A and the columnar structures 1031a satisfies: 3D≥P>D, where D can be the average value of the characteristic sizes of the columnar structures 1031A and the columnar structures 1031a.

[0127] In the above example, the gratings 1031 are arranged periodically, and the characteristic size and height of the columnar structure of the grating 1031 can be the same, or the characteristic size can be the same and the height can be different, or the characteristic size can be different and the height can be the same, or both the characteristic size and the height can be different.

[0128] In addition, in some other possible implementations, the columnar structure of the grating 1031 may also be arranged non-periodically. In some other embodiments, the columnar structure of the grating 1031 may be arranged non-periodically, but it is still necessary to satisfy that the thickness of the light-distributing layer 103 is less than or equal to 150 μm, and the height of the columnar structure of the grating 1031 is less than or equal to the thickness of the light-distributing layer 103, the characteristic size of the columnar structure is 1 μm to 25 μm, and the distance between two adjacent columnar structures and the characteristic size of the columnar structure satisfy: 3D ≥ P > D.

[0129] For example, the light type distribution after light equalization by the light-equalizing layer 103 including a non-periodic grating structure is more uniform, and the light intensity attenuation of the light output in various directions or angles is smaller; while the light-equalizing layer 103 including a periodic grating structure has better controllability of light equalization. In this case, the distribution of the light type after light equalization at a certain light output angle can be controlled by designing the size of the grating structure, etc.

[0130] The above example is only an illustrative description of the structure of the light-homogenizing layer 103. The light-homogenizing layer 103 may also include other structures as long as the light-homogenizing layer 103 generates an output light intensity distribution when the collimated light is vertically incident and the light intensity attenuation within the set output angle range is less than or equal to a threshold.

[0131] For example, when the collimated light is incident vertically, the light intensity distribution generated by the light homogenizing layer 103 satisfies that the light intensity attenuation within the set emission angle range is less than or equal to 30%.

[0132] Fig.14 a in the display module 13 is set as follows Fig.11 The schematic diagram of the pixel unit after the stacked structure is shown, and the pixel unit includes four irregular small light-emitting sub-pixels (two blue B light-emitting sub-pixels, one red R light-emitting sub-pixel and one green G light-emitting sub-pixel). Fig.14 b is set in the display module 13 as follows Fig.12 The schematic diagram of the pixel unit after the stacked structure is shown. Under the action of the light-homogenizing layer 103, the pixel aperture ratio is increased, so that the irregular small light-emitting sub-pixels of the display module 13 can be enlarged into regular large light-emitting sub-pixels. Among them, the pixel aperture ratio refers to the ratio between the area of ​​the part through which light can pass in a pixel and the overall area of ​​the pixel. The higher the pixel aperture ratio, the higher the efficiency of light passing through.

[0133] The embodiment of the present application does not limit the forming process of the light-homogenizing layer 103 . Fig.15 FIG. 1 is a flow chart of a method for forming the light-distributing layer 103. Fig.15 As shown, the flow chart of the forming method of the light-distributing layer 103 includes the following steps:

[0134] S101: Applying a coating on a substrate.

[0135] Among them, Fig.16 As shown, a coating is applied on a substrate 1032 by a nozzle 600 to form a grating 1031 .

[0136] S102: Masking exposure.

[0137] Among them, you can Fig.16 As shown, the coating is shielded and exposed to ultraviolet light 700 to cure the coating to obtain a uniform light layer 103 .

[0138] S103: Laminating and rolling.

[0139] Next reference Fig.16 , the film can be coated and wound by the film coating and winding machine 800.

[0140] In some embodiments, Fig.17 As shown, the stacked structure further includes an anti-reflection film 101 , which is arranged above the anti-glare layer 102 .

[0141] The forming process of the anti-reflection film 101 includes at least one of a wet etching process and a dry etching process.

[0142] The present application embodiment does not limit the material of the base film 1001. In some embodiments, the material of the base film 1001 includes: at least one of polyethylene terephthalate PET, thermoplastic polyurethane elastomer rubber TPU, and polyimide PI; the material of the buffer layer 1002 includes: non-Newtonian fluid.

[0143] The material of the stress barrier layer 1003 includes: Ultra-Thin Glass (UTG).

[0144] The embodiment of the present application does not limit the connection method between the base film 1001 and the light-distributing layer 103. In some embodiments, the stacked structure further includes: a first connection layer 10041, and the light-distributing layer 103 is connected to the base film 1001 through the first connection layer 10041. For example, the light-distributing layer 103 is connected to the stress barrier layer 1003 through the first connection layer 10041.

[0145] For example, the material of the first connection layer 10041 includes: optically transparent adhesive OCA.

[0146] In other embodiments, Fig. 20 As shown, the stress barrier layer 1003 is connected to the light-distributing layer 103 by thermal compression.

[0147] The embodiment of the present application does not limit the connection method between the light-distributing layer 103 and the display module. In some embodiments, the light-distributing layer 103 can be connected to the display module through the second connection layer 10042. For example, Fig.17 As shown, a second connection layer 10042 is disposed on a side of the light-homogenizing layer 1003 away from the stress barrier layer 1003 .

[0148] The material of the second connection layer 10042 can refer to the description of the first connection layer 10041 and will not be repeated here.

[0149] In other embodiments, Fig.18 As shown, the first protective film includes: a stacked base film 1001, a buffer layer 1002, a stress barrier layer 1003, a connecting layer 10043, a substrate 1004, a light-homogenizing layer 103 and a connecting layer 10044, the base film 1001 is arranged close to the anti-reflection film 101, the substrate 1004 is arranged close to the light-homogenizing layer 103, the buffer layer 1002 is arranged close to the base film 1001, and the stress barrier layer 1003 is arranged close to the substrate 1004.

[0150] The material of the substrate 1004 can refer to the description of the material of the base film 1001, which will not be repeated here.

[0151] The embodiment of the present application does not limit the connection method between the substrate 1004 and the stress barrier layer 1003. In some embodiments, the stress barrier layer 1003 is connected to the substrate 1004 through a connection layer 10043.

[0152] The embodiment of the present application does not limit the connection method between the substrate 1004 and the light-distributing layer 103. In some embodiments, the substrate 1004 is connected to the light-distributing layer 103 by thermal compression.

[0153] Next reference Fig.18 A connection layer 10044 is provided on one side of the light-homogenizing layer 103 away from the stress barrier layer 1003 , and the connection layer 10044 is used to connect with the display module.

[0154] The materials of the connection layer 10043 and the connection layer 10044 can refer to the description of the first connection layer 10041 and will not be repeated here.

[0155] In the above embodiment, only the first protective film is provided between the anti-glare layer 102 and the light-homogenizing layer 103 . To further improve the buffering performance of the laminated structure, in some embodiments, a second protective film may be provided on the side of the light-homogenizing layer 103 away from the anti-glare layer 102 .

[0156] In some embodiments, Fig.19 , Fig. 20As shown, the second protective film includes: a substrate 1004, and the substrate 1004 is arranged on a side of the light-homogenizing layer 103 close to the display panel.

[0157] The material of the substrate 1004 can refer to the description of the material of the base film 1001, which will not be repeated here.

[0158] like Fig.19 As shown, the light-distributing layer 103 is connected to the stress barrier layer 1003 through a connecting layer 1045, and the substrate 1004 is connected to the light-distributing layer 103 through a connecting layer 10046. A connecting layer 10047 is provided on the side of the substrate 1004 away from the light-distributing layer 103, and the connecting layer 10047 is used to connect to the display module.

[0159] like Fig. 20 As shown, the substrate 1004 is connected to the light-distributing layer 103 via a connecting layer 10048 , and the substrate 1004 is connected to the light-distributing layer 103 via a third connecting layer 10049 .

[0160] The materials of the connection layer 10045 , the connection layer 10046 , the connection layer 10047 , the connection layer 10048 , and the connection layer 10049 may refer to the description of the first connection layer 10041 , which will not be repeated here.

[0161] Fig.21 This is a schematic diagram of the structure of another display module provided in an embodiment of the present application. Fig.21 As shown, the display module 13 includes: an anti-reflection film 101 , an anti-glare layer 102 , a base film 1001 , a buffer layer 1002 , a stress barrier layer 1003 , a light-homogenizing layer 103 and a first release film 1030 which are stacked.

[0162] The side edge of the stress barrier layer 1003 is wrapped by the buffer layer 1002 .

[0163] In some examples of this embodiment, when preparing the laminated structure, such as Fig. 22 As shown, an anti-glare layer 102 may be provided on the surface of the base film 1001. The anti-glare layer may be formed by particle dispersion forming, phase separation forming, chemical etching forming, or nano-imprint forming. Fig.23 As shown, an anti-reflection film 101 can be provided on the surface of the anti-glare layer. The molding process of the anti-reflection film includes: a wet etching process and a dry etching process. Through this step, the following can be obtained: Fig.23 The laminated structure shown includes: an anti-reflection film 101, an anti-glare layer 102 and a base film 1001 which are stacked.

[0164] In addition, the light-homogenizing film can be attached to the surface of the stress barrier layer 1003 to obtain Fig.24The laminated structure shown in FIG. 1 includes: a second release film 10031, a stress barrier layer 1003, a light-distributing layer 103 and a first release film 1030. Next, the second release film 10031 can be removed, and a non-Newtonian fluid glue can be coated on the surface of the stress barrier layer 1003, so that the side of the stress barrier layer 1003 is infiltrated and wrapped by the non-Newtonian fluid glue. Then, the solvent of the non-Newtonian fluid glue can be removed to form a buffer layer 1002, and the result is as shown in FIG. Fig.25 The stacked structure shown.

[0165] Then, if Fig.26 As shown, it can be Fig.25 The stacked structure shown and Fig.23 The laminated structures shown are bonded together. For example, see Fig.26 , the base film 1001 and the buffer layer 1002 (non-Newtonian fluid after the solvent is removed) can be laminated, and then the optical module is heated and cured to make the interface of the non-Newtonian fluid and the high modulus buffer layer bonded. In some embodiments, the optical module can also be cut according to the required shape to obtain the following: Fig.21 The stacked structure shown.

[0166] Fig. 27 A schematic diagram of another laminate structure provided in an embodiment of the present application. Fig. 27 As shown, the laminated structure includes: an anti-reflection film 101 , an anti-glare layer 102 , a base film 1001 , a buffer layer 1002 , a stress barrier layer 1003 , a light-homogenizing layer 103 and a first release film 1030 which are stacked.

[0167] The side edge of the stress barrier layer 1003 is flush with the side edge of the buffer layer 1002 .

[0168] In the preparation of Fig. 27 When the laminated structure is shown, the non-Newtonian fluid glue can be coated on the surface of the base film 1001, and then the non-Newtonian fluid glue is cured so that the non-Newtonian fluid and the base film 1001 are combined to obtain a laminated structure as shown in FIG. Fig.28 The laminated structure of the anti-reflection film 101 , the anti-glare layer 102 , the base film 1001 , the buffer layer 1002 and the release film 10021 is shown.

[0169] for Fig.28 The stacked structure shown in FIG. 1 can be cut into a specified shape according to the shape of the stress barrier layer 1003, and the surfaces of the buffer layer 1002 and the stress barrier layer 1003 are processed, and the stacked structure can be cut into a specified shape according to the shape of the stress barrier layer 1003. Fig.29 As shown, the buffer layer 1002 and the stress barrier layer 1003 are bonded together under heating and pressure conditions.

[0170] Then, if Fig.30As shown, the surfaces of the stress barrier layer 1003 and the light-distributing layer 103 are treated, and the stress barrier layer 1003 and the light-distributing layer 103 are combined together under heating and pressurizing conditions to obtain a Fig. 27 The stacked structure shown.

[0171] In some embodiments, the stress barrier layer 1003 and the light-distributing layer 103 are connected by thermal compression. Fig.17 As shown, the stress barrier layer 1003 is connected to the light homogenizing layer 103 through the first connecting layer 10041 .

[0172] In this example, in the preparation Fig.17 When the display module is shown, the non-Newtonian fluid glue can be coated on the surface of the high modulus buffer layer, and then the non-Newtonian fluid glue is cured to combine the non-Newtonian fluid and the high modulus layer to obtain the following Fig.28 The stacked structure of the anti-reflection film 101 , the anti-glare layer 102 , the base film 1001 , the buffer layer 1002 and the release film 10021 is shown. Next, the stress barrier layer 1003 can be combined with the light homogenizing layer 103 through the first connecting layer 10041 .

[0173] In some embodiments, when the laminated structure is disposed on the light-emitting side of the display module, the laminated structure can be attached to the light-emitting surface of the display module. The laminated structure can be disposed on the display module as a protective film.

[0174] In some embodiments, the above-mentioned laminated structure may be disposed in a display module.

[0175] Among them, in some examples of this embodiment, the display module 13 may include: a display panel 20, a cover plate 2001 and the stacked structure as described above, the anti-reflection film 101, the anti-glare layer 102, the base film 1001, the buffer layer 1002 and the stress barrier layer 1003 in the stacked structure can be arranged on the cover plate 2001, the light-homogenizing layer 103 in the stacked structure can be arranged in the cover plate 2001, or, the light-homogenizing layer 103 in the stacked structure can be arranged between the cover plate 2001 and the display panel 20.

[0176] For example, Fig.31 As shown, the anti-reflection film 101 , the anti-glare layer 102 , the base film 1001 , the buffer layer 1002 , the stress barrier layer 1003 , and the light-homogenizing layer 103 are all stacked on the cover plate 2001 .

[0177] For example, Fig.32 As shown, the anti-reflection film 101 , the anti-glare layer 102 , the base film 1001 , the buffer layer 1002 , the stress barrier layer 1003 are stacked on the cover plate 2001 , and the light-homogenizing layer 103 is disposed between the cover plate 2001 and the display panel 20 .

[0178] For example, Fig.33 As shown, the cover plate 2001 can be a composite laminate of a single-layer polymer film material with a hardened layer, or a UTG composite layer. Fig.33 As shown, the display module 13 includes: a stacked anti-reflection film 101, an anti-glare layer 102, a base film 1001, a buffer layer 1002, a stress barrier layer 1003, a first connection layer 10041, a cover plate 2001 and a display panel 20. The light homogenizing layer 103 is integrated in the cover plate 2001.

[0179] In some other examples of this embodiment, the display module 13 may include: a display panel 20, a cover plate 2001, and a light-distributing layer 103. The light-distributing layer 103 may be disposed between the cover plate 2001 and the display panel 20. Alternatively, the light-distributing layer 103 may be disposed in the cover plate 2001. Alternatively, the light-distributing layer 103 may be disposed on the cover plate 2001.

[0180] For example, Fig.34 As shown, the display module 13 includes: a cover plate 2001 , a light-distributing layer 103 and a display panel 20 which are stacked.

[0181] For example, Fig.35 As shown, the display module 13 includes: a stacked cover plate 2001 and a display panel 20 , wherein the light homogenizing layer 103 is integrated in the cover plate 2001 .

[0182] For example, Fig.36 As shown, the display module 13 includes: a light-homogenizing layer 103 , a cover plate 2001 and a display panel 20 which are stacked.

[0183] The embodiment of the present application provides a laminated structure, an electronic device and a display module. In some implementations, the laminated structure is arranged on the display module. The laminated structure includes: an anti-glare layer, a base film, a buffer layer, a stress barrier layer and a light-distributing layer which are stacked. The anti-glare layer is formed on the base film. The modulus of the stress barrier layer is greater than the modulus of the buffer layer. The haze of the anti-glare layer is less than or equal to 35%. The haze of the light-distributing layer is greater than or equal to 70%. The light-distributing layer is used to mix the light emitted by the display panel. Thus, the light-distributing layer is used to evenly mix the light emitted by the display panel and then enter the anti-glare layer. The anti-glare layer can diffusely reflect the incident ambient light to avoid glare on the screen. Among them, when the light evenly mixed by the light-distributing layer is scattered by the anti-glare layer, crosstalk between different light rays can be avoided to cause screen flash points. The optical module suppresses the generation of glare and screen flash points through the combined effect of the light-distributing layer and the anti-glare layer. The anti-glare layer is set with a smaller haze parameter, so that the display device can ensure a higher definition of imaging, taking into account the requirements of low flash point and high definition. Moreover, by arranging a buffer layer and a stress barrier layer between the base film and the light-distributing layer, a laminated structure of a low modulus buffer layer and a high modulus buffer layer can be formed. The low modulus buffer layer is used to produce large deformation to absorb energy and achieve buffering, and the high modulus buffer layer improves the impact resistance of the buffer layer, thereby improving the buffering performance and impact resistance of the laminated structure.

[0184] In some other embodiments, the display module includes: a cover plate, a display panel and a light-distributing layer, the haze of the light-distributing layer is greater than or equal to 70%. The light-distributing layer can be arranged in the cover plate, above the cover plate and below the cover plate.

[0185] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions within the technical scope disclosed in the present application should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A laminated structure, characterized in that: The laminated structure is arranged on the display module, and the laminated structure includes: an anti-glare layer, a base film, a buffer layer, a stress barrier layer and a light-distributing layer which are stacked, the anti-glare layer is formed on the upper surface of the base film, the modulus of the stress barrier layer is greater than the modulus of the buffer layer, the haze of the anti-glare layer is less than or equal to 35%, and the haze of the light-distributing layer is greater than or equal to 70%.

2. The laminated structure according to claim 1, characterized in that: The buffer layer is formed on the lower surface of the base film by coating.

3. The laminated structure according to claim 1 or 2, characterized in that: The stress barrier layer is connected to the light-distributing layer by thermal compression.

4. The laminated structure according to claim 1 or 2, characterized in that: The stacked structure further includes: a first connecting layer, and the light-distributing layer is connected to the stress barrier layer via the first connecting layer.

5. The laminated structure according to claim 1 or 2, characterized in that: The stacked structure further includes: a substrate, wherein the substrate is disposed between the light-distributing layer and the stress-isolating layer, or the substrate is disposed below the light-distributing layer.

6. The laminated structure according to claim 5, characterized in that: The light-homogenizing layer is connected to the substrate by thermal compression.

7. The laminated structure according to claim 5, characterized in that: The stacked structure further includes: a second connecting layer, and the light-homogenizing layer is connected to the substrate via the second connecting layer.

8. The laminated structure according to any one of claims 1-2, 6-7, characterized in that: The stacked structure further includes an anti-reflection film, which is arranged above the anti-glare layer.

9. The laminated structure according to any one of claims 1-2, 6-7, characterized in that: The light-homogenizing layer includes a plurality of columnar structures arranged in an array, the spacing between adjacent columnar structures is P, and the spacing P between adjacent columnar structures satisfies: 3D≥P>D, wherein D is a characteristic size of the columnar structure.

10. The laminated structure according to any one of claims 1-2, 6-7, characterized in that: The molding process of the anti-glare layer includes at least one of coating molding, particle dispersion molding, phase separation molding, chemical etching molding, and nano-imprint molding.

11. An electronic device, characterized in that: It comprises a display module, and the laminated structure according to any one of claims 1 to 10, wherein the laminated structure is arranged on the light-emitting side of the display module.

12. A display module, characterized in that: include: An anti-glare layer, a base film, a buffer layer, a stress barrier layer and a display panel are stacked, wherein the anti-glare layer is formed on the base film, the modulus of the stress barrier layer is greater than the modulus of the buffer layer, and the haze of the anti-glare layer is less than or equal to 35%; The display module further includes: a light-distributing layer, which is disposed between the stress barrier layer and the display panel, and the haze of the light-distributing layer is greater than or equal to 70%.

13. The display module according to claim 12, characterized in that: The display module further includes a cover plate, which is disposed between the stress barrier layer and the display panel, and the light-distributing layer is disposed in the cover plate.

14. The display module according to claim 12, characterized in that: The display module further includes a cover plate, wherein the cover plate is disposed between the stress barrier layer and the display panel, and the light-distributing layer is disposed between the cover plate and the stress barrier layer.

15. The display module according to claim 12, characterized in that: The display module further includes a cover plate, wherein the cover plate is disposed between the stress barrier layer and the display panel, and the light-distributing layer is disposed between the cover plate and the display panel.

16. A display module, characterized in that: include: The cover plate and the display panel are stacked, and the display module also includes: a light-distributing layer, which is arranged on the cover plate, or the light-distributing layer is arranged in the cover plate, or the light-distributing layer is arranged between the cover plate and the display panel, and the haze of the light-distributing layer is greater than or equal to 70%.

17. An electronic device, characterized in that: It comprises a shell, and a display module as described in any one of claims 12 to 16, wherein the display module is arranged in the shell.

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