Exhaust stabilizing device used in wafer processing process and semiconductor equipment

Abstract

The utility model provides an exhaust stabilizing device used in a wafer processing process and semiconductor equipment, and the device comprises a pressure detection part which is disposed in an exhaust pipeline and is used for detecting an actual pressure value in the exhaust pipeline; the air flow adjusting mechanism is arranged on the exhaust pipeline and used for adjusting the air flow in the exhaust pipeline; and the controller is in control connection with the pressure detection piece and the air flow adjusting mechanism, and the controller controls the air flow adjusting mechanism to adjust the air flow in the exhaust pipeline according to the actual pressure value. According to the utility model, the actual pressure value in the exhaust pipeline is detected in real time through the pressure detection piece, and the controller controls the air flow adjusting mechanism to adjust the air flow in the exhaust pipeline according to the change condition of the actual pressure value so as to stabilize the exhaust in the wafer processing process; therefore, wafer defects caused by unstable exhaust are reduced to a great extent, the product yield is improved, unnecessary shutdown is reduced, and the use efficiency of a machine table is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor manufacturing, and in particular to an exhaust stabilization device and semiconductor equipment used in a wafer processing process. Background Art

[0002] In the semiconductor manufacturing process, the stability of exhaust is crucial. Exhaust fluctuations will directly affect the quality of the product. Various process machines are equipped with exhaust monitoring mechanisms. For example, for photolithography machines, in the coating and development stage of the photolithography process, a stable exhaust system is the prerequisite for ensuring coating or development. Usually, the film thickness of the coating is greatly affected by the exhaust. Similarly, the size of the exhaust during the development process will directly affect the quality of the key dimensions, which requires a stable exhaust system as support. However, the popular coating and development machines on the market are not equipped with a stable exhaust design. When the machine detects a change in the exhaust, the machine end will trigger the alarm of the corresponding unit, and the wafer will be forcibly terminated during the processing. After the equipment engineer finds out, he needs to investigate the cause of the unit and adjust the exhaust. However, the wafer that is forcibly terminated during the processing must go through the rework route or even be scrapped, resulting in reduced product yield, increased production costs, and increased machine downtime.

[0003] In view of this, it is necessary to propose an exhaust stabilization device for use in wafer processing to solve the above problems. Utility Model Content

[0004] The purpose of the utility model is to provide an exhaust stabilization device and semiconductor equipment used in the wafer processing process, so as to improve the problem that the existing machine is not equipped with a stable exhaust design, which leads to reduced product yield, increased production cost and increased machine downtime.

[0005] The utility model provides an exhaust stabilization device for use in a wafer processing process, comprising:

[0006] A pressure detection member, disposed in an exhaust pipeline and used to detect an actual pressure value in the exhaust pipeline, wherein the exhaust pipeline is connected between the wafer processing unit and the exhaust treatment device;

[0007] An airflow regulating mechanism, disposed on the exhaust pipeline and used to regulate the gas flow in the exhaust pipeline, wherein the airflow regulating mechanism is disposed closer to the wafer processing unit than the pressure detection element;

[0008] A controller is connected to the pressure detection component and the airflow regulating mechanism. According to the actual pressure value, the controller controls the airflow regulating mechanism to adjust the gas flow in the exhaust pipeline to stabilize the exhaust during wafer processing.

[0009] In a possible embodiment, the airflow adjustment mechanism includes a baffle, a connecting rod and a driving member;

[0010] The two ends of the connecting rod are rotatably arranged on the exhaust pipe;

[0011] The baffle is arranged on the connecting rod and is located in the exhaust pipe, and the size of the baffle is adapted to the radial cross-sectional size of the inner wall of the exhaust pipe;

[0012] The driving member is drivingly connected to the connecting rod to drive the connecting rod to rotate with the blocking piece.

[0013] In a possible embodiment, a pair of sealing covers are provided on the outer wall of the exhaust pipeline, and the pair of sealing covers respectively cover the connection between the two ends of the connecting rod and the exhaust pipeline.

[0014] In a possible embodiment, the sealing cover is provided with a circle of flange along the edge of the sealing cover;

[0015] The flange is in contact with the outer wall of the exhaust pipe and is fixed to the outer wall of the exhaust pipe by a first fastener, so that the sealing cover is fixed to the outer wall of the exhaust pipe.

[0016] In a possible embodiment, a sealing gasket is sandwiched between the flange and the outer wall of the exhaust pipe, and the sealing gasket is arranged along the extension direction of the flange.

[0017] In a possible embodiment, the exhaust stabilization device further includes a pressing plate, the connecting rod is located between the baffle plate and the pressing plate, portions of the pressing plate located on both sides of the connecting rod are in contact with the baffle plate, and the baffle plate is mounted and fixed on the connecting rod by a second fastener.

[0018] In a possible embodiment, the pressing plates are arranged in a plurality at intervals, and the arrangement direction of the plurality of pressing plates is consistent with the extension direction of the connecting rod; or,

[0019] The pressing sheet is in a strip shape, and the setting direction of the pressing sheet is consistent with the extending direction of the connecting rod.

[0020] In a possible embodiment, the pressure detection component is disposed close to the exhaust treatment device; and / or the airflow adjustment mechanism is disposed close to the wafer processing unit.

[0021] In a possible embodiment, the exhaust stabilization device further includes an alarm connected to the controller for issuing an alarm.

[0022] The utility model also provides a semiconductor device, comprising: a wafer processing unit, an exhaust treatment device, an exhaust pipeline connected between the wafer processing unit and the exhaust treatment device, and an exhaust stabilization device used in the wafer processing process as in any of the above embodiments.

[0023] The beneficial effect of the exhaust stabilization device provided by the utility model is that the actual pressure value in the exhaust pipeline is detected in real time by the pressure detection part, and according to the change of the actual pressure value, the controller controls the airflow adjustment mechanism to adjust the gas flow in the exhaust pipeline to stabilize the exhaust during the wafer processing process, thereby greatly reducing the wafer defects caused by unstable exhaust, improving the product yield, reducing unnecessary downtime, and improving the use efficiency of the machine. In a further solution, the airflow adjustment mechanism adopts a driving member to drive the baffle to rotate, and prevents the exhaust from leaking out through a sealing cover and a sealing gasket. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic diagram of the exhaust gas stabilization device used in the wafer processing process of the utility model being installed between the wafer processing unit and the exhaust gas treatment device.

[0025] Figure 2 It is a schematic diagram of the airflow regulating mechanism, controller and alarm in the exhaust stabilization device used in the wafer processing process of the utility model.

[0026] Figure 3 It is a schematic diagram of the airflow regulating mechanism, the sealing cover and the sealing gasket in the exhaust stabilization device used in the wafer processing process of the utility model.

[0027] Figure 4 The utility model is a schematic diagram of the installation of a sealing cover and a sealing gasket in an exhaust stabilization device used in a wafer processing process.

[0028] Figure 5 This is a state diagram of the exhaust stabilization device used in the wafer processing process of the utility model under three exhaust situations.

[0029] Figure 6 It is a schematic diagram of a semiconductor device of the present invention.

[0030] Explanation of the reference numerals: 110, pressure detection member; 120, air flow adjustment mechanism; 121, baffle; 122, connecting rod; 123, driving member; 124, bearing; 130, controller; 140, sealing cover; 141, flange; 150, first fastener; 160, sealing gasket; 170, pressing plate; 180, second fastener; 190, alarm; 200, wafer processing unit; 300, exhaust treatment device; 400, exhaust pipe. DETAILED DESCRIPTION

[0031] In order to make the purpose, technical solution and advantages of the embodiments of the utility model clearer, the technical solution in the embodiments of the utility model will be described clearly and completely below. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0032] Because the machine user end (for example, the coating unit or the developing unit) has extremely high requirements on the exhaust size and stability, in the prior art, the chamber unit is connected to the plant main line through the corresponding exhaust pipe. When the exhaust of the plant main line fluctuates, the machine user end detects that the exhaust has jumped out of the monitoring range and issues a corresponding warning or error alarm. However, the machine user end does not have a relevant emergency voltage stabilizing device. After the alarm, the wafer processing in the chamber unit is stopped and waits for the engineer to handle it on site. However, the wafer that is forcibly terminated during the processing process must be reworked or even scrapped, resulting in reduced product yield, increased production costs, and increased machine downtime.

[0033] In view of the problems existing in the prior art, the embodiment of the utility model provides an exhaust stabilization device for use in a wafer processing process, see Figure 1 and Figure 2 The exhaust stabilization device includes: a pressure detection component 110, an airflow adjustment mechanism 120 and a controller 130. The pressure detection component 110 is arranged in the exhaust pipeline 400 and is used to detect the actual pressure value in the exhaust pipeline 400. The exhaust pipeline 400 is connected between the wafer processing unit 200 and the exhaust treatment device 300. The airflow adjustment mechanism 120 is arranged on the exhaust pipeline 400 and is used to adjust the gas flow in the exhaust pipeline 400. The airflow adjustment mechanism 120 is arranged closer to the wafer processing unit 200 than the pressure detection component 110. The controller 130 is connected to the pressure detection component 110 and the airflow adjustment mechanism 120. According to the actual pressure value, the controller 130 controls the airflow adjustment mechanism 120 to adjust the gas flow in the exhaust pipeline 400 to stabilize the exhaust during the wafer processing process. In one embodiment, the wafer processing unit 200 can be a developing unit or a gluing unit, etc., and the exhaust treatment device 300 is a centralized exhaust treatment device for factory services. The pressure detection component 110 is a gas pressure sensor, a pipeline pressure sensor, etc.

[0034] In this embodiment, a pressure detection component 110 and an airflow regulating mechanism 120 are provided on the exhaust pipe 400 between the wafer processing unit 200 and the exhaust treatment device 300. During the wafer processing, the actual pressure value in the exhaust pipe 400 is detected in real time by the pressure detection component 110. When the actual pressure value in the exhaust pipe 400 exceeds the preset pressure range, the controller 130 controls the airflow regulating mechanism 120 to adjust the gas flow in the exhaust pipe 400 according to the change of the actual pressure value, so as to avoid the sudden change of the exhaust pressure in the wafer processing unit 200 caused by the exhaust fluctuation of the exhaust treatment device 300, and ensure that the wafer being processed in the current machine temporarily completes the current processing with a stable exhaust pressure. After the current processing is completed, the engineer can stop the machine for inspection, reduce the impact of sudden downtime, improve product yield and reduce production costs.

[0035] In a preferred embodiment, see Figure 3 The airflow regulating mechanism 120 includes a baffle 121, a connecting rod 122 and a driving member 123. Both ends of the connecting rod 122 are rotatably arranged on the exhaust pipe 400. The baffle 121 is arranged on the connecting rod 122 and is located in the exhaust pipe 400. The size of the baffle 121 is adapted to the radial cross-sectional size of the inner wall of the exhaust pipe 400. The connecting rod 122 is located on the center line of the baffle 121. The driving member 123 is drivingly connected to the connecting rod 122 to drive the connecting rod 122 to rotate with the baffle 121. In this embodiment, according to the change of the actual pressure value, the controller 130 can accurately control the opening and closing of the baffle 121 and the opening angle of the baffle 121 by controlling the driving member 123, thereby realizing accurate control of the gas flow.

[0036] For details, see Figure 3 The exhaust pipe 400 is a round tube, the baffle 121 is round, and the diameter of the baffle 121 matches the inner diameter of the exhaust pipe 400. It can be understood that when the baffle 121 is completely closed, there is a very small gap between the baffle 121 and the exhaust pipe 400, which can block the flow of gas without affecting the rotation of the baffle 121, thereby avoiding the "stuck" phenomenon of the baffle 121 when rotating. The baffle 121 is made of stainless steel, which has good corrosion resistance, for example, resistance to organic solvents.

[0037] In one embodiment, see Figure 3 , a through hole is respectively provided at both ends of the corresponding connecting rod 122 on the exhaust pipe 400, and the two ends of the connecting rod 122 are rotatably arranged in the corresponding through hole. Specifically, the two ends of the connecting rod 122 are rotatably arranged in the corresponding through hole through the bearing 124. The bearing 124 can reduce the friction between the connecting rod 122 and the inner wall of the through hole during the rotation process, ensuring that the connecting rod 122 can rotate smoothly.

[0038] In a specific embodiment, see Figure 3 and Figure 4 A pair of sealing covers 140 are provided on the outer wall of the exhaust pipe 400, and the pair of sealing covers 140 respectively cover the connection between the two ends of the connecting rod 122 and the exhaust pipe 400. In this embodiment, on the one hand, the sealing cover 140 can prevent the exhaust gas from leaking from the connection between the connecting rod 122 and the exhaust pipe 400 to ensure the sealing and safety. On the other hand, the sealing cover 140 can also prevent impurities, dust, etc. in the external environment from entering the exhaust pipe 400 from the connection and polluting the wafer processing environment.

[0039] In one embodiment, see Figure 3 and Figure 4 A flange 141 is provided along the edge of the sealing cover 140 , and the flange 141 is in contact with the outer wall of the exhaust pipe 400 and is fixed to the outer wall of the exhaust pipe 400 through the first fastener 150 , thereby fixing the sealing cover 140 to the outer wall of the exhaust pipe 400 . Specifically, the first fastener 150 is inserted into the flange 141. The first fastener 150 is a screw, a bolt, etc. When the first fastener 150 is a screw, one end of the screw is arranged on the outer wall of the exhaust pipe 400, and the other end of the screw is sleeved and threadedly connected with a nut to lock and fix the flange 141 between the nut and the exhaust pipe 400. When the first fastener 150 is a screw or a bolt, the end of the screw or the end of the bolt is embedded in the outer wall of the exhaust pipe 400, and the screw part of the screw or the screw part of the bolt is sleeved and threadedly connected with a nut to lock and fix the flange 141 between the nut and the exhaust pipe 400. The first fastener 150 is directly fixed on the outer wall of the exhaust pipe 400 to avoid perforating the exhaust pipe 400 to affect the air tightness. In this embodiment, the design of the flange 141 can increase the contact area between the sealing cover 140 and the outer wall of the exhaust pipe 400. On the one hand, the close fit between the flange 141 and the exhaust pipe 400 can achieve an airtight isolation effect to a certain extent. On the other hand, a first fastener 150 can be passed through the flange 141, so that the sealing cover 140 can be easily installed and removed from the outer wall of the exhaust pipe 400, which is convenient for later maintenance and replacement.

[0040] In another embodiment, see Figure 3 and Figure 4 A sealing gasket 160 is sandwiched between the flange 141 and the outer wall of the exhaust pipe 400, and the sealing gasket 160 is arranged along the extension direction of the flange 141. In this embodiment, the sealing gasket 160 is further added on the basis of the sealing of the flange 141 to form a double sealing structure to more effectively prevent gas leakage and further enhance the airtight isolation effect.

[0041] In some possible embodiments, the driving member 123 may be located outside the exhaust pipe 400, for example, the driving member 123 is disposed in one of the sealing covers 140; or, see Figure 3 , the driving member 123 is disposed on one of the sealing covers 140. In this case, the driving member 123 can directly drive the connecting rod 122 to rotate by using a motor or a rotary cylinder. Alternatively, the driving member 123 is disposed in the exhaust pipe 400, and the driving member 123 (for example, a motor) is connected to the connecting rod 122 through a transmission mechanism such as a gear transmission or a pulley transmission to drive the connecting rod 122 to rotate. The motor can be a stepper motor or a servo motor. On the one hand, the cost of the motor is low. On the other hand, the controller 130 can control the forward and reverse rotation of the motor and the rotation angle of the connecting rod 122 by sending a control signal to the motor, and receive a feedback signal from the motor, thereby realizing real-time and precise control of the opening angle of the baffle 121.

[0042] Specifically, the controller 130 is an industrial personal computer (IPC) or a programmable logic controller (PLC). An industrial personal computer is an industrial computer with powerful computing power, high reliability and stability, and is mainly used in the field of industrial production control. A PLC is a computer specifically used for industrial control. It uses a programmable memory to store programs internally, execute user-oriented instructions such as logical operations, sequential control, timing, counting and arithmetic operations, and control various types of mechanical equipment or production processes through digital or analog input / output.

[0043] In one specific embodiment, see Figure 3 The exhaust stabilization device further includes a pressing plate 170, the connecting rod 122 is located between the baffle 121 and the pressing plate 170, the parts of the pressing plate 170 located on both sides of the connecting rod 122 are in contact with the baffle 121, and the baffle 121 is fixed to the connecting rod 122 by a second fastener 180. Specifically, the second fastener 180 is provided on the connecting rod 122 and the baffle 121, and the second fastener 180 is a screw, a bolt, etc. In this embodiment, the baffle 121 is detachably fixed to the connecting rod 122 by the pressing plate 170 and the second fastener 180, which is simple and convenient to operate and convenient for later maintenance and replacement.

[0044] In some possible embodiments, see Figure 3, the pressing sheet 170 is a plurality of pressing sheets 170 arranged at intervals, and the arrangement direction of the plurality of pressing sheets 170 is consistent with the extension direction of the connecting rod 122; or, the pressing sheet 170 is in a strip shape, and the arrangement direction of the pressing sheet 170 is consistent with the extension direction of the connecting rod 122. In this embodiment, the contact area between the pressing sheet 170 and the blocking sheet 121 is increased by using a plurality of pressing sheets 170 arranged at intervals or a long strip pressing sheet 170, so that the connection between the pressing sheet 170 and the blocking sheet 121 is more firmly established.

[0045] In a specific embodiment, see Figure 1 , the pressure detection component 110 is arranged close to the exhaust treatment device 300; and / or, the airflow regulating mechanism 120 is arranged close to the wafer processing unit 200. In this embodiment, the pressure detection component 110 close to the exhaust treatment device 300 can monitor the exhaust fluctuation of the exhaust treatment device 300 (i.e., the factory service end) in real time and accurately. The design of the airflow regulating mechanism 120 close to the wafer processing unit 200 and away from the exhaust treatment device 300 reserves sufficient control time. Since it takes a while for the exhaust fluctuation to propagate to the wafer processing unit 200, when the pressure detection component 110 detects the exhaust fluctuation, the controller 130 immediately controls the airflow regulating mechanism 120 to adjust the gas flow rate to block the exhaust fluctuation from propagating to the wafer processing unit 200, thereby avoiding a sudden change in the exhaust pressure of the wafer processing unit 200. The exhaust stability during the wafer processing process is ensured by the combined design of real-time monitoring, rapid response, and reserved control time.

[0046] In one embodiment, see Figure 2 The exhaust stabilization device further includes an alarm 190 connected to the controller 130 for sounding an alarm. Specifically, when the actual pressure value detected by the pressure detection element 110 is greater than or equal to 0 (i.e., from negative pressure to positive pressure), the controller 130 controls the alarm 190 to sound an alarm to promptly remind the engineer to take measures.

[0047] See also Figure 5 The exhaust stabilization principle of the exhaust stabilization device of the utility model is explained below in conjunction with specific embodiments.

[0048] Situation 1: Under normal circumstances, the opening and closing degree of the baffle 121 is set to 45-70%. When the pressure detection component 110 detects that the exhaust gas of the exhaust treatment device 300 (i.e., the factory service end) has a tendency to be too large (i.e., the actual pressure value is less than the minimum negative pressure value in the preset negative pressure range, and the negative pressure is too large), the controller 130 sends a command to the motor, and the motor receives the pulse control signal and controls the connecting rod 122 to rotate to reduce the opening and closing degree of the baffle 121, such as Figure 5 The pressure detection element 110 continues to detect whether it meets the requirements of the preset negative pressure range, and continues to adjust if it does not meet the requirements.

[0049] Situation 2: Under normal circumstances, the opening and closing degree is 45-70%. When the pressure detection component 110 detects that the exhaust gas of the exhaust treatment device 300 (i.e., the factory service end) has a tendency to decrease (i.e., the actual pressure value is greater than the maximum negative pressure value in the preset negative pressure range, and the negative pressure is insufficient), the controller 130 sends a command to the motor, and the motor receives the pulse control signal and controls the connecting rod 122 to rotate to increase the opening and closing degree of the baffle 121, such as Figure 5 The baffle 121 corresponding to b is shown in the figure. The pressure detection member 110 continues to detect whether it meets the requirements of the preset negative pressure range, and continues to adjust if it does not meet the requirements.

[0050] Scenario 3: When the pressure detection element 110 detects that the negative pressure of the exhaust gas treatment device 300 (i.e., the factory service end) decreases extremely rapidly, or even changes from negative pressure to positive pressure, in order to prevent the particles in the exhaust pipe 400 from flowing back into the wafer processing unit 200, the baffle 121 is quickly 100% closed, such as Figure 5 As shown in the baffle 121 corresponding to c in the middle, the positive pressure exhaust of the reverse flow is isolated, the alarm 190 sounds an alarm, and the engineer shuts down the machine to investigate the cause.

[0051] The technical effect of the exhaust stabilization device of the utility model used in the wafer processing process is explained below.

[0052] 1. The pressure detection component 110 can detect the actual pressure value in the exhaust pipe 400 in real time. The controller 130 controls the airflow adjustment mechanism 120 to adjust the gas flow in the exhaust pipe 400 in a timely manner according to the detection data of the pressure detection component 110, thereby effectively stabilizing the exhaust pressure during the wafer processing process and avoiding the impact on product yield and production cost due to machine shutdown.

[0053] 2. The airflow adjustment mechanism 120 adopts a combination design of a baffle 121, a connecting rod 122 and a driving member 123. The driving member 123 ensures the accuracy of the angle adjustment of the baffle 121. By arranging a sealing cover 140 on the outer wall of the exhaust pipe 400 and sandwiching a sealing gasket 160 between the sealing cover 140 and the exhaust pipe 400, gas leakage is effectively prevented and the sealing performance is improved.

[0054] 3. The pressure detection component 110 close to the exhaust treatment device 300 can capture exhaust fluctuations in real time. This is because the exhaust treatment device 300 (i.e., the factory end) is the end of the exhaust system, and any changes in exhaust pressure or flow will first be reflected here. The airflow adjustment mechanism 120 is close to the wafer processing unit 200. Since it takes a certain amount of time for exhaust fluctuations to propagate in the pipeline, when the pressure detection component 110 detects fluctuations, the controller 130 can immediately start the airflow adjustment mechanism 120, and adjust the gas flow to block or slow down the propagation of airflow fluctuations to the wafer processing unit 200, effectively avoiding the wafer processing unit 200 from being affected by exhaust fluctuations, thereby ensuring the stability of exhaust during wafer processing.

[0055] See also Figure 6 The utility model also provides a semiconductor device, including: a wafer processing unit 200, an exhaust treatment device 300, an exhaust pipeline 400 connected between the wafer processing unit 200 and the exhaust treatment device 300, and an exhaust stabilization device used in the wafer processing process as in any of the above embodiments.

[0056] Although the embodiments of the utility model are described in detail above, it is obvious to those skilled in the art that various modifications and changes can be made to these embodiments. However, it should be understood that such modifications and changes are within the scope and spirit of the utility model described in the claims. Moreover, the utility model described herein may have other embodiments and may be implemented or realized in a variety of ways. Unless otherwise defined, the technical terms or scientific terms used herein should be understood by people with ordinary skills in the field to which the utility model belongs. The words "including" and the like used herein mean that the elements or objects appearing before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects.

Claims

1. An exhaust stabilization device for use in wafer processing, characterized in that: include: A pressure detection member, disposed in an exhaust pipeline and used to detect an actual pressure value in the exhaust pipeline, wherein the exhaust pipeline is connected between the wafer processing unit and the exhaust treatment device; An airflow regulating mechanism, disposed on the exhaust pipeline and used to regulate the gas flow in the exhaust pipeline, wherein the airflow regulating mechanism is disposed closer to the wafer processing unit than the pressure detection element; A controller is connected to the pressure detection component and the airflow regulating mechanism. According to the actual pressure value, the controller controls the airflow regulating mechanism to adjust the gas flow in the exhaust pipeline to stabilize the exhaust during wafer processing.

2. The exhaust stabilization device for wafer processing according to claim 1, characterized in that: The airflow adjustment mechanism includes a baffle, a connecting rod and a driving member; The two ends of the connecting rod are rotatably arranged on the exhaust pipe; The baffle is arranged on the connecting rod and is located in the exhaust pipe, and the size of the baffle is adapted to the radial cross-sectional size of the inner wall of the exhaust pipe; The driving member is drivingly connected to the connecting rod to drive the connecting rod to rotate with the blocking piece.

3. The exhaust stabilization device for wafer processing according to claim 2, characterized in that: A pair of sealing covers are arranged on the outer wall of the exhaust pipeline, and the pair of sealing covers respectively cover the connection between the two ends of the connecting rod and the exhaust pipeline.

4. The exhaust stabilization device for wafer processing according to claim 3, characterized in that: The sealing cover is provided with a circle of flange along the edge of the sealing cover; The flange is in contact with the outer wall of the exhaust pipe and is fixed to the outer wall of the exhaust pipe by a first fastener, so that the sealing cover is fixed to the outer wall of the exhaust pipe.

5. The exhaust stabilization device for wafer processing according to claim 4, characterized in that: A sealing gasket is sandwiched between the flange and the outer wall of the exhaust pipe, and the sealing gasket is arranged along the extending direction of the flange.

6. The exhaust stabilization device for wafer processing according to claim 2, characterized in that: It also includes a pressing plate, the connecting rod is located between the blocking plate and the pressing plate, the parts of the pressing plate located on both sides of the connecting rod are in contact with the blocking plate, and the blocking plate is fixed to the connecting rod by a second fastener.

7. The exhaust stabilization device for wafer processing according to claim 6, characterized in that: The pressing plates are arranged in a plurality of intervals, and the arrangement direction of the plurality of pressing plates is consistent with the extension direction of the connecting rod; or, The pressing sheet is in a strip shape, and the setting direction of the pressing sheet is consistent with the extending direction of the connecting rod.

8. The exhaust stabilization device for use in wafer processing according to any one of claims 1 to 7, characterized in that: The pressure detection member is arranged close to the exhaust treatment device; and / or, The airflow adjustment mechanism is arranged close to the wafer processing unit.

9. The exhaust stabilization device for use in wafer processing according to any one of claims 1 to 7, characterized in that: Also included is an alarm connected to the controller for issuing an alarm.

10. A semiconductor device, characterized in that: include: A wafer processing unit, an exhaust gas treatment device, an exhaust gas pipeline connected between the wafer processing unit and the exhaust gas treatment device, and an exhaust gas stabilization device used in a wafer processing process as described in any one of claims 1 to 9.

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